The purpose of this application note is to describe:
■ how to connect the TDA7498 demonstration board
■ how to evaluate the performance of the demonstration board using the electrical curves
■ how to avoid critical issues in the PCB schematic and layout of the TDA7498E
The TDA7498E represents a new generation of analog input class-D devices from
STMicroelectronics and is housed in a PSSO36 package. It is able to deliver 160 W +160 W
in stereo configuration with V
Figure 1.TDA7498E demonstration board
= 36 V and a 4 Ω load
CC
(a)
.
a. All of the results and graphs included in this document are measured using Audio Precision equipment.
AN4015Test conditions and connections of the demonstration board
2 Test conditions and connections of the
demonstration board
2.1 Power supply and interface connection
1.Connect PSU to the VCC terminal block
2. Connect the analog input cable to the RCA connectors on the demonstration board, the
other side must be connected to a signal source such as the Audio Precision analog
outputs or a DVD player
2.2 Output configuration
The TDA7498E demonstration board has been configured in 2-channel BTL output.
2.3 Connections
The board terminals (top view of demonstration board) are visible inFigure 2.
Figure 6.PCB layout - top and bottom sides plus components
8/22Doc ID 022507 Rev 1
AN4015Electrical characteristics
4 Electrical characteristics
Referring to Figure 3: TDA7498E schematic, the Left (L) and Right (R) channels are the
output for a stereo configuration. V
InputFreq = 1 kHz; RefLevel = 1 W (0 dBr), Load = 4 Ω (resistive dummy load).
ColorSweep Tr aceLine Style Thi ck Dat aAxis Comment
11RedSolid2Anlr.THD+N Ratio LeftVcc =36V; Load=4ohm; 1k Hz; Ch L
13BlueSolid2Anlr.THD+N Ratio LeftVc c=36V; Load=4ohm; 1kHz; Ch R
Figure 8.THD+N vs. frequency (ref = 1 W at 1 kHz)
1
0.5
0.2
0.1
%
0.05
0.02
0.01
2020k501002005001k2k5k10k
Hz
ColorSweep Tra ceLine Style Thi ck DataAxis Comment
11RedSolid2Anlr.THD+N Ratio Left Vcc=36V; 1W@1kHz; Ch L
12Blue Solid2Anlr.THD+N Ratio Left Vcc=36V; 1W@1kHz; Ch R
10/22Doc ID 022507 Rev 1
AN4015Test curves
Figure 9.DNR
-20
-25
-30
-35
-40
-45
d
-50
B
-55
-60
-65
-70
-75
-80
-60+0-55-50-45-40-35-30-25-20-15-10-5
dBr
ColorSweep Tra ceLine Style Thi ck Dat aAxis Comment
11RedSolid2Anlr.THD+N Ratio LeftVc c=36V_1k Hz_4 ohm; Ch L
12BlueSolid2Anlr.THD+N Ratio LeftVcc= 36V_1kHz_4 ohm ; Ch R
21Green Solid2Anlr.THD+N Ratio LeftVcc=36V _1kHz _4 ohm; Ch R - A W Fi lter
22Black Solid2Anlr.THD+N Ratio LeftVcc=36V_1k Hz_4 ohm; Ch L - AW Filt er
Figure 10. FFT (0 dBr at 1 W)
+0
-10
-20
-30
-40
-50
-60
d
B
-70
r
-80
A
-90
-100
-110
-120
-130
-140
-150
2020k501002005001k2k5k10k
ColorSweep Tra ceLine Sty le Thi ck DataAxisCom ment
11RedSolid2Fft.Ch.1 Ampl LeftVcc=36V; Ref: 1W@1kHz: Ch L
12Blue Solid2Fft.Ch.2 Ampl Right Vcc=36V; Ref: 1W@1kHz : Ch R
+0
-10
-20
-30
-40
-50
-60
d
B
-70
r
-80
B
-90
-100
-110
-120
-130
-140
-150
Hz
Doc ID 022507 Rev 111/22
Test curvesAN4015
Figure 11. Crosstalk
+0
-10
-20
-30
-40
-50
d
-60
B
-70
-80
-90
-100
-110
-120
2020k501002005001k2k5k10k
Hz
ColorSweep Tr aceLine S tyle Thic k DataAxis Comment
11RedSolid2S2C.Anlr.Crosstalk LeftVcc= 36V; 1W ; 4ohm; (Ch L on)
12BlueSolid2S2C.Anlr.Crosstalk LeftVcc =36V; 1W ; 4ohm; (Ch R on)
Figure 12. Linearity
24
23.5
23
22.5
22
Gain [dB]
21.5
21
20.5
Left
20
00. 20.40.60.811.21.41.61.82
Right
Gain Linearity
Input Level [V]
12/22Doc ID 022507 Rev 1
AN4015Test curves
Figure 13. Bandwidth
+1
+1
+0.5
+0
-0.5
d
B
-1
r
A
-1.5
-2
-2.5
-3
1050k20501002005001k2k5k10k20k
11RedSolid2Anlr.Level A LeftVcc=36V; 1W; Ch L
12BlueSolid2Anlr.Level B Right Vcc=36V; 1W; Ch R
Figure 14. Pout vs. V
200
180
Hz
ColorSweep Tra ceLine Style Th ic k Dat aAxisComment
ColorSweep Tra ceLine Style Th ic k DataAxis Comment
11Cy anSolid2Anlr.Level A LeftPout vs. Vc c; Load=4ohm ; THD=1%
21Green Solid2Anlr.Level A LeftPout vs. Vc c; Load=4ohm ; THD=10%
31BlueSolid2Anlr.Level A LeftPout vs. Vc c; Load= 4ohm; THD=20%
41RedSolid2Anlr.Level A LeftPout vs. Vc c; Load=4ohm; THD=30%
Doc ID 022507 Rev 113/22
Design guidelines for PCB schematic and layoutAN4015
6 Design guidelines for PCB schematic and layout
6.1 Schematic
6.1.1 Main driver for the selection of components
●Absolute maximum rate (input V
●Bypass capacitor 100 nF in parallel to 1µF for each power V
is suggested.
●Coil saturation current must be compatible with the peak current of application
6.1.2 Decoupling capacitors
There are two different ways to use the decoupling capacitors:
●The decoupling capacitor(s) can be shared among channels; the layout must be
designed to implement a "star route" for the V
●One decoupling capacitor can be used for each channel. It is mandatory that each
decoupling capacitor be placed as close as possible to the IC pins. This solution is
implemented on the TDA7498E demonstration board.
6.1.3 Output filter
●Snubber network: the key function of a snubber network is to absorb energy from the
inductive component in the power circuit (the output coils and the speaker). The
purpose of the snubber RC network is to dissipate the unnecessary high pulse energy,
such as a high voltage spike, in the power circuit which is dangerous to the system.
●Main filter (low-pass filter): The purpose of the main filter is to remove the carrier
frequency (≈310 kHz) and to cut off the frequency higher than the audible range of
20 kHz. The LPF filter is implemented by a passive Butterworth topology. In order to
have a clean and flat frequency response, it is mandatory to design the filter to fix the
cutoff frequency a little bit above 20 kHz.
●Damping network: The purpose of the damping network is to avoid the high-frequency
oscillation issue on the output circuit. When the load is disconnected from the amplifier,
the frequency response of the main filter is not flat and there is the possibility of adding
gain in a frequency band. The damping network also improves the THD performance.
The damping network can also avoid the inductive effect of the PCB tracks when the
system is working at high frequency with PWM.
supply): 40 V
CC
CC
paths.
branch. Dielectric X7R
CC
14/22Doc ID 022507 Rev 1
AN4015Design guidelines for PCB schematic and layout
Snubber filter
The snubber circuit must be optimized for the specific application. Starting values are
330 pF in series to 22 ohm. The power dissipation of this network (resistor) depends on the
power supply, frequency and capacitor values using following formula:
PCf2V⋅()
⋅⋅=
2
This power is dissipated on the series resistance.
Figure 15. Snubber filter - solution 1
INxA
C126
330p
R44
22
INxB
To increase the efficiency, it is possible to use two equal snubber networks toward GND. In
this case, the formula to evaluate power is:
PCf2V
This power is dissipated on the resistance.
Figure 16. Snubber filter - solution 2
INxA
⋅⋅ ⋅=
C127
330p
R45
22
R46
22
2
C130
INxB
Doc ID 022507 Rev 115/22
330p
Design guidelines for PCB schematic and layoutAN4015
Dumping network
The C-R-C is a dumping network. It is mainly intended for high inductive loads and for
common-mode noise attenuation.
Figure 17. Dumping network
PWM output frequency shifting for AM band radio sensitivity improvement
Using a logic control signal (FS) from MCU or from a DSP (3.3 V) it is possible to modify the
PWM output frequency.
Figure 18. Frequency shift
(b)
b. For the PWM frequency calculation formula please refer to the datasheet.
16/22Doc ID 022507 Rev 1
AN4015Design guidelines for PCB schematic and layout
6.2 Layout
●Solder 100 nF and 1µF bypass ceramic capacitors as close as possible to the related
IC pin
●To avoid the effect due to the parasitic inductive coil generated by the copper wires, it is
suggested to use the ceramic capacitor to balance the reactance. It's mandatory to
place the ceramic capacitor as close as possible to the related pins. The distance
between the capacitor to the related pins is recommended to be within 5 mm.
Figure 19. Decoupling capacitors
Ground pin and Vcc pin of
100 nF and 1μF capacitors
should be connected to the
related IC pin directly
●Solder the snubber networks as close as possible to the related IC pin. A high level
spike may occur if the snubber network is placed too far from the pins. It's
recommended that the distance from the snubber network be within 3 mm which takes
into consideration the width of the copper wire.
Figure 20. Snubber network
Snubber network
Doc ID 022507 Rev 117/22
Design guidelines for PCB schematic and layoutAN4015
Figure 21. V
●Use electrolytic capacitors first to separate the V
branches. A "star route" for the VCC
CC
supply is suggested to avoid interference between the channels such as when one
channel is idle while the other channel is working with a full load. In applications with
high output power, another approach is to filter the two channels separately. This
solution is implemented in this demonstration board.
decoupling electrolytic capacitors
CC
●ROSC network: Place the RC filter for the ROSC pin close to the IC
Figure 22. ROSC - component placement
R-C network for
ROSC
18/22Doc ID 022507 Rev 1
AN4015Design guidelines for PCB schematic and layout
●Place the filter capacitors for SVR, VREF, SVCC, VSS and VDDPW close to the IC.
Figure 23. Filter capacitors for SVR, VREF, SVCC, VSS and VDDPW
Filter capacitors for
VREF, SVCC and
VSS
Filter capacitor for SVR
Filter capacitors
for VDDS and
VDDPW
●Input signal routing
Figure 24. Input signal routing
Doc ID 022507 Rev 119/22
Design guidelines for PCB schematic and layoutAN4015
●Signal ground and power ground routing: the signal ground should be connected to the
bulk capacitor negative terminal via a dedicated copper track; no vias must be present
in the connection path.
Figure 25. Signal ground and power ground routing
20/22Doc ID 022507 Rev 1
AN4015Revision history
7 Revision history
Table 2.Document revision history
DateRevisionChanges
09-Jan-20121Initial release.
Doc ID 022507 Rev 121/22
AN4015
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