Datasheet CPL-WB-01C2 Datasheet (ST)

Wide band directional coupler with ISO port
Features
50 Ω nominal input / output impedance
Wide operating frequency range
(824 MHz to 2025 MHz)
34 dB typical coupling factor
High directivity (typical 25 dB)
High ESD robustness
(IEC 61000-4-2 Level 4)
Flip-Chip package
Small footprint: 1700 x 1200 µm
CPL-WB-01C2

Figure 1. Pin configuration (top view)

Benefits
Very low profile (< 690 µm thickness)
Lead-free package
High RF performance
RF module size reduction
Applications
Quad band power amplifier module
Quad band front end module
GSM / WCDMA / TD-SCDMA mobile phone
123
RF
GND
OUT
ATN. ATN.
ISO
GND
CPLD
RF
IN
A
B
Description
The CPL-WB-01C2 is a wide band directional coupler designed to measure RF antenna output power in GSM / TD-SCDMA applications. This CPL has been customized for wide band operating frequencies (EGSM and CELL, PCS, DCS, TD-SCDMA) with less than 0.2 dB insertion losses in the transmit bandwidth (824 MHz to 2025 MHz).
The CPL-WB-01C2 has been designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel.
January 2010 Doc ID 15366 Rev 3 1/8
www.st.com
8
Characteristics CPL-WB-01C2

1 Characteristics

Table 1. Absolute maximum rating (limiting values)

Value
Symbol Parameter
Min. Typ. Max.
IN
Input Power RF
IN
P
35 dBm
ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω, 10 shots
V
ESD (IEC)
V
ESD (HBM)
V
ESD (MM)
V
ESD (CDM)
T
OP
Table 2. Electrical characteristics - impedances (T
with both polarities and each condition, cumulative method) RF RF
IN
IN
, RF , RF
, air discharge
OUT
, contact discharge
OUT
±15
±8
Human body model, JESD22-A114-B, All I/O 2 kV
Machine model, JESD22-A115-A, All I/O 100 V
Charge device model, JESD22-C101-C, All I/O 500 V
Operating temperature -30 +85 ºC
amb
= 25 °C)
Value
Symbol Parameter
Min. Typ. Max.
Z
OUT
Z
Z
CPLD
Z
OUT
Table 3. Electrical characteristics - RF performance (T
Nominal output impedance 50 Ω
Nominal input impedance 50 Ω
IN
Nominal coupling impedance 50 Ω
Nominal ISO impedance 50 Ω
amb
= 25 °C)
Value
Symbol Parameter Test condition
Min. Typ. Max.
T
OP
I
R
CPLD
Ripple
Operating temperature -30 +85 °C
Frequency range
f
(bandwidth)
Insertion loss in
L
bandwidth
Return loss in bandwidth From 824 MHz to 2025 MHz 15 dB
L
Coupling factor (including attenuator)
Coupling ripple in individual band
From 824 MHz to 2025 MHz 0.1 0.2 dB
From 824 MHz to 915 MHz 35 39 dB
From 1710 MHz to 2025 MHz 28 33 dB
(824 to 849 MHz) (880 to 915 MHz) (1710 to 1785 MHz) (1850 to 1910 MHz)(1880 to 2025 MHz)
824 2025 MHz
0.5 dB
DIR Coupler directivity From 824 MHz to 2025 MHz 20 25 dB
Unit
kV kV
Unit
Unit
2/8 Doc ID 15366 Rev 3
CPL-WB-01C2 Characteristics

1.1 RF measurement (on reference evaluation board)

Measurements done on reference evaluation board under 50 Ω, de-embedding at CPL-WB-01C2 bumps.

Figure 2. Insertion loss

dB
-0.0
-0.05
-0.1
-0.15
-0.2
-0.25
-0.3

Figure 3. Coupling and isolation

dB
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
F (MHz)
20351901176616321497136212281093959824
F (MHz)
20351901176616321497136212281093959824
2170
2170

Figure 4. Directivity

40
38
36
34
32
30
28
26
24
22
20
F (MHz)
2170
20351901176616321497136212281093959824
Doc ID 15366 Rev 3 3/8
Reference evaluation board CPL-WB-01C2

2 Reference evaluation board

Figure 5. CPW lines (W = 850 µm with gap to gnd = 260 µm) on top layer + GND on
bottom layer
Material: 2 layers FR4 with solder mask on top and bottom layer
Substrate thickness: 0.8 mm
Line lengths: 10.2 mm
Extension values on short line measurement: 102 ps
Through insertion loss: 0.20 dB @ 1 GHz , 0.24 dB@ 2 GHz
4/8 Doc ID 15366 Rev 3
CPL-WB-01C2 Package information

3 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.

Figure 6. Package dimensions

650 µm
500 µm
1.200 mm ± 50 µm
1.700 mm ± 50µm
315 µm diameter
670 µm
Figure 7. Footprint Figure 8. Marking
Dot, ST logo
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
xx = marking z = manufacturing location yww = datecode
(y = year
ww = week)
E
xyxwz
w
Doc ID 15366 Rev 3 5/8
Package information CPL-WB-01C2

Figure 9. Flip Chip tape and reel specifications

Dot identifying Pin A1 location
8 ± 0.3
ST
xxx
yww
4 ± 0.1
ST
xxx
yww
E
E
Ø 1.5 ± 0.1
ST
E
xxx yww
1.75 ± 0.1 3.5 ± 0.1
0.73 ± 0.05
All dimensions in mm
User direction of unreeling
Note: More information is available in the application note:
AN1235: “Flip Chip: package description and recommendations for use”
4 ± 0.1
6/8 Doc ID 15366 Rev 3
CPL-WB-01C2 Ordering information

4 Ordering information

Table 4. Ordering information

Order code Marking Base qty Delivery mode
CPL-WB-01C2 RE 5000 Tape and reel

5 Revision history

Table 5. Document revision history

Date Revision Changes
15-Jan-2009 1 Initial release.
12-Oct-2009 2 Updated Table 3 value frequency range.
06-Jan-2010 3 Updated applications and description on page 1. Updated page layout.
Doc ID 15366 Rev 3 7/8
CPL-WB-01C2
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2010 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
8/8 Doc ID 15366 Rev 3
Loading...