The purpose of this application note is to describe:
■ how to connect the STA381BW/STA381BWS 2.0-channel demonstration board
■ how to evaluate the performance of the demonstration board with significant electrical
curves
■ how to avoid critical issues in the PCB schematic and layout of the
STA381BW/STA381BWS
The STA381BW/STA381BWS demonstration board is configured for 2.0 BTL channels,
releasing up to 2 x 20 W into 8 ohm of power output at 18 V of supply voltage in the VQFN48
package. It represents a total solution for the digital audio power amplifier.
Figure 15.THD vs. output power, V
Figure 16.THD vs. output power at different power supplies, R
Figure 17.Frequency response, V
Figure 18.Crosstalk, V
Figure 19.SNR, V
Functional description of the demonstration boardAN3959
1 Functional description of the demonstration board
The following terms used in this application note are defined as follows:
●THD+N vs. Freq: Total harmonic distortion (THD) plus noise versus frequency curve
●THD+N vs. Pout: Total harmonic distortion (THD) plus noise versus output power
●S/N ratio: Signal-to-noise ratio
●FFT: Fast Fourier Transform algorithm (method)
●CT: Channel separation L to R, or R to L channel crosstalk
The equipment used includes the following:
●Audio Precision (System 2700) by AP Co., USA
●DC power supply (4.5 V to 25.5 V operating range)
●Digital oscilloscope (TDS3034B by Tektronix)
●MS Windows-based PC with APWorkbench GUI control software installed. For the
APWorkbench software setup, please refer to the APW UserManualR1.0.pdf
Reference documents include:
●STA381BW and STA381BWS datasheets
●Demonstration board schematic, PCB layout and test curves
1.1 Connections
Power supply and interface connection
1.Connect the positive voltage of the 18 V DC power supply to the +VS pin and negative
to GND (note that the operating voltage range of the DC power supply is from 4.5 V to
25.5 V).
2. Connect the APWLink board to the J1 connector of the STA380BWS demonstration
board.
3. Connect the S/PDIF signal cable to the RCA jack on the APWLink board, the other side
connects to the signal source such as Audio Precision or a DVD player.
1.2 Output configuration
The STA381BW/STA381BWS demonstration board is specifically configured in 2 BTL
channels.
6/65Doc ID 022081 Rev 3
1.3 Schematic and block diagrams, bill of material, PCB layout
Note 1:
The output filter for the line/HP output
path is optional (not required for the STA381BW/S).
If the 2x 47 ohm resistors (R35 and R44) are
bypassed through J14 and J18, the 2x 100 nF
capacitors (C54 and C55) must also be removed.
Note 2:
C56 is not soldered when the STA 381BW/S
is configured in 2.0 or 2.1 channels; C56 is 100 nF
when the STA 381BW/S is configured in mono BTL.
Refer to the s
for an example of a mono BTL application.
chematic in Appendix A on page 63
AN3959Functional description of the demonstration board
Figure 3.Schematic-2
Doc ID 022081 Rev 38/65
R12
FFX3B
FFX3A
FFX4B
FFX4A
4K7
C16
470PF
R13
4K7
R20
4K7
C19
470PF
R21
4K7
STEREO HEA DPHONE DRIVER
AN3959Functional description of the demonstration board
C15
100uF
35V
10K
10K
C22
220PF
R29
R31
+VS
+VS
IC2
R27
4K7
LM833
1
2
3
4
OUTA
INA1
OUTB
INA2
VSS5INB2
VDD
INB1
+VS
R24
10K
220PF
C21
10K
R16
10K
R17
220PF
C28
47uF
8
7
6
10K
R25
C27
100nF
50V
C25
100uF
35V
10K
R34
220PF
C23
10K
10K
R33
R32
BD3
BEAD or 33R
C26
C24
100PF
100PF
BD4
BEAD o r 33R
10K
R28
1
2
3
HEADPHONE O/P
J13
C17
150PF
C20
150PF
R18
4K7
R19
4K7
C18
R26
4K7
R14
4K7
R15
4K7
R22
4K7
R23
4K7
+3V3
SDI1
BICKI
J17
MCLK
12
1
2
1112
1314
1516
TO AP INTERFACE
AP INTERFACE CONNECTOR
J1
HEADER8X2
34
56
78
910
LRCKI
SDASCL
RESET
PWRDN
+VS
CN1
CN2
CN-5-02P
1
2
+
1
2
C12
10uF/10V
The r ange of +Vs is f rom +5V t o +24V
POWER SUPPLY INPUT
+3V3
C13
100nF
J3-1
J4-1
J3-2
J4-2
J6-1
J6-2
SDA
J5-1
SCL
J5-2
MCLK
LRCKI
BICKI
SDI1
INT_LINE
SDA
SCL
J8-1
J8-2
J10-1
J10-2
J11-1
J11-2
J12-1
J12-2
FFX3A
FFX3B
FFX4A
FFX4B
F3XL
F3XR
SOFTMUTE
TEST PINS
AN3959Functional description of the demonstration board
Figure 23. THD vs. output power, VCC = 24 V, RL = 8 ohm, f = 1 kHz
10
5
2
1
0.5
%
0.2
0.1
0.05
0.02
0.01
10m4020m50m100m 200m500m1251020
W
Test Conditions: VCC=24V, Rl=8ohm, Dual BTL, Volume: +3dB
Figure 24. THD vs. output power at different power supplies, R
10
5
2
1
0.5
%
0.2
0.1
0.05
0.02
0.01
60m50100m200m500m1251020
Test Conditions: Rl=8ohm, Dual BTL, Volum e: +3dB
VCC=6V
VCC=9V
VCC=12V
VCC=15V
W
= 8 ohm, f = 1 kHz
L
VCC=27V
VCC=24V
VCC=21V
VCC=18V
Doc ID 022081 Rev 323/65
Analog section test resultsAN3959
4 Analog section test results
The line/headphone out can be fed either with an external analog source, or with the F3X
output, allowing the audio content to come from the digital interface on both the power
output and on the line/headphone out.
Table 2.Test conditions
ConditionsInputOutput
J15, J16 short-circuit & SW2, SW3 switch to HPOUT STA381BWS F3X F3X HP OUT
J15, J16 short-circuit & SW2, SW3 switch to LINEOUT STA381BWS F3X LINE OUT
J15, J16 open circuit & SW2, SW3 switch to HPOUT LINE IN F3X HP OUT
J15, J16 open circuit & SW2, SW3 switch to LINEOUT LINE INLINE OUT
Table 3.Headphone section test results
Filter: 22K LPFExt. Res: 18K + 43K
HeadphoneUnitSpec.Test results
ReferencemVrms75 mVrms reference
Maximum output level
Left
Right
H/P frequency response
Right
H/P THD+N vs. frequency
Left
Right
H/P THD+N vs. level
Left
Right
H/P signal-to-noise (20-bit)
Left
Right
mVrms540 mVrms(10 mW)542 mV
-3 dB↑, +0.5 dB 30 Hz
~20 kHz
dBr-5777
dBr-5777
dBr-60
548 mV
-0.4 ~ -0.28Left
77
77
78
78
24/65Doc ID 022081 Rev 3
AN3959Analog section test results
Table 4.Line out section test results
Filter: 22K LPFExt Res: 18K + 43K
Line outUnitSpec.Test results
Reference200 mV +/-20%
Maximum output level
Left
Right
Frequency response
Left
Right
THD+N vs. frequency
Left
Right
TH+N vs. level
Left
Right
Signal-to-noise (20-bit)
Left
Right
Channel separation
Left
Right
L/R CH phase differencedeg5↓0.02
Dynamic range (20-bit)
mVrms2.0 V↓1.86
1.87
-1 dB↑,+0.5dB↓ 20Hz
~20 kHz
dBr-60
dBr-60-78 dB at 200 mV
dBr-7079
dBr-7099
-0.87 dB at 20 Hz
-0.83 dB at 20 Hz
-71 dB at 20 Hz
-71 dB at 20 Hz
-78 dB at 200 mV
79
80
Left
Right
Residual noisemV7↓0.021 mV
dBr-85100
100
Doc ID 022081 Rev 325/65
Thermal performanceAN3959
5 Thermal performance
5.1 Thermal results - test 1
Figure 25. Temperature test 1
Testing conditions:
●V
●1 kHz sine wave
●8 ohm
= 12 V
CC
Output power: 2 x 7 W
Table 5.Thermal results - test 1
ResultTamb = 25 °CTamb = 40°C
IC temp39.2 °C54.2 °C
26/65Doc ID 022081 Rev 3
AN3959Thermal performance
5.2 Thermal results - test 2
Figure 26. Temperature test 2
Testing conditions:
●V
●1 kHz sine wave
●8 ohm
= 24 V
CC
Output power: 2 x 15 W
Table 6.Thermal results - test 2
ResultTamb = 25 °CTamb = 40°C
IC temp74.5 °C89.5 °C
Doc ID 022081 Rev 327/65
Design guidelines for schematic and PCB layoutAN3959
6 Design guidelines for schematic and PCB layout
6.1 Schematic
6.1.1 Criteria for selection of components
●Absolute maximum rating: STA381BWS V
●Bypass capacitor 100 nF in parallel to 1 µF for each power V
dielectric is X7R.
●Coil saturation current compatible with the peak current of application
6.1.2 Decoupling capacitors
For the decoupling capacitor(s), one decoupling system can be used with 2 capacitors per
channel. The decoupling capacitors must be as close as possible to the IC pins, in order to
avoid parasitic inductance with the copper wire on the PC board.
6.1.3 Output filter
Figure 27. Output filter (BTL)
IN xA
C90
330p
R36
20
IN xB
22u
L11
L1322u
C89
100n
C95
100n
C101
100n
C105
100n
= 27 V
CC
R34
6.2
R37
6.2
C98
470n
branch. Preferable
CC
C91
1000p
C99
1000p
C103
1000p
J7
1
2
CON2
SNUBBER
Main Filter
1.The key function of a snubber network is to absorb energy from the reactance in the
power circuit. The purpose of the snubber RC network is to avoid unnecessary high
pulse energy such as a spike in the power circuit which is dangerous to the system.
The snubber network allows the energy (big spike) to be transferred to and from the
snubber network in order for the system to work safely.
2. The purpose of the main filter is to cut off the frequency above the audible range of
20 kHz, which is mandatory in order to have a clean amplifer response. The main filter
is designed using the Butterworth formula to define the cutoff frequency.
3. The purpose of the damping network is to avoid the high-frequency oscillation issue on
the output circuit. The damping network allows the THD to be improved and also allows
avoiding the inductive copper on the PCB route when the system is working at high
frequency with PWM or PCM.
28/65Doc ID 022081 Rev 3
Dumping Network
AN3959Design guidelines for schematic and PCB layout
6.1.4 Snubber filter
The snubber circuit must be optimized for the specific application. Starting values are
330 pF in series to 22 ohm. The power on this network is dependent on the power supply,
frequency and capacitor value according to the following formula:
P=C*f*(2*V)
2
This power is dissipated on the series resistance.
Figure 28. Differential-mode snubber circuit
INxA
C126
330p
R44
22
INxB
For the common-mode snubber the formula to evaluate power is:
P=C*f*2*(V
2
)
This power is dissipated on the series resistance.
Figure 29. Common-mode snubber circuit
INxA
C127
330p
R45
22
R46
22
C130
INxB
330p
Doc ID 022081 Rev 329/65
Design guidelines for schematic and PCB layoutAN3959
6.1.5 Main filter
The main filter is an L and C based Butterworth filter. The cutoff frequency must be chosen
between the upper limit of the audio band (≈20 kHz) and the carrier frequency (384 kHz).
Figure 30. Main filter
6.1.6 Dumping network
The C-R-C is a dumping network. It is mainly intended for high inductive loads such as
disconnecting the speaker load.
Figure 31. Dumping network
C dump -S
C dump -P
C dump -P
C dump -S
Table 7.Recommended values
Rload16 ohm12 ohm8 ohm6 ohm4 ohm
Lload47 µH33 µH22 µH15 µH10 µH
Cload220 nF330 nF470 nF680 nF1 µF
R dump
Rdump
C dump-S100 nF100 nF100 nF100 nF220 nF
C dump-P100 nF100 nF100 nF100 nF220 nF
R dump108.26.24.72.7
30/65Doc ID 022081 Rev 3
AN3959Design guidelines for schematic and PCB layout
6.1.7 Recommended power-up and power-down sequence
There is no constraint regarding power supply voltages while it is required to release the
reset line (RST) only after the master clock (MCLK) is stable, after the power-down (PWDN)
is already set high and before any I
Figure 32. Recommended power-up and power-down sequence
2
C commands.
6.2 Layout
The following figures illustrate layout recommendations.
Figure 33. Snubber network soldered as close as possible to the respective IC pin
Doc ID 022081 Rev 331/65
Design guidelines for schematic and PCB layoutAN3959
Figure 34. Electrolytic capacitor used first to separate the VCC branches
Figure 35. Path between V
and ground pin minimized in order to avoid inductive paths
CC
32/65Doc ID 022081 Rev 3
AN3959Design guidelines for schematic and PCB layout
Thermal dissipation
It is mandatory to have a large ground plane on the top layer, inner layer2, inner layer3, and
bottom layer and solder the slug on the PCB.
Figure 36. Large ground plane on the top side
Figure 37. Large ground plane on inner layer2
Doc ID 022081 Rev 333/65
Design guidelines for schematic and PCB layoutAN3959
Figure 38. Large ground plane on inner layer3
34/65Doc ID 022081 Rev 3
AN3959Design guidelines for schematic and PCB layout
Figure 39. Large ground plane on bottom side
Figure 40. Symmetrical paths created for output stage, for differential applications
Doc ID 022081 Rev 335/65
Design guidelines for schematic and PCB layoutAN3959
Figure 41. Coils separated in order to avoid crosstalk
Figure 42. V
filter for high frequency
CC
Placing the V
filter capacitors close to the pins avoids an inductive coil generated by the
CC
copper wire, because the system is working in PWM with fast switching (the frequency is
384 kHz with fs = 48 kHz) so the longer copper wire easily becomes an inductor. To improve
this we suggest using the ceramic capacitor to balance the reactance. It's mandatory to put
the ceramic capacitor as close as possible to the related pins. The distance between the
capacitor to the related pins is recommended to be within 5 mm.
36/65Doc ID 022081 Rev 3
AN3959Design guidelines for schematic and PCB layout
Figure 43. Thermal layout with large ground
The thermal resistance junction in the bottom of the STA381BWS to ambient, obtainable
with a ground copper area of 5.6 x 5.6 mm and with 16 via holes is shown in Figure 43 as an
example.
Doc ID 022081 Rev 337/65
Software setup to use the STA381BW/STA381BWS devices (ST Map)AN3959
7 Software setup to use the STA381BW/STA381BWS
devices (ST Map)
7.1 Processing configuration
Figure 44. Processing path
Proc essing Frequency = 2xFs
I2S In p ut
Interface
X2Ov er-
-sampling
FIR
X2Ov er-
-sampling
FIR
Proc essing Frequency = 2xFs
Pre-
-scale
Pre-
-scale
Hi-Pass
Filter
By de fault tw o ch an nels
Hi-Pass
Filter
Biquad#1Biquad#2Biquad#3Biquad
are link ed
Biquad#1Biquad#2Biquad#3Biquad
●By default, the post-scale is linked (all channels use the channel-1 coefficient value)
– To use different coefficients, bit D3 register 0x03 must be set to 0
●By default, all 8 biquads are enabled
●By default, all biquads are linked (all channels use the channel-1 coefficient values)
– To use different coefficients, bit D4 register 0x03 must be set to 0
●By default, bass and treble are bypassed
– To use bass, bit D1 register 0x36 must be set to 0
– To use treble, bit D0 register 0x36 must be set to 0
Figure 45. 2.1-channel with STCompressor
L
C1Mx1
+
R
C1Mx2
Channel ½
Biquad #8
--------------
Hi-pass XO
Filter
User D efined Filters
User D efined Filters
TM
STCompressor
#4
#4
Volum e
And
Limiter
Biquad #5
De-emph
By d efault two c han nels
Biquad #5
Or
De-emph
Or
are link ed
Biquad #6
Bass
Biquad #6
Bass
DC Cut
Filter
Or
Tone Control
Or
Tone Control
By d efault the ch annels
Biquad #7
or
Treble
Biquad #7
or
Treble
are link ed
Pos t Scale
L
R
C2Mx1
+
C2Mx2
C3Mx1
+
C3Mx2
User-Defined
Mix Coefficients
Channel ½
Biquad #8
--------------
Hi-pass XO
Filter
Channel 3
Biquad #8
--------------
Low -pass XO
filte r
Crossov er Frequency
Determ ined by XO Setting
(User D efined If
XO=0000)
STCompressor
38/65Doc ID 022081 Rev 3
Volum e
And
Limiter
Volum e
And
Limiter
DC Cut
Filter
DC Cut
Filter
Pos t Scale
Pos t Scale
AN3959Software setup to use the STA381BW/STA381BWS devices (ST Map)
7.2 STCompressor
TM
Figure 46. STCompressor - overview
BQ0BQ1
Input
Ch0
BQ0
BQ1
Band Splitter
BQ2BQ3
Input
Ch1
BQ2
BQ3
Band Splitter
Level
Meter
Level
Meter
Level
Meter
Level
Meter
DRC0
Mapper
Mapper
DRC1
DRC2
Mapper
Mapper
DRC3
Offset
Attenuator
Attenuator
Offset
Offset
Attenuator
Attenuator
Offset
X
Output
Ch0
+
X
X
Output
Ch1
+
X
Figure 47. STCompressor - mapper
●Linear zone
–Standard operation, input and output are linked to volume
●Compression zone
–The signal is compressed with a programmable ratio
●Compression ratio
–The ratio changes the compression slope
●Limiting zone
–The signal is limited to avoid unpredictable effects or damages
Doc ID 022081 Rev 339/65
Software setup to use the STA381BW/STA381BWS devices (ST Map)AN3959
Figure 48. STCompressor - compression ratio
●The compression ratio is user-programmable
●By default the rate is 1:1 (no variable ratio)
●There are 16 different settings (from 0 to 15) and the ratio varies from 1:1 to 1:16
Figure 49. STCompressor - limiter threshold
●The limiter threshold is user-programmable
●By default the threshold is set to 0 dB
●There are 144 different settings (from -24 to +12 dB) with 0.25 dB/step
40/65Doc ID 022081 Rev 3
AN3959Software setup to use the STA381BW/STA381BWS devices (ST Map)
Figure 50. STCompressor - offset control
●The offset is a user-programmable gain or volume control
●When the STC is used, it is better to use offset instead of volume for location in the
processing path
There are 192 different settings (from 0 to +48) with 0.25 dB/step
7.2.1 STCompressor settings
●By default the STCompressor is enabled and in pass-through
–Bit D4 of register 0x5A (STC_EN) is set to 1. This means STC is enabled
–Bit D5 of register 0x5A (STC_BYP) is set to 1. This means STC is in pass-through
●By default the STC band recombination is disabled
–Bit D0 register 0x5B (BRC_EN) is set to 0
7.2.2 Configuring and enabling the STCompressor
●Write the STC configuration
–Define the band splitter filtering
–Define the limiter threshold [-24, +12] dB with 0.25 dB/step
–Define the max. linear zone (compression threshold) [-48, 0] dB with 0.25 dB/step
–Define the compression ratio [1:1, 1:16]
–Define the attack rate [0, +16] dB/msec with 0.25 dB/ms step
–Define the release rate [0.0078, 1) dB/msec with 0.0039dB/msec step
–Define the dynamic attack
–Define the offset
●Enable the STC
–Set the STC_BYP bit (register 0x5A bit D1) to 0
Doc ID 022081 Rev 341/65
Software setup to use the STA381BW/STA381BWS devices (ST Map)AN3959
7.2.3 Example settings of the STCompressor
Band splitter:
●Biquad 0, biquad 1 of band 0: low-pass filter with Fc = 200 Hz
/* the volume system consist of main volume and channel volume, the
main volume is responsible for the overall system control, it's
range from -127.5dB to 0dB, every step as 0.5dB,
/*the channel volume is responsible for the each channel volume
control, it's range from -79.5dB to 48dB, every step as 0.5dB,
channelvolume=255-((dbrequest+79.5)*2);
path is optional (not required for the STA381BW/S).
If the 2x 47 ohm resistors (R35 and R44) are
bypassed through J14 and J18, the 2x 100 nF
C8
1uF/10V
capacitors (C54 and C55) must also be removed.
Note 2:
C56 is not soldered when the STA 381BW/S
is configured in 2.0 or 2.1 channels; C56 is 100 nF
when the STA 381BW/S is configured in mono BTL.
OUTPUT FILTER
Revision historyAN3959
9 Revision history
Table 8.Document revision history
DateRevisionChanges
02-Sep-20111Initial release.
11-Nov-20112
05-Dec-20113Updated Section 8.1: FFX381X_Sample.h and Section 8.2: FFX381X_Sample.C
Updated Figure 2: Schematic-1 on page 7
Added Appendix A: Mono BTL schematic on page 63
64/65Doc ID 022081 Rev 3
AN3959
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