The L6207Q is a DMOS dual full bridge designed
for motor control applications, realized in
BCDmultipower technology, which combines
isolated DMOS power transistors with CMOS and
bipolar circuits on the same chip. The device also
includes two independent constant OFF time
PWM current controllers that perform the
chopping regulation. Available in QFN48 7x7
package, the L6207Q features thermal shutdown
and a non-dissipative overcurrent detection on the
high-side Power MOSFETs.
pin), internally limited by the
overcurrent protection
IS RMS supply current (for each VS pin) VSA = VSB = VS 2.5 A
T
stg
, TOP
Storage and operating temperature
range
A
and V
,
VSA = VSB = VS = 60 V;
VSENSE
A
GND
REFB
B
= VSB = VS;
V
SA
t
< 1 ms
PULSE
= VSENSEB =
60 V
+ 10 V
S
-0.3 to +7V
-0.3 to +7V
-1 to +4 V
7.1 A
-40 to 150 °C
1.2 Recommended operating conditions
Table 2.Recommended operating conditions
SymbolParameterParameterMin. Max. Unit
V
Supply voltage VSA = VSB = VS 8 52 V
S
Differential voltage between VS
V
OD
V
V
,
SENSEA
SENSEB
I
RMS output current 2.5 A
OUT
T
j
f
sw
, OUT2A, SENSEA and VSB,
OUT1
A
, OUT2B, SENSEB
OUT1
B
Voltage range at pins SENSEA and
SENSEB
Operating junction temperature -25 +125 °C
Switching frequency 100 kHz
Doc ID 018993 Rev 23/28
,
A
= VSB = VS;
VS
A
V
SENSEA
Pulsed t
DC -1 1 V
= V
W
< t
SENSEB
rr
52 V
-6 6 V
Pin connectionL6207Q
2 Pin connection
Figure 2.Pin connection (top view)
NC
OUT1A
OUT1A
NC
NC
GND
NC
NC
NC
OUT1B
OUT1B
NC
RCA
48 47 46 45 44 43 42 41 40 39 38 37
1
EPAD
2
3
4
5
6
7
8
9
10
11
12
13 14 15 16 17 18 19 20 21 22 23 24
RCB
SENSEANCIN2A
NC
SENSEB
SENSEA
SENSEB
IN1B
IN1A
IN2B
Note:The exposed PAD must be connected to GND pin.
Table 3.Pin description
VREFA
VREFB
ENA
VCPNCOUT2A
ENB
VBOOT
OUT2A
OUT2B
OUT2B
36
NC
35
VSA
34
VSA
33
NC
32
NC
31
GND
30
NC
29
NC
28
NC
27
VSB
26
VSB
25
NC
NC
AM02556v1
PinNameTypeFunction
43IN1A Logic input Bridge A logic input 1.
44IN2A Logic input Bridge A logic input 2.
45, 46SENSEA Power supply
48RCA RC pin
Bridge A source pin. This pin must be connected to power ground
through a sensing power resistor.
RC network pin. A parallel RC network connected between this pin and
ground sets the current controller OFF time of bridge A.
2, 3OUT1A Power output Bridge A output 1.
6, 31GND GND
Signal ground terminals. These pins are also used for heat dissipation
toward the PCB.
10, 11OUT1B Power output Bridge B output 1.
13RCB RC pin
15, 16SENSEB Power supply
RC network pin. A parallel RC network connected between this pin and
ground sets the current controller OFF time of bridge B.
Bridge B source pin. This pin must be connected to power ground
through a sensing power resistor.
17IN1B Logic input Bridge B input 1
4/28Doc ID 018993 Rev 2
L6207QPin connection
Table 3.Pin description (continued)
PinNameTypeFunction
18IN2B Logic input Bridge B input 2
19VREFB Analog input
Bridge B current controller reference voltage. Do not leave this pin open
or connect to GND.
Bridge B enable. Low logic level switches off all power MOSFETs of
Bridge B. This pin is also connected to the collector of the overcurrent
20ENB Logic input
(1)
and thermal protection transistor to implement overcurrent protection. If
not used, it must be connected to +5 V through a resistor.
21 VBOOT Supply voltage
Bootstrap voltage needed for driving the upper power MOSFETs of both
Bridge A and bridge B.
22, 23OUT2B Power output Bridge B output 2.
26, 27VSB Power supply
34, 35VSA Power supply
Bridge B power supply voltage. It must be connected to the supply
voltage together with pin VSA.
Bridge A power supply voltage. It must be connected to the supply
voltage together with pin VSB.
38, 39OUT2A Power output Bridge A output 2.
40VCP Output Charge pump oscillator output.
Bridge A enable. Low logic level switches off all power MOSFETs of
bridge A. This pin is also connected to the collector of the overcurrent
(1)
41ENA Logic input
and transistor to implement overcurrent protection. If not used, it must be
connected to +5 V through a resistor. Thermal protection
42VREFA Analog input
1. Also connected at the output drain of the overcurrent and thermal protection MOSFET. Therefore, it must be driven putting
in series a resistor with a value in the range of 2.2 kΩ - 180 kΩ, recommended 100 kΩ.
Bridge A current controller reference voltage. Do not leave this pin open
or connect to GND.
Doc ID 018993 Rev 25/28
Electrical characteristicsL6207Q
3 Electrical characteristics
VS = 48 V, TA = 25 °C, unless otherwise specified.
Table 4.Electrical characteristics
SymbolParameterTest conditionMin.Typ. Max.Unit
V
Sth(ON)
V
Sth(OFF)
Turn-on threshold 6.677.4V
Turn-off threshold 5.666.4V
IS Quiescent supply current
Thermal shutdown temperature 165°C
T
j(OFF)
Output DMOS transistors
High-side switch ON resistance
R
DS(ON)
Low-side switch ON resistance
I
DSS
Leakage current
Source drain diodes
V
Forward ON voltage ISD = 2.5 A, EN = low 1.151.3V
SD
t
rr
t
fr
Reverse recovery time If = 2.5 A 300ns
Forward recovery time 200ns
Logic input
All bridges OFF; Tj = -25 °C to
125 °C
(1)
510mA
Tj = 25 °C 0.340.4
Tj =125 °C
(1)
0.530.59
Ω
Tj = 25 °C 0.280.34
Tj =125 °C
EN = low; OUT = V
(1)
0.470.53
2mA
S
EN = low; OUT = GND -0.15mA
V
V
I
I
V
th(ON)
V
th(OFF)
V
th(HYS)
IH
IL
IH
Low level logic input voltage -0.30.8V
IL
High level logic input voltage 27V
Low level logic input current GND logic input voltage -10µA
High level logic input current 7 V logic input voltage 10µA
Turn-on input threshold 1.82V
Turn-off input threshold 0.81.3V
Input threshold hysteresis 0.250.5V
Switching characteristics
t
t
Enable to out turn ON delay time
D(on)EN
t
D(on)IN
t
RISE
D(off)EN
t
D(off)IN
Input to out turn ON delay time
Output rise time
Enable to out turn OFF delay time
Input to out turn OFF delay time I
(2)
(2)
I
LOAD
I
LOAD
time included)
I
LOAD
(2)
I
LOAD
LOAD
=2.5 A, resistive load 100250400ns
=2.5 A, resistive load (dead
=2.5 A, resistive load 40250ns
=2.5 A, resistive load300550800ns
=2.5 A, resistive load600ns
6/28Doc ID 018993 Rev 2
1.6µs
L6207QElectrical characteristics
Table 4.Electrical characteristics (continued)
SymbolParameterTest conditionMin.Typ. Max.Unit
t
Output fall time
FAL L
t
dt
f
CP
Dead time protection 0.51µs
Charge pump frequency -25 °C<Tj <125 °C 0.61MHz
PWM comparator and monostable
(2)
I
=2.5 A, resistive load 40250ns
LOAD
I
RCA
V
t
PROP
t
BLANK
t
ON(MIN)
t
I
BIAS
, I
offset
OFF
Source current at pins RCA and
RCB
RCB
Offset voltage on sense comparator V
Turn OFF propagation delay
Internal blanking time on SENSE
pins
(3)
V
RCA
REFA
= V
, V
= 2.5 V 3.55.5mA
RCB
= 0.5 V ±5 mV
REFB
Minimum ON time 1.52µs
R
PWM recirculation time
Input bias current at pins VREF
VREF
B
and
A
OFF
= 100 kΩ; C
R
OFF
= 20 kΩ; C
= 1 nF 13µs
OFF
= 1 nF 61µs
OFF
Over current detection
Input supply overcurrent detection
I
sover
R
OPDR
t
OCD(ON)
t
OCD(OFF)
1. Tested at 25 °C in a restricted range and guaranteed by characterization.
2. See Figure 3.
3. Measured applying a voltage of 1 V to pin SENSE and a voltage drop from 2 V to 0 V to pin V
4. See Figure 4.
threshold
Open drain ON resistance I = 4 mA 4060Ω
OCD turn-on delay time
OCD turn-off delay time
(4)
I = 4 mA; CEN < 100 pF 200ns
(4)
-25 °C<Tj <125 °C45.6 7.1A
I = 4 mA; CEN < 100 pF 100ns
REF
500ns
1µs
10µA
.
Doc ID 018993 Rev 27/28
Electrical characteristicsL6207Q
Figure 3.Switching characteristic definition
EN
V
th(ON)
V
th(OFF)
t
I
OUT
90%
10%
D01IN1316
t
D(OFF)EN
t
FAL L
t
D(ON)EN
t
RISE
t
AM02557v1
Figure 4.Overcurrent detection timing definition
I
OUT
I
SOVER
ON
BRIDGE
OFF
V
EN
90%
10%
t
OCD(ON)
t
OCD(OFF)
AM02558v1
8/28Doc ID 018993 Rev 2
L6207QCircuit description
4 Circuit description
4.1 Power stages and charge pump
The L6207Q integrates two independent power MOSFET full bridges, each power MOSFET
has an R
conduction protection is implemented by using a dead time (t
internal timing circuit between the turn-off and turn-on of two power MOSFETs in one leg of
a bridge.
= 0.3 Ω (typical value @ 25 °C) with intrinsic fast freewheeling diode. Cross
DS(ON)
= 1 µs typical value) set by
DT
Pins VS
and VSB must be connected together to the supply voltage (VS).
A
Using an N-channel power MOSFET for the upper transistors in the bridge requires a gate
drive voltage above the power supply voltage. The bootstrapped supply (V
) is obtained
BOOT
through an internal oscillator and a few external components to realize a charge pump
circuit, as shown in Figure 5. The oscillator output (pin VCP) is a square wave at 600 kHz
(typically) with 10 V amplitude. Recommended values/part numbers for the charge pump
circuit are shown in Tab le 5 .
Table 5.Charge pump external component values
ComponentValue
C
BOOT
C
P
R
P
220 nF
10 nF
100 Ω
D11N4148
D21N4148
Figure 5.Charge pump circuit
V
S
D1
R
C
VCPVBOOTVS
C
D2
P
P
BOOT
VS
A
B
AM02559v1
Doc ID 018993 Rev 29/28
Loading...
+ 19 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.