For designers of STM32 microcontroller applications, it is important to be able to easily
replace one microcontroller type by another one in the same product family. Migrating an
application to a different microcontroller is often needed, when product requirements grow,
putting extra demands on memory size, or increasing the number of I/Os. On the other
hand, cost reduction objectives may force you to switch to smaller components and shrink
the PCB area.
This application note is written to help you and analyze the steps you need to migrate from
an existing STM32F1 devices based design to STM32L1 devices. It groups together all the
most important information and lists the vital aspects that you need to address.
To migrate your application from STM32F1 series to STM32L1 series, you have to analyze
the hardware migration, the peripheral migration and the firmware migration.
AN3422
Application note
Migration of microcontroller applications
from STM32F1 to STM32L1 series
To benefit fully from the information in this application note, the user should be familiar with
the STM32 microcontroller family. You can refer to the following documents that are available
from www.st.com.
●The STM32F1 family reference manuals (RM0008 and RM0041), the STM32F1
datasheets, and the STM32F1 Flash programming manuals (PM0075, PM0063 and
PM0068).
●The STM32L1 family reference manual (RM0038), the STM32L1 datasheets, and the
STM32F1 Flash and EEPROM programming manual (PM0062).
For an overview of the whole STM32 series and a comparison of the different features of
each STM32 product series, please refer to AN3364 Migration and compatibility guidelines for STM32 microcontroller applications.
The STM32L1 platform forms a strong foundation with a broad and growing portfolio. With
new products addressing new applications, the complete STM32L product series now
comprises three series, STM32L1 Medium-density, STM32L1 Medium-density+ and STM32L1 High-density, all dedicated to ultra low power and low voltage applications.
●STM32L1: Designed for ultra-low-power applications that are energy-aware and seek
to achieve the absolute lowest power consumption. The L1 series maintains
compatibility with the F1 series.
–Medium-density devices are STM32L151xx and STM32L152xx microcontrollers
where the Flash memory density ranges between 64 and 128 Kbyte
–Medium-density+ devices are STM32L151xx, STM32L152xx and STM32L162xx
microcontrollers where the Flash memory density is 256 Kbyte
–High-density devices are STM32L151xx, STM32L152xx and STM32L162xx
microcontrollers where the Flash memory density is 384 Kbyte
The ultralow power STM32L1 Medium-density, STM32L1 Medium-density+ and STM32L1
High-density are fully pin-to-pin, software and feature compatible.
The ultralow power STM32L and general-purpose STM32F1xxx families are pin-to-pin
compatible. All peripherals shares the same pins in the two families, but there are some
minor differences between packages.
In fact, the STM32L1 series maintains a close compatibility with the whole STM32F1 series.
All power and functional pins are pin-to-pin compatible. The transition from the STM32F1
series to the STM32L1 series is simple as only a few pins are impacted (impacted pins are
in bold in the table below).
Table 2.STM32F1 series and STM32L1 series pinout differences
As shown in Table 3 on page 13, there are three categories of peripherals. The common
peripherals are supported with the dedicated firmware library without any modification,
except if the peripheral instance is no longer present, you can change the instance and of
course all the related features (clock configuration, pin configuration, interrupt/DMA
request).
The modified peripherals such as: FLASH, ADC, RCC, PWR, GPIO and RTC are different
from the F1 series ones and should be updated to take advantage of the enhancements and
the new features in L1 series.
All these modified peripherals in the L1 series are enhanced to obtain lower power
consumption, with features designed to meet new market requirements and to fix some
limitations present in the F1 series.
4.1 STM32 product cross-compatibility
The STM32 series embeds a set of peripherals which can be classed in three categories:
●The first category is for the peripherals which are by definition common to all products.
Those peripherals are identical, so they have the same structure, registers and control
bits. There is no need to perform any firmware change to keep the same functionality at
the application level after migration. All the features and behavior remain the same.
●The second category is for the peripherals which are shared by all products but have
only minor differences (in general to support new features), so migration from one
product to another is very easy and does not need any significant new development
effort.
●The third category is for peripherals which have been considerably changed from one
product to another (new architecture, new features...). For this category of peripherals,
migration will require new development at application level.
Ta bl e 3 gives a general overview of this classification.
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AN3422Peripheral migration
Table 3.STM32 peripheral compatibility analysis F1 versus L1 series
Compatibility
PeripheralF1 seriesL1 series
CommentsPinoutSW compatibility
No I2S in L1 Medium-density
SPIYe s
Ye s
series
IdenticalFull compatibility
L1 vs. F1: limitation fix
WWDG
IWDG
DBGMCU
CRC
EXTI
USB FS
Device
DMA
TIM
Ye sYesSame featuresNAFull compatibility
Ye sYesSame featuresNAFull compatibility
Ye sYesSame featuresNAFull compatibility
Ye sYesSame featuresNAFull compatibility
Ye sYesSame featuresIdenticalFull compatibility
Ye sYesSame featuresIdenticalFull compatibility
Ye sYesSame featuresNAFull compatibility
Ye sYesSame featuresIdenticalFull compatibility
Same features (No SDIO in
SDIO
Ye sYe s
L1 Medium-density and
IdenticalFull compatibility
Medium-density+ series)
Same features but only
SRAM/NOR memories are
FSMC
Ye sYe s
supported (No FSMC in L1
IdenticalFull compatibility
Medium-density and Mediumdensity+ series)
PWR
RCC
Ye sYe s +EnhancementNA
Ye sYe s +EnhancementNAPartial compatibility
Full compatibility for the
same feature
Limitation fix / One Sample
USART
I2C
DAC
ADC
RTC
Ye sYe s +
Bit method / Oversampling by 8IdenticalFull compatibility
Ye sYe s +Limitation fixIdenticalFull compatibility
Ye sYe s +DMA underrun interruptIdenticalFull compatibility
Ye sYes++New peripheralIdenticalPartial compatibility
Ye sYes++New peripheral
Identical for the
same feature
Not compatible
FLASHYe sYes++New peripheralNANot compatible
GPIO
CAN
Ye sYes++New peripheralIdenticalNot compatible
Ye sNANANANA
Doc ID 018976 Rev 213/52
Peripheral migrationAN3422
Color key:
= New feature or new architecture (Yes++)
= Same feature, but specification change or enhancement (Yes+)
= Feature not available (NA)
Table 3.STM32 peripheral compatibility analysis F1 versus L1 series (continued)
Compatibility
PeripheralF1 seriesL1 series
CommentsPinoutSW compatibility
CECYe sNANANANA
Ethernet
LCD glass
COMP
SYSCFG
AES
OPAMP
Ye sNANANANA
NAYesNANANA
NAYesNANANA
NAYesNANANA
NAYesNANANA
NAYesNANANA
4.2 System architecture
The STM32L MCU family, based on the Cortex-M3 core, extends ST’s ultra-low-power
portfolio in performance, features, memory size and package pin count. It combines very
high performance and ultra-low power consumption, through the use of an optimized
architecture and ST’s proprietary ultra-low leakage process, that is also used in the STM8L
family. The STM32L family offers three different product lines (STM32L Medium-density,
STM32L Medium-density+ and STM32L High-density).
4.3 Memory mapping
The peripheral address mapping has been changed in the L1 series vs. F1 series, the main
change concerns the GPIOs which have been moved from the APB bus to the AHB bus to
allow them to operate at maximum speed.
The tables below provide the peripheral address mapping correspondence between L1 and
F1 series.
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AN3422Peripheral migration
Table 4.IP bus mapping differences between STM32F1 and STM32L1 series
STM32L1 series STM32F1 series
Peripheral
BusBase addressBusBase address
FSMC
AES0x50060000
DMA20x40026400
0xA0000000AHB0xA0000000
NANA
0x40020400
DMA10x400260000x40020000
Flash Interface0x40023C000x40022000
AHB
RCC0x400238000x40021000
CRC0x40023000
GPIOG0x40021C00
AHB
0x40023000
0x40012000
APB2
GPIOF0x400218000x40011C00
GPIOH0x40021400
GPIOE0x40021000
NANA
0x40011800
GPIOD0x40020C000x40011400
GPIOC0x400208000x40011000
APB2
GPIOB0x400204000x40010C00
GPIOA0x400200000x40010800
USART1
0x40013800
0x40013800
APB2
SP10x400130000x40013000
SDIO0x40012C00AHB0x40018000
ADC10x40012400
TIM110x400110000x40015400
TIM100x40010C000x40015000
APB2
APB2
0x40012400
TIM90x400108000x40014C00
EXTI0x400104000x40010400
SYSCFG0x40010000NANA
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Peripheral migrationAN3422
Table 4.IP bus mapping differences between STM32F1 and STM32L1 series
STM32L1 series STM32F1 series
Peripheral
BusBase addressBusBase address
OPAMP
COMP+RI0x40007C00
DAC0x40007400
PWR0x400070000x40007000
USB device FS SRAM0x400060000x40006000
USB device FS0x40005C000x40005C00
I2C20x400058000x40005800
I2C10x400054000x40005400
UART50x400050000x40005000
UART40x40004C000x40004C00
USART30x400048000x40004800
USART20x400044000x40004400
SPI30x40003C000x40003C00
SPI20x40003800
IWDG0x400030000x40003000
WWDG0x40002C000x40002C00
RTC
APB1
0x40007C5CNANA
NANA
APB1
0x40002800
(inc. BKP registers)
0x40007400
0x40003800
0x40002800
LCD0x40002400NANA
TIM70x40001400
TIM60x400010000x40001000
TIM50x40000C000x40000C00
TIM40x400008000x40000800
TIM30x400004000x40000400
TIM20x400000000x40000000
USB OTG FS
ETHERNET MAC
ADC2
ADC3
TIM8
TIM1
16/52Doc ID 018976 Rev 2
NANA
NANA0x40028000
NANA
NANA0x40013C00
NANA0x40013400
NANA0x40012C00
0x40001400
APB1
0x50000000
AHB
0x40012800
APB2
AN3422Peripheral migration
Color key:
= Same feature, but base address change
= Feature not available (NA)
Table 4.IP bus mapping differences between STM32F1 and STM32L1 series
STM32L1 series STM32F1 series
Peripheral
BusBase addressBusBase address
CAN2NANA
CAN1
TIM14
TIM13
TIM12
TIM5
BKP registers
AFIO
NANA0x40006400
NANA0x40002000
NANA0x40001C00
NANA0x40001800
NANA0x40000C00
NANA0x40006C00
NANAAPB20x40010000
4.4 RCC
The main differences related to the RCC (Reset and Clock Controller) in the STM32L1
series vs. STM32F1 series are presented in the table below.
Table 5.RCC differences between STM32F1 and STM32L1 series
Table 5.RCC differences between STM32F1 and STM32L1 series (continued)
RCC main
features
HSE
LSE32.768 kHz32.768 kHz
PLL
System clock
source
STM32F1 seriesSTM32L1 series Comments
3 - 25 MHz
Depending on the product line
used
– Connectivity line:
2 PLLs for I2S, Ethernet and
OTG FS clock
– Other product lines:
PLL
HSI, HSE or PLL
main PLL +
main
1 - 24 MHz
– Main PLL for system
MSI, HSI, HSE or PLL
No change to SW configuration:
– Enable/disable
RCC_CR[HSEON]
– Status flag
RCC_CR[HSERDY]
LSE configuration/status bits are
now in RCC_CSR register.
– Enable/disable
RCC_CSR[LSEON]
– Status flag
RCC_CSR[LSERDY]
In L1 series the LSEON and
LSERDY bits occupy bits
RCC_CSR[9:8] respectively
instead of bit RCC_BDCR[1:0] in
F1 series.
There is no change to PLL
enable/disable
RCC_CR[PLLON] and status
flag RCC_CR[PLLRDY].
However, PLL configuration
(clock source selection,
multiplication/division factors)
are different. In L1 series
dedicated bits
RCC_CFGR[PLLDIV] are used
to configure the PLL divider
parameters and the PLL
multiplication factors are
different. The PLL sources are
only HSI and HSE.
No change to SW configuration:
– Selection bits
RCC_CFGR[SW]
– Status flag RCC_CFGR[SWS]
However there is one more
source, MSI, and the selection
bit meanings are different.
System clock
frequency
AHB
frequency
18/52Doc ID 018976 Rev 2
up to 72 MHz depending on the
product line used
8 MHz after reset using HSI
up to 72 MHz
32 MHz
2 MHz after reset using MSI
up to 32 MHz
For STM32L1 Flash wait states
should be adapted according to
the system frequency, the
product voltage range V
and the supply voltage range
VDD.
No change to SW configuration:
configuration bits
RCC_CFGR[HPRE]
CORE
AN3422Peripheral migration
Table 5.RCC differences between STM32F1 and STM32L1 series (continued)
RCC main
features
APB1
frequency
APB2
frequency
RTC clock
source
MCO clock
source
STM32F1 seriesSTM32L1 series Comments
No change to SW configuration:
up to 36 MHzup to 32 MHz
up to 72 MHz
LSI, LSE or HSE/128
– MCO pin (PA8)
– Connectivity Line:
PLL/2, SYSCLK, PLL2, PLL3
or XT1
– Other product lines:
HSE, PLL/2 or SYSCLK
HSI, HSE,
HSI,
up to 32 MHz
LSI, LSE or HSE clock
divided by 2, 4, 8 or 16
–MCO pin (PA8): SYSCLK,
HSI, HSE, PLLCLK, MSI,
LSE or LSI
With configurable prescaler,
1, 2, 4, 8 or 16 for each
output.
configuration bits
RCC_CFGR[PPRE1].
No change to SW configuration:
configuration bits
RCC_CFGR[PPRE2].
RTC clock source configuration
is done through the same bits
(RTCSE[1:0] and RTCEN) but
they are located in a different
register.
In L1 series the RTCSEL[1:0]
bits occupy bits
RCC_CSR[17:16] instead of bits
RCC_BDCR[9:8] in F1 series.
In L1 series the RTCEN bit
occupies bit RCC_CSR[22]
instead of bit RCC_BDCR[15] in
F1 series.
However, in L1 series when HSE
is selected as RTC clock source,
additional bits are used in CR
register, RCC_CR[RTCPRE], to
select the division factor to be
applied to HSE clock.
MCO configuration in L1 series
is different from F1:
– For MCO, the prescaler is
configured through bits
RCC_CFGR[MCOPRE] and
the selection of the clock to
output through bits
RCC_CFGR[MCOSEL]
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Peripheral migrationAN3422
Table 5.RCC differences between STM32F1 and STM32L1 series (continued)
RCC main
features
Internal
oscillator
measurement
/ calibration
Interrupt
STM32F1 seriesSTM32L1 series Comments
– LSI connected to TIM10
CH1 IC: can measure LSI
w/ respect to HSI/HSE
clock
– LSE connected to TIM10
CH1 IC: can measure LSE
– LSI connected to TIM5 CH4
IC: can measure LSI w/
respect to HSI/HSE clock
– CSS (linked to NMI IRQ)
– LSIRDY, LSERDY, HSIRDY,
HSERDY, PLLRDY,
PLL2RDY
(linked to RCC global IRQ)
and PLL3RDY
w/ respect to HSI/HSE
clock
– HSE connected to TIM11
CH1 IC: can measure HSE
w/ respect to LSE/HSI
clock
– MSI connected to TIM11
CH1 IC: can measure MSI
range w/ respect to
HSI/HSE clock
– CSS (linked to IRQ)
– LSIRDY, LSERDY,
MSIRDY, HSIRDY,
HSERDY and PLLRDY
(linked to RCC global IRQ)
There is no configuration to
perform in RCC registers.
No change to SW configuration:
interrupt enable, disable and
pending bits clear are done in
RCC_CIR register.
In addition to the differences described in the table above, the following additional
adaptation steps may be needed for the migration:
1.
Performance versus V
wait state depends on the selected voltage range V
ranges: The maximum system clock frequency and FLASH
CORE
and also on VDD. The
CORE
following table gives the different clock source frequencies depending on the product
voltage range.
Table 6.Performance versus V
CPU
performance
HighLow11.832162.0 - 3.6
MediumMedium21.5168
LowHigh31.242
Power
performance
V
CORE
range
CORE
ranges
Typica l
Val ue ( V)
Max frequency
(MHz)
1 WS0 WS
V
range
DD
1.65 - 3.6
2. System clock configuration: when moving from F1 series to L1 series only a few
settings need to be updated in the system clock configuration code; mainly the Flash
settings (configure the right wait states for the system frequency, prefetch
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AN3422Peripheral migration
enable/disable, 64-bit access enable/disable...) or/and the PLL parameters
configuration:
a) If the HSE or HSI is used directly as system clock source, in this case only the
Flash parameters should be modified.
b) If PLL (clocked by HSE or HSI) is used as system clock source, in this case the
Flash parameters and PLL configuration need to be updated.
Ta bl e 7 below provides an example of porting a system clock configuration from F1 to L1
series:
–STM32F105/7 Connectivity Line running at maximum performance: system clock
at 72 MHz (PLL, clocked by the HSE, used as system clock source), Flash with 2
wait states and Flash prefetch queue enabled.
–L1 series running at maximum performance: system clock at 32 MHz (PLL,
clocked by the HSE, used as system clock source), Flash with 1 wait state, Flash
prefetch and 64-bit access enabled.
As shown in the table below, only the Flash settings and PLL parameters (code in Bold Italic) need to be rewritten to run on L1 series. However, HSE, AHB prescaler and system
clock source configuration are left unchanged, and APB prescalers are adapted to the
maximum APB frequency in the L1 series.
Note:1The source code presented in the table below is intentionally simplified (time-out in wait loop
removed) and is based on the assumption that the RCC and Flash registers are at their
reset values.
2For STM32L1xx you can use the clock configuration tool,
STM32L1xx_Clock_Configuration.xls, to generate a customized system_stm32l1xx.c file
containing a system clock configuration routine, depending on your application
requirements. For more information, refer to AN3309 “Clock configuration tool for
STM32L1xx microcontrollers”
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Peripheral migrationAN3422
Table 7.Example of migrating system clock configuration code from F1 to L1
RCC->CR |= RCC_CR_PLLON;
/* Wait till the main PLL is ready */
while((RCC->CR & RCC_CR_PLLRDY) == 0)
{
}
/* Main PLL used as system clock source --*/
RCC->CFGR |= RCC_CFGR_SW_PLL;
/* Wait till the main PLL is used as system
clock source */
while ((RCC->CFGR & RCC_CFGR_SWS) !=
RCC_CFGR_SWS_PLL)
{
/* Enable the main PLL */
RCC->CR |= RCC_CR_PLLON;
/* Wait till the main PLL is ready */
while((RCC->CR & RCC_CR_PLLRDY) == 0)
{
}
/* Main PLL used as system clock source --*/
RCC->CFGR |= RCC_CFGR_SW_PLL;
/* Wait till the main PLL is used as system
clock source */
while ((RCC->CFGR & RCC_CFGR_SWS ) !=
RCC_CFGR_SWS_PLL);
{
}
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AN3422Peripheral migration
3. Peripheral access configuration: since the address mapping of some peripherals has
been changed in L1 series vs. F1 series, you need to use different registers to
[enable/disable] or [enter/exit] the peripheral [clock] or [from reset mode].
Table 8.RCC registers used for peripheral access configuration
BusRegisterComments
RCC_AHBRSTRUsed to [enter/exit] the AHB peripheral from reset
AHB
APB1
APB2
RCC_AHBENRUsed to [enable/disable] the AHB peripheral clock
RCC_AHBLPENR
RCC_APB1RSTRUsed to [enter/exit] the APB1 peripheral from reset
RCC_APB1ENRUsed to [enable/disable] the APB1 peripheral clock
RCC_APB1LPENR
RCC_APB2RSTRUsed to [enter/exit] the APB2 peripheral from reset
RCC_APB2ENRUsed to [enable/disable] the APB2 peripheral clock
RCC_APB2LPENR
Used to [enable/disable] the AHB peripheral clock in low
power Sleep mode
Used to [enable/disable] the APB1 peripheral clock in low
power Sleep mode
Used to [enable/disable] the APB2 peripheral clock in low
power Sleep mode
To configure the access to a given peripheral you have first to know to which bus this
peripheral is connected, refer to Table 4 on page 15, then depending on the action needed
you have to program the right register as described in Ta b le 8 above. For example, USART1
is connected to APB2 bus, to enable the USART1 clock you have to configure APB2ENR
register as follows:
RCC->APB2ENR |= RCC_APB2ENR_USART1EN;
to disable USART1 clock during Sleep mode (to reduce power consumption) you have to
configure APB2LPENR register as follows:
RCC->APB2LPENR |= RCC_APB2LPENR_USART1LPEN;
4. Peripheral clock configuration: some peripherals have a dedicated clock source
independent from the system clock, and used to generate the clock required for their
operation:
a) USB
: The USB 48 MHz clock is derived from the PLL VCO clock which should be
at 96MHz
b) SIDO
: The SDIO clock (SDIOCLK) is derived from the PLL VCO clock and is equal
to PLLVCO / 2
c) LCD:
d) ADC:
The LCD Glass clock shares the same clock source as the RTC
in STM32L1 series the ADC features two clock schemes:
–Clock for the analog circuitry: ADCCLK. This clock is always the HSI oscillator
clock. A divider by 1, 2 or 4 allows to adapt the clock frequency to the device
operating conditions. This configuration is done using ADC_CCR[ADCPRE] bits.
The ADC Clock depends also on the voltage range V
Doc ID 018976 Rev 223/52
. When product voltage
CORE
Peripheral migrationAN3422
range 3 is selected (V
= 1.2 V), the ADC is low speed (ADCCLK = 4 MHz,
CORE
250 Ksps).
–Clock for the digital interface (used for register read/write access). This clock is the
APB2 clock. The digital interface clock can be enabled/disabled through the
RCC_APB2ENR register (ADC1EN bit) and there is a bit to reset the ADC through
RCC_APB2RSTR[ADCRST] bit.
4.5 DMA
STM32F1 and STM32L1 series uses the same DMA controller fully compatible.
STM32F1 and STM32L1 series embeds two DMA controllers, each controller has up to 7
channels. Each channel is dedicated to managing memory access requests from one or
more peripherals. It has an arbiter for handling the priority between DMA requests.
The table below presents the correspondence between the DMA requests of the peripherals
in STM32F1 series and STM32L1 series.
Table 9.DMA request differences between STM32F1 series and STM32L1 series
PeripheralDMA requestSTM32F1 series STM32L1 series
The table below presents the interrupt vectors in STM32L1 series vs. STM32F1 series.
The changes in the interrupt vectors impact only a few peripherals:
1.ADC: in the F1 series there are two interrupt vectors for the ADCs; ADC1_2 and ADC3.
However in L1 series there is a single interrupt vector for ADC1; ADC1_IRQ.
2. As in STM32L1 series there are no CAN or TIM1 peripherals, their corresponding IRQs
are now mapped to new peripherals: COMP, DAC, TIM9, TIM10, TIM11 and LCD.
Table 10.Interrupt vector differences between STM32F1 series and STM32L1 series
PositionSTM32F1 series STM32L1 series
0WWDGWWDG
1PVDPVD
2TAMPERTAMPER_ STAMP
3RTC
4FLASHFLASH
5RCCRCC
6EXTI0EXTI0
7EXTI1EXTI1
8EXTI2EXTI2
9EXTI3EXTI3
10EXTI4EXTI4
11DMA1_Channel1DMA1_Channel1
12DMA1_Channel2DMA1_Channel2
13DMA1_Channel3DMA1_Channel3
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RTC_WKUP
AN3422Peripheral migration
Table 10.Interrupt vector differences between STM32F1 series and STM32L1 series
(continued)
PositionSTM32F1 series STM32L1 series
14DMA1_Channel4DMA1_Channel4
15DMA1_Channel5DMA1_Channel5
16DMA1_Channel6DMA1_Channel6
17DMA1_Channel7DMA1_Channel7
18ADC1_2
19
20
CAN1_TX / USB_HP_CAN_TX (
CAN1_RX0 / USB_LP_CAN_RX0
21CAN1_RX1
22CAN1_SCE
(1)
(1)
ADC1
USB_HP
USB_LP
DAC
COMP
23EXTI9_5EXTI9_5
(1)
(1)
(1)
TIM9
TIM10
TIM11
24TIM1_BRK / TIM1_BRK _TIM9
25TIM1_UP / TIM1_UP_TIM10
26
TIM1_TRG_COM /
TIM1_TRG_COM_TIM11
27TIM1_CCLCD
28TIM2TIM2
29TIM3TIM3
30TIM4TIM4
31I2C1_EVI2C1_EV
32I2C1_ERI2C1_ER
33I2C2_EVI2C2_EV
34I2C2_ERI2C2_ER
35SPI1SPI1
36SPI2SPI2
37USART1USART1
38USART2USART2
39USART3USART3
40EXTI15_10EXTI15_10
41RTC_AlarmRTC_Alarm
42OTG_FS_WKUP / USBWakeUp
43
44
45
TIM8_BRK / TIM8_BRK_TIM12
TIM8_UP / TIM8_UP_TIM13
TIM8_TRG_COM /
TIM8_TRG_COM_TIM14
(1)
(1)
(1)
USB_FS_WKUP
TIM6
TIM7
SDIO
46TIM8_CCTIM5
Doc ID 018976 Rev 227/52
Peripheral migrationAN3422
Color key:
= Different Interrupt vector
= Interrupt Vector name changed but F1 peripheral still mapped on the same Interrupt Vector
position in L1 series
= Feature not available (NA)
Table 10.Interrupt vector differences between STM32F1 series and STM32L1 series
(continued)
PositionSTM32F1 series STM32L1 series
47ADC3SPI3
48FSMC
49SDIO
50TIM5
51SPI3
52UART4
53UART5
54TIM6 / TIM6_DAC
(1)
55TIM7
56DMA2_Channel1
57DMA2_Channel2
58DMA2_Channel3
59
60
61
62
63
64
65
66
67
DMA2_Channel4 / DMA2_Channel4_5
DMA2_Channel5NA
ETHNA
ETH_WKUPNA
CAN2_TXNA
CAN2_RX0NA
CAN2_RX1NA
CAN2_SCENA
OTG_FSNA
(1)
UART4
UART5
DMA2_Channel1
DMA2_Channel2
DMA2_Channel3
DMA2_Channel4
DMA2_Channel5
AES
COMP_ACQ
NA
NA
NA
1. Depending on the product line used.
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4.7 GPIO
The STM32L1 GPIO peripheral embeds new features compared to F1 series, below the
main features:
●GPIO mapped on AHB bus for better performance
●I/O pin multiplexer and mapping: pins are connected to on-chip peripherals/modules
through a multiplexer that allows only one peripheral alternate function (AF) connected
to an I/O pin at a time. In this way, there can be no conflict between peripherals sharing
the same I/O pin.
●More possibilities and features for I/O configuration
The L1 GPIO peripheral is a new design and thus the architecture, features and registers
are different from the GPIO peripheral in the F1 series, so any code written for the F1 series
using the GPIO needs to be rewritten to run on L1 series.
For more information about STM32L1’s GPIO programming and usage, please refer to the
"I/O pin multiplexer and mapping" section in the GPIO chapter of the STM32L1xx Reference
Manual (RM0038).
The table below presents the differences between GPIOs in the STM32F1 series and
STM32L1 series.
Table 11.GPIO differences between STM32F1 series and STM32L1 series
GPIOSTM32F1 series STM32L1 series
Floating
Input mode
General purpose
output
Alternate Function
output
Input / OutputAnalogAnalog
Output speed
PU
PD
PP
OD
PP
OD
2 MHz
10 MHz
50 MHz
Floating
PU
PD
PP
PP + PU
PP + PD
OD
OD + PU
OD + PD
PP
PP + PU
PP + PD
OD
OD + PU
OD + PD
400KHz
2 MHz
10 MHz
40 MHz
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Table 11.GPIO differences between STM32F1 series and STM32L1 series (continued)
GPIOSTM32F1 series STM32L1 series
To optimize the number of peripheral I/O
Alternate function
selection
Max IO toggle frequency 18 MHz16 MHz
functions for different device packages, it
is possible to remap some alternate
functions to some other pins (software
remap).
Highly flexible pin multiplexing allows no
conflict between peripherals sharing the
same I/O pin.
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Alternate function mode
In STM32F1 series
1.The configuration to use an I/O as alternate function depends on the peripheral mode
used, for example the USART Tx pin should be configured as alternate function pushpull while USART Rx pin should be configured as input floating or input pull-up.
2. To optimize the number of peripheral I/O functions for different device packages
(especially with those with low pin count), it is possible to remap some alternate
functions to other pins by software, for example the USART2_RX pin can be mapped
on PA3 (default remap) or PD6 (by software remap).
In STM32L1 series
1.Whatever the peripheral mode used, the I/O must be configured as alternate function,
then the system can use the I/O in the proper way (input or output).
2. The I/O pins are connected to on-chip peripherals/modules through a multiplexer that
allows only one peripheral’s alternate function to be connected to an I/O pin at a time.
In this way, there can be no conflict between peripherals sharing the same I/O pin.
Each I/O pin has a multiplexer with sixteen alternate function inputs (AF0 to AF15) that
can be configured through the GPIOx_AFRL and GPIOx_AFRH registers:
–After reset all I/Os are connected to the system’s alternate function 0 (AF0)
–The peripheral alternate functions are mapped by configuring AF1 to AF13
–Cortex-M3 EVENTOUT is mapped by configuring AF15
3. In addition to this flexible I/O multiplexing architecture, each peripheral has alternate
functions mapped on different I/O pins to optimize the number of peripheral I/O
functions for different device packages, for example the USART2_RX pin can be
mapped on PA3 or PD6 pin
Note:Please refer to the “Alternate function mapping” table in the STM32L15x datasheet for the
detailed mapping of the system and the peripheral alternate function I/O pins.
4. Configuration procedure
–Configure the desired I/O as an alternate function in the GPIOx_MODER register
–Select the type, pull-up/pull-down and output speed via the GPIOx_OTYPER,
GPIOx_PUPDR and GPIOx_OSPEEDER registers, respectively
–Connect the I/O to the desired AFx in the GPIOx_AFRL or GPIOx_AFRH register
4.8 EXTI source selection
In STM32F1 the selection of EXTI line source is performed through EXTIx bits in
AFIO_EXTICRx registers, while in L1 series this selection is done through EXTIx bits in
SYSCFG_EXTICRx registers.
Only the mapping of the EXTICRx registers has been changed, without any changes to the
meaning of the EXTIx bits. However, the maximum range of EXTIx bits values is 0b0101 as
only 6 GPIO ports are supported in L1 (in F1 series the maximum value is 0b0110).
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4.9 FLASH
The table below presents the difference between the FLASH interface of STM32F1 series
and STM32L1 series, which can be grouped as follows:
Consequently the L1 Flash programming procedures and registers are different from the F1
series, and any code written for the Flash interface in the F1 series needs to be rewritten to
run on L1 series.
For more information on programming, erasing and protection of the L1 Flash memory,
please refer to the STM32L1xx Flash programming manual (PM0062).
Table 12.FLASH differences between STM32F1 series and STM32L1 series
FeatureSTM32F1 series STM32L1 series
Wait Stateup to 2
Start Address0x0800 00000x0800 0000
Main/Program
memory
EEPROM memory
System memory
Option Bytes
OTP
End Addressup to 0x080F FFFFup to 0x0805 FFFF
Page size = 2 Kbytes
Granularity
Start Address
End Address
Start Address0x1FFF F000
End Address0x1FFF F7FF
Start Address0x1FFF F800
End Address0x1FFF F80F
Start Address
End Address
Start address0x4002 2000
except for Low and Medium
density page size = 1 Kbytes
Available through SW emulation
(1)
NANA
up to 1 (depending on the
supply voltage)
Sector size = 4 Kbytes:
16 Pages of 256 bytes
0x0808 0000
0x0808 2FFF
0x1FF0 0000
0x1FF0 1FFF
0x1FF8 0000/0x1FF8 0080
0x1FF8001F/0x1FF8 009F
0x4002 3C00
Flash interface
Erase granularityPage (1 or 2 Kbytes)
32/52Doc ID 018976 Rev 2
Programming
procedure
Same for all product lines
Different from F1 series
Program memory: Page (256
bytes)
DATA EEPROM memory:
halfword/ word / double word
byte/
AN3422Peripheral migration
Color key:
= New feature or new architecture
= Same feature, but specification change or enhancement
= Feature not available (NA)
Table 12.FLASH differences between STM32F1 series and STM32L1 series (continued)
Write protection granularityProtection by 4 Kbyte blockProtection by sector
STOPSTOP
STANDBYSTANDBY
User Option bytes
WDGWDG
NABOR level
NABFB2
1. For more details refer to “EEPROM emulation in STM32F10x microcontrollers (AN2594)
2. Memory read protection Level 2 is an irreversible operation. When Level 2 is activated, the level of protection cannot be
decreased to Level 0 or Level 1.
4.10 ADC
Table 13.ADC differences between STM32F1 series and STM32L1 series
ADCSTM32F1 seriesSTM32L1 series
ADC TypeSAR structureSAR structure
InstancesADC1 / ADC2 / ADC3ADC1
Max Sampling freq1 MSPS
The table below presents the differences between the ADC interface of STM32F1 series
and STM32L1 series, these differences are the following:
●New digital interface
●New architecture and new features
1 MSPS
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Color key:
= Same feature, but specification change or enhancement
Table 13.ADC differences between STM32F1 series and STM32L1 series (continued)
ADCSTM32F1 seriesSTM32L1 series
Number of
channels
up to 21 channels
up to 42 Channels
Resolution12-bit12-bit
Conversion Modes
Single / continuous / Scan / Discontinuous /
Dual Mode
Single / continuous / Scan / Discontinuous
DMAYe sYe s
Ye sYe s
External Trigger
External event for
regular group
For ADC1 and ADC2:
TIM1 CC1
TIM1 CC2
TIM1 CC3
TIM2 CC2
TIM3 TRGO
TIM4 CC4
EXTI line 11 /
TIM8_TRGO
For ADC3:
TIM3 CC1
TIM2 CC3
TIM1 CC3
TIM8 CC1
TIM8 TRGO
TIM5 CC1
TIM5 CC3
In STM32L1 series the PWR controller presents some differences vs. F1 series, these
differences are summarized in the table below. However, the programming interface is
unchanged.
Table 14.PWR differences between STM32F1 series and STM32L1 series
PWRSTM32F1 series STM32L1 series
Power supplies
1. V
= 2.0 to 3.6 V: external power
DD
supply for I/Os and the internal
regulator. Provided externally through
pins.
V
DD
, V
2. V
SSA
= 2.0 to 3.6 V: external
DDA
analog power supplies for ADC, DAC,
Reset blocks, RCs and PLL (minimum
voltage to be applied to V
DDA
when the ADC or DAC is used). V
and V
must be connected to VDD
SSA
and VSS, respectively.
3. V
= 1.8 to 3.6 V: power supply for
BAT
RTC, external clock 32 kHz oscillator
and backup registers (through power
switch) when VDD is not present.
is 2.4 V
DDA
1. VDD = 1.8 V (at power on) or 1.65 V (at power down)
to 3.6 V when the BOR is available. VDD = 1.65 V to
3.6 V, when BOR is not available.
is the external power supply for I/Os and internal
V
DD
regulator. It is provided externally through VDD pins.
2. V
V
CORE
and Flash memory. It is generated by a internal voltage
regulator. Three V
= 1.2 to 1.8 V
CORE
is the power supply for digital peripherals, SRAM
ranges can be selected by
CORE
software depending on VDD.
, V
3. V
SSA
down) to 3.6 V, when BOR is available and V
= 1.8 V (at power on) or 1.65 V (at power
DDA
SSA
1.65 to 3.6 V, when BOR is not available.
is the external analog power supply for ADC, DAC,
V
DDA
reset blocks, RC oscillators and PLL. The minimum
voltage to be applied to V
is 1.8 V when the ADC is
DDA
used.
, V
DDA
=
Battery backup
domain
RTC domain
Power supply
supervisor
4. V
= 2.5 to 3.6 V
LCD
The LCD controller can be powered either externally
through the V
pin, or internally from an internal
LCD
voltage generated by the embedded step-up converter.
– Backup registers
–RTC
–LSE
– PC13 to PC15 I/Os
NA
Note: in F1 series the Backup registers
are integrated in the BKP peripheral.
– RTC w/ backup registers
–LSE
NA
– PC13 to PC15 I/Os
Note: in L1 series the backup registers are integrated in
the RTC peripheral
Integrated POR / PDR circuitry
Programmable Voltage Detector (PVD)
Integrated POR / PDR circuitry
Programmable voltage detector (PVD)
NABrownout reset (BOR)
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Color key:
= New feature or new architecture
= Same feature, but specification change or enhancement
Table 14.PWR differences between STM32F1 series and STM32L1 series (continued)
In L1 some additional bits were added:
– PWR_CR[ULP] used to switch off the VREFINT in
STOP and STANDBY modes.
– PWR_CR[FWU] used to ignore the VREFINT startup
time when exiting from low power modes.
– PWR_CR[VOS] used to select the product voltage
range.
– PWR_CR[LPRUN] used to select the RUN low power
mode.
– PWR_CSR[VREFINTRDY]: VREFTINT ready status
– PWR_CSR[VOSF]: Internal Regulator change status
– PWR_CSR[REGLP]: MCU is in Low power run mode
– PWR_CSR[EWUP2] and PWR_CSR[EWUP3]:
Wakeup Pin 2 and Wakeup Pin 3 Enable/Disable bits.
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4.12 RTC
The STM32L1 series embeds a new RTC peripheral vs. F1 series; the architecture, features
and programming interface are different.
As consequence the L1 RTC programming procedures and registers are different from the
the F1 series, so any code written for the F1 series using the RTC needs to be rewritten to
run on L1 series.
The L1 RTC provides best-in-class features:
●BCD timer/counter
●Time-of-day clock/calendar with programmable daylight saving compensation
●Two programmable alarm interrupts
●Digital calibration circuit
●Time-stamp function for event saving
●Periodic programmable wakeup flag with interrupt capability
●Automatic wakeup unit to manage low power modes
●32 backup registers (128 bytes) which are reset when a tamper detection event occurs
For more information about STM32L1’s RTC features, please refer to RTC chapter of
STM32L1xx Reference Manual (RM0038).
For advanced information about the RTC programming, please refer to Application Note
AN3371 Using the STM32 HW real-time clock (RTC).
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Firmware migration using the libraryAN3422
5 Firmware migration using the library
This section describes how to migrate an application based on STM32F1xx Standard
Peripherals Library in order to use the STM32L1xx Standard Peripherals Library.
The STM32F1xx and STM32L1xx libraries have the same architecture and are CMSIS
compliant, they use the same driver naming and the same APIs for all compatible
peripheral.
Only a few peripheral drivers need to be updated to migrate the application from an F1
series to an L1 series product.
Note:In the rest of this chapter (unless otherwise specified), the term “STM32L1xx Library” is
used to refer to the STM32L1xx Standard Peripherals Library and the term of “STM32F10x
Library” is used to refer to the STM32F10x Standard Peripherals Library.
5.1 Migration steps
To update your application code to run on STM32L1xx Library, you have to follow the steps
listed below:
5. Update the toolchain startup files
a) Project files: device connections and Flash memory loader. These files are
provided with the latest version of your toolchain that supports STM32L1xxx
devices. For more information please refer to your toolchain documentation.
b) Linker configuration and vector table location files: these files are developed
following the CMSIS standard and are included in the STM32L1xx Library install
package under the following directory: Libraries\CMSIS\Device\ST\STM32L1xx.
6. Add STM32L1xx Library source files to the application sources
a) Replace the stm32f10x_conf.h file of your application with stm32l1xx_conf.h
provided in STM32L1xx Library.
b) Replace the existing stm32f10x_it.c/stm32f10x_it.h files in your application with
stm32l1xx_it.c/stm32l1xx_it.h provided in STM32L1xx Library.
7. Update the part of your application code that uses the RCC, PWR, GPIO, FLASH, ADC
and RTC drivers. Further details are provided in the next section.
Note:The STM32L1xx Library comes with a rich set of examples (87 in total) demonstrating how
to use the different peripherals (under Project\STM32L1xx_StdPeriph_Examples\).
5.2 RCC
1.System clock configuration: as presented in section 4.4: RCC the STM32L1 and F1
series have the same clock sources and configuration procedures. However, there are
some differences related to the product voltage range, PLL configuration, maximum
frequency and Flash wait state configuration. Thanks to the CMSIS layer, these
differences are hidden from the application code; you only have to replace the
system_stm32f10x.c file by system_stm32l1xx.c file. This file provides an
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implementation of SystemInit() function used to configure the microcontroller system at
start-up and before branching to the main() program.
Note:For STM32L1xx you can use the clock configuration tool,
STM32L1xx_Clock_Configuration.xls, to generate a customized SystemInit() function
depending on your application requirements. For more information, refer to AN3309 “Clock
configuration tool for STM32L1xx microcontrollers”
2. Peripheral access configuration
: as presented in section 4.4: RCC you need to call
different functions to [enable/disable] or [enter/exit] the peripheral [clock] or [from reset
mode]. For example, GPIOA is mapped on AHB bus on L1 series (APB2 bus on F1
series), to enable its clock you have to use the
in the F1 series. Refer to Table4 on page15 for the peripheral bus mapping changes
between L1 and F1 series.
3.
Peripheral clock configuration
a) USB FS Device: in STM32L1 series the USB FS Device require a frequency of 48
MHz to work correctly. The following is an example of the main PLL configuration
to obtain 32 MHz as system clock frequency and 48 MHz for the USB FS Device.
/* Wait till PLL is ready */
while((RCC->CR & RCC_CR_PLLRDY) == 0)
{
}
/* Select PLL as system clock source */
RCC->CFGR &= (uint32_t)((uint32_t)~(RCC_CFGR_SW));
RCC->CFGR |= (uint32_t)RCC_CFGR_SW_PLL;
/* Wait till PLL is used as system clock source */
while ((RCC->CFGR & (uint32_t)RCC_CFGR_SWS) != (uint32_t)RCC_CFGR_SWS_PLL)
{
}
...
/* Enable USB FS Device's APB1 interface clock */
RCC_APB1PeriphClockCmd(RCC_APB1Periph_USB, ENABLE);
b) ADC: in STM32L1 series the ADC features two clock schemes:
–Clock for the analog circuitry: ADCCLK. This clock is generated always from the
HSI clock divided by a programmable prescaler that allows the ADC to work at
f
/1, /2 or /4. This configuration is done using the ADC registers.
HSI
–Clock for the digital interface (used for register read/write access). This clock is
equal to the APB2 clock. The digital interface clock can be enabled/disabled
through the RCC APB2 peripheral clock enable register (RCC_APB2ENR).
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Firmware migration using the libraryAN3422
/* Enable the HSI oscillator */
RCC_HSICmd(ENABLE);
/* Check that HSI oscillator is ready */
while(RCC_GetFlagStatus(RCC_FLAG_HSIRDY) == RESET)
{
}
/* Enable ADC1 clock */
RCC_APB2PeriphClockCmd(RCC_APB2Periph_ADC1, ENABLE);
5.3 FLASH
The table below presents the FLASH driver API correspondence between STM32F10x and
STM32L1xx Libraries. You can easily update your application code by replacing
STM32F10x functions by the corresponding function in STM32L1xx Library.
Table 15.STM32F10x and STM32L1xx FLASH driver API correspondence
STM32F10x Flash driver APISTM32L1xx Flash driver API
This section explains how to update the configuration of the various GPIO modes when
porting the application code from STM32F1 series to STM32L1 series.
5.4.1 Output mode
The example below shows how to configure an I/O in output mode (for example to drive a
led) in STM32F1 series:
1.The configuration to use an I/O as alternate function depends on the peripheral mode
used, for example the USART Tx pin should be configured as alternate function pushpull while the USART Rx pin should be configured as input floating or input pull-up.
2. To optimize the number of peripheral I/O functions for different device packages, it is
possible by software to remap some alternate functions to other pins, for example the
USART2_RX pin can be mapped on PA3 (default remap) or PD6 (by software remap).
In STM32L1 series
1.Whatever the peripheral mode used, the I/O must be configured as alternate function,
then the system can use the I/O in the proper way (input or output).
2. The I/O pins are connected to onboard peripherals/modules through a multiplexer that
allows only one peripheral’s alternate function to be connected to an I/O pin at a time.
In this way, there can be no conflict between peripherals sharing the same I/O pin.
Each I/O pin has a multiplexer with sixteen alternate function inputs (AF0 to AF15) that
can be configured through the GPIO_PinAFConfig () function:
–After reset all I/Os are connected to the system’s alternate function 0 (AF0)
–The peripherals’ alternate functions are mapped by configuring AF1 to AF13
–Cortex-M3 EVENTOUT is mapped by configuring AF15
3. In addition to this flexible I/O multiplexing architecture, each peripheral has alternate
functions mapped onto different I/O pins to optimize the number of peripheral I/O
functions for different device packages, for example the USART2_RX pin can be
mapped on PA3 or PD6 pin
4. Configuration procedure
–Connect the pin to the desired peripherals' Alternate Function (AF) using
GPIO_PinAFConfig() function
–Use GPIO_Init() function to configure the I/O pin:
- Configure the desired pin in alternate function mode using
GPIO_InitStructure->GPIO_Mode = GPIO_Mode_AF;
- Select the type, pull-up/pull-down and output speed via
GPIO_PuPd, GPIO_OType and GPIO_Speed members
The example below shows how to remap USART2 Tx/Rx I/Os on PD5/PD6 pins in
STM32F1 series:
/* Enable APB2 interface clock for GPIOD and AFIO (AFIO peripheral is used
to configure the I/Os software remapping) */
RCC_APB2PeriphClockCmd(RCC_APB2Periph_GPIOD | RCC_APB2Periph_AFIO, ENABLE);
In L1 series the configuration of the EXTI line source pin is performed in the SYSCFG
peripheral (instead of AFIO in F1 series). As result, the source code should be updated as
follows:
The main changes in the source code/procedure in L1 series vs. F1 are described below:
1.ADC configuration is made through two functions ADC_CommonInit() and ADC_Init():
ADC_CommonInit() function is used to configure the ADC analog clock prescaler.
2. To enable the generation of DMA requests continuously at the end of the last DMA
transfer, the ADC_DMARequestAfterLastTransferCmd() function should be used.
3. No calibration is needed
5.7 PWR
The table below presents the PWR driver API correspondence between STM32F10x and
STM32L1xx Libraries. You can easily update your application code by replacing
STM32F10x functions by the corresponding function in STM32L1xx Library.
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Color key:
= New function
= Same function, but API was changed
= Function not available (NA)
Table 16.STM32F10x and STM32L1xx PWR driver API correspondence
In STM32F1 series the Backup data registers are managed through the BKP peripheral,
while in L1 series they are a part of the RTC peripheral (there is no BKP peripheral).
The example below shows how to write to/read from Backup data registers in STM32F1
series:
uint16_t BKPdata = 0;
...
/* Enable APB2 interface clock for PWR and BKP */
RCC_APB1PeriphClockCmd(RCC_APB1Periph_PWR | RCC_APB1Periph_BKP, ENABLE);
/* Enable write access to Backup domain */
PWR_BackupAccessCmd(ENABLE);
/* Write data to Backup data register 1 */
BKP_WriteBackupRegister(BKP_DR1, 0x3210);
/* Read data from Backup data register 1 */
BKPdata = BKP_ReadBackupRegister(BKP_DR1);
In L1 series you have to update this code as follows:
/* Enable write access to RTC domain */
PWR_RTCAccessCmd(ENABLE);
/* Write data to Backup data register 1 */
RTC_WriteBackupRegister(RTC_BKP_DR1, 0x3220);
/* Read data from Backup data register 1 */
BKPdata = RTC_ReadBackupRegister(RTC_BKP_DR1);
The main changes in the source code in L1 series vs. F1 are described below:
1.There is no BKP peripheral
2. Write to/read from Backup data registers are done through RTC driver
3. Backup data registers naming changed from BKP_DRx to RTC_BKP_DRx, and
numbering starts from 0 instead of 1
50/52Doc ID 018976 Rev 2
AN3422Revision history
6 Revision history
Table 17.Document revision history
DateRevisionChanges
20-Jul-20111Initial release
01-Mar-20122Added support for medium+ and high-density STM32L1xxx
Doc ID 018976 Rev 251/52
AN3422
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