EMIF02-AV01F3
Dual audio and video line IPAD™, EMI filter and ESD protection
Features
■ High-density capacitor
■ EMI low-pass filter and ESD protection
■ High-efficiency in EMI filtering
■ Lead-free package
■ 400 µm pitch
■ Very small PCB footprint: 0.77 mm x 1.17 mm
■ Very thin package: 0.605 mm
■ High reliability offered by monolithic integration
■ Reduction of parasitic elements thanks to CSP
integration
Complies with the following standards
■ IEC 61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ IEC 61000-4-2 level 1 on internal pin (A1, C1)
– 2 kV (air discharge)
– 2 kV (contact discharge)
on
external pin (A2, C2)
Figure 1. Pin configuration (bump side
view)
Figure 2. Schematic
Flip Chip
5 bumps
12
A
B
C
Application
■ Dual audio and video line interface protection
A1
R
and filtering in mobile phones
Description
The EMIF02-AV01F3 is a highly integrated array
designed to suppress EMI / RFI noise and provide
impedance matching for mobile phones and
portable applications.
The EMIF02-AV01F3 is in Flip-Chip package to
offer space saving and high RF performance.
Additionally, this low-pass filter includes an ESD
protection circuitry to prevent damage to the
2 kV
B2
Gnd
2 kV
C1
15 kV
15 kV
R
application when subjected to ESD surges up
to 15 kV.
TM: IPAD is a trademark of STMicroelectronics.
April 2010 Doc ID 12835 Rev 4 1/7
A2
C
C
C2
www.st.com
7
Characteristics EMIF02-AV01F3
1 Characteristics
Table 1. Absolute maximum ratings (T
Symbol Parameter Value Unit
Internal pins (A1, C1)
ESD discharge IEC 61000-4-2, air discharge
V
ESD discharge IEC 61000-4-2, contact discharge
pp
External pins (A2, C2)
ESD discharge IEC 61000-4-2, air discharge
ESD discharge IEC 61000-4-2, contact discharge
Maximum junction temperature 125 °C
T
j
amb
= 25 °C)
2
2
kV
15
8
P
T
T
Total Power Dissipation 200 mW
TOT
Operating temperature range - 40 to + 85 °C
op
Storage temperature range - 55 to 150 °C
stg
Figure 3. Electrical characteristics (definitions)
I
Symbol Parameter
V = Breakdown voltage
BR
I = Leakage current @ V
RM RM
V = Stand-off voltage
RM
C = Line capacitance
line
Table 2. Electrical characteristics (values, T
amb
BR
= 25 °C)
Symbol Test conditions Min. Typ. Max. Unit
I
R
I
RM
VRMV
I
RM
I
V
R
V
BRVRM
V
BRIR
I
RM
R
I/O
C
line
= 1 mA 14 18 V
VRM = 3 V per line 0.5 µA
V
line
= 0 V, V
= 30 mV, F = 100 kHz 2.56 3.2 3.84 nF
osc
2/7 Doc ID 12835 Rev 4
12 15 18 Ω
EMIF02-AV01F3 Characteristics
Figure 4. Attenuation simulation with
Figure 5. Analog crosstalk
1 kΩ input and 10 kΩ ouput
-10.00
-20.00
-30.00
-40.00
-50.00
-60.00
-70.00
-80.00
-90.00
-100.00
dB
0.00
F (Hz)
1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G
Xtalk 1/2
db
0
-10
-20
-30
-40
-50
-60
-70
-80
10 100 1k 10k 100k 1M 10M 100M 1G
Input: 1 k
Output: 10 k
AC simulation
Ω
Ω
50Ω measurements
50Ω simulations
F (Hz)
Figure 6. Digital crosstalk Figure 7. ESD response to IEC 61000-4-2
(+15 kV air discharge) on one input
(V
A1-A2 line
C1
C1-C2 line
C2
Vin = 1 V/Div
V
= 5 mV/Div
out
50 µs/Div
) and one output (V
IN
)
OUT
INPUT : 10 V/Div
INPUT : 10 V/Div
100 ns/Div
100 ns/Div
OUTPUT : 10 V/Div
OUTPUT : 10 V/Div
100 ns/Div
100 ns/Div
Figure 8. ESD response to IEC 61000-4-2
(-15 kV air discharge) on one input
(V
) and one output (V
IN
)
OUT
INPUT : 10 V/Div
INPUT : 10 V/Div
100 ns/Div
100 ns/Div
OUTPUT : 10 V/Div
OUTPUT : 10 V/Div
100 ns/Div
100 ns/Div
50 µs/Div
Figure 9. Line capacitance versus applied
voltage
C
(nF)
LINE
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0123456
F=100 kHz
V
OSC
Tj=25 °C
=30 mV
V
LINE
RMS
(V)
Doc ID 12835 Rev 4 3/7
Ordering information scheme EMIF02-AV01F3
2 Ordering information scheme
Figure 10. Ordering information scheme
EMIF yy - xx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10 (pF)
or
2 letters = application
2 digits = version
Package
F = Flip Chip
x = 3: Lead-free, pitch = 400 µm, bump = 255 µm
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Figure 11. Package dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
400 µm ± 40
185 µm
770 µm ± 30 µm
400 µm ± 40
255 µm ± 40
185 µm
.
605 µm ± 55
1170 µm ± 30 µm
4/7 Doc ID 12835 Rev 4
EMIF02-AV01F3 Ordering information
Figure 12. Footprint Figure 13. Marking
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Dot
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
xyxwz
Solder stencil opening:
220 µm recommended
Figure 14. Flip Chip tape and reel specification
w
Dot identifying Pin A1 location
8.0 ± 0.3
1.27
ST
yww
xxz
E
4.0 ± 0.1
ST
ST
yww
yww
xxz
xxz
E
E
0.87
0.69 ± 0.05
Note: Note: More information is available in the application note:
AN2348:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
4 Ordering information
4.0 ± 0.1
Ø 1.5 ± 0.1
ST
yww
xxz
E
1.75 ± 0.1
3.5 ±- 0.1
Table 3. Ordering information
Order code Marking Package Weight Base qty Delivery mode
EIMF02-AV01F3 HH Flip Chip 1.4 mg 5000 Tape and reel 7”
Doc ID 12835 Rev 4 5/7
Revision history EMIF02-AV01F3
5 Revision history
Table 4. Document revision history
Date Revision Changes
06-Oct-2006 1 Initial release.
11-Oct-2006 2 Corrected test conditions for C
17-Apr-2008 3
Updated ECOPACK statement. Updated Figure 10, Figure 11 and
Figure 14. Reformatted to current standards.
in Table 2.
line
08-Apr-2010 4 Updated dimensions on page 1 and Figure 4, Figure 11, Figure 14.
6/7 Doc ID 12835 Rev 4
EMIF02-AV01F3
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Doc ID 12835 Rev 4 7/7
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