FOUR INDEPENDENT LINE DRIVERS WITH
100 mAUP TO35VOUTPUTS
INPUT SIGNALS BETWEEN -7V AND +35V,
WITHPRESETTABLETHRESHOLD
PUSH-PULL OUTPUTS WITH THREE STATE
CONTROL AND TRUE ZERO CURRENT BETWEENV
CURRENT LIMITING ON EACH OUTPUT EFFECTIVE IN THE FULL ”GROUND TO V
OUTPUTVOLTAGERANGE
OUTPUT VOLTAGE CLAMP TO V
GROUND
OVERTEMPERATUREANDUNDERVOLTAGE PROTECTIONS
DIAGNOSTIC FOR OVERTEMPERATURE,
UNDERVOLTAGEAND OVERCURRENT
PRESETTABLE DELAY FOR OVERCURRENTDIAGNOSTIC
HIGH SPEED OPERATION: UP TO 300kHz
WITH 35VSWING
ANDGROUND
S
INDUSTRIAL QUAD LINE DRIVER
S
S AND TO
ADVANCE DATA
”
POWERDIP 16+2+2SO 16+2+2
ORDERING NUMBER: L6374DP (POWERDIP16+2+2)
L6374FP (SO16+2+2)
DESCRIPTION
The L6374 is especiallydesignedto be used as a
line driver in industrial control systems based on
the 24V signal levels (IEC1131, 24VDC).
L6374
BLOCK DIAGRAM
December 1994
This is advanced information on a new product now in development orundergoing evaluation.Details are subject to change without notice.
1/13
L6374
ABSOLUTE MAXIMUM RATINGS
SymbolPinParameterValueUnit
S1Supply Voltage(t
V
Supply Voltage(DC)40V
ilog12, 13Logic Input Voltage (DC)-0.3 to 7V
V
ilogLogic Input forced current, per pin±1mA
I
i7, 8,
I
iChannelInput Voltage- 7 to35V
V
out3, 4,
I
9, 10
17, 18
outOutputVoltage (forced, not resulting from an inductive
V
Channel Input Current (forced)±2mA
Output Current (forced, apart from inductive load)±100mA
Output Current (forced, apart from inductive load)
same t
< 10ms
W
kick)
I
set11Setting pin forced current±1mA
setSetting pin forced voltage-0.3 to 5V
V
diag14External voltage-0.3 to 35V
V
diagExternallyforced current-10 to 10mA
I
C313Voltage on the delay capacitor, externally forced-0.3 to 4.5V
V
opAmbient temperature, operating range-25 to 85°C
T
jJunction temperature, operatingrange (see
T
Overtemperature Protection)
T
stgStorage temperature-55 to 150°C
< 10ms)50V
W
±1A
-0.3 to VS +0.3V
-25 to 125°C
PIN CONNECTION (Top view)
2/13
ELECTRICALCHARACTERISTICS (VS = 24V; Tj = -25 to 125°C; unless otherwise specified.)
DC OPERATION
SymbolPinParameterTest ConditionMin.Typ.Max.Unit
S1Supply Voltage10.835V
V
shUV UpperThreshold910.8V
V
ys1UV Hysteresis250450650mV
H
qscQuiescent CurrentOutputs Open35mA
I
ref11Input Comparators Reference
V
Voltage
I
ref
Sink/Source Current on
Reference Pin
th7, 8,
V
ilInput Low LevelV
V
ihInput High LevelV
V
iInput Voltage(Operative Range)-735V
V
biasInput Bias Current0 < Vi <VS-11µA
I
ys2Input ComparatorsHysteresisSee Analog Inputs Sections100200350mV
H
hOVT Upper Threshold170°C
T
TOVT Hysteresis20°C
H
sc3, 4,
I
onInternal Voltage Drop @ Rated
V
17,18
Comparator Threshold with
9, 10
External Bias
Current LimitVi =-7toVS;Vout = 0 to VS;110200300mA
Current
I
lkg
in12Push-Pull Mode Request-0.20.8V
V
Output 3-State Leakage CurrentV
3-State Mode Request25.5V
inInput CurrentV
I
dlkg14Diagnostic OutputLeakageDiagnostic Off; V
I
diagDiagnostic OutputVoltage DropI
V
Reference pin Floating1.051.251.35V
V
= 0V-30-20-10µA
ref
=5V102030µA
V
ref
VS = 9 to 12V-0.22.0V
S = 12 to 35V-0.25.0V
V
Externally Biased-7V
REF
REF
-0.2
Pin V
Floating-70.8V
REF
Externally BiasedV
REF
REF
35V
+0.2
Pin V
i = -7V-1-0.5-0.1mA
V
Iout = ±100mA; Sourced @ High
Floating235V
REF
400600mV
Output, Sunk @ Low Output
T
= 125°C
j
Same, T
out
i
diag
=25°C250400mV
j
= 0 to V
S
-2525µA
=0V1025µA
= 24V5µA
diag
=5mA200500mV
L6374
V
AC OPERATION (VS = 10.8 to 35V; Tj = -25 to 125°C; I
= 100mA; unless otherwise specified; see
out
switchingwaveforms diagrams)
SymbolPinParameterTest ConditionMin.Typ.Max.Unit
dr7to4
t
8to3
dfDelay Time on Falling EdgeRl to ground5001000ns
t
r3,4,
t
9to18
10to17
17, 18
fFall TimeRl to ground150300ns
t
Delay Time on Rising EdgeR
l to ground1000 1500ns
to V
R
l
S
to V
R
l
S
5001000ns
1000 1500ns
Rise TimeRl to ground120250ns
to V
R
l
S
to V
R
l
S
120250ns
150300ns
3/13
L6374
THERMAL DATA
SymbolParameterDIP20SO20Unit
th j-pinThermal Resistance, Junction to Pin1217°C/W
R
th j-amb1Thermal Resistance, Junction to Ambient (see Thermal
R
R
th j-amb2Thermal Resistance, Junction to Ambient (see Thermal
Characteristics)
Characteristics)
4065°C/W
5080°C/W
THERMAL CHARACTERISTICS
R
th j-pins
POWERDIP. The thermalresistanceis referred
to the thermalpath from thedissipatingregion
on the top surface of the siliconchip, to the
points alongthe four central pins of the package, at a distanceof 1.5 mm awayfrom the
stand-offs.
SO. Similarly, the referencepoint is the knee
on the four central pins, where the pins areupwardly bent and the solderingjoint with the
PCB footprintcan be made.
R
th j-amb1
If a dissipatingsurface, thick at least 35 µm,
and with a surfacesimilar or bigger thanthe
one shown, iscreated making use of the
printed circuit.
Figure1: Printed Heatsink
Such heatsinkingsurface isconsidered on the
bottom side of an horizontalPCB (worst case).
R
th j-amb2
If the power dissipatingpins (the four central
ones), as well as the others, have aminimum
thermalconnection with the externalworld
(very thin strips only) so thatthe dissipation
takesplace through still air and through the
PCB itself.
It is the same situationof pointabove, without
any heatsinkingsurface createdon purposeon
the board.
Additionaldata for the PowerDip package can be
foundin:
ApplicationNote 9030:
Thermal Characteristicsof the PowerDip
20,24PackagesSolderedon 1,2,3 oz.
CopperPCB
4/13
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