Datasheet EMIF01-1003M3 Datasheet (ST)

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EMIF01-1003M3

1 line IPAD™, EMI filter and ESD protection in Micro QFN package

Features

■ Single line EMI symmetrical (I/O) low-pass filter

■ High efficiency in EMI filtering

■ Very low PCB space consumption:

– 1.0 mm x 0.6 mm

■ Very thin package: 0.6 mm max

■ High efficiency in ESD suppression

(IEC 61000-4-2 level 4)

■ High reliability offered by monolithic integration

■ High reduction of parasitic elements through

integration and wafer level packaging

■ Lead free package

■ Easy layout and flexibility due to single line

topology

■ Low capacitance

(JEDEC MO-236AA compliant)

Figure 1. Pin configuration (top view)

SOT-883

IN OUT

Complies with following standards

■ IEC 61000-4-2 level 4 input and output pins:

– 15 kV (air discharge) – 8 kV (contact discharge)

■ MIL STD 883G - Method 3015-7 Class 3B (all

pins)

Applications

Where EMI filtering in ESD sensitive equipment is required:

■ Keyboard for mobile phones

■ Computers and printers

■ Communication systems

■ MCU boards

GND

Figure 2. Basic cell configuration

Input

R = 100

C = 30 pF typ. @ 0 V

LINE

Output

Description

The EMIF01-1003M3 is a 1 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.

This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on all pins.

TM: IPAD is a trademark of STMicroelectronics

November 2010 Doc ID 13976 Rev 2 1/11

www.st.com

Characteristics EMIF01-1003M3

1 Characteristics

Table 1. Absolute ratings (limiting values at T

= 25° C unless otherwise specified)

amb

Symbol Parameter Value Unit

ESD discharge IEC 61000-4-2 air discharge on input and output pins

ESD discharge IEC 61000-4-2 contact discharge on input and output pins

Junction temperature 125 °C

Operating temperature range -40 to + 85 °C

Storage temperature range -55 to +150 °C

stg

Figure 3. Electrical characteristics (definitions)

Symbol Parameter

V = Breakdown voltage

I = Leakage current @ V

RM RM

V = Stand-off voltage

V = Clamping voltage

I = Peak pulse current

I = Breakdown current

C = Line capacitance

line

= Cut-off frequency

Dynamic resistance

Table 2. Electrical characteristics (T

amb

= 25° C)

Symbol Test conditions Min. Typ. Max. Unit

BRIR

I/O

line

= 1 mA 5 6.5 8 V

VRM = 3 V per line 100 nA

Tolerance ± 10% 100 Ω

VR= 0 VDC, V

= 30 mV, F = 1 MHz 30 39 pF

OSC

S21 F = 900 MHz -25 dB

2/11 Doc ID 13976 Rev 2

EMIF01-1003M3 Characteristics

Figure 4. S21 attenuation measurement

= 0 V)

bias

0.00

-5.00

-10.00

-15.00

-20.00

-25.00

F (Hz)

-30.00

100.0k 1.0M 10.0M 100.0M 1.0G

I-O

Figure 6. ESD response to IEC 61000-4-2

(+15 kV air discharge)

INPUT

Figure 5. Line capacitance versus reverse

voltage applied (typical value)

(pF)

3.50E+01

3.00E+01

2.50E+01

2.00E+01

1.50E+01

1.00E+01

5.00E+00

0.00E+00

LINE

VR(V)

012345

Figure 7. ESD response to IEC 61000-4-2

(- 15 kV air discharge)

INPUT

OUTPUT

Doc ID 13976 Rev 2 3/11

Application schematic EMIF01-1003M3

2 Application schematic

Figure 8. Application schematic

Keypad protection

Key_Row_1

Key_Row_2

Key_Col_y

IN OUT

GND

IN OUT

GND

IN OUT

GND

4/11 Doc ID 13976 Rev 2

EMIF01-1003M3 Ordering information

3 Ordering information

Figure 9. Ordering information scheme

EMIF yy - xxx z Mx

EMI Filter

Number of lines

Information

x = resistance value (Ohms z = capacitance value / 10(pF)

Package

M3 = SOT-883

)

Doc ID 13976 Rev 2 5/11

Package information EMIF01-1003M3

4 Package information

● Epoxy meets UL94, V0

● Lead-free packages

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 3. SOT-883 dimensions

packages, depending on their level of environmental compliance. ECOPACK®

is an ST trademark.

Dimensions

Ref.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 0.45 0.50 0.18 0.2

A1 0.00 0.05 0.00 0.02

L1L

b 0.10 0.15 0.20 0.04 0.06 0.08

b1 0.45 0.50 0.55 0.18 0.20 0.22

D 0.60 0.24

E 1.00 0.39

e 0.35 0.14

e1 0.65 0.26

L 0.20 0.25 0.30 0.08 0.10 0.12

L1 0.20 0.25 0.30 0.08 0.10 0.12

Figure 10. Footprint (dimensions in mm) Figure 11. Marking

0.40

0.20

0.15

0.40

0.50

6/11 Doc ID 13976 Rev 2

EMIF01-1003M3 Package information

Figure 12. Tape and reel specification

1.75 ± 0.1 3.5 ±- 0.05

0.55 ± 0.05

All dimensions in mm

8.0 ± 0.3

1.15 ± 0.05

4.0 ± 0.1

2.0 ± 0.05

0.70 ± 0.05

User direction of unreeling

2.0 ± 0.1

Ø 1.55 ± 0.05

Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should

this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.

Doc ID 13976 Rev 2 7/11

Recommendation on PCB assembly EMIF01-1003M3

5 Recommendation on PCB assembly

5.1 Stencil opening design

1. General recommendation on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 13. Stencil opening dimensions

b) General Design Rule

Stencil thickness (T) = 75 ~ 125 µm

Aspect Ratio

Aspect Area

-----

1.5≥=

LW×

---------------------------2T L W+()

0.66≥=

2. Reference design

a) Stencil opening thickness: 100 µm

b) Stencil opening for leads: Opening to footprint ratio is 90%.

5.2 Solder paste

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste is recommended.

3. Offers a high tack force to resist component movement during high speed

4. Solder paste with fine particles: powder particle size is 20-45 µm.

8/11 Doc ID 13976 Rev 2

EMIF01-1003M3 Recommendation on PCB assembly

5.3 Placement

1. Manual positioning is not recommended.

2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering

3. Standard tolerance of ± 0.05 mm is recommended.

4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.

5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool.

6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.

5.4 PCB design preference

1. To control the solder paste amount, the closed via is recommended instead of open vias.

2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.

5.5 Reflow profile

Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)

260°C max

255°C

220°C

180°C

125 °C

3°C/s max

012345 67

10-30 sec

90 to 150 sec

90 sec max

Note: Minimize air convection currents in the reflow oven to avoid component movement.

2°C/s recommended

6°C/s max

Time (min)

Doc ID 13976 Rev 2 9/11

Ordering information EMIF01-1003M3

6 Ordering information

Table 4. Ordering information

Part number Marking Package Weight Base qty Delivery mode

EMIF01-1003M3 F

1. The marking can be rotated by 90° to diferentiate assembly location

(1)

SOT-883 0.96 mg 12000 Tape and reel (7”)

7 Revision history

Table 5. Document revision history

Date Revision Changes

07-Oct-2007 1 Initial release.

03-Nov-2010 2 Updated base quantity Table 4.

10/11 Doc ID 13976 Rev 2

EMIF01-1003M3

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Doc ID 13976 Rev 2 11/11

Datasheet EMIF01-1003M3 Datasheet (ST)

Specifications and Main Features

Frequently Asked Questions

User Manual

Figure 1. Pin configuration (top view)

Figure 2. Basic cell configuration

1 Characteristics

Figure 3. Electrical characteristics (definitions)

2 Application schematic

Figure 8. Application schematic

3 Ordering information

Figure 9. Ordering information scheme

4 Package information

Table 3. SOT-883 dimensions

Figure 12. Tape and reel specification

5 Recommendation on PCB assembly

5.1 Stencil opening design

Figure 13. Stencil opening dimensions

5.2 Solder paste

5.3 Placement

5.4 PCB design preference

5.5 Reflow profile

Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting

6 Ordering information

Table 4. Ordering information

7 Revision history

Table 5. Document revision history