Wide-band directional coupler with ISO port
Features
■ 50 Ω nominal input / output impedance
■ Wide operating frequency range
(824 MHz to 2170 MHz)
■ Low insertion loss (< 0.2 dB)
■ 26 dB coupling factor
■ High directivity
■ High ESD robustness
(IEC 61000-4-2 Level 4)
■ Flip-Chip package
■ Small footprint
CPL-WB-01D3
Flip-Chip package 6 bumps
Figure 1. Pin configuration (top view)
Benefits
■ Very low profile
■ Lead-free package
■ High RF performance
■ RF module size reduction
Applications
■ Quad-band power amplifier module
■ Quad-band front end module
■ GSM / WCDMA mobile phone
123
RF
ISO
OUT
GND
GND
RF
IN
CPLD
A
B
Description
The CPL-WB-01D3 is a wide-band directional
coupler designed to measure RF antenna output
power in GSM / WCDMA / TD-SCDMA
applications. This CPL has been customized for
wide band operating frequencies (EGSM and
CELL, PCS, DCS, TD-SCDMA, WCDMA Band I)
with less than 0.2 dB insertion losses in the
transmit bandwidth (824 MHz to 2170 MHz).
The CPL-WB-01D3 has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non-conductive glass
substrate to optimize RF performance. The device
is delivered 100% tested in tape and reel.
February 2012 Doc ID 019036 Rev 3 1/10
www.st.com
10
Characteristics CPL-WB-01D3
1 Characteristics
Table 1. Absolute maximum rating (limiting values)
Symbol Parameter
IN
Input power RF
IN
P
ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω, 10 shots
V
ESD (IEC)
V
ESD (HBM)
V
ESD (MM)
V
ESD (CDM)
T
OP
Table 2. Electrical characteristics (T
with both polarities and each condition, cumulative method)
RF
RF
IN
IN
, RF
, RF
, air discharge
OUT
, contact discharge
OUT
Human body model, JESD22-A114-B, All I/O 2 kV
Machine model, JESD22-A115-A, All I/O 100 V
Charge device model, JESD22-C101-C, All I/O 500 V
Operating temperature -30 +85 ºC
= 25 °C) - impedances
amb
Symbol Parameter
Z
Z
Z
OUT
Z
CPLD
ISO
Nominal output impedance 50 Ω
Nominal input impedance 50 Ω
IN
Nominal coupling impedance 50 Ω
Nominal ISO impedance 50 Ω
Val ue
Min. Typ. Max.
35 dBm
±15
±8
Val ue
Min. Typ. Max.
Unit
kV
kV
Unit
2/10 Doc ID 019036 Rev 3
CPL-WB-01D3 Characteristics
Table 3. Electrical characteristics (T
Symbol Parameter Test condition
T
OP
I
R
CPLD Coupling factor
Ripple
DIR Coupler directivity From 824 MHz to 2025 MHz 15 20 dB
Operating temperature -30 +85 °C
Frequency range
f
(bandwidth)
Insertion loss in bandwidth From 824 MHz to 2170 MHz 0.1 0.2 dB
L
Return loss in bandwidth From 824 MHz to 2170 MHz 15 dB
L
From 824 MHz to 915 MHz 24 26 27 dB
From 1710 MHz to 2025 MHz 18 19 21 dB
Coupling ripple in
individual band
(824 to 849 MHz) - (880 to 915 MHz)
(1710 to 1785 MHz) - (1850 to 1910 MHz)
(1880 to 2025 MHz) - (1920 to 1980 MHz)
= 25 °C) - RF performance
amb
Val ue
Unit
Min. Typ. Max.
824 2170 MHz
0.5 dB
Doc ID 019036 Rev 3 3/10
Characteristics CPL-WB-01D3
1.1 RF measurement
Figure 2. Insertion loss
IL - dB
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
Figure 3. Coupling LB
-23
-24
-25
-26
-27
-28
8.2E8 8.8E88.6E88.4E8 9.0E8
Figure 4. Coupling HB
-17
-18
F (Hz)
1.0E98.0E8 1.8E91.6E91.4E91.2E9 2.0E9 2.2E9
CPLD_LB, dB
F (Hz)
9.2E8
CPLD_HB, dB
-19
-20
-21
-22
1.70E9
1.75E9 1.90E91.85E91.80E9 1.95E9
4/10 Doc ID 019036 Rev 3
F (Hz)
2.05E92.00E9
CPL-WB-01D3 Characteristics
Figure 5. Return losses
RL - dB
-10
-15
-20
-25
-30
-35
-40
-45
-50
0.0
RL_IN
RL_OUT
RL_ISO
RL_CPLD
5.0E8
F (Hz)
2.5E92.0E91.5E91.0E9 3.0E9
Doc ID 019036 Rev 3 5/10
PCB layout recommendation CPL-WB-01D3
2 PCB layout recommendation
Figure 6. Typical PCB layout recommendation
● Material: 4 layers FR4 with solder mask on top and bottom layer
● Substrate thickness: 0.8 mm
● 50 Ω line access
● Ground plane must be on PCB layer 1 as shown in Figure 6
6/10 Doc ID 019036 Rev 3
CPL-WB-01D3 Package information
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Figure 7. Package dimensions
595 µm
450 µm
255 µm
1.3 mm ± 45 µm
1.0 mm ± 45 µm
625 µm
±50 µm
UBM: ø 220 µm
Figure 8. Footprint Figure 9. Marking
Copper pad diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xyxwz
w
Doc ID 019036 Rev 3 7/10
Package information CPL-WB-01D3
Figure 10. Flip Chip tape and reel specifications
Dot identifying Pin A1 location
2.0
0.22
1.4
ST ST ST
8.0
xxz xxz xxz
yww yww yww
1.1
0.73
All dimensions are typical values in mm
User direction of unreeling
Note: More information is available in the application note:
AN2348: “Flip Chip: package description and recommendations for use”
4.0
Ø 1.55
1.75
3.5
4.0
8/10 Doc ID 019036 Rev 3
CPL-WB-01D3 Ordering information
4 Ordering information
Table 4. Ordering information
Order code Marking Package Weight Base qty Delivery mode
CPL-WB-01D3 RV Flip Chip 1.61 mg 5000 Tape and reel
5 Revision history
Table 5. Document revision history
Date Revision Changes
08-Jul-2011 1 Initial release
12-Sep-2011 2 Updated Figure 2, Figure 3, and Figure 4.
14-Feb-2012 3 Updated Figure 8.
Doc ID 019036 Rev 3 9/10
CPL-WB-01D3
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10/10 Doc ID 019036 Rev 3
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