ST HDMI05-CL02F3 User Manual

5-line IPAD™, HDMI™ control line ESD protection
Features
Low line capacitance: 12 pF max.
High efficiency in ESD protection
Lead-free package
High reliability offered by monolithic integration
High reduction of parasitic elements through
integration and wafer level packaging
Complies with the standards:
IEC 61000-4-2 Level 4
– ± 15 kV (air discharge) – ± 8 kV (contact discharge)
IEC 61000-4-2 Level 1
– ± 2 kV (air discharge) – ± 2 kV (contact discharge)
Application
HDMI05-CL02F3
Flip Chip
9 bumps

Figure 1. Pin configuration (bump side)

123
SCL
SDA
HPD
CEC
GND
GND
5V
RPU2
RPU
A
B
C
Where ESD protection for HDMI control lines (CEC, HPD, SCL and SDA) is required:
Mobile phones and communication systems
Portable multimedia players
Camcorder, digital still cameras

Figure 2. Schematic

A1
5V
CEC
A2
SCL
A3
SDA
B3
HPD
C3
Description
The HDMI05-CL02F3 chip is a low capacitance
R3
ESD protection for HDMI control pins. It also integrates pull-up resistor for I²C bus and pull­down resistor for hot plug detect and pull-up resistor for CEC line.
B2 and C2 are ground pins
The ESD protection circuitry prevents damage to the protected device when subjected to ESD surges up to 15 kV.
April 2010 Doc ID 15516 Rev 2 1/9
TM: IPAD is a trademark of STMicroelectronics. HDMI, the
HDMI logo and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC.
R2
C1
www.st.com
R1
R4
B1
9
Characteristics HDMI05-CL02F3

1 Characteristics

Table 1. Absolute maximum ratings (T
Symbol Parameter Value Unit
External pins (A1, A2, A3, B3 and C3): ESD IEC 61000-4-2, level 4 - air discharge
V
ESD IEC 61000-4-2, level 4 - contact discharge
PP
Internal pins (B1, C1): ESD IEC 61000-4-2, level 1 - air discharge ESD IEC 61000-4-2, level 1 - contact discharge
Pd Line resistance power dissipation at 70 °C 60 mW
Operating temperature range -30 to + 85 °C
T
op
T
Storage temperature range -55 to + 150 °C
stg

Figure 3. Electrical characteristics (definitions)

Symbol Parameter
V = Breakdown voltage
BR
I = Leakage current @ V
RM RM
V = Stand-off voltage
RM
V = Clamping voltage
CL
R = Dynamic impedance
d
I = Peak pulse current
PP
I = Breakdown current
R
α
T = Voltage temperature coefficient
V = Forward voltage drop
F
C = Line capacitance
line
=
R Series resistance between Input
I/O
= 25 °C)
amb
V
V
CL
V
RM
BR
Slope = 1/Rd
15
8
kV
2 2
I
I
F
V
F
I
RM
I
R
I
PP
V
Table 2. Electrical characteristics (T
= 25 °C)
amb
Symbol Test condition Min. Typ. Max. Unit
V
BRIR
I
RM
, R
R
1
R
R
C
line
= 1 mA 6 20 V
VRM = 3 V per line 50 200 nA
2
3
4
V
= 0 V, V
line
CEC to GND with R SCL and SDA to GND with R
= 30 mV, F = 1 MHz
osc
not connected
PU2
not connected
PU
(measured under zero light conditions)
V
= 0 V, V
line
CEC, SCL and SDA to GND with R
(1)
C
line
grounded
= 30 mV, F = 1 MHz
osc
PU
and R
(measured under zero light conditions)
1. This is the line capacitance seen by the data signals in the application conditions
2/9 Doc ID 15516 Rev 2
PU2
1575 1750 1925 Ω
80 100 120 kΩ
22 27 32 kΩ
14 24
10 12 pF
17 29 pF
HDMI05-CL02F3 Characteristics
300.0
300.0
0G 3.0G
Figure 4. S21(dB) versus frequency Figure 5. Analog crosstalk measurements
dB
0.00
0.00
0.00
CEC SDA
5V
SCL
-5.00
-5.00
-5.00
HPD
-10.00
-10.00
-10.00
-15.00
-15.00
-15.00
-20.00
-20.00
-20.00
300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G
300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G
300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G
F(Hz)
Figure 6. ESD response to IEC 61000-4-2
(+8 kV contact discharge) on CEC line
0.00
-40.00
-80.00
-120.00
dB
-
CEC
RPU2 SDA-SCL SCL-RPU HPD-SCL SCL-CEC
F(Hz)
-160.00 k1.0M3.0M10.0M30.0M100.0M
M1.
Figure 7. ESD response to IEC 61000-4-2
(-8 kV contact discharge) on CEC line
10 V/div
72 V
1
52 V
1
V : ESD peak voltage
PP
2
V @ 30 ns: clamping voltage @ 30 ns
2
CL
V @ 60 ns: clamping voltage @ 60 ns
3
CL
3
39 V
20 ns/div
Figure 8. ESD response to IEC 61000-4-2
(+8 kV contact discharge) on SCL line
10 V/div
1
V : ESD peak voltage
70 V
1
48 V
PP
V @ 30 ns: clamping voltage @ 30 ns
2
CL
V @ 60 ns: clamping voltage @ 60 ns
3
2
CL
3
39 V
20 ns/div
10 V/div
3
-11 V
2
-52 V
-17 V
1
1
V : ESD peak voltage
PP
V @ 30 ns: clamping voltage @ 30 ns
2
CL
V @ 60 ns: clamping voltage @ 60 ns
3
CL
20 ns/div
Figure 9. ESD response to IEC 61000-4-2
(-8 kV contact discharge) on SCL line
10 V/div
3
-11 V
2
-51 V
-17 V
1
1
V : ESD peak voltage
PP
V @ 30 ns: clamping voltage @ 30 ns
2
CL
V @ 60 ns: clamping voltage @ 60 ns
3
CL
20 ns/div
Doc ID 15516 Rev 2 3/9
Characteristics HDMI05-CL02F3
Figure 10. ESD response to IEC 61000-4-2
(+8 kV contact discharge) on SDA line
10 V/div
79 V
1
51 V
1
V : ESD peak voltage
2
PP
V @ 30 ns: clamping voltage @ 30 ns
2
CL
V @ 60 ns: clamping voltage @ 60 ns
3
CL
3
39 V
20 ns/div
Figure 12. ESD response to IEC 61000-4-2
(+8 kV contact discharge) on HPD line
10 V/div
1
V : ESD peak voltage
PP
V @ 30 ns: clamping voltage @ 30 ns
2
CL
V @ 60 ns: clamping voltage @ 60 ns
3
CL
3
40 V
65 V
2
1
49 V
Figure 11. ESD response to IEC 61000-4-2
(-8 kV contact discharge) on SDA line
10 V/div
3
-14 V
2
-57 V
-22 V
1
1
V : ESD peak voltage
PP
V @ 30 ns: clamping voltage @ 30 ns
2
CL
V @ 60 ns: clamping voltage @ 60 ns
3
CL
20 ns/div
Figure 13. ESD response to IEC 61000-4-2
(-8 kV contact discharge) on HPD line
10 V/div
20 ns/div
Figure 14. ESD response to IEC 61000-4-2
(+8 kV contact discharge) on 5 V line
10 V/div
72 V
1
52 V
2
1
V : ESD peak voltage
PP
V @ 30 ns: clamping voltage @ 30 ns
2
CL
V @ 60 ns: clamping voltage @ 60 ns
3
CL
3
39 V
20 ns/div
3
-11 V
1
V : ESD peak voltage
PP
V @ 30 ns: clamping voltage @ 30 ns
2
CL
V @ 60 ns: clamping voltage @ 60 ns
3
CL
-43 V
2
-17 V
1
20 ns/div
Figure 15. ESD response to IEC 61000-4-2
(-8 kV contact discharge) on 5 V line
10 V/div
3
-14 V
2
-52 V
-20 V
1
1
V : ESD peak voltage
PP
V @ 30 ns: clamping voltage @ 30 ns
2
CL
V @ 60 ns: clamping voltage @ 60 ns
3
CL
20 ns/div
4/9 Doc ID 15516 Rev 2
HDMI05-CL02F3 Typical application schematic

2 Typical application schematic

Figure 16. Implementation with HDMI

Host
(Mobile Phone)
(Mobile Phone)
Multimedia
Multimedia
controller
controller
4 TMDS channel
4 TMDS channel
HDMIULC6-4F3
HDMIULC6-4F3
Gnd
TX2­TX2+
TX2+
Gnd
Gnd TX1-
TX1­TX1+
TX1+
Gnd
Gnd
TX0-
video
video
audio
audio
Ctrl /
Ctrl /
status
status
TX0-
TX0+
TX0+
Gnd
Gnd
TC-
TC -
TC+
TC+
Gnd
Gnd CEC
CEC
SCL
SCL
SDA
SDA
V
VDD_5V
_5V
DD
HPD
HPD
Type C Connector
Type C connector
Type C Connector
Type C Connector
Pin-out
Pin
Pin
Pin
B2
B2
-
out
-
-
out
out
D3D1C3C1A1 A3 F1 F3
D3D1C3C1A1 A3 F1 F3
B2 E2
B2 E2B2 E2
HDMIULC6-4F3
HDMIULC6-4F3
5V
5V
CEC
CEC SCL
SCL SDA
SDA HPD
HPD
E2
E2
HDMI
HDMIULC6-4F3
HDMIULC6-4F3
-
-
HDMI05
HDMI05
CL02F3
CL02F3
D3
F1 F3
D3
F1 F3D3
F1 F3
D1C3C1A1 A3
D1C3C1A1 A3
D1C3C1A1 A3
5V
5V
2 x 1K75
2 x 1K75
VDD_CEC
VDD_CEC
27K
27K
100K
100K
Gnd
TX2­TX2+
TX2+
Gnd
Gnd
TX1-
TX1­TX1+
TX1+
Gnd
Gnd
TX0-
TX0-
TX0+
TX0+
Gnd
Gnd
TC-
TC
TC+
TC+
Gnd
Gnd CEC
CEC
SCL
SCL
SDA
SDA
V
V
DD
DD
HPD
HPD
_5V
-
_5V
(TV, flat panel,
(TV, flat panel,
monitor, projector)
monitor, projector)
video
video
audio
audio
Multimedia
Multimedia
Ctrl /
Ctrl /
status
status
J4
J4
1
1
TMDS DATA2 SHIELD
TMDS DATA2 SHIELD
2
2
TMDS DATA2 +
TMDS DATA2 +
3
3
TMDS DATA2
TMDS DATA2
4
4
TMDS DATA1 SHIELD
TMDS DATA1 SHIELD
5
5
TMDS DATA1 +
TMDS DATA1 +
6
6
TMDS DATA1
TMDS DATA1
7
7
TMDS DATA0 SHIELD
TMDS DATA0 SHIELD
8
8
TMDS DATA0 +
TMDS DATA0 +
9
9
TMDS DATA0
TMDS DATA0
10
10
TMDS CLK SHIELD
TMDS CLK SHIELD
11
11
TMDS CLK +
TMDS CLK +
12
12
TMDS CLK
TMDS CLK
13
13
DDC / EEC GROUND
DDC / EEC GROUND
14
14
CEC
CEC
15
15
SCL
SCL
16
16
SDA
SDA
17
17
RESERVED
RESERVED
18
18
+5V POWER
+5V POWER
19
19
HOT PLUG DETECT
HOT PLUG DETECT
Display
controller
controller
-
-
-
-
-
-
-
-
HDMI05-CL02F3
HDMI05-CL02F3
Doc ID 15516 Rev 2 5/9
Ordering information scheme HDMI05-CL02F3

3 Ordering information scheme

Figure 17. Ordering information scheme

HDMI 05 - CL 02 F3
Function
HDMI = HDMI Protection
Number of lines
05 = 5 lines
Application
CL = Control lines
Version
02 = with CEC Pull-up integrated
Package
F3 = Flip Chip 0.4 mm pitch

4 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Figure 18. Flip Chip dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
400 µm ± 40
400 µm ± 40
1.14 mm ± 30 µm
.
605 µm ± 55
255 µm ± 40
1.14 mm ± 30 µm
6/9 Doc ID 15516 Rev 2
HDMI05-CL02F3 Package information

Figure 19. Footprint Figure 20. Marking

Copper pad Diameter: 220 µm recommended 260 µm maximum
Solder mask opening: 300 µm minimum
Solder stencil opening : 220 µm recommended
Dot, ST logo xx = marking z = manufacturing location yww = datecode
(y = year
ww = week)

Figure 21. Flip Chip tape and reel specification

4.0 ± 0.1
1.24
8.0 ± 0.3
ST
yww
xxz
E
ST
yww
xxz
E
Ø 1.5 ± 0.1
ST
yww
xxz
E
E
xyxwz
w
1.75 ± 0.1
3.5 ±- 0.1
0.69 ± 0.05
All dimensions in mm
1.24
4.0 ± 0.1
User direction of unreeling
Doc ID 15516 Rev 2 7/9
Ordering information HDMI05-CL02F3

5 Ordering information

Table 3. Ordering information

Order code Marking Package Weight Base qty Delivery mode
HDMI05-CL02F3 JG Flip Chip 1.76 mg 5000 Tape and reel (7”)

6 Revision history

Table 4. Document revision history

Date Revision Changes
24-Mar-2009 1 First issue.
07-Apr-2010 2 Updated Figure 18.
8/9 Doc ID 15516 Rev 2
HDMI05-CL02F3
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Doc ID 15516 Rev 2 9/9
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