ST L3GD20H User Manual

Features

LGA-16

(3x3x1 mm)

■ Wide supply voltage, 2.2 V to 3.6 V

■ Wide extended operating temperature range

(from -40 °C to 85 °C)

■ Low voltage compatible IOs, 1.8 V

■ Low power consumption

■ Embedded power-down

■ Sleep mode

■ Fast turn-on and wake-up

■ Three selectable full scales up to 2000 dps

■ 16 bit rate value data output

■ 8 bit temperature data output

2

■ I

C/SPI digital output interface

■ 2 dedicated lines (1 interrupt, 1 data ready)

■ User enable integrated high-pass filters

■ Embedded temperature sensor

■ Embedded 32 levels of 16 bit data output FIFO

■ High shock survivability

■ ECOPACK

®

RoHS and “Green” compliant

Applications

■ Gaming and virtual reality input devices

■ Motion control with MMI (man-machine

interface)

■ GPS navigation systems

■ Appliances and robotics

L3GD20H

MEMS motion sensor:

three-axis digital output gyroscope

Datasheet — preliminary data

Description

The L3GD20H is a low-power three-axis angular
rate sensor.

It includes a sensing element and an IC interface
able to provide the measured angular rate to the
external world through digital interface (I

The sensing element is manufactured using a
dedicated micromachining process developed by
ST to produce inertial sensors and actuators on
silicon wafers.

The IC interface is manufactured using a CMOS
process that allows a high level of integration to
design a dedicated circuit which is trimmed to
better match the sensing element characteristics.

The L3GD20H has a full scale of
±245/±500/±2000 dps and is capable of
measuring rates with a user selectable
bandwidth.

The L3GD20H is available in a plastic land grid
array (LGA) package and can operate within a
temperature range from -40 °C to +85 °C.

2

C/SPI).

Table 1. Device summary

Order code Temperature range (°C) Package Packing

L3GD20H -40 to +85 LGA-16 (3x3x1) Tray

L3GD20HTR -40 to +85 LGA-16 (3x3x1) Tape and reel

July 2012 Doc ID 023469 Rev 1 1/25

This is preliminar y information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.

www.st.com

25

Contents L3GD20H

Contents

1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.4 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.4.1 SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.4.2 I2C - Inter IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2.6 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.6.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.6.2 Zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.7 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3 Digital main blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3.2 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4.1 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4.1.1 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.2 SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.2.1 SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4.2.2 SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

4.2.3 SPI read in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

5 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

2/25 Doc ID 023469 Rev 1

L3GD20H List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 3. Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 5. Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 6. SPI slave timing values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 7. I2C slave timing values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 8. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Table 9. Serial interface pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 10. I2C terminology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 11. SAD+Read/Write patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 12. Transfer when Master is writing one byte to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 13. Transfer when Master is writing multiple bytes to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 14. Transfer when Master is receiving (reading) one byte of data from slave . . . . . . . . . . . . . 17

Table 15. Transfer when Master is receiving (reading) multiple bytes of data from slave . . . . . . . . . 17

Table 16. LGA 3x3x1.0 16L mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Doc ID 023469 Rev 1 3/25

List of figures L3GD20H

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 3. SPI slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Figure 4. I2C slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 5. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 6. Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 7. SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 8. Multiple bytes SPI read protocol (2 bytes example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 9. SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Figure 10. Multiple bytes SPI write protocol (2 bytes example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Figure 11. SPI read protocol in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 12. LGA 3x3x1.0 16L mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

4/25 Doc ID 023469 Rev 1

L3GD20H Block diagram and pin description

FIFO

TRIMMING

CIRCUITS

REFERENCE

MIXER

CHARGE

AMP

CLOCK

LOW-PASS

FILTER

+ Ω

x,y,z

I2C

SPI

CS

SCL/SPC

SDA/SDI/SDO
SDO/SA0

Y+

Z+

Y-

Z-

X+

X-

DRIVING MASS

Feedback loop

M
U
X

A

D

D
C

I

G

I
T
A
L

F

I
L
T
E
R

I
N
G

CONTROL LOGIC

&

INTERRUPT GEN.

INT1

DRDY/INT2

DEN

A
D
C

T

E
M
P
E
R
A

T
U
R
E

S
E
N
S
O
R

1

2

&

PHASE GENERATOR

AM12689V1

(TOP VIEW)
DIRECTIONS OF THE

DETECTABLE
ANGULAR RATE

1

X

Vdd_IO

SCL/SPC
SDA/SDI/SDO
SDO/SA0

RES

INT1

DRDY/INT2

CS

DEN

Cap

RES

Vdd

1

8

6

16

+ Ω

Z

+ Ω

X

BOTTOM

VIEW

+ Ω

Y

5

13

9

RES

RES

GND

GND

14

AM12690V1

1 Block diagram and pin description

Figure 1. Block diagram

The vibration of the structure is maintained by a drive circuitry in a feedback loop. The
sensing signal is filtered and appears as digital signal at the output.

1.1 Pin description

Figure 2. Pin connection

Doc ID 023469 Rev 1 5/25

Block diagram and pin description L3GD20H

Table 2. Pin description

Pin# Name Function

(1)

1 Vdd_IO

2

SCL
SPC

SDA

3

SDI

SDO

Power supply for I/O pins

2

I

C serial clock (SCL)

SPI serial port clock (SPC)

2

I

C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)

4

SDO

SA0

5CS

SPI serial data output (SDO)

2

I

C less significant bit of the device address (SA0)

SPI enable

2

I

C/SPI mode selection (1: I2C mode; 0: SPI enabled)

6 DRDY/INT2 Data ready/fifo interrupt (FIFO Threshold/overrun/empty)

7 INT1 Programmable Interrupt

8 DEN Gyroscope data enable

9 Reserved Connect to GND

10 Reserved Connect to GND

11 Reserved Connect to GND

12 GND 0 V supply

13 GND 0 V supply

14 Cap Connect to GND with ceramic capacitor

(2)

15 Reserved Connect to Vdd

16 Vdd

1. Recommended 100 nF filter capacitor.

2. 10 nF (+/-10%), 25 V. 1 nF minimum value has to be guaranteed under 12 V bias condition.

3. Recommended 100 nF plus 10 μF capacitors.

(3)

Power supply

6/25 Doc ID 023469 Rev 1

L3GD20H Mechanical and electrical specifications

dps/ Hz()

2 Mechanical and electrical specifications

2.1 Mechanical characteristics

@ Vdd = 3.0 V, T = 25 °C unless otherwise noted

Table 3. Mechanical characteristics

Symbol Parameter Test condition Min. Typ.

FS Measurement range User selectable

So Sensitivity

(a)

(1)

±245
±500

±2000

8.75

17.50

70.00

Max. Unit

dps

mdps/digit

SoDr

Sensitivity change vs.
temperature

(2)

From -40 °C to +85 °C
Delta from T = 25 °C

±2 %

DVoff Digital Zero-rate level FS = 2000 dps ±25 dps

OffDr

Zero-rate level change
vs temperature

NL Non linearity

(3)

(3)

Rn Rate noise density

FS = 2000 dps ±0.04 dps/°C

Best fit straight line 0.2 % FS

(3)

BW = 50 Hz 0.011

11.9/23.7/

47.3/94.7/

189.4/

378.8/

Hz

ODR

Digital output data

(3)

rate

757.6

Top

1. Typical specifications are not guaranteed.

2. Guaranteed by design.

3. The period (1/ODR), length of time between two consecutive sampling, must be derived by the reciprocal of the maximum.
and minimum ODR limits: for example for ODR = 189.4 Hz, sampling period range will be within [4591 μs, 6211 μs] (where
ODR minimum and maximum have been approximated at 162 Hz, 219 Hz respectively).

Operating temperature
range

-40 +85 °C

a. The product is factory calibrated at 3.0 V. The operational power supply range is specified in Table 4.

Doc ID 023469 Rev 1 7/25

Mechanical and electrical specifications L3GD20H

2.2 Electrical characteristics

@ Vdd =3.0 V, T=25 °C unless otherwise noted

Table 4. Electrical characteristics

Symbol Parameter Test condition Min. Typ.

Vdd Supply voltage 2.2 3.0 3.6 V

Vdd_IO I/O pins supply voltage

Idd Supply current 5.0 mA

(2)

(b)

(1)

Max. Unit

1.71 Vdd+0.1 V

IddSL

IddPdn

VIH

VIL

Ton Turn-on time

To p

1. Typical specifications are not guaranteed.

2. It is possible to remove Vdd maintaining Vdd_IO without blocking the communication busses, in this condition the
measurement chain is powered off.

3. Sleep mode introduces a faster turn-on time related to power down mode.

4. Time to obtain stable Sensitivity (within

Supply current
in sleep mode

(3)

Supply current in power­down mode

Digital high level input
voltage

Digital low level input
voltage

(4)

Operating temperature
range

Selectable by digital
interface

Selectable by digital
interface

2.5 mA

1 μA

0.8*Vdd_I
O

0.2*Vdd_I
O

LPF2 disabled
ODR = 190 Hz

50 ms

-40 +85 °C

±5% of final value) after exiting power-down mode. It is guaranteed by design.

V

V

b. The product is factory calibrated at 3.0 V.

8/25 Doc ID 023469 Rev 1