Sony Ericsson Z770 Schematics 2

Working Instruction, Electrical

Applicable for Z770i

CONTENTS

1 Moisture Sensitivity and Component Baking ......................................3

2 Lead-free Rework...................................................................................4

2.1 Lead-free Symbol..................................................................................4

2.2 Bottom Heat ..........................................................................................4

2.3 Reflow Profile for BGA Rework Station.................................................5

2.4 Inspection..............................................................................................6

3 Replacement of components ................................................................7

3.1 X1200: Conn Antenna...........................................................................8

3.2 X1201: Coax Connector........................................................................8

3.3 X1202:ANT GND Connector Leaf Spring 1p .......................................9

X2200:Battery Connector......................................................................9

3.4

3.5 X2400:System connector.....................................................................10

3.6 X3100: Con X Keyboard connector ....................................................10

3.7 X4200:LCM Connector.......................................................................11

3.8 N1400:Module Bluetooth + FM STLC2592........................................11

3.9 B4200: SMD Vibrator.........................................................................12

3.10 X2403:SIM Card Connector................................................................12

3.11 X2405: MS-Micro Pico holder............................................................ 13

3.12 N3101:ASIC Tjatte3 CSP20................................................................13

3.13 D2105:IC Single bus buffer gate.........................................................14

3.14 D2400:IC IF ISP1508 ES3 (3.5*3.5*0.8)............................................14

3.15 L2401-L2404:Filter 0.0 Hz 0402.........................................................15

3.16 N2203: 2ch-LDO, Vout1=2.8V, Vout2=1.8V, WL-CSP6................... 15

3.17 N2400: IC............................................................................................ 16

3.18 N2402:IC ESD Prot UDFN 6 2x2 mm................................................16

3.19 Ear speaker:Ear Speaker 1107.0 Rectangular...................................... 17

3.20 Loudspeaker:Loudspeaker 1318.0 Oval..............................................18

3.21 V2420-V2422, V4209: Diode Zener 15, V SOD523........................... 18

3.22 E1000:Shield Can Closed small shielding...........................................19

E1001:Shield Can Fence.....................................................................20

3.23

3.24 N2202:IC Vreg SON-6........................................................................20

3.25 B4410:IC Lin,MR sensor....................................................................21

3.26 N2204: LDO1.2 V, 200mA, low noice, CS 5...................................... 21

3.27 B2102:Crystal 32,768 kHz..................................................................22

3.28 N1200: RF-Module Thor Pre-bumped.................................................22

3.29 N1210: RF-Module Squid Pre -bumped..............................................23

3.30 C3137,C3141: Capacitor Ceramic 220,0 nF +/-10% 6,3 V ..................23

3.31 L2200: Ind WW 4.7 uH K3012.............................................................24

3.32 V2202: TRANS V;DUAL_PMOSFET;BYX101603_A;REQ318.......24

3.33 V2431: Diode Protection 0.7 V SOD-882.............................................25

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Working Instruction, Electrical

3.34 Z4200,Z4201,Z4202: LC Filter Array 0805 22pF................................25

3.35 N2205: DC/DC Converter....................................................................26

3.36 N3100: IC Amp 9-Pin Flip-Chip...........................................................26

3.37 V4205,V4206: Trans Array..................................................................27

3.38 Z2400: Filter 100, MHz K1210...........................................................27

4 Revision history ...................................................................................28

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Working Instruction, Electrical

1 Moisture Sensitivity and Component Baking

Some components in this product are moisture sensitive and must be baked prior to use if they have been exposed to air. These components and their moisture sensitivity levels are specified in the Electrical Component Placing document. Below is a brief description of moisture sensitivity levels, but repair centers should visit the JEDEC website for more details before reworking moisture sensitive components. Search for the most recent version of the IPC/JEDEC J-STD-033A standard online at http://www.jedec.org/

Level 1 unlimited floor life; does not require dry pack or re-baking. Level 2 1 year floor life; </=30° C; 60% relative humidity (rh); shipped in dry pack; must

be re-baked after being opened if floor life is exceeded.

Level 2A 4 weeks floor life; </=30° C; 60% rh; shipped in dry pack; must be re-baked after

being opened if floor life is exceeded.

Level 3 168 hours floor life; </=30° C; 60% rh; shipped in dry pack; must be re-baked

after being opened if floor life is exceeded.

Level 4 72 hours floor life; </=30° C; 60% rh; shipped in dry pack; must be re-baked after

being opened if floor life is exceeded.

Parts shipped from the Sony Ericsson Parts Warehouse are most likely NOT shipped in dry pack. This means the time elapsed between placing the order and receiving the parts must be considered as time exposed to the environment.

Different moisture sensitivity levels and exposure times create the need for different baking temperatures and times. More detailed information may be found in the most recent version of the IPC/JEDEC J-STD-033A standard. The standard is available online at

http://www.jedec.org/

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Working Instruction, Electrical

2 Lead-free Rework

2.1 Lead-free Symbol

NOTE!

• This is a lead-free product!

• All solder wire or paste used with this product

must be lead-free.

• All rework tools that directly contact the solder must remain lead-free. They must only be used for lead-free repairs.

2.2 Bottom Heat

Because of the higher temperatures required for lead-free solder, bottom heat is strongly recommended for rework of all ASICs. This does not include small transistors or chips, but it does include fine pitch components and BGA type components.

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Working Instruction, Electrical

2.3 Reflow Profile for BGA Rework Station

The profile shall be according to SEMC profiling specification below. Profile parameters are illustrated in table 2.3.

Reflow profile in this document always refers to the reflow profile which is measured on the board/component with thermocouples and do not refer to the BGA Rework Stations setting which can vary depending on the machine type and individual machine. Verification of reflow profile shall be done on each set of equipment.

Table 2.3.1

Ramp rate < 3°C/sec Ramp rate cooling < 6°C/sec Time above liquidus 40-70 sec Minimum temperature 235°C Maximum component temperature 260 °C Time above 235°C 10-40 sec Recommended Total time Approx. 3-5min

The following graph, in table 2.3.2, shows an example of a lead-free profile including bottom heat and top heat. The profile for specific parts and specific equipment will vary, but the maximum temperature must not be exceeded.

Table 2.3.2

290

250

200

150

Temperature [ºC]

100

Reflow zone

260°C 245°C 230°C

150°C 125°C

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40 80 120 160 200 240 280

Time [Seconds]

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Working Instruction, Electrical

2.4 Inspection

Lead-free solder joints are more difficult to inspect because they do not have shiny surfaces like leaded solder joints. Also, lead-free solder does not flow as well as leaded solder, so some of the solder pad area may remain exposed.

Good Leaded Solder Joints

Good Lead-free Solder Joints

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Working Instruction, Electrical

3 Replacement of components

EQUIPMENT

• Dentist hook

• ESD-gloves (cotton gloves)

• ESD-wristband

• Soldering tools

• Hot Air Station

• Bottom Heat

• BGA Rework Station

• Pair of tweezers

• Solder wick

• Solder paste lead-free (SN 96% Ag 3.5% Cu 0.5%)

• Flux, RMA no-clean flux

CAUTION

• Keep all contact surfaces clean of dirt and hand-grease!

• Remove Film and Labels on PCBA, BB shielding can, and Liquid intrusion indicators in

advance if necessary before repairing PCBA.

MECHANICAL INSTRUCTIONS

For all the following part replacements, disassemble and assemble the phone as described in

Working Instruction 1208-3142

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Working Instruction, Electrical

3.1 X1200: Conn Antenna

REMOVE FILM AND LIQUID INTRUSION INDICATORS IN ADVANCE!

PROTECT THE SYSTEM CONNECTOR AND SIM CONNECTOR WITH HEAT RESISTANT TAPE

Use BGA Station to replace the Conn Antenna.

3.2 X1201: Coax Connector

REMOVE FILM AND LIQUID INTRUSION INDICATORS IN ADVANCE!

PROTECT THE SYSTEM CONNECTOR AND SIM CONNECTOR WITH HEAT RESISTANT TAPE

Use BGA Station to replace the Coax Connector.

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Working Instruction, Electrical

3.3 X1202: ANT GND Connector Leaf Spring 1p

Use Hot Air Station to replace the ANT GND Connector Leaf Spring 1p

3.4 X2200: Battery Connector

REMOVE FILM AND LIQUID INTRUSION INDICATORS IN ADVANCE!

PROTECT THE M2 CARD CONNECTOR AND SIM CONNECTOR WITH HEAT RESISTANT TAPE

Use BGA Station to replace the Battery Connector.

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