Features
■ Low insertion loss in pass band
■ High attenuation levels
■ High rejection of out-of-band frequencies
■ Small footprint: <1.4 mm
Benefits
■ Very low profile (<600 µm after reflow)
■ High Q, low loss
■ High RF performance
■ Tight tolerance
■ Bill of materials and area reduction
2
DIP2450-01D3
2 G / 5 G WLAN diplexer
Datasheet − production data
Flip Chip package 4 bumps
Figure 1. Pin configuration (bump view)
Applications
■ WLAN
■ Bluetooth
■ Mobile phone application
■ Wireless networking
Description
This diplexer targets the use of dual band 2.4 GHz
and 5 GHz. The DIP2450-01D3 is a diplexer
dedicated to the WLAN/BT application.
It is designed using STMicroelectronics IPD
(integrated passive device) technology on non
conductive glass substrate to optimize RF
performance.
1
5G
ANT
2
2G
GND
A
B
June 2012 Doc ID 023193 Rev 1 1/10
This is information on a product in full production.
www.st.com
10
Characteristics DIP2450-01D3
1 Characteristics
Table 1. Absolute rating (limiting values)
Value
Symbol Parameter
Min. Typ. Max.
P
AV
V
ESD
antenna
and 2G
ports
T
OP
Table 2. Electrical characteristics and RF performance (T
Average power 27 dBm
ESD ratings:
MIL STD883C (HBM:C = 100 pF, R = 1.5 kΩ, air discharge)
Charged device model (CDM)
Machine model (MM: C = 200 pF, R = 25 Ω, L = 500 nH)
400
500
100
Operating temperature range -40 +85 ºC
amb
= 25 °C)
Value
Symbol Parameter Test condition
Min. Typ. Max.
Pass band
2 G band pass 2400 2483.5 MHz
f
5 G band pass 4900 5850 MHz
Z Nominal impedance 50 Ω
Unit
V
Unit
Return loss All ports -17 dB
S21 2 G to antenna insertion loss 2400 to 2483.5 MHz 0.6 0.7 dB
S31 5 G to antenna insertion loss 4900 to 5850 MHz 0.6 0.7 dB
Attenuation
S21 2 G to antenna attenuation 4900 to 5850 MHz 20 dB
S31 5 G to antenna attenuation 2400 to 2483.5 MHz 18 dB
Out of band attenuation
5850 to 7000 MHz 15
S21 2 G to antenna attenuation
dB7000 to 9500 MHz 9
9800 to 10500 MHz 16
S31 5 G to antenna attenuation 9800 to 11650 MHz 11 dB
2/10 Doc ID 023193 Rev 1
DIP2450-01D3 Characteristics
1.1 Measured performance
Figure 2. 2 G and 5 G forward transmission
(T
= 25 °C)
amb
S21 and S31 (dB)
0
-10
-20
-30
-40
-50
-60
02468
Figure 4. 2 G insertion loss (T
S21(dB)
-0.40
-0.45
-0.50
S21 (2 G ANT)≥
S31 (5 G ANT)≥
F (GHz)
10
= 25 °C) Figure 5. 2 G attenuation in 5 G band
amb
Figure 3. 2 G, 5 G and antenna reflection
coefficient (T
S11, S22 and S33 (dB)
0
-5
-10
-15
-20
-25
-30
-35
12
02468
(T
= 25 °C)
amb
S21(dB)
-10
-20
-30
amb
= 25 °C)
S11 (ANT)
S22 (2 G)
S33 (5 G)
F (GHz)
10
12
-0.55
-0.60
-0.65
-0.70
2.40 2.42 2.44 2.46 2.48
F (GHz)
Figure 6. 2 G attenuation in high frequency
-10
-20
-30
-40
-50
-60
-0
band (T
S21(dB)
678
5
amb
= 25 °C)
9
F (GHz)
10
11
-40
-50
-60
-70
2.50
4.9 5.1 5.3 5.5 5.7
Figure 7. 2 G return loss (T
S22(dB)
-10
-15
-20
-25
-30
12
2.40 2.42 2.44 2.46 2.48
amb
F (GHz)
5.9
= 25 °C)
F (GHz)
2.50
Doc ID 023193 Rev 1 3/10
Characteristics DIP2450-01D3
Figure 8. Antenna return loss in 2 G band
(T
= 25 °C)
amb
S11(dB)
-10
-15
-20
-25
-30
2.40 2.42 2.44 2.46 2.48
Figure 10. 5 G insertion loss (T
S31(dB)
-0.40
-0.45
-0.50
F (GHz)
= 25 °C) Figure 11. 5 G attenuation in 2 G band
amb
Figure 9. Antenna return loss in 5 G band
(T
= 25 °C)
amb
S11(dB)
-10
-15
-20
-25
-30
2.50
4.9 5.1 5.3 5.5 5.7
(T
= 25 °C)
amb
S31(dB)
-10
-20
-30
F (GHz)
5.9
-0.55
-0.60
-0.65
-0.70
4.9 5.1 5.3 5.5 5.7
F (GHz)
Figure 12. 5 G attenuation in high frequency
-10
-20
-30
-40
-50
-60
-0
band (T
S31(dB)
678
5
amb
= 25 °C)
9
F (GHz)
11
10
-40
-50
-60
-70
5.9
2.40 2.42 2.44 2.46 2.48
Figure 13. 5 G return loss (T
S33(dB)
-10
-15
-20
-25
-30
12
4.9 5.1 5.3 5.5 5.7
amb
F (GHz)
2.50
= 25 °C)
F (GHz)
5.9
4/10 Doc ID 023193 Rev 1
DIP2450-01D3 Characteristics
Figure 14. 2 G to 5 G isolation (T
S23 (dB)
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
02468
= 25 °C) Figure 15. 2 G to 5 G isolation in 2 G band
amb
F (GHz)
10
Figure 16. 2 G to 5 G isolation in 5 G band (T
S23(dB)
-15
-20
-25
12
amb
(T
= 25 °C)
amb
S23(dB)
-15
-20
-25
-30
-25
-40
2.40 2.42 2.44 2.46 2.48
= 25 °C)
F (GHz)
2.50
-30
-25
-40
4.9 5.1 5.3 5.5 5.7
F (GHz)
5.9
Doc ID 023193 Rev 1 5/10
Application information DIP2450-01D3
2 Application information
Figure 17. Application schematic
5GHz Tx
WLAN
2GHz Tx
5GHz Rx
2GHz Rx
Diplexer
BT TX
BT RX
BT
Balun
Figure 18. PCB recommendation
2G 5G
Pad diameter: 220 µm, distance from ground: 100 µm
ANT
6/10 Doc ID 023193 Rev 1
DIP2450-01D3 Package information
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Figure 19. Package dimensions
725 µm
2G
GND
1.25 mm ±50 µm
1.1 mm ±50 µm
5G
ANT
Ø255 µm ±40 µm
625 µm
630 µm ±60 µm
200 µm
Figure 20. Footprint Figure 21. Marking
Copper pad diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing
location
yww = datecode
(y = year
ww = week)
xyx
wzw
Doc ID 023193 Rev 1 7/10
Package information DIP2450-01D3
Figure 22. Flip Chip tape and reel specifications
0.20 ± 0.02
0.71 ± 0.05
All dimensions in mm
1.35± 0.05
8.0 +0.3 -0.10
2.0 ± 0.05
1.20 ± 0.05
4.0 ± 0.1
User direction of unreeling
Ø 1.50 ± 0.10
1.75 ± 0.1
3.5 ±- 0.05
4.0 ± 0.1
8/10 Doc ID 023193 Rev 1
DIP2450-01D3 Ordering information
4 Ordering information
Table 3. Ordering information
Order code Marking Package Weight Base qty Delivery mode
DIP2450-01D3 SA Flip Chip 1.88 mg 5000 Tape and reel (7”)
5 Revision history
Table 4. Document revision history
Date Revision Changes
27-June-2012 1 Initial release
Doc ID 023193 Rev 1 9/10
DIP2450-01D3
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