The controller is an integrated circuit realized in BCD5 (BiCMOS-DMOS, version 5)
fabrication that provides complete control logic and protection for high performance stepdown DC-DC and niPoL converters.
It is designed to drive N-channel MOSFETs in a synchronous rectified buck topology. The
output voltage of the converter can be precisely regulated down to 600 mV with a maximum
tolerance of ±0.8 % and it is also possible to use an external reference from 0 V to 2.5 V.
The input voltage can range from 1.8 V to 14 V, while the supply voltage can range from
4.5 V to 14 V. High peak current gate drivers provide for fast switching to the external power
section, and the output current can be in excess of 20 A. The PWM duty cycle can range
from 0 % to 100 % with a minimum on-time (T
conversions with very low duty cycle at high switching frequency. The device provides
voltage-mode control that includes a selectable frequency oscillator (250 kHz or 500 kHz).
The error amplifier features a 10 MHz gain-bandwidth-product and 5 V/µs slew-rate that
permits to realize high converter bandwidth for fast transient response. The device monitors
the current by using the R
the need for a current sensing resistor and guaranteeing an effective over-current-protection
in all the application conditions. When necessary, two different current limit protections can
be externally set through two external resistors.
of both the high-side and low-side MOSFET(s), eliminating
DS(on)
ON, MIN
) lower than 100 ns making possible
During the soft-start phase a constant current protection is provided while after the soft-start
the device enters in hiccup mode in case of over-current. During the soft-start, the sink
mode capability is disabled in order to allow a proper start-up also in pre-biased output
voltage conditions. After the soft-start the device can sink current. Other features are
power good, master/slave synchronization (with 180° phase shift), over-voltage-protection,
feed-back disconnection and thermal shutdown. The HTSSOP16 package allows the
realization of really compact DC/DC converters.
4/37
L6732Summary description
1.1 Functional description
Figure 1.Block diagram
=
-
Vin=1.8V-14V
OCH
Monitor
Monitor
+
+
-
-
OCH
0.6V
OSC
OSC
VCCDR
VCCDR
LDO
LDO
L6732
-
-
+
+
+
+-+
PWM
PWM
E/A
E/A
-
-
BOOT
BOOT
HGATE
HGATE
-
-
PHASE
PHASE
V
OUT
LGATE
LGATE
PGND
PGND
GND
GND
EAREF
EAREF
PGOOD
SYNCH
SS
SS
OCL
OCL
Protection and Ref
Protection and Ref
FB
FB
COMP
COMP
5/37
Electrical dataL6732
2 Electrical data
2.1 Maximum rating
Table 2.Absolute maximum ratings
Symbol Parameter Value Unit
V
VCC to GND and PGND, OCH, PGOOD-0.3 to 18V
CC
V
BOOT -
V
PHASE
V
HGATE -
V
PHASE
V
BOOT
Boot voltage0 to 6V
0 to V
BOOT
- V
PHASE
V
BOOT-0.3 to 24V
PHASE-1 to 18
V
PHASE
PHASE spike, transient < 50 ns (F
SS, FB, EAREF, SYNC, OCL, LGATE, COMP,
V
CCDR
OCH pin
Maximum withstanding voltage range
test condition: CDF-AEC-Q100-002 “human body
Other pins±2000
model” acceptance criteria: “normal performance”
2.2 Thermal data
Table 3.Thermal data
SymbolDescriptionValueUnit
R
T
thJA
STG
T
T
Thermal resistance junction to ambient50°C/W
Storage temperature range-40 to +150°C
Junction operating temperature range-40 to +125°C
J
Ambient operating temperature range-40 to +85°C
A
= 500 kHz)
SW
-3
+24
-0.3 to 6V
±1500
V
VPGOOD pin±1000
6/37
L6732Pin connection and function
3 Pin connection and function
Figure 2.Pin connection (top view)
PGOOD
SYNCH
SGND
FB
COMP
SS/INH
EAREF
OCL
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
HTSSOP16
Table 4.Pin functions
Pin n.Name Function
This pin is an open collector output and it is pulled low if the output voltage
1 PGOOD
2 SYNCH
3 SGNDAll the internal references are referred to this pin.
is not within the specified thresholds (90 %-110 %). If not used it may be left
floating. Pull-up this pin to V
signal.
It is a Master-Slave pin. Two or more devices can be synchronized by
simply connecting the SYNCH pins together. The device operating with the
highest FSW will be the Master. The Slave devices will operate with 180°
phase shift from the Master. The best way to synchronize devices together
is to set their FSW at the same value. If it is not used the SYNCH pin can
be left floating.
with a 10 k resistor to obtain a logical
CCDR
VCC
VCCDR
LGATE
PGND
BOOT
HGATE
PHASE
OCH
4 FB
5 COMP
6 SS/INH
This pin is connected to the error amplifier inverting input. Connect it to
through the compensation network. This pin is also used to sense the
V
OUT
output voltage in order to manage the over voltage conditions and the
PGood signal.
This pin is connected to the error amplifier output and is used to
compensate the voltage control feedback loop.
The soft-start time is programmed connecting an external capacitor from
this pin and GND. The internal current generator forces a current of 10 A
through the capacitor. When the voltage at this pin is lower than 0.5 V the
device is disabled.
7/37
Pin connection and functionL6732
Table 4.Pin functions (continued)
Pin n.Name Function
By setting the voltage at this pin is possible to select the internal/external
reference and the switching frequency:
7 EAREF
8 OCL
V
V
V
An internal clamp limits the maximum V
captures the analog value present at this pin at the start-up when V
meets the UVLO threshold.
A resistor connected from this pin to ground sets the valley- current-limit.
The valley current is sensed through the low-side MOSFET(s). The internal
current generator sources a current of 100 µA (I
through the external resistor (R
the following equation:
Connecting a capacitor from this pin to GND helps in reducing the noise
injected from V
high-frequency noise related to the GND. Connect a capacitor only to a
“clean” GND.
0-80 % of V
EAREF
= 80 %-95 % of V
EAREF
= 95 %-100 % of V
EAREF
-> external reference/F
CCDR
-> V
CCDR
CCDR -> VREF
OCL
I
VALLEY
to the device, but can be a low impedance path for the
CC
= 0.6 V/FSW = 500 kHz
REF
= 0.6 V/F
EAREF
). The over-current threshold is given by
I
•
OCLROCL
----------------------------------=
2R
•
DSONLS
= 250 kHz
SW
= 250 kHz
SW
at 2.5 V (typ.). The device
) from this pin to ground
OCL
CC
A resistor connected from this pin and the high-side MOSFET(s) drain sets
the peak-current-limit. The peak current is sensed through the high-side
9 OCH
MOSFET(s). The internal 100 µA current generator (I
from the drain through the external resistor (R
threshold is given by the following equation:
I
•
I
PEAK
OCHROCH
--------------------------------- -=
R
DSONHS
OCH
). The over-current
OCH
This pin is connected to the source of the high-side MOSFET(s) and
10 PHASE
provides the return path for the high-side driver. This pin monitors the drop
across both the upper and lower MOSFET(s) for the current limit together
with OCH and OCL.
11 HGATEThis pin is connected to the high-side MOSFET(s) gate.
Through this pin is supplied the high-side driver. Connect a capacitor from
12 BOOT
this pin to the PHASE pin and a diode from V
to this pin (cathode
CCDR
versus BOOT).
13 PGND
This pin has to be connected closely to the low-side MOSFET(s) source in
order to reduce the noise injection into the device.
14 LGATEThis pin is connected to the low-side MOSFET(s) gate.
15 V
16 V
CCDR
CC
5 V internally regulated voltage. It is used to supply the internal drivers.
Filter it to ground with at least 1 µF ceramic cap.
Supply voltage pin.
The operative supply voltage range is from 4.5 V to 14 V.
) sinks a current
8/37
L6732Electrical characteristics
4 Electrical characteristics
Table 5.Electrical characteristics
(V
= 12 V, TA = 25 °C, unless otherwise specified)
CC
Symbol Parameter Test condition MinTypMaxUnit
V
supply current
CC
VCC stand by currentOSC = open; SS to GND79
I
CC
quiescent current
V
CC
OSC = open;
HG = open, LG = open,
8.510
mA
PH = open
Power-ON
V
CCDR
V
CC
V
IN OK
V
IN OK
regulation
Tu r n -O N VCC thresholdV
Tu r n -O F F V
Tu r n -O N V
Tu r n -O F F V
V
voltage
CCDR
thresholdV
CC
threshold1.11.251.47V
OCH
threshold0.91.051.27V
OCH
= 1.7 V4.04.24.4V
OCH
= 1.7 V3.63.84.0V
OCH
VCC = 5.5 V to 14 V
IDR = 1 mA to 100 mA
4.555.5V
Soft-start and inhibit
I
SS
Soft-start current
SS = 0 to 0.5 V203045
Oscillator
237250263kHz
SS = 2 V71013
∆V
f
OSC
OSC
Accuracy
450500550kHz
Ramp amplitude 2.1V
Output voltage
V
FB
Output voltageV
= 0 to Vth 0.5970.60.603V
DIS
Error amplifier
R
EAREF
I
FB
Ext ref
clamp
V
OFFSET
G
V
EAREF input resistanceVs GND70100150kΩ
I.I. bias current VFΒ = 0 V0.2900.5µA
2.3V
Error amplifier offsetVref = 0.6 V-5+5mV
Open loop voltage gainGuaranteed by design100dB
GBWPGain-bandwidth productGuaranteed by design10MHz
SRSlew-rate
COMP = 10 pF
Guaranteed by design
5V/µs
µA
9/37
Electrical characteristicsL6732
Table 5.Electrical characteristics
(V
= 12 V, TA = 25 °C, unless otherwise specified) (continued)
CC
Symbol Parameter Test condition MinTypMaxUnit
Gate drivers
R
HGATE_ON
R
HGATE_OFF
R
LGATE_ON
R
LGATE_OFF
Protections
I
OCH
I
OCL
OVP
Power good
V
B
B
PGOOD
High side source resistance V
High side sink resistanceV
Low side source resistanceV
Low side sink resistanceV
OCH current sourceV
- V
BOOT
- V
BOOT
= 5 V1.15Ω
CCDR
= 5 V0.6Ω
CCDR
= 1.7 V90100110µΑ
OCH
= 5 V1.7Ω
PHASE
= 5 V1.12Ω
PHASE
OCL current source90100110µΑ
rising
V
Over voltage trip
(VFB / VEAREF)
Under voltage threshold
(V
B
FB
/ VB
B
EAREF
)
B
Upper threshold
(V
B
FB
/ VB
B
EAREF
)
B
Lower threshold
(V
B
FB
/ VB
B
EAREF
)
B
PGOOD voltage lowIB
FB
V
V
V
VB
VB
VB
= 0.6 V
EAREF
falling
FB
= 0.6 V
EAREF
falling80%
B
FB
rising108110112%
B
FB
falling889092%
B
FB
= -5 mA0.5V
B
PGOOD
120%
117%
Table 6.Thermal characteristics (VCC = 12 V)
Symbol Parameter Test condition MinTypMaxUnit
Output voltage
T
= 0 °C ~ 125 °C0.5960.60.605
V
FB
Output voltage
10/37
J
= -40 °C ~ 125 °C0.5930.60.605
T
J
V
L6732Device description
5 Device description
5.1 Oscillator
The switching frequency can be fixed to two values: 250 kHz or 500 kHz by setting the
proper voltage at the EAREF pin (see Table 4. pins function and section 4.3 Internal and
external reference).
5.2 Internal LDO
An internal LDO supplies the internal circuitry of the device. The input of this stage is the
V
pin and the output (5 V) is the V
CC
Figure 3. LDO block diagram
pin (Figure 3.).
CCDR
4.5÷14V
The LDO can be by-passed, providing directly a 5 V voltage to V
V
pins must be shorted together as shown in Figure 4. V
CCDR
LDO
. In this case VCC and
CCDR
pin must be filtered with
CCDR
at least 1 µF capacitor to sustain the internal LDO during the recharge of the bootstrap
capacitor. V
also represents a voltage reference for PGOOD pin (see Table 4. pins
CCDR
function).
11/37
Device descriptionL6732
5.3 Bypassing the LDO to avoid the voltage drop with low Vcc
If V
≈ 5 V the internal LDO works in dropout with an output resistance of about 1 Ω. The
CC
maximum LDO output current is about 100 mA and so the output voltage drop is 100 mV, to
avoid this the LDO can be by passed.
Figure 4.Bypassing the LDO
5.4 Internal and external references
It is possible to set the internal/external reference and the switching frequency by setting the
proper voltage at the EAREF pin. The maximum value of the external reference depends on
the V
5V the maximum external reference is 2.5 V (typ.).
Providing an external reference from 0 V to 450 mV the output voltage will be regulated but
some restrictions must be considered:
To set the resistor divider it must be considered that a 100 k pull-down resistor is integrated
into the device (see Figure 5.). Finally it must be taken into account that the voltage at the
EAREF pin is captured by the device at the start-up when V
: with V
CC
●V
●V
●V
●OV threshold saturates to a minimum value of 300 mV (OV is tracking the
= 4 V the clamp operates at about 2 V (typ.), while with VCC greater than
CC
from 0 % to 80 % of V
EAREF
from 80 % to 95 % of V
EAREF
from 95 % to 100 % of V
EAREF
CCDR
CCDR
reference; tracking small references will result in a narrow threshold reducing
noise immunity)
●The under-voltage-protection doesn't work;
●The PGOOD signal remains low;
-> External reference/Fsw = 250 kHz
CCDR
-> V
-> V
= 0.6V/Fsw = 500 kHz
REF
= 0.6V/Fsw = 250 kHz
REF
is about 4 V.
CC
12/37
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