2. GENERAL ·········································································· 6
3. DISASSEMBLY
3-1. Loading Panel·····································································7
3-2. Base Unit (BU-5BD27) ······················································ 7
7-1. Front Panel and Case Section ··········································· 23
7-2. CD Mechanism Section (CDM66-5BD27) ······················ 24
7-3. Base Unit Section (BU-5BD27) ······································· 25
8. ELECTRICAL PARTS LIST······································· 26
MODEL IDENTIFICATION
— BACK PANEL —
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
2
Parts No.
PARTS No.MODEL
4-232-150-0s
4-232-150-1s
AEP
UK
SECTION 1
SERVICING NOTE
CDP-XE570
HOW TO OPEN THE DISC TRAY WHEN POWER SWITCH
TURNS OFF
Insert a tapering driver into the aperture of the unit bottom, and turn
in the direction of arrow.
Use a flat (–) head screwdriver to open the CD tray b y manual operation. (Flat head screwdriver with nominal blade length of 3mm.)
*
To close the disc table, turn the driver in the reverse direction.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer
electrostatic breakdown because of the potential difference
generated by the charged electrostatic load, etc. on clothing and
the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Pull out disc table.
3
CDP-XE570
CD-TEXT TEST DISC
This unit is able to display the TEXT data (character information)
written in the CD on its fluorescent indicator tube.
The CD-TEXT TEST DISC (TGCS-313: J-2501-126-A) is used
for checking the display.
To check, perform the following procedure.
Procedure:
1.Turn ON the power and set the test disc.
2.Press the H button and play back the disc.
3.The following will be displayed on the fluorescent indicator
tube.
Display : 1kHz/0 dB/– – – –
4.Rotate the l AMS L knob to switch the track. The
text data of each track will be displayed.
Restrictions in CD-TEXT Display
In this unit, some special characters will not be displayed properly . These will be displayed as a space or a character resembling it. For details,
refer to “Table 2 : CD-TEXT DISC Recorded Contents and Display”.
Table 1 : CD-TEXT TEST DISC TEXT Data Contents (TRACKS No. 1 to 41:Normal Characters)
A OPEN/CLOSE 7 (8, 10, 12)
H 8 (9, 11, 12, 14)
X 9 (9, 14)
x 0 (9, 14)
lAMSL dial qa (9, 12, 14)
m/M qk (9, 13)
ANALOG OUT L/R jacks 2 (7)
CONTROL A1II jacks 3 ( 8, 15)
DIGITAL OUT OPTICAL jack 1 (8)
Mains lead 4 (7)
6
SECTION 3
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
3-1. LOADING PANEL
• In order to remove the front panel block when the power supply
does not turn on, rotate the cam with tapering driver as the figure
shows, and the loading part will be moved.
Then pull out the loading part by your hand to remove the loading
panel as the figure shows. After that take out the front panel block.
Tapering driver
CDP-XE570
Loading panel
Loading part
3-2. BASE UNIT (BU-5BD27)
1 Turn the cam to the direction of
arrow (counter clock wise) by
tapering driver.
3 Screw (DIA. 12), floating
BU-5BD27
4 Remove the Base unit
(BU-5BD27) to the direction
of arrow.
2Take off the tray.
7
CDP-XE570
SECTION 4
TEST MODE
4-1. CHECK MODE
The following checks can be performed in the CHECK Mode.
• Offset value display
1.Turn on the set.
2.Put disc in the set.
3.Press the [PLAY MODE] , H and M b uttons simultaneously.
4.The Offset measured values will be displayed as “AB 02 FE”
(typical values).
• RFDC value display
1.Turn on the set.
2.Put disc in the set.
3.Press the [PLAY MODE], H and m b uttons simultaneously .
4.The RFDC measured value will be displayed as “RFDC 65”
(typical value). If there is no disc in the set, “RFDC NO” will
be displayed.
4-2. AF ADJ MODE
The following checks can be performed in the AF ADJ mode, which
is set by connecting the TP2 (AFADJ) terminal on DISPLAY
BOARD to the Ground and turning on the power.
• FL tube check
After all segments light up, when the H button is pressed, the
following will be displayed.
The display will light up as follows when the l AMS L
knob is rotated to the right, and as follows when rotated to the
left.
JOG RIGHT
JOG LEFT
When the OPEN/CLOSE A button is pressed, all will light up
again.
• Key check
All buttons have corresponding button numbers. When a button
is pressed, the counter will count up and display the button’s number. Ho wever , the counter will only count to “15”. It will not count
for buttons already pressed once, but will display the button’s
number.
ABCDEF
When the x button is pressed, the following will be displayed.
42
6
16
810
1412
1820
88TOTAL= 88
X
Display of button number
Button
X
M
m
ENTER(AMS)
TIME/TEXT
FADER
CLEAR
CHECK
• Remote commander check
When the “ H ” button is pressed, the display will light up
as follows.
Buttton No.
Displayed
1
8
9
10
16
17
18
19
X
Display of counting
Button
PEAK SEARCH
TIME EDIT
PLAY MODE
REPEAT
OPEN/CLOSE
A
PLAY H
STOP x
Button No.
Displayed
20
21
22
23
All lit
(ABCDEF)
(Music Calendar)
REMOCON PLAY
8
CDP-XE570
TP2
AFADJ
TP1
ADJ
GND
S531
l AMS L
4-3. ADJ MODE
The following operations are performed in the ADJ mode, which is
set by connecting the TP1 (ADJ) terminal to the Ground and turning
on the power.
Table of Button Operations in ADJ Mode
The functions of the buttons are shown in the following table.
Function of Buttons
Button
TIME/TEXT
M
m
CLEAR
* NOTE : Other buttons are not used for servicing and should not
3.Use an oscilloscope with more than 10MΩ impedance.
4.Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with the
following checks.
RF Level Check
oscilloscope
BD board
TP (RF AC)
TP (VC)
Procedure :
1.Connect oscilloscope to test point TP (RF A C) and TP (VC) on
BD BOARD.
2.Connect the test point TP1 (ADJ) on DISPLA Y BO ARD to the
ground with a lead wire.
3.Turn Power switch on.
4.Put disc (PATD-012) in to play the number five track.
5.Press the [CLEAR] buton and select the RFCK function.
6.Confirm that oscilloscope waveform is clear and check RF
signal level is correct or not.
Note:
A clear RF signal waveform means that the shape “◊” can be clearly
distinguished at the center of the waveform.
RF signal waveform
VOLT/DIV : 200mV
TIME/DIV : 500ns
level : 1.35 ± 0.4 Vp-p
1 track jump waveform
Center of the waveform
B
0V
level : 1.15 ± 0.5Vp-p
symmetry
A (DC voltage)
E-F Balance Check
oscilloscope
BD board
TP (TE1)
TP (VC)
Procedure :
1.Connect the test point TP1 (ADJ) on DISPLAY BOARD to
the ground with a lead wire on main board.
2.Connect oscilloscpe to test point TP (TE1) and TP (VC) on
BD BOARD.
3.Turn the Power switch on to set the ADJ mode.
4.Put disc (PATD-012) in to play the number five track.
5.Press the [TIME/TEXT] button. (The tracking servo are turned
OFF.)
6.Check the level B of the oscilliscope's waveform and the A
(DC voltage) of the center of the Traverse waveform.
Confirm the following :
A/B x 100 = less than ± 22%
Traverse waveform
Center of the waveform
B
E-F Balance (1 Track Jump) Check
oscilloscope
BD board
TP (TE1)
TP (VC)
Procedure :
1.Connect oscilloscpe to test point TP (TE1) and TP (VC) on
BD BOARD.
2.Turn Power switch on.
3.Put disc (PATD-012) in to play the number five track.
4.Press the X (Pause) button. (Becomes the 1 track jump mode)
5.Check the level B of the oscilliscope's waveform and the A
(DC voltage) of the center of the Traverse waveform.
Confirm the following :
A/B x 100 = less than ± 22%
0V
level : 1.15 ± 0.5 Vp-p
A (DC voltage)
7.Press the [TIME/TEXT] button. (The tracking servo are turned
ON.) Confirm the C (DC voltage) is almost equal to the A (DC
voltage) is step 6.
Traverse waveform
C (DC
0V
Tracking servo
OFF
Tracking servo
ON
voltage
8.Disconnect the lead wire of TP1 (ADJ) connected in step 1.
10
Adjustment Location :
[ DISPLAY BOARD ] – Conductor side –
CDP-XE570
TP2
AFADJ
GND
l AMS L
S531
[ BD BOARD ] – Side B –
TP(VC)
TP1
ADJ
TP(TE1)
CN102
TP(FE1)
IC101
TP(RF AC)
11
CDP-XE570
6-1. CIRCUIT BOARDS LOCATION
LOADING board
POWER SW board
KEY board
SECTION 6
DIAGRAMS
BD board
DISPLAY board
MAIN board
HEADPHONE board
12
CDP-XE570
d
d
11
(21)
S272
LOAD
IN
S271
LOAD
OUT
CN151
1
5
M151
LOADING
MOTOR
M
LOADING BOARD
1-645-721-
TO MAIN BOARD
(Page 16)
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
f
•
• C : panel designation.
Note: The components identified by mark 0 or dotted line
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
• Voltages are taken with a VOM (Input impedance 10 MΩ).
• Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
: internal component.
with mark 0 are critical for safety.
Replace only with part number specified.
under no-signal (detuned) conditions.
no mark : STOP
() : PLAY
Voltage variations may be noted due to normal production tolerances.
Voltage variations may be noted due to normal production tolerances.
J: CD
c : digital out
4
W or less unless otherwise
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•x: parts mounted on the conductor side.
a
•
• b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)parts face are indicated.
: Through hole.
• WA VEFORMS
– BD Board –
1
IC101 ta (RFAC)
(CD Play Mode)
2
IC101 rd (RFD)
(CD Play Mode)
3
IC101 el (FE)
approx.
200 mVp-p
(CD Play Mode)
4
IC101 ra (TE)
approx.
400 mVp-p
(CD Play Mode)
– DISPLAY Board –
8
IC501 el (EXTAL)
40 ns
1.3 Vp-p
1.4 Vp-p
4.5 Vp-p
5
IC101 wh (MDP)
(CD Play Mode)
6
IC101 w; (SCOR)
13.4 ms
(CD Play Mode)
7
IC101 yj (XTAO)
59 ns
(CD Play Mode)
7.5
6-2. SCHEMATIC DIAGRAM LOADING MOTOR SECTION
2.7 V
µ
s
5.2 Vp-p
5.9 Vp-p
6-3. PRINTED WIRING BOARD LOADING MOTOR SECTION • See page 12 for Circuit Board Location.
• Indication of transistor
C
Q
These are omitte
EB
C
EB
These are omitte
1313
CDP-XE570
16
IC150
IC101
IC131
6-4. PRINTED WIRING BOARD BD SECTION • See page 12 for Circuit Board Location.
There are a few cases that the part printed on
this diagram isn’t mounted in this model.
• Semiconductor
Location
Ref. No. Location
IC101*C-2
IC131*C-1
IC150*B-1
Q131C-3
Q132C-3
* : Side B
1414
6-5. SCHEMATIC DIAGRAM BD SECTION • See page 21,22 for IC Block Diagrams. • See page 13 for waveforms.
CDP-XE570
IC B/D
IC B/D
1515
CDP-XE570
6-6. PRINTED WIRING BOARD MAIN SECTION • See page 12 for Circuit Board Location.
IC681
18
IC631
There are a few cases that the part printed on
this diagram isn’t mounted in this model.
1X-4953-456-2 PANEL ASSY, FRONT (BLACK)(AEP,UK)
1X-4953-457-2 PANEL ASSY, FRONT (SILVER)(AEP)
21-681-120-11 POWER SW BOARD
34-232-237-01 FOOT (DIA. 30)
53-354-981-11 SPRING (SUS), RING
R1011-216-835-11 METAL CHIP15K5%1/16W
R1021-216-845-11 METAL CHIP100K5%1/16W
R1031-216-835-11 METAL CHIP15K5%1/16W
R1101-216-821-11 METAL CHIP1K5%1/16W
R1111-216-809-11 METAL CHIP1005%1/16W
R1121-216-833-11 METAL CHIP10K5%1/16W
R1201-216-839-11 METAL CHIP33K5%1/16W
R1211-216-833-11 METAL CHIP10K5%1/16W
R1221-216-845-11 METAL CHIP100K5%1/16W
R1231-216-857-11 METAL CHIP1M5%1/16W
R1251-216-827-11 METAL CHIP3.3K5%1/16W
R1261-216-833-11 METAL CHIP10K5%1/16W
R1271-216-821-11 METAL CHIP1K5%1/16W
R1291-216-815-11 METAL CHIP3305%1/16W
R1341-216-853-11 METAL CHIP470K5%1/16W
R1351-216-836-11 METAL CHIP18K5%1/16W
R1361-216-836-11 METAL CHIP18K5%1/16W
R1371-216-797-11 METAL CHIP105%1/16W
R1381-216-798-11 RES-CHIP125%1/16W
R1391-216-847-11 METAL CHIP150K5%1/16W
R1401-216-854-11 METAL CHIP560K5%1/16W
R1411-216-840-11 METAL CHIP39K5%1/16W
R1421-216-841-11 METAL CHIP47K5%1/16W
R1431-216-855-11 METAL CHIP680K5%1/16W
R1441-216-846-11 METAL CHIP120K5%1/16W
R1451-216-830-11 METAL CHIP5.6K5%1/16W
R1461-216-845-11 METAL CHIP100K5%1/16W
R1491-216-821-11 METAL CHIP1K5%1/16W
R1511-216-845-11 METAL CHIP100K5%1/16W
R1521-216-833-11 METAL CHIP10K5%1/16W
R1531-216-864-11 METAL CHIP05%1/16W
R1551-216-836-11 METAL CHIP18K5%1/16W
R1711-218-720-11 METAL CHIP15K0.5%1/16W
R1721-218-720-11 METAL CHIP15K0.5%1/16W
R1731-218-720-11 METAL CHIP15K0.5%1/16W
R5111-249-427-11 CARBON6.8K5%1/4W F
R5121-249-415-11 CARBON6805%1/4W F
R5131-249-417-11 CARBON1K5%1/4W F
R5141-249-419-11 CARBON1.5K5%1/4W F
R5211-249-427-11 CARBON6.8K5%1/4W F
R1741-216-809-11 METAL CHIP1005%1/16W
R1811-218-720-11 METAL CHIP15K0.5%1/16W
R1821-218-720-11 METAL CHIP15K0.5%1/16W
R1831-218-720-11 METAL CHIP15K0.5%1/16W
R1841-216-809-11 METAL CHIP1005%1/16W
R1911-216-817-11 METAL CHIP4705%1/16W
R1921-216-797-11 METAL CHIP105%1/16W
IC501 8-752-921-33 IC CXP82832-033Q
IC502 8-759-459-86 IC NJL64H400A(REMOTE SENSOR)
< TRANSISTOR >
Q5018-729-029-66 TRANSISTORDTC114ESA-TP
Q5028-729-029-66 TRANSISTORDTC114ESA-TP
< RESISTOR >
R5011-249-427-11 CARBON6.8K5%1/4W F
R5021-249-415-11 CARBON6805%1/4W F
R5031-249-417-11 CARBON1K5%1/4W F
R5041-249-419-11 CARBON1.5K5%1/4W F
R5051-249-421-11 CARBON2.2K5%1/4W F
R5311-249-441-11 CARBON100K5%1/4W
R5321-249-441-11 CARBON100K5%1/4W
R5351-249-427-11 CARBON6.8K5%1/4W F
R5361-249-427-11 CARBON6.8K5%1/4W F
R5371-249-429-11 CARBON10K5%1/4W
R5391-249-429-11 CARBON10K5%1/4W
R5411-247-807-31 CARBON1005%1/4W
R5421-247-807-31 CARBON1005%1/4W
R5511-249-415-11 CARBON6805%1/4W F
R5521-249-417-11 CARBON1K5%1/4W F
R5221-249-415-11 CARBON6805%1/4W F
R5231-249-417-11 CARBON1K5%1/4W F
R5241-249-419-11 CARBON1.5K5%1/4W F
R5251-249-421-11 CARBON2.2K5%1/4W F
R5261-247-843-11 CARBON3.3K5%1/4W
R5271-249-427-11 CARBON6.8K5%1/4W F
R5281-249-431-11 CARBON15K5%1/4W
IC6018-759-039-69 IC uPC7805AHF
IC6028-749-011-78 IC BA17807T
IC6038-759-165-81 IC PST600D-T
IC6318-759-598-69 IC BA6956AN
IC6518-749-921-12 IC GP1F32T(DIGITAL OUT OPTICAL)
IC6718-759-604-86 IC M5F7807L
IC6728-759-604-90 IC M5F7907L
IC6818-759-167-88 IC NJM4565D
IC8018-759-710-59 IC NJM4580D-D
IC9018-759-710-59 IC NJM4580D-D
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
R6811-249-441-11 CARBON100K5%1/4W
R6821-249-419-11 CARBON1.5K5%1/4W F
R6831-249-419-11 CARBON1.5K5%1/4W F
R6911-249-441-11 CARBON100K5%1/4W
R6921-249-419-11 CARBON1.5K5%1/4W F
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
29
CDP-XE570
REVISION HISTORY
Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised
page.
Ver.DateDescription of Revision
1.02001.03 New
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