The L6386E is an high-voltage device,
manufactured with the BCD “off-line” technology.
It has a driver structure that enables to drive
independent referenced channel power MOS or
IGBT. The high-side (floating) section is enabled
to work with voltage rail up to 600 V. The logic
inputs are CMOS/TTL compatible for ease of
interfacing with controlling devices.
Note:ESD immunity for pins 12, 13 and 14 is guaranteed up to 900 V (human body model)
1.2 Thermal data
Table 2.Thermal data
Symbol Parameter SO-14 DIP-14Unit
R
Thermal resistance junction to ambient165100°C/W
th(JA)
1.3 Recommended operating conditions
Table 3.Recommended operating conditions
Symbol Pin Parameter Test condition MinTypMaxUnit
V
V
BS
f
sw
V
T
1. If the condition Vboot - Vout < 18 V is guaranteed, Vout can range from -3 to 580 V
2. VBS = V
12Output voltage
out
(2)
14Floating supply voltage
Switching frequency HVG,LVG load CL = 1 nF400 kHz
cc
4Supply voltage 17V
J
Junction temperature -45 125 °C
- V
boot
out
Doc ID 13989 Rev 23/18
(1)
(1)
17 V
580 V
Pin connectionL6386E
2 Pin connection
Figure 2.Pin connection (Top view)
1
2
3
4
5
6
7PGND
D97IN521A
14
13
12
11
10
9
8
Table 4.Pin description
LIN
SD
HIN
V
CC
DIAG
CIN
SGND
N°PinTypeFunction
1 LIN I Low side driver logic input
2 SD
(1)
I Shut down logic input
3 HIN I High side driver logic input
4 VCC Low voltage supply
5 DIAG O Open drain diagnostic output
6 CIN I Comparator input
7 SGND Ground
8 PGND Power ground
(1)
9 LVG
O Low side driver output
10, 11 N.C. Not connected
V
boot
HVG
OUT
N.C.
N.C.
LVG
12 OUT O High side driver floating driver
(1)
13 HVG
14 V
1. The circuit guarantees 0.3 V maximum on the pin (@ Isink = 10 mA), with VCC > 3 V. This allows to omit
the “bleeder” resistor connected between the gate and the source of the external MOSFET normally used
to hold the pin low; the gate driver assures low impedance also in SD condition.
Note: SD active condition is latched until next negative IN edge.
D97IN522A
Doc ID 13989 Rev 27/18
Bootstrap driverL6386E
4 Bootstrap driver
A bootstrap circuitry is needed to supply the high voltage section. This function is normally
accomplished by a high voltage fast recovery diode (Figure 4 a). In the L6386E a patented
integrated structure replaces the external diode. It is realized by a high voltage DMOS,
driven synchronously with the low side driver (LVG), with in series a diode, as shown in
Figure 4 b. An internal charge pump (Figure 4 b) provides the DMOS driving voltage. The
diode connected in series to the DMOS has been added to avoid undesirable turn on of it.
4.1 C
To choose the proper C
capacitor. This capacitor C
The ratio between the capacitors C
It has to be:
e.g.: if Q
300 mV.
If HVG has to be supplied for a long time, the C
the leakage losses.
e.g.: HVG steady state consumption is lower than 200 μA, so if HVG T
to supply 1 μC to C
The internal bootstrap driver gives great advantages: the external fast recovery diode can
be avoided (it usually has great leakage current).
This structure can work only if V
LVG is on. The charging time (T
fulfilled and it has to be long enough to charge the capacitor.
BOOT
selection and charging
value the external MOS can be seen as an equivalent
BOOT
is related to the MOS total gate charge:
EXT
C
EXT
and C
EXT
C
is 30 nC and V
gate
. This charge on a 1 μF capacitor means a voltage drop of 1 V.
EXT
is 10 V, C
gate
EXT
is close to GND (or lower) and in the meanwhile the
OUT
) of the C
charge
Q
gate
-------------- -=
V
gate
is proportional to the cyclical voltage loss.
BOOT
>>>C
BOOT
EXT
is 3 nF. With C
BOOT
is the time in which both conditions are
BOOT
= 100 nF the drop would be
BOOT
selection has to take into account also
is 5 ms, C
ON
BOOT
has
The bootstrap driver introduces a voltage drop due to the DMOS R
Ω). At low frequency this drop can be neglected. Anyway increasing the frequency it must be
taken in to account.
The following equation is useful to compute the drop on the bootstrap DMOS:
==
V
dropIcheargRdsonVdrop
where Q
bootstrap DMOS, and T
8/18Doc ID 13989 Rev 2
is the gate charge of the external power MOS, R
gate
is the charging time of the bootstrap capacitor.
charge
→
Q
gate
-------------------
T
chearg
(typical value: 125
DSon
R
dson
is the on resistance of the
DSon
L6386EBootstrap driver
For example: using a power MOS with a total gate charge of 30 nC the drop on the
bootstrap DMOS is about 1 V, if the T
V
drop
V
has to be taken into account when the voltage drop on C
drop
is 5 μs. In fact:
charge
30nC
-------------- -
5μ s
125Ω 0.8V∼⋅=
is calculated: if this drop
BOOT
is too high, or the circuit topology doesn’t allow a sufficient charging time, an external diode
can be used.
Figure 4.Bootstrap driver
D
BOOT
V
S
HVG
LVG
ab
V
BOOT
H.V.
C
BOOT
V
OUT
TO LOAD
V
S
HVG
LVG
V
BOOT
H.V.
C
BOOT
V
OUT
TO LOAD
D99IN1056
Doc ID 13989 Rev 29/18
Typical characteristicL6386E
5 Typical characteristic
Figure 5.Typical rise and fall times vs
time
(nsec)
250
200
150
100
50
0
load capacitance
D99IN1054
Tr
Tf
012345 C (nF)
For both high and low side buffers @25˚C Tamb
Figure 6.Quiescent current vs supply
Iq
(μA)
4
10
3
10
2
10
10
246810121416V
0
Figure 7.Turn on time vs temperatureFigure 8.V
250
200
150
Typ.
100
Ton (ns)
50
0
-45 -250255075 100 125
@ Vcc = 15V
Tj (°C)
15
14
13
Typ.
12
11
Vbth1 (V)
10
9
8
7
-45 -250255075 100 125
voltage
UV turn on threshold
BOOT
vs temperature
@ Vcc = 15V
Tj (°C)
D99IN1057
(V)
S
Figure 9.Turn Off time vs temperature Figure 10. V
250
200
150
Typ.
100
Toff (ns)
50
0
-45 -250255075 100 125
10/18Doc ID 13989 Rev 2
@ Vcc = 15V
Tj (°C)
UV turn off threshold
BOOT
vs temperature
15
14
13
12
11
Vbth2 (V)
Typ.
10
9
8
7
-45 -250255075 100 125
@ Vcc = 15V
Tj (°C)
L6386ETypical characteristic
Figure 11. Shutdown time vs
250
200
150
tsd (ns0
100
temperature
@ Vcc = 15V
Typ.
50
0
-45 -250255075 100 125
Tj (°C)
Figure 13. VCC UV turn on threshold vs
15
14
13
12
Vccth1(V)
11
10
temperature
Typ.
Figure 12. V
3
UV hysteresis
BOOT
@ Vcc = 15V
2.5
Typ.
2
Vbhys (V)
1.5
1
-45 -250255075100 125
Tj (°C)
Figure 14. Output source current vs
temperature
1000
800
600
Typ.
current (mA)
400
200
@ Vcc = 15V
9
-45 -250255075100 125
Tj (°C)
Figure 15. VCC UV turn off threshold vs
12
11
10
Vccth2(V)
temperature
Typ.
9
8
7
-45 -250255075 100 125
Tj (°C)
0
-45 -250255075 100 125
Tj (°C)
Figure 16. Output sink current vs
temperature
1000
800
Typ.
600
400
current (mA)
200
0
-45-250 255075100125
@ Vcc = 15V
Tj (°C)
Doc ID 13989 Rev 211/18
Typical characteristicL6386E
Figure 17. VCC UV hysteresis vs
2.5
Vcchys (V)
1.5
temperature
3
Typ.
2
1
-45 -250255075 100 125
Tj (°C)
12/18Doc ID 13989 Rev 2
L6386EPackage mechanical data
6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
is an ST trademark.
Doc ID 13989 Rev 213/18
Package mechanical dataL6386E
Figure 18. DIP14 mechanical data and package dimensions
DIM.
a10.510.020
B1.391.65 0.0550.065
b0.50.020
b10.250.010
D200.787
E8.50.335
e2.540.100
e315.240.600
F7.10.280
I5.10.201
L3.30.130
Z1.272.54 0.0500.100
mminch
MIN. TYP. MAX. MIN. TYP. MAX.
OUTLINE AND
MECHANICAL DATA
DIP14
14/18Doc ID 13989 Rev 2
L6386EPackage mechanical data
Figure 19. SO14 mechanical data and package dimensions
DIM.
A1.351.75 0.0530.069
A10.100.30 0.0040.012
A21.101.65 0.0430.065
B0.330.51 0.0130.020
C0.190.25 0.0070.01
(1)
D
E3.804.00.1500.157
e1.270.050
H5.86.20 0.2280.244
h0.250.500.010.02
L0.401.27 0.0160.050
k0˚ (min.), 8˚ (max.)
ddd0.100.004
(1) “D” dimension does not incl ude mold flash, protusions or gate
burrs. Mold flash, p rotusions or gate burrs shall not exceed
0.15mm per side.
mminch
MIN. TYP. MAX. MIN.TYP. MAX.
8.558.75 0.3370.344
OUTLINE AND
MECHANICAL DATA
SO14
0016019 D
Doc ID 13989 Rev 215/18
Ordering informationL6386E
7 Ordering information
Table 7.Ordering information
Part numberPackagePackaging
L6386EDIP14Tube
L6386ED
SO14
L6386ED013TRTape and reel
Tu be
16/18Doc ID 13989 Rev 2
L6386ERevision history
8 Revision history
Table 8.Document revision history
DateRevisionChanges
11-Oct-20071First release
22-Jul-20092Modified V
on Ta bl e 6
bth2
Doc ID 13989 Rev 217/18
L6386E
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