ST L6374 User Manual

L6374

L6374

INDUSTRIAL QUAD LINE DRIVER

FOUR INDEPENDENT LINE DRIVERS WITH 100 mA UP TO 35V OUTPUTS

INPUT SIGNALS BETWEEN -7V AND +35V, WITH PRESETTABLE THRESHOLD PUSH-PULL OUTPUTS WITH THREE STATE CONTROL AND TRUE ZERO CURRENT BETWEEN VS AND GROUND

CURRENT LIMITING ON EACH OUTPUT EFFECTIVE IN THE FULL ºGROUND TO VSº OUTPUT VOLTAGE RANGE

OUTPUT VOLTAGE CLAMP TO VS AND TO GROUND

OVERTEMPERATURE AND UNDERVOLTAGE PROTECTIONS

DIAGNOSTIC FOR OVERTEMPERATURE, UNDERVOLTAGE AND OVERCURRENT

PRESETTABLE DELAY FOR OVERCURRENT DIAGNOSTIC

HIGH SPEED OPERATION: UP TO 300kHz WITH 35V SWING

ADVANCE DATA

POWERDIP 16+2+2

SO 16+2+2

ORDERING NUMBER: L6374DP (POWERDIP 16+2+2) L6374FP (SO 16+2+2)

DESCRIPTION

The L6374 is especially designed to be used as a line driver in industrial control systems based on the 24V signal levels (IEC1131, 24VDC).

BLOCK DIAGRAM

December 1994

1/13

This is advanced information on a new product now in development or undergoing evaluation. Details are subject to change without notice.

L6374

ABSOLUTE MAXIMUM RATINGS

Symbol

Pin

Parameter

Value

Unit

VS

1

Supply Voltage (tW < 10ms)

50

V

 

 

Supply Voltage (DC)

40

V

Vilog

12, 13

Logic Input Voltage (DC)

-0.3 to 7

V

Iilog

 

Logic Input forced current, per pin

±1

mA

Ii

7, 8,

Channel Input Current (forced)

±2

mA

Vi

9, 10

Channel Input Voltage

- 7 to 35

V

 

Iout

3, 4,

Output Current (forced, apart from inductive load)

±100

mA

 

17, 18

Output Current (forced, apart from inductive load)

±1

A

 

 

 

 

same tW < 10ms

 

 

Vout

 

Output Voltage (forced, not resulting from an inductive

-0.3 to VS +0.3

V

 

 

kick)

 

 

Iset

11

Setting pin forced current

±1

mA

Vset

 

Setting pin forced voltage

-0.3 to 5

V

Vdiag

14

External voltage

-0.3 to 35

V

Idiag

 

Externally forced current

-10 to 10

mA

VC3

13

Voltage on the delay capacitor, externally forced

-0.3 to 4.5

V

Top

 

Ambient temperature, operating range

-25 to 85

°C

Tj

 

Junction temperature, operating range (see

-25 to 125

°C

 

 

Overtemperature Protection)

 

 

Tstg

 

Storage temperature

-55 to 150

°C

PIN CONNECTION (Top view)

2/13

ST L6374 User Manual

 

 

 

 

 

 

 

L6374

ELECTRICAL CHARACTERISTICS (VS = 24V; Tj = -25 to 125°C; unless otherwise specified.)

 

DC OPERATION

 

 

 

 

 

 

Symbol

Pin

Parameter

Test Condition

Min.

Typ.

Max.

Unit

VS

1

Supply Voltage

 

10.8

 

35

V

Vsh

 

UV UpperThreshold

 

9

 

10.8

V

Hys1

 

UV Hysteresis

 

250

450

650

mV

Iqsc

 

Quiescent Current

Outputs Open

 

3

5

mA

Vref

11

Input Comparators Reference

Reference pin Floating

1.05

1.25

1.35

V

 

 

Voltage

 

 

 

 

 

Iref

 

Sink/Source Current on

Vref = 0V

-30

-20

-10

μA

 

 

Reference Pin

Vref = 5V

10

20

30

μA

 

 

 

Vth

7, 8,

Comparator Threshold with

VS = 9 to 12V

-0.2

 

2.0

V

 

9, 10

External Bias

VS = 12 to 35V

-0.2

 

5.0

V

 

 

 

 

Vil

 

Input Low Level

VREF Externally Biased

-7

 

VREF

V

 

 

 

 

 

 

-0.2

 

 

 

 

Pin VREF Floating

-7

 

0.8

V

Vih

 

Input High Level

VREF Externally Biased

VREF

 

35

V

 

 

 

 

+0.2

 

 

 

 

 

 

Pin VREF Floating

2

 

35

V

Vi

 

Input Voltage (Operative Range)

 

-7

 

35

V

Ibias

 

Input Bias Current

0 < Vi < VS

-1

 

1

μA

 

 

 

Vi = -7V

-1

-0.5

-0.1

mA

Hys2

 

Input Comparators Hysteresis

See Analog Inputs Sections

100

200

350

mV

Th

 

OVT Upper Threshold

 

 

170

 

°C

HT

 

OVT Hysteresis

 

 

20

 

°C

Isc

3, 4,

Current Limit

Vi = -7 to VS; Vout = 0 to VS;

110

200

300

mA

Von

17, 18

Internal Voltage Drop @ Rated

Iout = ±100mA; Sourced @ High

 

400

600

mV

 

 

 

 

Current

Output, Sunk @ Low Output

 

 

 

 

 

 

 

Tj = 125°C

 

 

 

 

 

 

 

Same, Tj = 25°C

 

250

400

mV

Ilkg

 

Output 3-State Leakage Current

Vout = 0 to VS

-25

 

25

μA

Vin

12

Push-Pull Mode Request

 

-0.2

 

0.8

V

 

 

3-State Mode Request

 

2

 

5.5

V

Iin

 

Input Current

Vi = 0V

 

10

25

μA

Idlkg

14

Diagnostic Output Leakage

Diagnostic Off; Vdiag = 24V

 

 

5

μA

Vdiag

 

Diagnostic Output Voltage Drop

Idiag =5mA

 

200

500

mV

AC OPERATION (VS = 10.8 to 35V; Tj = -25 to 125°C; Iout = 100mA; unless otherwise specified; see switching waveforms diagrams)

Symbol

Pin

Parameter

Test Condition

Min. Typ. Max. Unit

tdr

7 to 4

Delay Time on Rising Edge

Rl to ground

1000

1500

ns

 

8 to 3

 

Rl to VS

500

1000

ns

 

9 to18

 

tdf

Delay Time on Falling Edge

Rl to ground

500

1000

ns

10to17

 

 

 

Rl to VS

1000

1500

ns

tr

3, 4,

Rise Time

Rl to ground

120

250

ns

 

17, 18

 

Rl to VS

120

250

ns

 

 

 

tf

 

Fall Time

Rl to ground

150

300

ns

 

 

 

Rl to VS

150

300

ns

3/13

L6374

THERMAL DATA

Symbol

Parameter

DIP20

SO20

Unit

Rth j-pin

Thermal Resistance, Junction to Pin

12

17

°C/W

Rth j-amb1

Thermal Resistance, Junction to Ambient (see Thermal

40

65

°C/W

 

Characteristics)

 

 

 

Rth j-amb2

Thermal Resistance, Junction to Ambient (see Thermal

50

80

°C/W

 

Characteristics)

 

 

 

THERMAL CHARACTERISTICS

Rth j-pins

POWERDIP. The thermal resistance is referred to the thermal path from the dissipating region on the top surface of the silicon chip, to the points along the four central pins of the package, at a distance of 1.5 mm away from the stand-offs.

SO. Similarly, the reference point is the knee on the four central pins, where the pins are upwardly bent and the soldering joint with the PCB footprint can be made.

Rth j-amb1

If a dissipating surface, thick at least 35 μm, and with a surface similar or bigger than the one shown, is created making use of the printed circuit.

Figure 1: Printed Heatsink

Such heatsinking surface is considered on the bottom side of an horizontal PCB (worst case).

Rth j-amb2

If the power dissipating pins (the four central ones), as well as the others, have a minimum thermal connection with the external world (very thin strips only) so that the dissipation takes place through still air and through the PCB itself.

It is the same situation of point above, without any heatsinking surface created on purpose on the board.

Additional data for the PowerDip package can be found in:

Application Note 9030:

Thermal Characteristics of the PowerDip 20,24 Packages Soldered on 1,2,3 oz. Copper PCB

4/13

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