Sony Ericsson Z555I Working Instruction
Working Instruction, Electrical
Working Instruction, Electrical
Applicable for W380, Z555
CONTENTS
1 Read this first! ........................................................................................2
2 Lead-free soldering ................................................................................3
3 BGA equipment reflow profiles............................................................. 5
3.1 General.................................................................................................. 5
3.2 Temperature Measurements ................................................................. 5
3.3 Reflow Profiles ...................................................................................... 6
4 Replacement of components ................................................................6
4.1 Liquid Intrusion Indicator: ...................................................................... 7
4.2 System Connector Gaskets:.................................................................. 7
4.3 E1002 Bluetooth Shield Can: ................................................................ 8
4.4 X0616: Battery Connector ..................................................................... 9
4.5 X2600: System Connector .................................................................. 10
4.6 X2600: System Connector Continued ................................................. 11
4.7 Revision History .................................................................................. 12
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Working Instruction, Electrical
1 Read this first!
• Before you start replacing any components, make sure you have read and fully understood
the contents of section 2 and 3!
• Also make sure you have access to the Mechanical Working Instruction and the Equipment
Lists described on the first page of section 4!
• Use Electrostatic Discharge (ESD) equipment to avoid damaging the PBA.
• Use gloves or finger cots to avoid contaminating the PBA with skin oil.
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Working Instruction, Electrical
2 Lead-free soldering
THIS PRODUCT IS MANUFACTURED WITH LEAD-FREE SOLDER
AND LEAD
During electrical repair, it is critical to make sure that no lead is
introduced.
This symbol indicates that the product is lead- free.
-FREE COMPONENTS!
The lead-free symbol is located on the PCB as shown.
A lead-free work area must be set up completely separated
from work areas that are used to make lead repairs. The leadfree work area must also be clearly labeled with the lead free
symbol as shown in the adjacent picture. The items on this
desk must remain lead-free. They must be adequately labeled
to make their lead-free status clearly and easily recognized.
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Working Instruction, Electrical
Lead-free soldering continued
LFS (lead-free solder) characteristics:
• High melting point (typically 217°C)
• Low wetting
• High surface tension
• Difficult to spread
• Recommended tip temperature = 370°C
WHEN SERVICING PBAS THAT HAVE BEEN MANUFACTURED
WITH
LFS (LEAD-FREE SOLDER), LFS MUST BE USED!
F NOT, THERE IS A HIGH RISK OF UNRELIABLE SOLDERING
I
JOINTS
Lead-free solder joints are more difficult to inspect because they
do not have shiny surfaces like leaded solder joints. Also, leadfree solder does not flow as well as leaded solder, so some of
the solder pad areas may remain exposed.
!
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