ST EMIF02-SPK02F2 User Manual

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2-line IPAD™, EMI filter and ESD protection

Features

■ Packaged in lead-free Flip Chip

■ Very low resistance: 0.35 Ω

■ High attenuation: -45 dB at 900 MHz

■ Very low PCB space consumption:

0.89 mm x 1.26 mm

■ Very thin package: 0.65 mm

■ High efficiency in ESD suppression

IEC6 1000-4-2 level 4

■ High reliability offered by monolithic integration

■ High reduction of parasitic elements through

integration and wafer level packaging

Complies with the following standards

EMIF02-SPK02F2

Datasheet − production data

Flip-Chip package

(5 bumps)

Figure 1. Pin configuration (bump side)

■ IEC 61000-4-2 level 4:

– ±15 kV (air discharge) – ±8 kV (contact discharge)

Application

■ Mobile phones

Description

The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.

The EMIF02-SPK02F2 flip-chip packaging means the package size is equal to the die size. That's why the EMIF02-SPK02F2 is a very small device.

Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.

GND

Figure 2. Functional schematic

Input

Output

TM: IPAD is a trademark of STMicroelectronics

April 2012 Doc ID 15035 Rev 3 1/12

This is information on a product in full production.

www.st.com

Characteristics EMIF02-SPK02F2

1 Characteristics

Table 1. Absolute maximum ratings (T

Symbol Parameter Value Unit

ESD discharge IEC 61000-4-2

Air discharge Contact discharge

SPK

stg

Maximum rms current per channel 350 mA

Junction temperature range -30 to 125 °C

Storage temperature range -55 to + 150 °C

Figure 3. Electrical characteristics - definitions

amb

= 25 °C)

30 30

Symbol Parameter

V = Breakdown voltage

V = Clamping voltage

I = Leakage current @ V

RM RM

V = Stand-off voltage

I = Forward current

I = Peak pulse current

I = Breakdown current

V = Forward voltage drop

= Dynamic resistance

T = Voltage temperatureα

Table 2. Electrical characteristics - values (T

Slope: 1/R

= 25 °C)

amb

Slope: 1/R

Symbol Test conditions Min Typ Max Unit

IR = 1 mA 6 V

VRM = 3 V 400 nA

0.35 0.8 Ω

VR = 0 V DC, 1 MHz 185 250 315 pF

Cut-off frequency: Z

SOURCE

= Z

= 50 Ω 20 MHz

LOAD

LINE

I/O

2/12 Doc ID 15035 Rev 3

EMIF02-SPK02F2 Characteristics

Figure 4. Attenuation measurements versus frequency

S21 (dB)

0.00

-10.00

-20.00

-30.00

-40.00

F (Hz)

-50.00

Figure 5. Crosstalk measurements versus frequency

100.0k 1.0M 10.0M 100.0M 1.0G I1-O1 I2-O2

0.00

-10.00

-20.00

-30.00

-40.00

-50.00

-60.00

-70.00

-80.00

XTalk (dB)

F (Hz)

100.0k 1.0M 10.0M 100.0M 1.0G I1-O2

Doc ID 15035 Rev 3 3/12

Characteristics EMIF02-SPK02F2

Figure 6. ESD test conditions

2 x -20 dB

50 inputΩ

Figure 7. Clamping voltage V

versus peak pulse current IPP for short pulse duration such as

ESD surges

IPP(A)

Typical breakdown dynamic resistance RD: 140 mΩ

tP= 100 ns

TJinitial = 25 °C

) A

(

P P

VCL(V)

0246810121416

(V)

Note: For further information on the dynamic characteristic see the STMicroelectronics’

application note AN4022, “TVS short pulse R

measurement and correlation with TVS

clamping voltage during ESD”.

4/12 Doc ID 15035 Rev 3

EMIF02-SPK02F2 Characteristics

Figure 8. Output filter ESD response to IEC 61000-4-2 (+8 kV contact discharge) I1 to O1

V : ESD peak voltage

V :clamping voltage @ 30 ns

V :clamping voltage @ 60 ns

V :clamping voltage @ 100 ns

15.7 V

9.1 V

8.7 V

7.9 V

Figure 9. Output filter ESD response to IEC 61000-4-2 (-8 kV contact discharge) I1 to O1

16.1 V

-8.9 V

-8.7V

-7.9 V

V : ESD peak voltage

V :clamping voltage @ 30 ns

V :clamping voltage @ 60 ns

V :clamping voltage @ 100 ns

Doc ID 15035 Rev 3 5/12

Characteristics EMIF02-SPK02F2

Figure 10. Output filter ESD response to IEC 61000-4-2 (+15 kV contact discharge) I1 to O1

V : ESD peak voltage

V :clamping voltage @ 30 ns

V :clamping voltage @ 60 ns

V :clamping voltage @ 100 ns

25.5 V

9.7 V

10 V

8.3 V

Figure 11. Output filter ESD response to IEC 61000-4-2 (-15 kV contact discharge) I1 to O1

23.8 V

-10.2 V

-8.3V

-8.2 V

V : ESD peak voltage

V :clamping voltage @ 30 ns

V :clamping voltage @ 60 ns

V :clamping voltage @ 100 ns

6/12 Doc ID 15035 Rev 3

EMIF02-SPK02F2 Characteristics

Figure 12. Output filter ESD response to IEC 61000-4-2 (+30 kV contact discharge) I1 to O1

V : ESD peak voltage

V :clamping voltage @ 30 ns

V :clamping voltage @ 60 ns

V :clamping voltage @ 100 ns

37.1 V

11.8 V

10.8 V

8.8 V

Figure 13. Output filter ESD response to IEC 61000-4-2 (-30 kV contact discharge) I1 to O1

-37.9 V

-12.2 V

-11.3 V

-8.4 V

V : ESD peak voltage

V :clamping voltage @ 30 ns

V :clamping voltage @ 60 ns

V :clamping voltage @ 100 ns

Doc ID 15035 Rev 3 7/12

Ordering information scheme EMIF02-SPK02F2

2 Ordering information scheme

Figure 14. Ordering information scheme

EMIF yy - xxx zz Fx

EMI Filter

Number of lines

Information

x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version

Package

F = Flip Chip x = 2: lead-free, pitch = 500 µm, bump = 315 µm

8/12 Doc ID 15035 Rev 3

EMIF02-SPK02F2 Package information

3 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

packages, depending on their level of environmental compliance. ECOPACK®

is an ST trademark.

Figure 15. Package dimensions

500 µm ± 10

250 µm ± 10

435 µm

500 µm ± 15

0.89 mm ± 50 µm

315 µm ± 50

1.26 mm ± 50 µm

650 µm ± 65

Figure 16. Footprint Figure 17. Marking

Dot, ST logo

Copper pad Diameter:

250 µm recommended, 300 µm max.

Solder stencil opening:

330 µm recommended

Solder mask opening recommendation:

340 µm min. for 315 µm copper pad diameter

xx = marking z = manufacturing location yww = datecode

(y = year

ww = week)

xyxwz

Doc ID 15035 Rev 3 9/12

Package information EMIF02-SPK02F2

Figure 18. Flip Chip tape and reel specification

Dot identifying Pin A1 location

8 ± 0.3

4 ± 0.1

xxz

yww

xxz

yww

Ø 1.5 ± 0.1

xxz yww

1.75 ± 0.1 3.5 ± 0.1

0.73 ± 0.05

All dimensions in mm

User direction of unreeling

Note: More information is available in the application notes:

AN1235: “Flip Chip: Package description and recommendations for use”

AN1751: “EMI filters: Recommendations and measurements”

4 ± 0.1

10/12 Doc ID 15035 Rev 3

EMIF02-SPK02F2 Ordering information

4 Ordering information

Table 3. Ordering information

Order code Marking Package Weight Base qty Delivery mode

EMIF02-SPK02F2 JD Flip Chip 1.8 mg 5000 Tape and reel 7”

5 Revision history

Table 4. Document revision history

Date Revision Changes

17-Sep-2008 1 Initial release.

12-Sep-2011 2 Updated Figure 15 and Figure 16.

3-Apr-2012 3

Updated cover page features and description.Inserted Figure 6 to

Figure 13.

Doc ID 15035 Rev 3 11/12

EMIF02-SPK02F2

Please Read Carefully:

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ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

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www.st.com

12/12 Doc ID 15035 Rev 3

ST EMIF02-SPK02F2 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Figure 1. Pin configuration (bump side)

Figure 2. Functional schematic

1 Characteristics

Figure 3. Electrical characteristics - definitions

Figure 4. Attenuation measurements versus frequency

Figure 5. Crosstalk measurements versus frequency

Figure 6. ESD test conditions

Figure 8. Output filter ESD response to IEC 61000-4-2 (+8 kV contact discharge) I1 to O1

Figure 9. Output filter ESD response to IEC 61000-4-2 (-8 kV contact discharge) I1 to O1

Figure 10. Output filter ESD response to IEC 61000-4-2 (+15 kV contact discharge) I1 to O1

Figure 11. Output filter ESD response to IEC 61000-4-2 (-15 kV contact discharge) I1 to O1

Figure 12. Output filter ESD response to IEC 61000-4-2 (+30 kV contact discharge) I1 to O1

Figure 13. Output filter ESD response to IEC 61000-4-2 (-30 kV contact discharge) I1 to O1

2 Ordering information scheme

Figure 14. Ordering information scheme

3 Package information

Figure 15. Package dimensions

Figure 16. Footprint Figure 17. Marking

Figure 18. Flip Chip tape and reel specification

4 Ordering information

Table 3. Ordering information

5 Revision history

Table 4. Document revision history