Features
1N5806U
Aerospace 2.5 A fast recovery rectifier
■ Aerospace applications
■ Surface mount hermetic package
■ High thermal conductivity materials
■ Very small conduction losses
■ Negligible switching losses
■ Extremely fast switching
■ Low forward voltage drop
■ Package mass: 0.12 g
■ Target radiation qualification
– 150 krad (Si) low dose rate
– 3 Mrad (Si) high dose rate
■ ESCC qualified
Table 1. Device summary
(1)
A
K
K
A
LCC2A
Description
This power ultrafast recovery rectifier is designed
and packaged to comply with the ESCC5000
specification for aerospace products. It is housed
in a surface mount hermetically sealed LCC2A
package whose footprint is 100% compatible with
industry standard solutions in D5A.
The 1N5806U is suitable for switching mode
power supplies and high frequency DC to DC
converters such as low voltage high frequency
inverter, free wheeling or polarity protection.
Order code
1N5806UA1 -
1N5806U01A 5101/014/13 Flight part Gold plated Y
ESCC detailed
specification
Quality level Lead finish EPPL I
Engineering
model
Gold plated -
F(AV)
V
RRM
T
j(max)VF (max)
2.5 A 150 V 175 °C 1.0 V
1N5806U02A 5101/014/14 Flight part Solder dip Y
1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q versions.
March 2010 Doc ID 15986 Rev 2 1/7
www.st.com
7
Characteristics 1N5806U
1 Characteristics
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
T
stg
T
T
sol
1. Maximum duration 5 s. The same package must not be re-soldered until 3 minutes have elapsed.
Repetitive peak reverse voltage 150 V
Forward rms current 6 A
Average forward rectified current Tc = 135 °C, δ = 0.5 2.5 A
t
= 8.3 ms sinusoidal 35
Forward surge current
Storage temperature range -65 to + 175 °C
Maximum operating junction temperature 175 °C
j
Maximum soldering temperature
(1)
p
= 10 ms sinusoidal 33
t
p
A
245 °C
Table 3. Thermal resistance
Symbol Parameter Value Unit
(1)
R
th (j-c)
1. Package mounted on infinite heatsink
Table 4. Static electrical characteristics
Symbol Parameter Tests conditions Min. Typ. Max. Unit
I
R
V
F
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 680 µs, δ < 2%
Junction to case 13 °C/W
(1)
Reverse current
(2)
Forward voltage
Tj = 25 °C
= 125 °C - - 20
T
j
= 25 °C
T
j
= -65 °C - - 10
T
j
V
= 150 V
R
V
= 160 V
R
Tj = 25 °C
Tj = 125 °C - - 800
= -65 °C - - 1075
T
j
= 25 °C IF = 2.5 A - - 1000
T
j
= 1 A
I
F
--0.5
--10
--880
µA
mV
To evaluate the conduction losses use the following equation:
P = 0.70 x I
2/7 Doc ID 15986 Rev 2
F(AV)
+ 0.10 x I
F2(RMS )
1N5806U Characteristics
/
Table 5. Dynamic characteristics
Symbol Parameter
= IR = 0.5 A, Irr = 0.05 A, dI/dt = -65 A/µs
I
F
t
RR
V
t
FR
C
Reverse recovery time
Forward recovery voltage IFM = 250 mA - - 2.2 V
FP
Forward recovery time IFM = 250 mA, VRF = 1.1 x V
Diode capacitance VR = 10 V, F = 1 MHz - - 25 pF
j
(min.)
= 1 A, VR = 30 V, dI/dt = -50 A/µs, - - 30
I
F
Figure 1. Forward voltage drop versus
forward current (typical values)
IFM(A)
10
8
6
4
2
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Tj=125 °CTj=125 °C
Tj=25 °CTj=25 °C
Tj=-65 °C
VFM(V)
Test conditions
Min. Typ. Max. Unit
--25
F
--15ns
Figure 2. Forward voltage drop versus
forward current (maximum values)
IFM(A)
10
8
6
4
2
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Tj=125 °CTj=125 °C
Tj=25 °CTj=25 °C
Tj=-65 °C
ns
VFM(V)
Figure 3. Reverse leakage current versus
reverse voltage applied
(typical values)
IR(µA)
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
1.E-04
0 20 40 60 80 100 120 140 160
Tj=125 °C
Tj=75 °C
Tj=25 °C
VR(V)
Figure 4. Relative variation of thermal
impedance, junction to case,
versus pulse duration
Z
R
th(j-c)
th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
Single pulse
0.3
0.2
0.1
0.0
1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
tP(s)
LCC2A
Doc ID 15986 Rev 2 3/7
Characteristics 1N5806U
Figure 5. Reverse recovery time
versus dI
tRR(ns)
40
36
32
28
24
20
16
12
8
4
0
0 50 100 150 200 250 300 350 400 450 500
/dt
F
Tj=125 °C
Tj=25 °C
dIF/dt(A/µs)
IF=I
F(AV)
VR=120 V
Figure 6. Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
100
10
VR(V)
1
1 10 100 1000
V
OSC
F=1 MHz
=30 mV
Tj=25 °C
RMS
4/7 Doc ID 15986 Rev 2
1N5806U Package information
1
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 6. Leadless chip carrier 2 (LCC2A) package dimensions
Pin 2 Cathode
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Dimensions
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
(1)
1.86 2.03 2.20 0.073 0.080 0.087
Note 1
Note
A
B 4.54 4.67 4.87 0.179 0.184 0.192
C 2.33 2.46 2.59 0.92 0.97 0.102
D 1.53 1.70 1.87 0.060 0.067 0.074
E 0.48 - 0.71 0.019 - 0.028
A
B
C
2
Note 1
E
E
D
1
F
Pin 1 Anode
F - 1.3 - - 0.051 -
1
H
I
r1
2
G
r2
G - 2.16 - - 0.085 -
H - 0.86 - - 00.34 -
.
I - 0.15 - - 0.006 -
r1 - 0.15 - - 0.006 -
r2 - 0.20 - - 0.008 -
Note 1: The anode is identified by metallization in two top internal angles and the index mark.
1. Measurement prior to solder coating the mounting pads on bottom of package
Doc ID 15986 Rev 2 5/7
Ordering information 1N5806U
3 Ordering information
Table 7. Ordering information
Order code
ESCC detailed
specification
1N5806UA1 -
1N5806U01A 5101/014/13 Gold plated 06U01A Y
1N5806U02A 5101/014/14 Solder dip 06U02A Y
1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q
versions.
4 Revision history
Table 8. Document revision history
Date Revision Changes
27-Jul-2009 1 First issue.
25-Mar-2010 2 Updated ESCC status in Features and added footnote to Tab l e 3 .
(1)
Package Lead finish Marking EPPL Mass Packing
Gold plated 06UA1 - 0.12 g
LCC2A
0.12 g
Waffle
pack
6/7 Doc ID 15986 Rev 2
1N5806U
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2010 STMicroelectronics - All rights reserved
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
STMicroelectronics group of companies
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID 15986 Rev 2 7/7
Loading...