Sony-Ericsson K500 Service Manual WORKING INSTRUCTION

Working Instruction, Electrical

Working Instruction, Electrical

Applicable for F500 and K500 family

Contents

Lead free soldering .........................................................................................................2

1
2

BGA Equipment reflow profiles (lead free)..................................................................5

2.1

General ..............................................................................................................5

2.2

Temperature measurement ................................................................................ 5

3

BGA Equipment reflow profiles (lead free)..................................................................6

4

BGA Equipment reflow profiles (leaded) .....................................................................7

5

Replacement of parts......................................................................................................8

6

Replacement of parts......................................................................................................9

6.1

Battery connector...............................................................................................9

6.2

Board to board connector ................................................................................10

6.3

FPC connector.................................................................................................11

6.4

Form shield can fence......................................................................................12

6.5

PA shield can...................................................................................................14

6.6

Replacing shield can fence if damage at a repair center..................................14

7

Revision History............................................................................................................15

3/00021-2/FEA 209 544/86 E

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Approved according to 000 21-LXE 107 42/1

Working Instruction, Electrical

1 Lead free soldering

Instruction

Keep all contact surfaces clean of dirt and hand-grease

Step-by-Step Instructions

1 NOTE!

This product is manufactured with lead-free
solder and lead-free components.

During electrical repair, it is critical to make
sure that no lead is introduced.

The symbol indicates that the product is lead
free.

2 The first lead free PBA will not be marked with

this LF symbol; they are identified as lead free
by a new revision on the ROA label. All future
PBA is handled lead free

It’s important that from revision:
ROA 128 0768/3 R2A and onwards PBA is
handled with Lead Free process.

3 A lead-free work area must be set up that is

completely separated from work areas that are
used to make leaded repairs.

The lead free work area must also be clearly
labelled with the lead free symbol as shown in
the figure beside.

The items in this table must remain lead free.
They must be adequately labelled to make their
lead-free status clearly and easily recognized.

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Working Instruction, Electrical

Step-by-Step Instructions

4 LFS (Lead free solder paste) characteristics:

High melting point (Typically 220°C)
Low wet ability
High surface tension
Difficult to spread
Recommended tip temperature 370°C

NOTE!
When servicing PBA’s that is produced with

LFS (Lead free solder paste). LFS MUST be
used. If not, there is a high risk for unreliable
soldering joints.

5 Lead-free solder joints are more difficult to

inspect because they do not have shiny surfaces
like leaded solder joints.

Also, lead-free solder does not flow as well as
leaded solder, so some of the solder pad area
may remain exposed.

Example of lead free solders joints.

6 Example of solder joints with lead.

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Working Instruction, Electrical

Step-by-Step Instructions

7 Example of lead free solders joints.

8 Example of solder joints with lead.

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Working Instruction, Electrical

2 BGA Equipment reflow profiles (lead free)

2.1 General

This document contains recommendations for reflow profile for mobile phones and similar
products. This is only general recommendation and considerations have to be taken for every
single product. The solder paste is secondary but could also affect the parameters.

In this document one alloy is specified:
SnAgCu (Lead free) melting point 217°C

2.2 Temperature measurement

At least 4 probes should be used; they should be placed on components with the highest and
lowest thermal mass.

The probes shall be located in the beginning, in the middle and at the end of the board/panel.
The probes are recommended to be soldered on the board but glue and capton tape could also

be used if necessary.
At least one probe shall be placed in the air or on top of a component.

These values are strongly depending on the BGA replacement equipment.
Nozzle type will be chosen after the outer size of the actual component. Make sure the nozzle

does not affect any near placed components.

NOTE:
These values are recommendations and may have to be changed depending on the type of

equipment.
The maximum temperature for any component must not exceed 250C.

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