The electrical characteristics are valid within the defined Operating Conditions, unless otherwise specified.
The function is guaranteed by design until T
SymbolParameterTest ConditionMin. Typ.Max.Unit
SUPPLY
Quiescent currentVS ≤ 14V; VEN ≤ 0.3V
I
Q
switch-on-threshold.
JSDon
T
85 °C
amb
VS ≤ 14V; VEN ≤ 0.3V
Ta 150°C
VS ≤ 14V; EN = high, Output = off
EN = high, Output = on
< 210µA
50µA
12
3.5
mA
mA
Inputs, IN1 - IN4; Programming, PRG
V
INlow
V
INhigh
R
Note 3) : Current direction depends on the programming settin g (PRG=high leads into a positi ve current see also Blockdi agram page 1)
Input voltage LOW-14 1V
Input voltage HIGH 245V
I
Input current
IN
Input impedanceVIN < 0V; VIN > V
IN
0V ≤ V
IN
≤ 45V
3)
S
-2550µA
1060kΩ
Enable EN
V
ENlow
V
ENhigh
R
I
Input voltage LOW-141V
Input voltage HIGH 245V
Input impedance-14V < VEN < 1.5V5kΩ
EN
Input current 1.5V < VEN < 45V580µA
EN
4/13
L9333
ELECTRICAL CHARACTERISTCS
(continued)
SymbolParameterTest ConditionMin. Typ.Max.Unit
Outputs OUT1- OUT4
R
DSon
I
OLeak
Output ON-resistorVS > 6V, IO = 0.3A 1.73.8Ω
Leakage current VO = VS = 14V; Ta < 125°C 15µA
Output voltage LOW IDL = 0.6mA0.8V
Max. output current internal current limitation; VD =
1515mA
14V
I
DLeak
Leakage current VD = VS = 14 V; Ta < 125 °C 0.11µA
VD = VS = 14 V; Ta < 150 °C 5µA
Timing Characteristics
4)
t
d,on
t
d,off
t
t
d,DIAG
S
Note : All para m eters are meas ured at 125°C.
Note 4) : See als o F i g.3 Timing Characteristics
On delay time VS = 14V
Off delay time 34.5µs
Enable settling time 20µs
set
ON or OFF Diagnostic delay time10µs
Output voltage slopes 2.5916V/µs
out
C
= 0F; L
ext
ext
= 0H
only testing condition
≤ I
≤ 200mA
0
10mA
23.5µs
5/13
L9333
Figure 1. Tim in g C haracteristic s
V
EN
Active
V
PRG
V
OUT
0.8 V
t
Non-Inverting ModeInverting Mode
t
V
IN
t
V
S
S
5)
0.2 V
S
t
set
Note 5) : Output voltage slope not controlled for enable low!
t
d,off
t
d,on
6/13
t
t
set
L9333
FUNCTIONAL DESCRIPTION
The L9333 is a quad low si de dr iver for l ines, l amps or i nductive loads in automoti ve and i ndustr ial a pplicati ons.
The logic input levels are 3.3V CMOS compatible. This allows the device to be driven directly by a microcon-
troller. For the noise immunity, all input thresholds have a hysteresis of typ. 100mV. Each input (IN, EN and
PRG) is protected to withstand vol tages from -14V to 45V. The device is activated with a ' high' sign al on ENable.
ENable 'low' switches the device into the sleep mode. In this mode the quiescent current is typically less than
2µA. A high signal on PRoGramming input c hanges the signal transfer polarity from noninv erting to the inv erting
mode. This pin can be connected either to V
PRG and EN pin is low. For packaged applications it is still recommended to connect all input pins to ground
respective VS to avoid EMC influence. The forced condition leads to a mode change if the PRG pin was high
before the interrupti on. Independent of the PRoGramming input, the OUTput switches off, i f the s ignal INput pin
is not connected. This function is verified using a leakage current of 5µA (sink for PRG=high; source for
PRG=low) during circuit test.
Each output driver has a current limitation of min 0.4A and an independent thermal shut-down. The thermal
shut-down deactivates that output, which exceeds temperature switch off lev el. When the juncti on temperatur e
decreases 20K below this temperature threshold the output will be activated again. This 20K is the hysteresis
of the thermal shutdown function. The Gates, of the output DMOS transistors are charged and discharged with
a current source. Therefore the output slope is limited. This reduces the electromagnetic radiation. For inductive loads an output voltage clamp of typically 52V is implemented.
The DIAGnostic is an open drain output. The logic status depends on the PRoGramming pin. If the PRG pin is
'low' the DIAG output becomes low, if the device works correctly. At thermal shut-down of one channel or if the
ground is disconnected the DIAGnostic output becomes high. If the PRG pin is 'high' this output is switched off
at normal function and switched on at overtemper ature. For the fault conditi on of inter rupted ground, the potential of VS and Diagnostic should be equal.
or GND. If these pins are not connected, the forced status of the
Measurement setup:
DUT mounted on a specific application board is driven in a typical application circuit (see below). Two devices
are stimulated by a generator to read and write bus signals. They will be monitored externally to ensure proper
function.
Measurement method:
a)The two bus lines are transferred 2m under a terminated stripline. That's where they were exposed to the
RF-field. Stripline setup and measurement method is described in DIN 40839-4 or ISO 11452-5.
b)DUT mounted on the same application board is exposed to RF through the tophole of a TEM-cell. Mea-
surement method according SAE J1752.
c)The tw o bus lines are transferred into a BCI current injection probe. Setup and measurement method is
described in ISO 11452-4.
Failure criteria:
Failure monitoring is done by envelope measurement of the logic signals with a LeCroy oscilloscope with acceptance levels of 20% in amplitude and 2% time.
Limits:
The device is measured within the described setup and limits without fail function.
The Electromagnetic Susceptivity is not tested in production.
a) Field strength under stripline of > 250V/m in the frequency range 1 - 400MHz modulation:AM 1kHz 80%.
b) Field strength in TEM-cell of > 500V/m in the frequency range 1 - 400MHz modulation:AM 1kHz 80%.
c) RF-currents with BCI of > 100mA in the frequency range 1 - 400MHz modulation:AM 1kHz 80%.
Measured Circuit
The EMS of the device was verified in the below described setup.
9/13
L9333
Figure 4.
11
Jumper
ANECHOIC CHAMBER
SMBYW01-20 0
1
Ω
100
∗
optional
4
Ω
20k
Ω
10k
Ω
10k
4.7nF 4.7nF
10nF
33µF
SM6T39A
Jumper
14
19
DIAG
VSENPRG
Ω
10k
∗
4
16
8
13
OUT1
7
1nF
∗
4
optional
OUT2
OUT3
4.7nF
OUT4
GND
L9333
IN1
IN2
IN3
IN4
4.7n
∗
4
4
5
17
9
10/13
2m
Stripline
Flat cable
11
1
9
14
13
8
7
16
125Hz
17
2
250Hz
f
U(t)
4
2
f
2
500Hz
f
14V
-
+
5
1kHz
L9333
DIM.
MIN.TYP.MAX.MIN.TYP.MAX.
A2.352.650 .0930.104
A10.10.30.0040.012
B0.330.510 .0130.020
C0.230.320.0090.013
D12.6130.4960.512
E7.47.60.2910.299
e1.270.050
H1010.65 0.3940.419
h0.250.750.0100.030
L0.41.270.0160.050
K0˚ (min.)8˚ (max.)
mminch
OUTLINE AND
MECHANICAL DATA
SO20 (12+4+4)
B
e
D
1120
110
PAD
L
h x 45˚
A
K
A1
C
H
E
SO20MEC
11/13
L9333
L9333
12/13
L9333
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implic ation or otherwise unde r any patent or patent right s of STMic roelectronics. Specifications ment i oned in this p ublication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics product s are not
authorized for use as crit i cal component s in l i fe support devi ces or systems wi t hout express written approva l of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
2001 STMi croelectroni cs - All Rights Reserved
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STMicroelectronics GROUP OF COMPANIES
- Sweden - Sw itzerland - United Kingdo m - U.S.A.
http://www.s t. com
13/13
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