Designing an application with the ST10F27x devices
Introduction
This note gives advice on designing applications based on devices of the ST10F27x family
which includes the ST10F276, ST10F275, ST10F273, ST10F272 and ST10F271.
Six topics are covered:
■ Information and recommendations on using an external resonator with the on-chip
oscillator
■ Details on start-up configuration and necessary precautions
The ST10F27x can run with an external clock connected to the XTAL1 input pin of the
oscillator inverter or with a clock signal generated by a resonator connected to the XTAL1 /
XTAL2 pins. According to the device, two kinds of oscillators have been implemented:
●ST10F276E, ST10F275E and ST10F273E: Wide-swing oscillator
●ST10F272E/B and ST10F271E/B: Low-power oscillator
Moreover, the ST10F27x provides a new feature when the Real Time Clock module is used
and a reference clock is needed in Power Down mode. In this case, two possible
configurations may be selected by the user application according to the desired level of
power reduction:
●A 32 kHz crystal is connected to the on-chip 32 kHz oscillator (pins XTAL3 / XTAL4)
and running. In this case, the main oscillator is stopped when Power Down mode is
entered, while the Real Time Clock continues counting using the 32 kHz clock signal as
reference.
●Only the main oscillator is running (XTAL1 / XTAL2 pins). In this case, the main
oscillator is not stopped when Power Down is entered and the Real Time Clock
continues counting using the main oscillator clock signal as reference.
Refer to the ST10F27x datasheet for the possible combinations. This chapter provides
detailed information on the use of the on-chip oscillator in conjunction with an external
resonator.
1.1 Oscillator characteristics
Although simple to implement, using an external resonator (crystal or ceramic resonator)
requires a few basic precautions. Referring to the schematic of the on-chip oscillator
(
Figure 1
Figure 1.Oscillator characteristics
The resonator component can be a crystal or a ceramic resonator. It is represented as a
series resonant branch R
replaced by a negative resistance R
capacitances and the stray capacitance of the resonator.
), the key items are described in the following section.
On-chip Oscillator circuit
g
m
XTAL1XTAL2
C
Resonator
1
, Ls, Cs. The amplification ability of the oscillator inverter is
s
L
Equivalent circuit
C
L
R
L
C
L
C
2
s
Resonator
s
R
s
and the capacitance CL contains the C1 and C2 load
4/18
AN2353Oscillator
The load cap aci tor s C1 and C2 transf orm th e ga in o f t he am plif ier (gm) into a negative series
resistance R
The best frequency stability is obtained when C
of R
and Rs (the series resistance of the crystal) is negative.
L
By choosing C
to compensate for the losses of the crystal.
L
= C2. The oscillation occurs when the sum
1
= C2 = C, the minimal gain of the amplifier (gm) is expressed as follows:
1
gm
min
2
RsC
×ω
×RsC2×2π×f×()
2
×==
2
The minimal gain of the amplifier also implicitly sets the on-chip oscillator start-up time.
Table 1.g
SymbolParameter Version Conditions
values for different types of oscillators
m
Value
Unit
MinTypMax
g
m
Oscillator transconductance
The oscillation stability mainly depends on external parameters so only the
transconductance (g
measurement at the application level.
1.2 Start-up time
Ceramic resonators have a much shorter start-up time than crystals (about 100 times faster)
but have a lower accuracy on the frequency (initial tolerance, temperature variations and
drift).
Depending on applications
oscillator start-up time and frequency accuracy.
Fro m an S T 10 perspective, the w or s t ca se co nd i ti o n / environment for t h e o sc il l at or s tart-up
time is high temperature and low voltage.
Wide-swing 81735
Low-power 0.72.56
32 kHz
) can be guaranteed and the start-up time value is defined by
m
Start-up203150
Norm al run81730
requirements and possibilities, users can choose between short
mA/V
µ A/V
5/18
OscillatorAN2353
1.3 PCB layout for ST10F27x oscillator
The following
Figure 2
shows the proposed layout for the ST10F27x oscillator.
Figure 2.Example of layout for external crystal
ST10F27x
Vias to VDD
Vias to GND
Crystal package
soldered to GND
1.4 Oscillator and EMC
Decoupling capacitor
XT AL2
V
DD
C2
CD
Crystal
Ground plate
V
XTAL1
SS
C1
Vias to GND
The ST10F27x oscillator has an integrated gain control to minimize EMC and power
consumption. However, this does not prev ent users from observing / respecting the following
rules / recommendations:
●Avoid other high frequency signals near the oscillator circuitry . These can influence the
oscillator.
●Lay out/configure the ground supply on the basis of low impedance.
●Shield the crystal with an additional ground plane underneath the crystal.
●Do not lay out sensitive signals near the oscillator. Analyze cross-talk between different
layers.
●The V
pin close to the XTAL pins must be connected to the ground plane and
SS
decoupled to the closest V
●Capacitors are placed at both ends of the crystal, directly connected to the ground
plane while keeping the overall loop as small as possible.
●The crystal package, when metallic, is directly connected to the ground.
1.5 32 kHz oscillator
The same recommendations are valid for the 32 kHz oscillator. In any case, when the
32 kHz oscillator amplifier is not used, to avoid spurious consumption, XTAL3 must be tied
to ground while XTAL4 is left open. Moreover, bit OFF32 in the RTCCON register should be
set. The 32 kHz oscillator can only be driven by an external crystal and not by a different
clock source.
DD
pin.
6/18
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