The various sensing elements are manufactured
using specialized micromachining processes,
while the IC interfaces are developed using a
CMOS technology that allows the design of a
dedicated circuit which is trimmed to better match
the sensing element characteristics.
The LSM330 has an user-selectable full scale
acceleration range of ±2 g/±4 g/±6 g/±8 g/±16 g
and angular rate range of ±250/±500/±2000
d.The accelerometer and gyroscope sensors can
be either activated or separately put in Powerdown/ sleep mode for applications optimized for
power saving.
The LSM330 is available in a plastic land grid
array (LGA) package.
Table 1.Device summary
Part number
LSM330-40 to +85
LSM330TR-40 to +85
Temperature
range [°C]
PackagePacking
LGA-24L
(3x3.5x1mm)
Tr a y
Tape
and reel
The LSM330 is a system-in-package featuring a
3D digital accelerometer with two embedded state
machines that can be programmed to implement
autonomous applications and a 3D digital
gyroscope.
ST’s family of MEMS sensor modules leverages
the robust and mature manufacturing processes
already used for the production of micromachined
accelerometers and gyroscopes.
July 2012Doc ID 023426 Rev 11/76
This is preliminary information on a new product foreseen to be developed. Details are subject to change without notice.
I2C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
Gyroscope:
SPI serial data output (SDO)
2
I
C least significant bit of the device address (SA0)
Accelerometer:
SPI serial data output (SDO)
2
I
C least significant bit of the device address (SA0)
Gyroscope: SPI enable
2
C/SPI mode selection (1: SPI idle mode / I2C communication
I
enabled; 0: SPI communication mode / I
Accelerometer: SPI enable
2
I
C/SPI mode selection (1: SPI idle mode / I2C communication
enabled; 0: SPI communication mode / I
Gyroscope Data Ready/FIFO Interrupt
(Watermark/Overrun/Empty)
2
C disabled)
2
C disabled)
LSM330Block diagram and pin description
Table 2.Pin description (continued)
Pin#NameFunction
10INT1_GGyroscope interrupt signal
11INT1_AAccelerometer interrupt1 signal
12INT2_AAccelerometer interrupt2 signal
13DEN_GGyroscope Data Enable
14ResReserved. Connect to GND
15ResReserved. Connect to GND
16ResReserved. Connect to GND
17ResReserved. Connect to GND
18ResReserved. Connect to GND
19GND0 V supply
20GND0 V supply
21CAPConnect to GND with ceramic capacitor
22Vdd
23Vdd
24Vdd
(3)
(3)
(3)
Power supply
Power supply
Power supply
(2)
1. 100 nF filter capacitor recommended.
2. 10 nF (+/- 10%), 25V. 1nF minimum value has to be guaranteed under 11V bias condition1.
3. 100 nF plus 10 µF capacitors recommended.
Doc ID 023426 Rev 113/76
Module specificationsLSM330
2 Module specifications
2.1 Mechanical characteristics
@ Vdd = 3V, T = 25 °C unless otherwise noted
Table 3.Mechanical characteristics
SymbolParameterTest conditionsMin.Typ.
FS bit set to 000±2.0
FS bit set to 001±4.0
LA_FS
G_FS
LA_SoLinear acceleration sensitivity
G_SoAngular rate sensitivity
LA_TyOff
G_TyOff
TopOperating temperature range-40+85°C
1. Typical specifications are not guaranteed.
2. Verified by wafer level test and measurement of initial offset and sensitivity.
3. Typical zero-g level offset value after MSL3 preconditioning.
4. Offset can be eliminated by enabling the built-in high-pass filter.
Linear acceleration measurement
(2)
range
Angular rate
measurement range
Linear acceleration typical zero-g
level offset accuracy
Angular rate typical zero-rate
(4)
level
(3)
(3)
FS bit set to 010±6.0
FS bit set to 011±8.0
FS bit set to 100±16.0
FS bit set to 00±250
FS bit set to 10±2000
FS bit set to 0000.061
FS bit set to 0010.122
FS bit set to 0100.183
FS bit set to 0110.244
FS bit set to 1000.732
FS = ±250 dps8.75
FS = ±500 dps17.50
FS = ±2000 dps70
FS bit set to 000±60mg
FS = 250 dps±10
FS = 2000 dps±25
(a)
(1)
Max.Unit
g
dpsFS bit set to 01±500
mg/digit
mdps/
digit
dpsFS = 500 dps±15
a. The product is factory calibrated at 3.0 V. The operational power supply range is from 2.4 V to 3.6 V.
14/76Doc ID 023426 Rev 1
LSM330Module specifications
2.2 Electrical characteristics
@ Vdd = 3 V, T = 25 °C unless otherwise noted
Table 4.Electrical characteristics
SymbolParameterTest conditionsMin.Typ.
VddSupply voltage2.43.6V
Vdd_IOPower supply for I/O1.71Vdd+0.1V
(1)
Max.Unit
LA_Idd
LA_IddPdn
G_Idd
G_IddLowP
G_IddPdn
VIHDigital high level input voltage0.8*Vdd_IOV
VILDigital low level input voltage0.2*Vdd_IOV
VOHHigh level output voltage0.9*Vdd_IOV
VOLLow level output voltage0.1*Vdd_IOV
TopOperating temperature range-40+85
1. Typical specifications are not guaranteed.
2. Sleep mode introduces a faster turn-on time compared to Power-down mode.
Accelerometer current
consumption in Normal mode
Accelerometer current
consumption in Power-down
mode
Gyroscope current
consumption in Normal mode
Gyroscope supply current
in Sleep mode
Gyroscope current
consumption in Power-down
mode
(2)
1.6 kHz ODR 250
3.125 Hz ODR10
1µA
6.1mA
2mA
5µA
µA
°C
2.3 Temperature sensor characteristics
@ Vdd = 3V, T = 25 °C unless otherwise noted
Table 5.Temperature sensor characteristics
SymbolParameterTest conditionMin.Typ.
TSDr
TODRTemperature refresh rate1Hz
Top Operating temperature range-40+85°C
1. Typical specifications are not guaranteed.
Temperature sensor output
change vs. temperature
-
b. The product is factory calibrated at 3.0 V.
Doc ID 023426 Rev 115/76
(b)
(1)
-1°C/digit
Max.Unit
Module specificationsLSM330
SPC
CS
SD I
SD O
t
su (CS)
t
v(SO)
t
h(SO )
t
h(SI)
t
su (SI)
t
h(CS)
t
dis(SO)
t
c(SPC )
MSB IN
MSB OUT
LSB OUT
LSB IN
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
2.4 Communication interface characteristics
2.4.1 SPI - serial peripheral interface
Subject to general operating conditions for Vdd and TOP.
Table 6.SPI slave timing values
(2)
Symbol
Parameter
(1)
tc(SPC)SPI clock cycle100ns
fc(SPC)SPI clock frequency10MHz
tsu(CS)CS setup time6
th(CS)CS hold time8
tsu(SI)SDI input setup time5
th(SI)SDI input hold time15
tv(SO)SDO valid output time50
th(SO)SDO output hold time9
tdis(SO)SDO output disable time50
Val ue
Unit
MinMax
ns
1. Data on CS, SPC, SDI and SDO refer to pins:CS_A, CS_G, SCL_A/G, SDA_A/G, SDO_A / SDO_G.
2. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results. Not
tested in production.
(c)
Figure 3.SPI slave timing diagram
2. Data on CS, SPC, SDI and SDO refer to pins:CS_A, CS_G, SCL_A/G, SDA_A/G, SDO_A / SDO_G.
c. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output ports.
16/76Doc ID 023426 Rev 1
LSM330Module specifications
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2.4.2 I2C - inter IC control interface
Subject to general operating conditions for Vdd and TOP.
Table 7.I2C slave timing values
SymbolParameter
(1)
I2C standard mode
(1)
I2C fast mode
Min.Max.Min.Max.
(1)
Unit
f
(SCL)
t
w(SCLL)
t
w(SCLH)
t
su(SDA)
t
h(SDA)
t
r(SDA) tr(SCL)
t
f(SDA) tf(SCL)
t
h(ST)
t
su(SR)
t
su(SP)
t
w(SP:SR)
1. SCL (SCL_A/G pin), SDA (SDA_A/G pin).
2. Cb = total capacitance of one bus line, in pF
Figure 4.I
SCL clock frequency01000400KHz
SCL clock low time4.71.3
SCL clock high time4.00.6
SDA setup time250100ns
SDA data hold time0.013.4500.9µs
SDA and SCL rise time1000
SDA and SCL fall time300
START condition hold time40.6
Repeated START condition
setup time
STOP condition setup time40.6
Bus free time between STOP
and START condition
2
C slave timing diagram
(d)
20 + 0.1C
20 + 0.1C
4.70.6
4.71.3
b
b
(2)
(2)
µs
300
ns
300
µs
d. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both ports.
Doc ID 023426 Rev 117/76
Module specificationsLSM330
This is a mechanical shock sensitive device, improper handling can cause permanent
damage to the part.
This is an ESD sensitive device, improper handling can cause permanent damage to
the part.
2.5 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 8.Absolute maximum ratings
SymbolRatingsMaximum valueUnit
VddSupply voltage-0.3 to 4.8V
Vdd_IOI/O pins supply voltage-0.3 to 4.8V
(1)
Vin
Input voltage on any control pin (SCL_A/G, SDA_A/G,
SDO_A, SDO_G, CS_A, CS_G, DEN_G)
-0.3 to Vdd_IO +0.3V
3000 g for 0.5 ms
A
POW
Acceleration (any axis, powered, Vdd = 3 V)
10000 g for 0.1 ms
3000 g for 0.5 ms
A
T
UNP
T
STG
Acceleration (any axis, unpowered)
10000 g for 0.1 ms
Operating temperature range-40 to +85°C
OP
Storage temperature range-40 to +125°C
ESDElectrostatic discharge protection2 (HBM)kV
1. Supply voltage on any pin should never exceed 4.8 V.
18/76Doc ID 023426 Rev 1
LSM330Terminology
3 Terminology
3.1 Sensitivity
Linear acceleration sensitivity can be determined e.g. by applying 1 g acceleration to the
device. Because the sensor can measure DC accelerations, this can be done easily by
pointing the selected axis towards the ground, noting the output value, rotating the sensor
180 degrees (pointing towards the sky) and noting the output value again. By doing so, ±1 g
acceleration is applied to the sensor. Subtracting the larger output value from the smaller
one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This value
changes very little over temperature and over time. The sensitivity tolerance describes the
range of sensitivities of a large number of sensors.
Angular Rate Sensitivity describes the angular rate gain of the sensor and can be
determined by applying a defined angular velocity to the device. This value changes very
little overtemperature and also very little overtime.
3.2 Zero-g and zero rate level
Linear acceleration zero-g level offset (TyOff) describes the deviation of an actual output
signal from the ideal output signal if no acceleration is present. A sensor in a steady state on
a horizontal surface will measure 0 g on both the X axis and Y axes, whereas the Z axis will
measure 1 g. Ideally, the output is in the middle of the dynamic range of the sensor (content
of OUT registers 00h, data expressed as 2’s complement number). A deviation from the
ideal value in this case is called zero-g offset.
Offset is to some extent a result of stress to MEMS sensor and therefore the offset can
slightly change after mounting the sensor onto a printed circuit board or exposing it to
extensive mechanical stress. Offset changes little over temperature, see “Linear
acceleration zero-g level change vs. temperature” in Ta bl e 3 . The zero-g level tolerance
(TyOff) describes the standard deviation of the range of zero-g levels of a group of sensors.
Angular rate zero-rate level describes the actual output value if there is no angular rate
present. zero-rate level of precise MEMS sensors is, to some extent, a result of stress to the
sensor and therefore zero-rate level can slightly change after mounting the sensor onto a
printed circuit board or after exposing it to extensive mechanical stress. This value changes
very little overtemperature and overtime.
Doc ID 023426 Rev 119/76
FunctionalityLSM330
4 Functionality
The LSM330 is a system-in-package featuring a 3D digital accelerometer with two
embedded state machines and a 3D digital gyroscope, together with two FIFO memory
block available to manage linear acceleration and angular rate data.
The device includes specific sensing elements and two IC interfaces capable to measuring
both the acceleration and angular rate applied to the module and to provide a signal to
external applications through an SPI/I
The various sensing elements are manufactured using specialized micromachining
processes, while the IC interfaces are developed using a CMOS technology that allows the
design of a dedicated circuit which is trimmed to better match the sensing element
characteristics.
4.1 Power modes
The linear acceleration sensor and the angular rate sensor can be either activated or
separately set in Power-down/ sleep mode for applications optimized for power saving.
The acceleration sensor operating modes can be selected between normal or power-down
trough the CTRL_REG5_A (20h); the angular rate sensor operating mode can be selected
among normal power-down or sleep mode, through CTRL_REG1_G (20h).
2
C serial interface.
4.2 Linear acceleration sensor digital main blocks
4.2.1 State machine
The LSM330 embeds two state machines able to run a user defined program.
The program is composed by a set of instructions that define the transition to successive
states. Conditional branches are possible.
From each state (n) it is possible to have transition to next state (n+1) or to reset state.
Transition to Reset Point happens when “RESET condition” is true; Transition to next step
happens when “NEXT condition” is true.
Interrupt is triggered when Output/Stop/Continue state is reached.
Each State machine allows to implement in a flexible way gesture recognition, Free Fall,
Wake-up, 4D/6D orientation, pulse counter and step recognition, click/double click,
shake/double shake, face up/face down, turn/double turn:
–Code and parameters are loaded by host into dedicated memory areas for the
state program
–State program with timing based on ODR or decimated time
–Possibiliy of conditional branches
20/76Doc ID 023426 Rev 1
LSM330Functionality
State 1
State 2
next
State 3
next
State n
next
reset
reset
reset
reset
START
OUTPUT/STOP/CONTINUE
INT set
AM14725v1
Table 9.LSM330 accelerometer state machines: sequence of state to execute an
algorithm
4.2.2 FIFO
LSM330 embeds 32 slots of data FIFO for each of the three acceleration output
channels: X, Y and Z. This allows consistent power saving for the system, since the host
processor does not need to continuously poll data from the sensor, but it can wake up only
when needed and burst the significant data out from the FIFO. In order to use FIFO it is
necessary to enable FIFO_EN bit inCTRL_REG7_A (25h)register.
FIFO buffer can work accordingly in five different modes: Bypass mode, FIFO mode, Stream
mode, Stream-to-FIFO mode and Bypass-to-Stream mode. Each mode is selected by
FMODE [2:0] bits in the FIFO_CTRL_REG_A (2Eh) register. Programmable watermark
level, FIFO empty or FIFO overrun events can be enabled to generate dedicated interrupts
on the INT1_A/INT2_A pin (configured through INT2_EN and INT1_EN bits in the
CTRL_REG4_A (23h) register).
When FIFO is empty, EMPTY bit in FIFO_SRC_REG_A (2Fh) is equal to '1' and no samples
are available.
If the application requires a lower number of samples a programmable watermark level can
be set. In FIFO_SRC_REG_A (2Fh) WTM bit is high if a new data arrives and FSS [4:0] bit
in FIFO_SRC_REG_A (2Fh) is greater than or equal to WTMP [4:0] bit in
FIFO_CTRL_REG_A (2Eh) register. In FIFO_SRC_REG_A (2Fh) WTM bit goes to '0' if
reading X, Y, Z data slot from FIFO and FSS [4:0] bit in FIFO_SRC_REG_A (2Fh) is minor
than or equal to WTMP [4:0] bit in FIFO_CTRL_REG_A (2Eh) register.
When FIFO is completely filled, OVRN_FIFO bit in FIFO_SRC_REG_A (2Fh) is equal to '1'
and FIFO slot is overwritten.
Doc ID 023426 Rev 121/76
FunctionalityLSM330
4.2.3 Bypass mode
In Bypass mode, the FIFO is not operational and it remains empty. For each channel only
the first address is used. The remaining FIFO slots are empty.
Bypass mode must be used in order to reset the FIFO buffer when a different mode is
operating (i.e. FIFO mode).
4.2.4 FIFO mode
In FIFO mode, the buffer continues filling data from the X, Y and Z accelerometer channels
until it is full (32 samples set stored). When the FIFO is full it stops collecting data from the
input channels and the FIFO content remains unchanged.
An overrun interrupt can be enabled, P1_OVERRUN = '1' in CTRL_REG7_A (25h) register,
in order to be raised when the FIFO stops collecting data. When overrun interrupt occurs,
the first data has been overwritten and the FIFO stops collecting data from the input
channels.
At the end of the reading procedure it is necessary to transit from Bypass mode to reset
FIFO content. . After this reset command it is possible to restart FIFO mode writing FMODE
[2:0] the value '001' in FIFO_CTRL_REG_A (2Eh) register.
FIFO buffer can memorize 32 X, Y and Z data but the depth of the FIFO can be reduced by
a programmable watermark. In order to enable FIFO watermark, WTM_EN bit in
CTRL_REG7_A (25h) is high and the FIFO depth is set in WTMP [4:0] bits in
FIFO_CTRL_REG_A (2Eh) register. The watermark interrupt can be enable in INT1_A pad
if P1_WTMbit in CTRL_REG7_A (25h) register is enable.
4.2.5 Stream mode
In Stream mode FIFO continues filling data from X, Y, and Z accelerometer channels, when
the buffer is full (32 samples set stored) the FIFO buffer index restarts from the beginning
and older data is replaced by the current. The oldest values continue to be overwritten until
a read operation makes free FIFO slots available.
An overrun interrupt can be enabled, P1_OVERRUN = '1' in CTRL_REG7_A (25h) register,
in order to read the whole FIFO content at once. If in the application it is mandatory not to
lose data and it is not possible to read at least one sample for each axis within one ODR
period, a watermark interrupt can be enabled in order to read partially the FIFO and let free
memory slots for data incoming.
Setting the WTMP [4:0] bit in FIFO_CTRL_REG_A (2Eh) register to N value, the number of
X, Y and Z data samples that should be read at watermark interrupt rising is up to (N+1).
In the latter case reading all FIFO content before an overrun interrupt has occurred, the first
data read is equal to the last already read in previous burst, so the number of new data
available in FIFO depends on previous reading (see FIFO_SRC_REG_A (2Fh)) .
At the end of the reading procedure it is necessary to transit from Bypass mode to reset
FIFO content.
4.2.6 Stream-to-FIFO mode
In Stream-to-FIFO mode FIFO behavior changes according to interrupt generated by the
configuration of the two state machine by INT_SM1and INT_SM2 bits in STAT (18h) register.
22/76Doc ID 023426 Rev 1
LSM330Functionality
ADC
LPF1
HPF
0
1
HPen
LPF2
10
11
01
00
Out_Sel
DataReg
00
11
10
01
Interrupt
generator
INT_Sel
I2C
SPI
INT1
SCR REG
CONF REG
FIFO
32x16x3
AM07230v1
When INT_SM1, INT_SM2 bits in STAT (18h) register are equal to '1' FIFO operates in FIFO
mode, when INT_SM1, INT_SM2 bit in STAT (18h) register are equal to '0' FIFO operates in
Stream mode.
4.2.7 Bypass-to-stream mode
In Bypass-to-stream mode, the FIFO starts operating in Bypass mode and once a trigger
event occurs (STAT (18h) the FIFO starts operating in Stream mode.
4.2.8 Retrieve data from FIFO
FIFO data is read through OUT_X_L_A (28h) and OUT_X_H_A (29h), OUT_Y_L_A (2Ah)
and OUT_Y_H_A (2Bh) and OUT_Z_L_A (2Ch) and OUT_Z_H_A (2Dh). When the FIFO is
in Stream, Trigger or FIFO mode, a read operation to the OUT_X_L_A (28h) and
OUT_X_H_A (29h), OUT_Y_L_A (2Ah) and OUT_Y_H_A (2Bh) or OUT_Z_L_A (2Ch) and
OUT_Z_H_A (2Dh) registers provides the data stored in the FIFO. Each time data is read
from the FIFO, the oldest X, Y and Z data are placed in the OUT_X_L_A (28h) and
OUT_X_H_A (29h), OUT_Y_L_A (2Ah) and OUT_Y_H_A (2Bh) and OUT_Z_L_A (2Ch)
and OUT_Z_H_A (2Dh) registers and both single read and read_burst operations can be
used.
4.3 Angular rate sensor digital main blocks
Figure 5.Angular rate sensor digital block diagram
Doc ID 023426 Rev 123/76
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