Sony Ericsson K330 Working Instruction

Working Instruction, Electrical

Applicable for K330

CONTENTS

Read this first!...................................................................................................2

2 Lead-free soldering...........................................................................................3

3 BGA equipment reflow profiles........................................................................5

3.1 General.................................................................................................. 5

3.2 Temperature Measurements ................................................................. 5

3.3 Reflow Profiles ...................................................................................... 6

4 Replacement of components...........................................................................7

4.1 Shielding Cover BB ............................................................................... 8

4.2 D12: TVS Diode 24V 50pF.................................................................... 9

4.3 D71: TVS Diode 12V 38pF................................................................... 9

4.4 D101: Protection DIODE ....................................................................... 9

4.5 J1: LCD ZIF Connector ....................................................................... 10

4.6 J2: SIM Connector............................................................................... 10

4.7 J4: Microphone.................................................................................... 10

4.8 J6: Battery Connector.......................................................................... 11

4.9 J7: Board to Board Connector (Keypad PCB)..................................... 11

4.10 U100: Illumination Pump ..................................................................... 11

4.11 U601: Audio Amplifier.......................................................................... 12

4.12 U606: FM Module................................................................................ 12

4.13 U706: Voltage Level Shifter................................................................. 12

4.14 U8: Charge IC ..................................................................................... 13

4.15 U9: IC Charging................................................................................... 13

4.16 Z1002: Camera Socket ....................................................................... 13

4.17 Z901: Antenna Connector ................................................................... 14

4.18 Z902: RF Connector............................................................................ 14

5 Revision history .............................................................................................. 15

1219-0637 Rev 2 Company Internal © Sony Ericsson Mobile Communications AB

Working Instruction, Electrical

1 Read this first!

z Before you start replacing any components, make sure you have read and fully understood

the contents of section 2 and 3!

z Also make sure you have access to the mechanical Working Instruction and the equipment

listed on the first page of section 4!

1219-0637 Rev 2 Company Internal © Sony Ericsson Mobile Communications AB

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Working Instruction, Electrical

2 Lead-free soldering

THIS PRODUCT IS MANUFACTURED WITH LEADFREE SOLDER AND LEAD-FREE COMPONENTS!

During electrical repair, it is critical to make sure that no lead is introduced. This symbol indicates that the product is lead- free.

All lead-free PBAs will be marked with this symbol.

A lead-free work area must be set up completely separated from work areas that are used to make lead repairs. The lead-free work area must also be clearly labeled with the lead free symbol as shown in the adjacent picture. The items on this desk must remain lead-free. They must be adequately labeled to make their lead-free status clearly and easily recognized.

1219-0637 Rev 2 Company Internal © Sony Ericsson Mobile Communications AB

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Working Instruction, Electrical

Lead-free soldering continued

LFS (lead-free solder paste) characteristics:

z High melting point (typically 220°C) z Low wet ability z High surface tension z Difficult to spread z Recommended tip temperature = 370°C

WHEN SERVICING PBAS THAT HAVE BEEN MANUFACTURED WITH LFS (LEAD-FREE SOLDER PASTE), LFS MUST BE USED! IF NOT, THERE IS A HIGH RISK OF UNRELIABLE SOLDERING JOINTS!

Lead-free solder joints are more difficult to inspect because they do not have shiny surfaces like leaded solder joints. Also, lead-free solder does not flow as well as leaded solder, so some of the solder pad areas may remain exposed.

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Working Instruction, Electrical

3 BGA equipment reflow profiles

3.1 General

This document contains reflow profile recommendations for mobile phones and similar products. They are just general recommendations and considerations have to be taken for every single product. The solder paste is secondary but could also affect the parameters. In this document one alloy is specified: SnAgCu (Lead free) melting point 217°C

3.2 Temperature Measurements

At least four probes should be used. They should be placed on components with the highest and lowest thermal mass. The probes shall be located in the beginning, in the middle and at the end of the board/panel. It is recommended that the probes are soldered on the board, but glue and capton tape can be used. At least one probe shall be placed in the air or on top of a component. These values are strongly depending on the BGA replacement equipment. Nozzle type will be chosen after the outer size of the actual component. Make sure the nozzle does not affect any nearby placed components.

THESE VALUES ARE RECOMMENDATIONS AND MAY HAVE TO BE CHANGED DEPENDING ON THE TYPE OF EQUIPMENT!

THE MAXIMUM TEMPERATURE FOR ANY COMPONENT MUST NOT EXCEED 250°C!

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