Sony Ericsson K200I Working Instruction
Working Instruction, Electrical
Working Instruction, Electrical
Applicable for K200 and K220
CONTENTS
1 Lead-free soldering ................................................................................2
2 BGA equipment reflow profiles............................................................. 4
2.1
General.................................................................................................. 4
2.2
Temperature measurement...................................................................4
2.3
3 Replacement of components ................................................................6
3.1
3.2
3.3
J308: LCD Display continued .............................................................................. 9
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
4 Revision history ...................................................................................16
Reflow profiles.......................................................................................5
LED D317: Charge LED Red ................................................................ 7
D314, D316, D319, D360: Keypad Led Blue......................................... 7
J308: LCD Display................................................................................. 8
J402: Camera Socket.......................................................................... 10
J602: Antenna Connector.................................................................... 10
J302: SIM Connector........................................................................... 11
J305: Battery Connector...................................................................... 11
U604: IC Charger ................................................................................ 12
U606: FM Module (K220 Only)............................................................ 12
U702: Audio Power Amplifier (K220 Only) .......................................... 13
U605: IRDA Module ............................................................................ 13
U306: Melody IC.................................................................................. 14
U307: IC Charge Pump ....................................................................... 14
R201: NTC Resistor ............................................................................ 15
Shield can Lid Assy ............................................................................. 15
3/000 21-2/FEA 209 544/127 B
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Company Internal
Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
1 Lead-free soldering
K
EEP ALL CONTACT SURFACES CLEAN OF DIRT AND HAND
GREASE
!
T
HIS PRODUCT IS MANUFACTURED WITH LEAD-FREE SOLDER
-
AND LEAD
FREE COMPONENTS!
During electrical repair, it is critical to make sure that no lead is
introduced.
This symbol indicates that the product is lead- free.
All lead-free PBA’s will be marked with this symbol.
A lead-free work area must be set up completely separated from
work areas that are used to make lead repairs.
The lead-free work area must also be clearly labeled with the lead
free symbol as shown in the adjacent picture.
The items on this desk must remain lead-free.
They must be adequately labeled to make their lead-free status
clearly and easily recognized.
3/000 21-2/FEA 209 544/127 B
©
Company Internal
Sony Ericsson Mobile Communications AB
2(16)
Working Instruction, Electrical
LFS (lead-free solder paste) characteristics:
High melting point (typically 220°C)
Low wettability
High surface tension
Difficult to spread
Recommended tip temperature = 370°C
W
HEN SERVICING
LFS (
WITH
I
F NOT, THERE IS A HIGH RISK FOR UNRELIABLE SOLDERING
JOINTS
LEAD-FREE SOLDER PASTE),
.
PBA’
S THAT HAVE BEEN MANUFACTURED
LFS
MUST BE USED
.
Lead-free solder joints are more difficult to inspect because they
do not have shiny surfaces like leaded solder joints.
Also, lead-free solder does not flow as well as leaded solder, so
some of the solder pad areas may remain exposed.
3/000 21-2/FEA 209 544/127 B
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Company Internal
Sony Ericsson Mobile Communications AB
3(16)
Working Instruction, Electrical
2 BGA equipment reflow profiles
2.1 General
This document contains reflow profile recommendations for mobile phones and similar
products.
They are just general recommendations and considerations have to be taken for every single
product.
The solder paste is secondary but could also affect the parameters.
In this document one alloy is specified:
SnAgCu (Lead free) melting point 217°C
2.2 Temperature measurement
At least two probes should be used. Primary thermocouple should be attached from back side
of the board on a drilled hole under the middle of the component because that is usually the
coolest part of component during reflow. Second thermocouple should be attached on the top
of the component body.
It is recommended that the probes are soldered on the board, but glue and capton tape could
also be used, if necessary.
Nozzle type will be chosen after the outer size of the actual component.
Make sure the nozzle does not affect any nearby placed components.
These values are recommendations and may have to be changed depending on the type of
equipment.
The maximum temperature for any component must not exceed 260
°C.
3/000 21-2/FEA 209 544/127 B
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Company Internal
Sony Ericsson Mobile Communications AB
4(16)
Working Instruction, Electrical
2.3 Reflow profiles
Sn/Ag/Cu (lead-free)
290
250
Reflow zone
260°C
245°C
230°C
200
150
Temperature [ºC]
100
150°C
125°C
50
0
40 80 120 160 200 240 280
Time [Seconds]
Ramp rate < 3°C/sec
Ramp rate cooling < 4°C/sec
Pre heating time 60-150 sec
Time above liquid 40-70 sec
Minimum temperature 230°C
Maximum temperature 245°C°
Maximum component temperature 260 °C
Time between 230 and 245 30 sec
Board temperature bottom side 160°C-185°C
Total time Approx. 3-5min
3/000 21-2/FEA 209 544/127 B
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Company Internal
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