Sony Ericsson S312 Schematics 1

Component Replacement

- electrical -

S312

1222-7452 Rev 2

Component Replacement (elect)

CONTENTS

1 Replaceable Components ............................................................. 3

2 Component Placing ........................................................................ 5

3 Repair Actions ................................................................................ 6

3.1 Shield Can Fence Modifications .......................................................... 6

3.2 Additional Repair Info ........................................................................... 7

4 Revision History ............................................................................. 8

For general information about electrical repair related issues, refer to 1220-1336: Generic Repair Manual - electrical

1222-7452 Rev 2

2(2)

Component Replacement (elect)

1 Replaceable Components

EXPLANATION OF ABBREVIATIONS USED IN THE COLUMN ‘COMMENTS’ BELOW

COMPONENT LOCATION

P = Primary side S = Secondary side

MOISTURE SENSITIVITY LEVEL

MSLX (X = 1, 2, 2A, 3, 4, 5, 5A or 6)

For more information on moisture sensitivity levels: Refer to 1220-1336: Generic Repair Manual – electrical, section ‘Moisture & Baking’!

REPAIR METHOD

HA = Hot Air (removal & mounting) ST = Soldering Tool (removal & mounting) HA/ST = Hot Air for removal - Soldering Tool for mounting BGA = BGA Station BH = Bottom Heater

ADDITIONAL INFORMATION

Ö1 (2,3,4, etc.) = Proceed to ‘Additional Repair Info’ for further instructions in the indicated section(s).

CALIBRATION

C = Calibration of the phone is required after replacing the component

Calibration to be done by authorized centers only!

1222-7452 Rev 2

3(3)