C6, C7, C8RF balun/matching DC blocking capacitors
C9, C10Crystal loading capacitors
C11, C12, C13SMPS LC filter capacitor
L0RF choke inductor
L1, L2, L3, L9RF LC filter/matching inductors
L4, L5, L6RF balun/matching inductors
10/91Doc ID 022758 Rev 2
SPIRIT1Typical application diagram and pin description
Table 2.Description of the external components of the typical application diagram
(continued)
ComponentsDescription
L7, L8SMPS LC filter inductor
XTAL24, 26, 48, 52 MHz
Ta bl e 2 assumes to cover all the frequency bands using only four sets of external
components.
Doc ID 022758 Rev 211/91
PinoutSPIRIT1
4 Pinout
Table 3.Pinout description
PinNameI/ODescription
1GPIO_0I/OSee description of GPIOs below
2MISOOSPI data output pin
3MOSIISPI data input pin
4SCLKISPI clock input pin
5CSnISPI chip select
6XOUTO
7XINI
8VBATVDD+1.8 V to +3.6 V input supply voltage
9RXpI
10RXnI
11GND_PAGNDGround for PA
12TXORF output signal
13SMPS Ext2IRegulated DC-DC voltage input
14SMPS Ext1ODC-DC output pin
15SDNI
16VBATVDD+1.8 V to +3.6 V input supply voltage
17VREG
18GPIO3I/OGeneral purpose I/O that may be configured through the SPI
19GPIO2I/O
20GPIO1I/O
21GNDGNDExposed pad ground pin
(1)
VDDRegulated output voltage. A 100 nF decoupling capacitor is required
Crystal oscillator output. Connect to an external 26 MHz crystal or
leave floating if driving the XIN pin with an external signal source
Crystal oscillator input. Connect to an external 26 MHz crystal or to
an external source. If using an external clock source with no crystal,
DC coupling with a nominal 0.2 VDC level is recommended with
minimum AC amplitude of 400 mVpp
Differential RF input signal for the LNA. See application diagram for a
typical matching network
Shutdown input pin. 0-VDD V digital input. SDN should be = ‘0’ in all
modes except shutdown mode. When SDN =’1’ the SPIRIT1 is
completely shut down and the contents of the registers are lost
registers to perform various functions, including:
– MCU clock output
– FIFO status flags
– Wake-up input
– Battery level detector
– TX-RX external switch control
– Antenna diversity control
– Temperature sensor output
1. This pin is intended for use with the SPIRIT1 only. It cannot be used to provide supply voltage to other devices.
12/91Doc ID 022758 Rev 2
SPIRIT1Absolute maximum ratings and thermal data
5 Absolute maximum ratings and thermal data
Absolute maximum ratings are those values above which damage to the device may occur.
Functional operation under these conditions is not implied. All voltages are referred to GND.
Table 4.Absolute maximum ratings
PinParameterValueUnit
8,14,16Supply voltage and SMPS output -0.3 to +3.6 V
17DC voltage on VREG -0.3 to +1.4 V
1,3,4,5,15,18,19,20DC voltage on digital input pins -0.3 to +3.6 V
2DC voltage on digital output pins -0.3 to +3.6 V
11DC voltage on analog pins -0.3 to +3.6 V
6,7,9,10DC voltage on RX/XTAL pins -0.3 to +1.4 V
13DC voltage on SMPS Ext2 pin -0.3 to +1.4 V
12DC voltage on TX pin -0.3 to +3.6 V
T
STG
V
ESD-HBM
Storage temperature range-40 to +125 °C
Electrostatic discharge voltage ±1.0 KV
Table 5.Thermal data
SymbolParameterQFN20Unit
R
thj-amb
Thermal resistance junction-ambient45°C/W
Table 6.Recommended operating conditions
SymbolParameterMin.Typ.Max.Unit
V
BAT
T
Operating battery supply voltage1.833.6V
Operating ambient temperature range-4085°C
A
Doc ID 022758 Rev 213/91
CharacteristicsSPIRIT1
6 Characteristics
6.1 General characteristics
Table 7.General characteristics
SymbolParameterMin.Typ.Max.Unit
FREQFrequency range
Air data rate for each modulation scheme
Optional Manchester and 3 out of 6 encoding/decoding can be selected
2-FSK1
DR
GMSK (BT=1, BT=0.5)1500kBaud
GFSK (BT=1, BT=0.5)1500kBaud
MSK1500kBaud
OOK/ASK1250kBaud
6.2 Electrical specifications
6.2.1 Electrical characteristics
Characteristics measured over recommended operating conditions unless otherwise
specified. Typical values are referred to T
to a 50 Ohm antenna connector, via the reference design.
= 25 °C, V
A
150
300348MHz
387470MHz
779956MHz
= 3.0 V. All performance is referred
BAT
174MHz
-
500kBaud
-
14/91Doc ID 022758 Rev 2
SPIRIT1Characteristics
Table 8.Power consumption
SymbolParameterTest conditionsMin.Typ.Max.Unit
RX
(1)
(1)
(1)
(1)
(1)
(1)
2.5
650nA
950nA
400µA
4.5mA
9mA
21
22
19.5
21
6
6.5
7
7
nA
-
mA
I
BAT
1. See Table 17.
Supply current
Shutdown
Standby
Sleep
Ready (default mode)
Tu ni n g
(1)
TX
+11 dBm 169 MHz
(1)
TX
+11 dBm 315 MHz
(1)
TX
+11 dBm 433 MHz
(1)
TX
+11 dBm 868 MHz
(1)
TX
-8 dBm 169 MHz
(1)
TX
-8 dBm 315 MHz
(1)
TX
-7 dBm 433 MHz
(1)
TX
-7 dBm 868 MHz
6.2.2 Digital SPI
Table 9.Digital SPI input and output (SDO, SDI, SCLK, CSn, and SDN) and GPIO
SymbolParameterTest conditionMin.Typ.Max.Unit
Clock frequency10MHz
clk
Port I/O capacitance1.4pF
IN
Rise time
Fall time
Logic high level input
IH
voltage
T
T
f
C
RISE
FAL L
V
specification (GPIO_1-4)
0.1*VDD to 0.9*VDD,
CL=20 pF (low output
current programming)
0.1*VDD to 0.9*VDD,
CL=20 pF (high output
current programming)
0.1*VDD to 0.9*VDD,
CL=20 pF (low output
current programming)
0.1*VDD to 0.9*VDD,
CL=20 pF (high output
current programming)
VDD/2
+0.3
3.5
ns
2
5.5
ns
2.8
V
V
Logic low level input
IL
voltage
VDD/8
+0.3
V
Doc ID 022758 Rev 215/91
CharacteristicsSPIRIT1
Table 9.Digital SPI input and output (SDO, SDI, SCLK, CSn, and SDN) and GPIO
specification (GPIO_1-4) (continued)
SymbolParameterTest conditionMin.Typ.Max.Unit
IOH = -2.4 mA (-4.2 mA if
V
V
High level output voltage
OH
Low level output voltage
OL
high output current
capability is
programmed).
IOL = +2.4 mA (+4 mA if
high output current
capability is
programmed).
(5/8)*
VDD+
0.1
0.5V
6.2.3 RF receiver
Characteristics measured over recommended operating conditions unless otherwise
specified. All typical values are referred to T
= 25 °C, V
A
the RX signal. All performance is referred to a 50 Ohm antenna connector, via the reference
design.
Table 10.RF receiver characteristics
SymbolParameterTest conditionMin.Typ.Max.Unit
169.4-169.475 MHz, 433-435
RLReturn loss
CH
BW
Receiver channel bandwidth6800 kHz
MHz, 868-868.6 MHz, 310-320
MHz, 902-928 MHz
169MHz 2-FSK 1.2Kbps
(4 kHz dev. CH Filter=10kHz)
(1)
= 3.0 V, no frequency offset in
BAT
-10 dB
-117 dBm
V
169MHz GFSK (BT=0.5)
Sensitivity, 1% BER (according
to W-MBUS N mode
specification)
RX
SENS
Sensitivity, 1% PER (packet
length = 20 bytes) FEC
DISABLED
868 MHz GFSK 38.4 kbps
BT=1 (20kHz dev. CH BW=100
kHz), desired channel 3 dB
above the sensitivity limit, with
IQC correction.
@ 2 MHz offset, 868 MHz
GFSK 38.4kbps, desired
channel 3 dB above the
sensitivity limit
@ 10 MHz offset, 868 MHz
GFSK 38.4kbps, desired
channel 3 dB above the
sensitivity limit.
47dB
41dB
56dB
48dB
-42dBm
-40dBm
18/91Doc ID 022758 Rev 2
SPIRIT1Characteristics
Table 10.RF receiver characteristics (continued)
SymbolParameterTest conditionMin.Typ.Max.Unit
Below 1 GHz-58dBm
RX
SPUR
Spurious emissions (maximum
values according to ETSI EN
300 220-1)
Above 1 GHz up to 4 GHz for
frequency band < 470 MHz, up
to 6 GHz for frequency band >
-61dBm
470 MHz
1. Guaranteed in an entire single sub band. Reference design can be different for different application bands.
2. In OOK modulation, indicated value represents mean power.
3. Interferer is CW signal (as specified by ETSI EN 300 220 v1).
4. Blocker is CW signal (as specified by ETSI EN 300 220 v1)
6.2.4 RF transmitter
Characteristics measured over recommended operating conditions unless otherwise
specified. All typical values are referred to T
referred to a 50 Ohm antenna connector, via the reference design.
1. In ASK/OOK modulation, indicated value represents peak power.
46 + j36Ohm
25 + j27 Ohm
29 + j19 Ohm
34 - j7 Ohm
15 + j28 Ohm
42 - j15 Ohm
6.2.5 Crystal oscillator
Characteristics measured over recommended operating conditions unless otherwise
specified. All typical values are referred to T
= 25 °C, V
A
characteristics are referred to 915 MHz band.
Table 12.Crystal oscillator characteristics
SymbolParameterTest conditionsMin.Typ.Max.Unit
= 3.0 V. Frequency synthesizer
BAT
XTAL
F
TOL
Crystal frequency26MHz
F
Frequency tolerance
(1)
± 40ppm
100 Hz-90dBc/Hz
PN
XTAL
Minimum requirement on
external reference phase noise
mask (Fxo=26 MHz), to avoid
degradation on synthesizer
phase/noise
1 kHz-120dBc/Hz
10 kHz-135dBc/Hz
100 kHz-140dBc/Hz
1 MHz-140dBc/Hz
T
START
1. Including initial tolerance, crystal loading, aging, and temperature dependence. The acceptable crystal tolerance depends
on RF frequency and channel spacing/bandwidth.
2. Startup times are crystal dependent. The crystal oscillator transconductance can be tuned to compensate the variation of
crystal oscillator series resistance.
Startup time
(2)
V
=1.8 V100280300µs
BAT
Doc ID 022758 Rev 223/91
CharacteristicsSPIRIT1
Table 13.Ultra low power RC oscillator
SymbolParameterTest conditionsMin.Typ.Max.Unit
Calibrated RC oscillator
RC
Calibrated frequency
F
frequency is derived from
crystal oscillator frequency.
Digital clock domain 26 MHz
34.7kHz
-
RC
TOL
Frequency accuracy after
calibration
±1%
Table 14.N-Fractional ΣΔ frequency synthesizer characteristics
SymbolParameterTest conditionsMin.Typ.Max.Unit
F
RES
Frequency resolution-100Hz
10 kHz-100-97-94dBc/Hz
100 kHz-104-101-99dBc/Hz
PN
SYNTH
RF carrier phase noise
(915 MHz band)
200 kHz-105-102-100dBc/Hz
500 kHz-112-110-107dBc/Hz
1 MHz-120-118-116dBc/Hz
2 MHz-123-121-119dBc/Hz
TO
SET
CAL
TIME
PLL turn-on/hop time6080µs
PLL RX/TX settling time
TIME
PLL calibration time54µs
TIME
Settling time from RX to TX
and from TX to RX
8.5µs
6.2.6 Sensors
Characteristics measured over recommended operating conditions unless otherwise
specified. All typical values are referred to T
Table 15.Analog temperature sensor characteristics
= 25 °C, V
A
(1)
SymbolParameterTest conditionsMin.Typ.Max.Unit
T
T
SLOPE
V
TS-OUT
Error in temperatureAcross all the temperature range±2.5°C
ERR
Temperature coefficient2.5
Output voltage level0.92V
Buffered output (low output
impedance, about 400 Ohm)
T
Current consumption
ICC
Not buffered output (high output
impedance, about 100 kΩ)
1. The temperature readout is a trigger based function. Some processing time is allowed. So, start of conversion trigger ->
end of conversion status + read out register.
24/91Doc ID 022758 Rev 2
BAT
= 3.0 V.
600µA
10µA
mV/
°C
SPIRIT1Characteristics
Table 16.Battery indicator and low battery detector
(1)
SymbolParameterTest conditionsMin.Typ.Max.Unit
V
Battery level thresholds2.12.7V
BLT
Measured in slow battery
variation (static) conditions
1.535V
(inaccurate)
V
Brownout threshold
BOT
Measured in slow battery
variation (static) conditions
1.684V
(accurate)
BOT
1. For battery powered equipment, the TX does not transmit at a wrong frequency under low battery voltage conditions. It
either remains on channel or stops transmitting. The latter can of course be realized by using a lock detect and/or by
switching off the PA under control of the battery monitor. For testing reasons this control is enabled/disabled by SPI.
Brownout threshold hysteresis70mV
hyst
Doc ID 022758 Rev 225/91
Operating modesSPIRIT1
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7 Operating modes
The SPIRIT1 is provided with a built-in main controller which controls the switching between
the two main operating modes: transmit (TX) and receive (RX).
In shutdown condition (the SPIRIT1 can be switched on/off with the external pin SDN, all
other functions/registers/commands are available through the SPI interface and GPIOs), no
internal supply is generated (in order to have minimum battery leakage), and hence, all
stored data and configurations are lost. From shutdown, the SPIRIT1 can be switched on
from the SDN pin and goes into READY state, which is the default, where the reference
signal from XO is available.
From READY state, the SPIRIT1 can be moved to LOCK state to generate the high
precision LO signal and/or TX or RX modes. Switching from RX to TX and vice versa can
happen only by passing through the LOCK state. This operation is normally managed by
radio control with a single user command (TX or RX). At the end of the operations above,
the SPIRIT1 can return to its default state (READY) and can then be put into a sleeping
condition (SLEEP state), having very low power consumption. If no timeout is required, the
SPIRIT1 can be moved from READY to STANDBY state, which has the lowest possible
current consumption while retaining FIFO, status and configuration registers. To manage the
transitions towards and between these operating modes, the controller works as a statemachine, whose state switching is driven by SPI commands. See Figure 3 for state diagram
and transition time between states.
Figure 3.Diagram and transition
The SPIRIT1 radio control has three stable states (READY, STANDBY, LOCK) which may be
defined stable, and they are accessed by the specific commands (respectively READY,
26/91Doc ID 022758 Rev 2
SPIRIT1Operating modes
STANDBY, and LOCKRX/LOCKTX), which can be left only if any other command is used. All
other states are transient, which means that, in a typical configuration, the controller
remains in those states, at most for any timeout timer duration. Also the READY and LOCK
states behave as transients when they are not directly accessed with the specific commands
(for example, when LOCK is temporarily used before reaching the TX or RX states).
Table 17.States
State/modeDigital LDOSPIXtalRF Synth.
SHUTDOWN
STANDBY
SLEEPOnOffOffOn350 µs350 µs
READY (Default)OnOnOffDon’t care110 µs110 µs
LOCKOnOnOnDon’t careNANA
RXOnOnOnDon’t care20 µsNA
TXOnOnOnDon’t careNA20 µs
OFF (register
contents lost)
ON (FIFO and
register
contents
retained)
OffOffOffOffNANA
OnOffOffOff320 µs320 µs
Wake-up
timer
Response time to
TXRX
Note:Response time SHUTDOWN to READY is ~1 ms.
READY state is the default state after the power-on reset event. In the steady condition, the
XO is settled and usable as the time reference for RCO calibration, for frequency synthesis,
and as the system clock for the digital circuits.
The TX and RX modes can be activated directly by the MCU using the TX and RX
commands, or automatically if the state machine wakes up from SLEEP mode and some
previous TX or RX is pending.
(a)
In LOCK state the synthesizer is in a locking condition
. If LOCK state is reached using
either one of the two specific commands (LOCKTX or LOCKRX), the state machine remains
in LOCK state and waits for the next command. This feature can be used by the MCU to
perform preliminary calibrations, as the MCU can read the calibration word in the
RCO_VCO_CALIBR_OUT register and store it in a non-volatile memory, and after that it
requires a further tuning cycle.
When TX is activated by the TX command, the state machine goes into TX state and
remains there until the current packet is fully transmitted or, in the case of direct mode TX,
TXFIFO underflow condition is reached or the SABORT command is applied.
a. LOCK state is reached when one of the following events occurs first: lock detector assertion or locking timeout
expiration.
Doc ID 022758 Rev 227/91
Operating modesSPIRIT1
After TX completion, the possible destinations are:
●TX, if the persistent-TX option is enabled in the PROTOCOL configuration registers
●PROTOCOL, if some protocol option (e.g. automatic re-transmission) is enabled
●READY, if TX is completed and no protocol option is in progress.
Similarly, when RX is activated by the RX command, the state machine goes into RX state
and remains there until the packet is successfully received or the RX timeout expires. In
case of direct mode RX, the RX stops when the RXFIFO overflow condition is reached or
the SABORT command is applied. After RX completion, the possible destinations are:
●RX, if the persistent-RX option is enabled in the PROTOCOL configuration registers
●PROTOCOL, if some protocol option (e.g. automatic acknowledgement) is enabled
●READY, if RX is completed and the LDCR mode is not active
●SLEEP, if RX is completed and the LDCR mode is active.
The SABORT command can always be used in TX or RX state to break any deadlock
condition and the subsequent destination depends on SPIRIT1 programming according to
the description above.
Commands are used in the SPIRIT1 to change the operating mode, to enable/disable
functions, and so on. A command is sent on the SPI interface and may be followed by any
other SPI access without pulling CSn high.
The complete list of commands is reported in Ta bl e 18 . Note that the command code is the
second byte to be sent on the MOSI pin (the first byte must be 0x80).
Table 18.Commands list
Command
code
0x60TXREADYStart to transmit
0x61RXREADYStart to receive
0x62READY
0x63STANDBYREADYGo to STANDBY
0x64SLEEPREADYGo to SLEEP
0x65LOCKRXREADY
0x66LOCKTXREADY
0x67SABORTTX, RXExit from TX or RX states and go to READY state
0x68LDC_RELOADAll
0x69
Command nameExecution stateDescription
SEQUENCE_UPDA
TE
STANDBY, SLEEP,
LOCK
All
Go to READY
Go to LOCK state by using the RX configuration of the
synthesizer
Go to LOCK state by using the TX configuration of the
synthesizer
Reload the LDC timer with the value stored in the
LDC_PRESCALER/COUNTER registers
Reload the packet sequence counter with the value
stored in the PROTOCOL[2] register.
0x6AAES EncAllStart the encryption routine
0x6BAES KeyAllStart the procedure to compute the key for decryption
0x6CAES DecAllStart decryption using the current key
28/91Doc ID 022758 Rev 2
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