ST L3GD20H User Manual

L3GD20H

MEMS motion sensor: three-axis digital output gyroscope

Features

■Wide supply voltage, 2.2 V to 3.6 V

■Wide extended operating temperature range (from -40 °C to 85 °C)

■Low voltage compatible IOs, 1.8 V

■Low power consumption

■Embedded power-down

■Sleep mode

■Fast turn-on and wake-up

■Three selectable full scales up to 2000 dps

■16 bit rate value data output

■8 bit temperature data output

■I2C/SPI digital output interface

■2 dedicated lines (1 interrupt, 1 data ready)

■User enable integrated high-pass filters

■Embedded temperature sensor

■Embedded 32 levels of 16 bit data output FIFO

■High shock survivability

■ECOPACK® RoHS and “Green” compliant

Applications

■Gaming and virtual reality input devices

■Motion control with MMI (man-machine interface)

■GPS navigation systems

■Appliances and robotics

Datasheet — preliminary data

LGA-16 (3x3x1 mm)

Description

The L3GD20H is a low-power three-axis angular rate sensor.

It includes a sensing element and an IC interface able to provide the measured angular rate to the external world through digital interface (I2C/SPI).

The sensing element is manufactured using a dedicated micromachining process developed by ST to produce inertial sensors and actuators on silicon wafers.

The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics.

The L3GD20H has a full scale of ±245/±500/±2000 dps and is capable of measuring rates with a user selectable bandwidth.

The L3GD20H is available in a plastic land grid array (LGA) package and can operate within a temperature range from -40 °C to +85 °C.

Table 1.	Device summary
Order code		Temperature range (°C)	Package	Packing
	L3GD20H	-40 to +85	LGA-16 (3x3x1)	Tray
L3GD20HTR		-40 to +85	LGA-16 (3x3x1)	Tape and reel

July 2012

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This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to	www.st.com
change without notice.

Contents	L3GD20H

Contents

1	Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		5
	1.1	Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	5
2	Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . .		7

2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.4.1 SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.4.2 I2C - Inter IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.6 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.6.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.6.2 Zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.7 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3	Digital main blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .			14
	3.1	Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		14
	3.2	FIFO . .	. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	14
4	Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .			15
	4.1	I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		15
		4.1.1	I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	16
	4.2	SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		17
		4.2.1	SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	19
		4.2.2	SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	20
		4.2.3	SPI read in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	21
5	Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .			22
6	Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .			24

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L3GD20H	List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 3. Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 5. Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 6. SPI slave timing values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 7. I2C slave timing values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 8. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 9. Serial interface pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 10. I2C terminology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 11. SAD+Read/Write patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 12. Transfer when Master is writing one byte to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 13. Transfer when Master is writing multiple bytes to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 14. Transfer when Master is receiving (reading) one byte of data from slave . . . . . . . . . . . . . 17 Table 15. Transfer when Master is receiving (reading) multiple bytes of data from slave . . . . . . . . . 17 Table 16. LGA 3x3x1.0 16L mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

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List of figures	L3GD20H

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3. SPI slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 4. I2C slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 5. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 6. Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 7. SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 8. Multiple bytes SPI read protocol (2 bytes example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 9. SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 10. Multiple bytes SPI write protocol (2 bytes example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 11. SPI read protocol in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 12. LGA 3x3x1.0 16L mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

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L3GD20H	Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

	+Ω x,y,z
	X+
	Y+	CHARGE	MIXER	LOW-PASS
		AMP		FILTER				F
	Z+						D
								I
							I			CS
						A		L
		M					G		I2C	SCL/SPC
						D		T
		U					I
										SDA/SDI/SDO
						C		E	SPI
		X					T
	Z-									SDO/SA0
						1	A	R
	Y-							I
							L
								N
	X-
								G
				T
				E
				M	S
				P		A
				E	E
		DRIVING MASS		R	N	D
					S	C
				A	O	2
				T
		Feedback loop		U	R
				R
				E
	TRIMMING				CLOCK			CONTROL LOGIC		INT1
REFERENCE		FIFO			&				&	DEN
	CIRCUITS
				PHASE GENERATOR				INTERRUPT GEN.		DRDY/INT2
										AM12689V1

The vibration of the structure is maintained by a drive circuitry in a feedback loop. The sensing signal is filtered and appears as digital signal at the output.

1.1Pin description

Figure 2. Pin connection

+Ω Z

+Ω Y GND

GND

RES

RES

+Ω X RES

(TOP VIEW)

DIRECTIONS OF THE DETECTABLE ANGULAR RATE

paC	SRE	Vdd
14		16
13		1
BOTTOM
	VIEW
9		5
8		6

Vdd_IO

SCL/SPC SDA/SDI/SDO SDO/SA0

CS

DEN

INT1

DRDY/INT2

AM12690V1

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Block diagram and pin description				L3GD20H
	Table 2.	Pin description
	Pin#		Name	Function
	1		Vdd_IO(1)	Power supply for I/O pins
	2		SCL	I2C serial clock (SCL)
			SPC	SPI serial port clock (SPC)
			SDA	I2C serial data (SDA)
	3		SDI	SPI serial data input (SDI)
			SDO	3-wire interface serial data output (SDO)
	4		SDO	SPI serial data output (SDO)
			SA0	I2C less significant bit of the device address (SA0)
	5		CS	SPI enable
				I2C/SPI mode selection (1: I2C mode; 0: SPI enabled)
	6		DRDY/INT2	Data ready/fifo interrupt (FIFO Threshold/overrun/empty)
	7		INT1	Programmable Interrupt
	8		DEN	Gyroscope data enable
	9		Reserved	Connect to GND
	10		Reserved	Connect to GND
	11		Reserved	Connect to GND
	12		GND	0 V supply
	13		GND	0 V supply
	14		Cap	Connect to GND with ceramic capacitor(2)
	15		Reserved	Connect to Vdd
	16		Vdd(3)	Power supply

1.Recommended 100 nF filter capacitor.

2.10 nF (+/-10%), 25 V. 1 nF minimum value has to be guaranteed under 12 V bias condition.

3.Recommended 100 nF plus 10 μF capacitors.

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L3GD20H	Mechanical and electrical specifications

2 Mechanical and electrical specifications

2.1Mechanical characteristics

@ Vdd = 3.0 V, T = 25 °C unless otherwise noted(a)

Table 3.	Mechanical characteristics
Symbol	Parameter	Test condition	Min.	Typ.(1)	Max.	Unit
				±245
FS	Measurement range	User selectable		±500		dps
				±2000
				8.75
So	Sensitivity			17.50		mdps/digit
				70.00
SoDr	Sensitivity change vs.	From -40 °C to +85 °C		±2		%
	temperature(2)	Delta from T = 25 °C
DVoff	Digital Zero-rate level	FS = 2000 dps		±25		dps
OffDr	Zero-rate level change	FS = 2000 dps		±0.04		dps/°C
	vs temperature(3)
NL	Non linearity(3)	Best fit straight line		0.2		% FS
Rn	Rate noise density(3)	BW = 50 Hz		0.011		dps/( Hz)
				11.9/23.7/
	Digital output data			47.3/94.7/
ODR				189.4/		Hz
	rate(3)
				378.8/
				757.6
Top	Operating temperature		-40		+85	°C
	range

1.Typical specifications are not guaranteed.

2.Guaranteed by design.

3.The period (1/ODR), length of time between two consecutive sampling, must be derived by the reciprocal of the maximum. and minimum ODR limits: for example for ODR = 189.4 Hz, sampling period range will be within [4591 μs, 6211 μs] (where ODR minimum and maximum have been approximated at 162 Hz, 219 Hz respectively).

a. The product is factory calibrated at 3.0 V. The operational power supply range is specified in Table 4.

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Mechanical and electrical specifications	L3GD20H

2.2Electrical characteristics

@ Vdd =3.0 V, T=25 °C unless otherwise noted(b)

Table 4.	Electrical characteristics
Symbol	Parameter	Test condition	Min.	Typ.(1)	Max.	Unit
Vdd	Supply voltage		2.2	3.0	3.6	V
Vdd_IO	I/O pins supply voltage(2)		1.71		Vdd+0.1	V
Idd	Supply current			5.0		mA
IddSL	Supply current	Selectable by digital		2.5		mA
	in sleep mode(3)	interface
IddPdn	Supply current in power-	Selectable by digital		1		μA
	down mode	interface
VIH	Digital high level input		0.8*Vdd_I			V
	voltage		O
VIL	Digital low level input				0.2*Vdd_I	V
	voltage				O
Ton	Turn-on time(4)	LPF2 disabled		50		ms
		ODR = 190 Hz
Top	Operating temperature		-40		+85	°C
	range

1.Typical specifications are not guaranteed.

2.It is possible to remove Vdd maintaining Vdd_IO without blocking the communication busses, in this condition the measurement chain is powered off.

3.Sleep mode introduces a faster turn-on time related to power down mode.

4.Time to obtain stable Sensitivity (within ±5% of final value) after exiting power-down mode. It is guaranteed by design.

b. The product is factory calibrated at 3.0 V.

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