The L6226Q is a DMOS dual full bridge designed
for motor control applications, realized in
BCDmultipower technology, which combines
isolated DMOS power transistors with CMOS and
bipolar circuits on the same chip. Available in
QFN32 5x5 package, the L6226Q features
thermal shutdown and a non-dissipative
overcurrent detection on the high side power
MOSFETs plus a diagnostic output that can be
easily used to implement the overcurrent
protection.
pin), internally limited by the
overcurrent protection
I
S
T
, T
stg
RMS supply current (for each VS pin)
Storage and operating temperature
OP
range
VSA =
VSB = V
VSA =
VSB = VS = 60 V,
V
VSA =
VSA =
t
PULSE
VSA =
SENSEA
VSB = V
VSB = VS,
< 1 ms
VSB = V
= V
S
SENSEB
S
S
1.2 Recommended operating conditions
= GND
60V
60V
VS + 10V
-1 to + 4V
3.55A
1.4A
-40 to 150°C
Table 2.Recommended operating conditions
SymbolParameterParameterMinMaxUnit
V
S
V
OD
V
SENSEA,
V
SENSEB
I
OUT
T
J
f
sw
Supply voltage
Differential voltage between
, OUT1A, OUT2A, SENSEA and
VS
A
, OUT1B, OUT2B, SENSE
VS
B
B
Voltage range at pins SENSEA and
SENSE
B
VSA =
VSB = V
VSA =
VSB = VS,
V
SENSEA
= V
SENSEB
(pulsed tW < trr)
(DC)
S
852V
52V
-6
-1
6
1
RMS output current1.4A
Operating junction temperature-25+125°C
Switching frequency100kHz
Doc ID 14335 Rev 53/29
V
V
Electrical dataL6226Q
1.3 Thermal data
Table 3.Thermal data
Symbol Parameter ValueUnit
R
th(JA)
1. Mounted on a double-layer FR4 PCB with a dissipating copper surface of 0.5 cm2 on the top side plus 6
cm2 ground layer connected through 18 via holes (9 below the IC).
Thermal resistance junction-ambient max.
(1)
42°C/W
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L6226QPin connection
2 Pin connection
Figure 2.Pin connection (top view)
Note:1The pins 2 to 8 are connected to die PAD.
2The die PAD must be connected to GND pin.
Doc ID 14335 Rev 55/29
Pin connectionL6226Q
Table 4.Pin description
N°PinTypeFunction
1, 21GNDGNDSignal ground terminals.
9OUT1BPower output Bridge B output 1.
11OCDB
12SENSEBPower supply
13IN1BLogic inputBridge B input 1
14IN2BLogic inputBridge B input 2
15PROGCLBR pin
16ENBLogic input
17VBOOT
19OUT2BPower output Bridge B output 2.
20VSBPower supply
22VSAPower supply
Open drain
output
Supply
voltage
Bridge B overcurrent detection and thermal protection pin. An internal open
drain transistor pulls to GND when overcurrent on bridge B is detected or in
case of thermal protection.
Bridge B source pin. This pin must be connected to power ground directly or
through a sensing power resistor.
Bridge B overcurrent level programming. A resistor connected between this
pin and ground sets the programmable current limiting value for the bridge B.
By connecting this pin to ground the maximum current is set. This pin cannot
be left non-connected.
Bridge B enable. LOW logic level switches OFF all power MOSFETs of
bridge B.
If not used, it has to be connected to +5 V.
Bootstrap voltage needed for driving the upper power MOSFETs of both
bridge A and bridge B.
Bridge B power supply voltage. It must be connected to the supply voltage
together with pin VSA.
Bridge A power supply voltage. It must be connected to the supply voltage
together with pin VSB.
23OUT2APower output Bridge A output 2.
24VCPOutputCharge pump oscillator output.
Bridge A enable. LOW logic level switches OFF all power MOSFETs of
25ENALogic input
26PROGCLAR pin
27IN1ALogic inputBridge A logic input 1.
28IN2ALogic inputBridge A logic input 2.
29SENSEAPower supply
30OCDA
31OUT1APower output Bridge A output 1.
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Open drain
output
bridge A.
If not used, it has to be connected to +5 V.
Bridge A overcurrent level programming. A resistor connected between this
pin and ground sets the programmable current limiting value for the bridge A.
By connecting this pin to ground the maximum current is set. This pin cannot
be left non-connected.
Bridge A source pin. This pin must be connected to power ground directly or
through a sensing power resistor.
Bridge A overcurrent detection and thermal protection pin. An internal open
drain transistor pulls to GND when overcurrent on bridge A is detected or in
case of thermal protection.