The purpose of this document is to provide enhanced technic al information for Sony Ericsson
repair technicians in order to assist during service, repair and troubleshooting operations on Sony
Ericsson mobile phones. It should be used as a c omplement to other repair instructions and tools
as notifi ed by the local Sony Ericsson representative.
To search for components throughout the entire document use the “search” function in Adobe
Acrobat Reader 7.0 (or later version) and enter the component name or other word. Use zoom to
enlarge.
For easier navigation of the document you can use the bookmarks that appear in the Bookmarks
tab on the left side of the Adobe Acrobat Reader window. Each bookmark jumps to a page in the
document.
Disclaimer
This document is Sony Ericsson confi dential and should be treated as confi dential in accordance
with the agreement with Sony Ericsson. This document is intended for use by authorized ser vice
technicians only. Sony Ericsson is not to be held responsible for any damages or losses caused
intentionally or unintentionally due to unauthorise d use of the information in this document.
Revision Hi st o ry
Rev.DateChanges / Co mments
110/31/2008Initital revision.
ABOUT
Contents
ABOUT 2
TROUBLESHOOTING 3
MEASUREMENT POINTS 39
About 2
Contents 2
Equipme nt L ist 3
On/Off Problems 8
Flash Problems 8
Dead Phone Problems 9
Display Problems 10
Display Illumination Problems 11
Key Problems part 1 11
Key Problems part 2 12
LED Problems 12
Main & VGA Camera 13
Camera Door Sens or & Flash LED Pr o bl em s 13
Vibrator Problems 14
Charging Problems 14
USB/VBUS Charging Problems 15
SIM Problems 16
Memor y S t i c k Pr o bl em s 16
Audio Internal Problems 17
Audio Exter nal Pr o ble ms 17
FM Radio Problems 18
Bluetooth Problems 18
GSM Netwo rk Problems 19
WCDMA Network Probl em s 20
System Connector Protection Test 21
Current Consumption Test 21
Current Consumption Test 22
Battery an d Cur r ent C alibr ati on Test 23
Backup Capacitor Test 23
Charging Test 24
ASIC Revision Test 24
Reference Measurement Points 25
Measurement Points Pictures 26
Front S ide 39
Back Side 40
N1200 Thor Module 41
N1210 Squid Module 42
Top Schematic 43
Imaging Top 44
Imaging Display 45
Imaging Camera 46
Imaging LMU 47
Imaging Sensor 48
Access Top 49
Access GS M & UMTS 50
Access Blueto ot h 51
Access AGPS 52
Applicatio n & S ystem Performance 53
System Top 54
Clocks & Resets 55
System Memories 56
SEMC Troubleshooting Manual
C702
ABOUT
System PoP IF 57
Power Top 58
Regulators & Charging 59
Power Camera 6 0
Power ASICs 61
Power Memories 62
Connectivity Top 63
Connectivity ADC & I2C 64
Connectivity Cards 65
Connectivity 66
Connectivity Keypad 67
Audio Top 68
Audio Analog 69
Audio Digital 70
Audio FM Radio 71
Test 72
Thor RF Module - TOP 73
Thor RF Module - G SM/EDG E Tx + FEM 74
Thor RF Module - G SM/EDG E Rx + Synth 75
Squid RF Module - Ra di o Top 76
Squid RF Module - Ra dio Cont UMTS 77
Squid RF Module - Radi o D up l ex 78
Squid RF Module - Ra di o Top UMTS 79
Squid RF Module - Ra di o Receiver UMTS 80
Squid RF Module - Radio S y nt he sizer UMTS 81
Squid RF Module - Radi o Power Amplifi er 82
Note: More additional information about the equipment used for TRS can be found in Repair
Tools Catalogue on CSPN or on the following location: CSPN – Repair Instructions – Electrical –
C702 – Equipment List.
Power Supply Channel 2 DCIO/SEPI
Agilent 6632B or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Instrument Settings:
Voltage: 5.0 Volt
Limiter: 2A
Note: It is very important to follow instrument setting instructions when performing the
Current Calibration Test.
Oscilloscope
Tektronix TDS 2012 or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Digital Multimeter (DMM)
Fluke 83 or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
The 0, 64 mm Test Probes is recommended by Sony Ericsson when DMM is in use see picture 1.
Picture 1
TROUBLESHOOTING
TRS Fixture Kit
Location: CSPN-Repair Instructions-Electrical-C702-Equipment List
Dummy Battery
Location: CSPN-Repair Instructions-Electrical-C702-Equipment List
Part number: NTZ 112 533
Note! The resistance between GND and BDATA should be approximately 120K Ohm.
Instruments
Power Supply Channel 1 VBATT
Agilent 6632B or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Instrument Settings:
Voltage: 3.8 Volt
Limiter: 2A
Note: During the calibration the accurate voltage from the VBATT must be within ±0.015 V. If
this is not fulfilled it will result in a faulty calibration. (For more information about
recommended power supply units, see the Repair Tool Catalogue on CSPN under the Mechanical
level. The Power Supply Channel 1 VBATT must allow reverse current.
Note: Maximal cable length between the Power Supply Channel 1 VBATT and the dummy
battery must be maximum 1m. The cable must have a capacity for at least 16A.
Spectrum Analyzer
HP 8595E or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
RF probe
HP 85024A or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Mobile Phone Tester
Yokogawa VC230 or similar
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
FM Signal Generator
Agilent E4433B or similar
Location: -
RF Adaptor
Adaptor 33 N-BNC-50-1
Adaptor to Signal Generator RF Output
See Picture 2
Location: -
Note: It is very important to follow instrument settings instructions when performing the
Battery Calibration Test.
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Part number: KRY 101 1413
RF Test Cable Flexible
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Part number: RPM 119 885
See Picture 5.
Picture 5
Drivers
SEPI BOX Drivers
Location: EMMA III-Drivers-SEPI
SE Communication Interface SEPI BOX
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Part number: LTN 214 1484
See Picture 3.
Picture 3
Cables
USB Computer Cable
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
See Picture 4.
SEPI Interface Cable – A1
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Part number: KRY 101 1119/1
See Picture 6.
Picture 6
Power Cable RED to Power Supply Channel 1 VBATT
Maximum Length: 1m
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Power Cable BLACK to Power Supply Channel 1 VBATT
Maximum Length: 1m
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
1221-7857 rev. 1
4 (115)
Page 5
TROUBLESHOOTING
Equipment List
SEMC Troubleshooting Manual
C702
Customized Power Supply Channel 2 DCIO/SEPI Cable
To perform Current Calibration the phone must be supplied directly through the system
connector. Customize the cable according to following instructions:
STEP 1:
Take the CST-75 battery charger and cut of the charger according to Picture 7.
Picture 7
Note: Cable length must be exact 1.3m.
STEP 2:
Connect the CST-75 charger Red or White wire to the Plus Output and the Black wire to the
Minus (GND) Output at Power Supply Channel 2 DCIO/SEPI according to Picture 8.
STEP 4:
Connect DCIO and SEPI Interface Cable – A1 cables according to Picture 10.
Picture 10
TROUBLESHOOTING
This is wrong setup see picture 11.
Picture 11
Picture 8
STEP 3:
Cut of isolation material from inside of the charger plug according to Picture 9.
Picture 9
Power Supply Channel 2 DCIO/SEPI Cable Connection Setups
Correct DCIO/SEPI Cable setup when TRS Fixture is used.
Picture 12
Note: Example of DCIO/SEPI and K750 TRS Fixture Setup.
1221-7857 rev. 1
5 (115)
Page 6
TROUBLESHOOTING
Equipment List
SEMC Troubleshooting Manual
C702
Correct DCIO/SEPI Cable setup when the Dummy Battery is used.
Picture 13
Picture 14
STEP 2:
Cut the Red lab plug according to Picture 16
Picture 16
TROUBLESHOOTING
STEP 3:
Use any Hands free (PHF) Cable and cut according to Picture 17
Picture 17
Customized FM Radio Cable
STEP 1:
Use Cable according to Picture 15
Picture 15
Product Name: Test lead BNC-4mm 1,5m
Product Description: Test lead with 4 mm lab plugs at one end and a BNC plug at the other.
Manufacturer: PMK Germany
Location: http://www.elfa.se/en/
or other supplier.
Part number: 46-310-40 (Note: This is ELFA part number)
Note: Minimum Cable length 40 cm.
STEP 4:
Use only wire connected to Pin2 and cut all rest wires according to Picture 18.
Use digital multimeter instrument (DMM) and perform diode measurement to select wire
connected to Pin2 at hands free system connector plug.
Picture 18
1221-7857 rev. 1
6 (115)
Page 7
TROUBLESHOOTING
Equipment ListEquipment ListEquipment List
SEMC Troubleshooting Manual
C702
STEP 5:
Connect by soldering cable from Picture 16 and cable from Picture 18 according to Picture 19.
Picture 19
Test Cards
Local SIM
Any functional Local SIM Card, see Picture 20
Picture 20
Sony Memory Stick M2
Any functional Memory Stick Micro M2 Card, see Picture 22
One Test SIM GSM/UMTS is needed to perform Current Consumption Test, see Picture 21.
Location: To buy a Test SIM GSM/UMTS, please contact your supplier of test equipment.
Picture 21
SMK RF Probe
Location: CSPN-Repair Instructions-Level: Mechanical-Tool Catalogue
Part number: SXA 109 6356
Picture 24
1221-7857 rev. 1
7 (115)
Page 8
TROUBLESHOOTING On/Off Problems
- Flash Problems
SEMC Troubleshooting Manual
C702
START
Use
Dummy Battery (VBATT)
No
Is the
phone consuming
any current when
powering on the
phone
Yes
On/Off Problems
Is the phone
consuming more than
1mA when the phone
is powered off
No
Is it possible to
power on the phone
Connect a chargerNo
Yes
Yes
Is it possible to power
off the phone
Is the phones
behavior as normal
Optimized
charging
No
Yes
No
Yes
Go to
Dead phone
Problems part 1
Go to
Current
Consumption Test
After this go to
Charging Test.
Go to
Key Problems
No
Power Up the Phone
Connect
USB Cable From PC
The phone
Indicates charging
on the display
No
Go to
USB/VBUS
Charging Problems
No
Yes
Flash Problems
Flash process
Start-up when using
EMMA SW
Yes
Is
ITP SW Flash
Successful
5 Volt DC at
MP 118 (C2414)
Yes
3.3V - 3.5V
Pk-Pk Pulses at
MP 116 (C2476)
No
No
Yes
SL 5 Replace
D2020
SL 4 Escalate
Is any of
C2413 and C2433
short circuit
1.8 Volt DC
at
MP 120 (R2427)
START
Step 1:
System Connector Protection Test
If the test is pass go to step 2
Use Phone with Normal SW
Connect: Display, Keypad
Dowload ITP SW into the Phone
No
Yes
No
Perform
Step 2:
Use TRS Fixture
and VBATT
by using EMMA SW
SL 5 Replace
R2484
SL 4 Escalate
SL 5 Replace
C2413 or C2433
SL 4 Escalate
SL 5 Replace
D2000
SL 4 Escalate
TROUBLESHOOTING
Is the current
consumption between
10mA to 70mA
Yes
Flash
the phone with
correct CDA
software
Flash
The phone with
ITP software
successful
No
Go to
Flash Problems
Yes
CDA Software
Flash
Successful
1. Customize the phone into DPY/Z
No
No
Problems part 1
Connect USB from PC
No
Yes
2. Startup the phone and wait for
the configuration to take place
(takes less than a minute)
3. Customize with correct CDA
4. Activate the phone
Problem
solved
Go to
Dead Phone
Press ”C”
Run SEMC BOOT
if necessary
Run SUCR SW
Is Phone Flash
OK
No
Flash process
started
Yes
NoYes
Yes
No
Go to
System Connector
Protection Test..
After this go to
Flash Problems
Problem
solved
Yes
Claim for a
SW Upgrade
Disconnect:
VBATT and USB Cable
from the TRS Fixture
Max
2 Ohm between
MP 113 (X2300_Pin 2)
and MP 115
(Z4203_Pin 4)
Yes
Max
2 Ohm between
MP 112 (X2300_Pin 3)
and MP 110
(Z4203_Pin 3)
Yes
Replace
D2404
Yes
No
No
Yes
1.8V - 2.5V
Pk-Pk Pulses at
MP 98 (C2474)
Max
0.5 Ohm between
MP 113 (X2300_Pin 2)
and MP 114
(Z4203_Pin 1)
Max
0.5 Ohm between
MP 112 (X2300_Pin 3)
and MP 111
(Z4203_Pin 2)
Problem
solved
Yes
Yes
No
No
No
No
Yes
Is any of
V2410 and V2411
short circuit
Replace
System Connector
X2300
SL 5 Replace
Z4203
SL 4 Escalate
Replace
System Connector
X2300
SL 5 Replace
Z4203
SL 4 Escalate
Claim Component
D2404
SL 5 Replace
D2000
SL 4 Escalate
Yes
Yes
Replace
D2404
No
SL 5 Replace
V2410 or V2411
SL 4 Escalate
1221-7857 rev. 1
8 (115)
Page 9
TROUBLESHOOTING Dead Phone Problems
SEMC Troubleshooting Manual
C702
START
Try to recover the phone by
Run SEMC BOOT if necessary
If successful claim SW Flash
If not continue with the step 2.
Step 1:
using EMMA SW
Press ”C”
Connect USB from PC
Run SUCR SW
Step 2:
Use TRS Fixture
Connect Only: VBATT
Replace
N1200 or N1210
SL 5 Remove
N2000
SL 4 Escalate
Yes
Dead Phone Problems part 1
Is the
current consumption
more than 1mA
Yes
Try to trace faulty
component by using
freezing spray
Are any of
N1200 (Thor)
or N1210 (Squid)
getting hot
No
No
0 Volt DC
between Power
Supply VBATT GND
and Shield Can
Fence
Yes
Connect
DCIO/SEPI
to the Phone
2.2 Volt DC
at MP 13 (ST2212
VDD_LP)
Yes
32 kHz
at MP 41 (C2103) and
MP 42 (C2106)
No
No
No
SL 5 Replace
R2200
SL 4 Escalate
SL 5 Replace
N2000
SL 4 Escalate
Replace
B2101
Dead Phone Problems part 2
START
NOTE !
Before following this guide
the Dead Phone Problems
part 1 must be finished.
VAUDIO26
Voltage
Ok
Yes
No
Dead Phone Problems part 2
Replace
N2400 or V2405
Yes
N2400 or V2405
getting hot
SL 5 Replace
N2202 or D2000
SL 4 Escalate
Yes
No
SL 5 Replace
N2000
SL 4 Escalate
No
Is any of
C2209, C2400
C2430, C3135
C3136 or C4213
short circuit
SL 5 Replace
N2000
SL 4 Escalate
No
Yes
TROUBLESHOOTING
SL 5 Replace
Faulty Component
SL 4 Escalate
Is the
current consumption
still more than
1mA
No
Replace
N1200
Step 1:
Disconnect
VBATT and DCIO/SEPI
Step 2:
Connect: Display and Keypad
to the PBA
Step 3:
Connect Only: VBATT
Step 4:
Activate EMMA SW
Press the ”C” key a nd
connect USB Cable from P C
Flash the Phone with ITP SW
Yes
Yes
Try to trace faulty
component by using
MP 20 (ST2207 VDDE18)
freezing spray
SL 5 Replace
N2000
SL 4 Escalate
No
1.8V DC at
and 2.8V DC at
MP 43 (C2230
VccA)
Yes
No
26 MHz
SYSCLK1 at
MP 97 (SP2102)
No
SL 5 Replace
D2000
SL 4 Escalate
Yes
32 kHz
RTCCLK at
MP 39 (R2122)
Yes
26 MHz
MCLK at
MP 6 (R2120)
Yes
No
Yes
SL 5 Replace
SL 4 Escalate
Check the following voltages:
2.6V MP 24 (ST2205 VAUDIO26)
2.5V MP 19 (ST2206 VANA25)
2.7V MP 25 (T2208 VBT27)
2.7V MP 26 (ST2209 VDIG)
1.2V MP 45 (ST2213 VCORE12)
1.8V MP 7 (ST2214 VCORE18)
All voltages
N2000
Ok
No
VANA25
Voltage
Ok
Yes
VBT27
Voltage
Ok
Yes
VDIG
Voltage
Ok
No
N2202 or D2000
getting hot
No
Replace
N1400
Yes
No
N1400
getting hot
No
Replace
N1400
Yes
NoNo
N1400
getting hot
Is any of
C2216 or
C2326 to C2332
short circuit
SL 5 Replace
N2000
SL 4 Escalate
No
Is any of
C2205 or C1409
short circuit
SL 5 Replace
N2000
SL 4 Escalate
No
Is any of
C2215, C8122 or C1407
short circuit
Yes
Yes
Yes
SL 5 Replace
Faulty Component
SL 4 Escalate
SL 5 Replace
Faulty Component
SL 4 Escalate
SL 5 Replace
Faulty Component
SL 4 Escalate
ITP SW Flash
Successful
No
Yes
SL 5 Replace
D2020
SL4 Escalate
Go to
Flash Problems
SL 5 Replace
N2000
SL 4 Escalate
Go to
Dead Phone
Problems part 2
No
Current
Consumption more
than 50mA
Yes
Yes
Go to
Dead Phone
Problems part 3
1221-7857 rev. 1
9 (115)
Page 10
TROUBLESHOOTING Dead Phone Problem
s - Display Problems
SEMC Troubleshooting Manual
C702
START
Dead Phone Problems part 3
NOTE !
Before following this guide
the Dead Phone Problems
part 2 must be finished.
VCORE12
Voltage
Ok
Yes
VCORE18
Voltage
Ok
No
No
Dead Phone Problems part 3
1.2 Volt DC at
MP 40 (V2206)
Yes
Is
MP 45 (ST2213)
short circuit to
Shield Can
Fence
No
SL 5 Replace
L2200
SL 4 Escalate
SL 5 Replace
D2000
SL 4 Escalate
Yes
D2000
getting hot
No
Yes
C2220, C2219, C2222, C2221
C2243, C2244, C2301 to C2308
C2417, C2418, C2322, C2324
3.8 Volt DC at
MP 44 (L2201)
D2000
getting hot
No
Check if following
components are
short circuit:
C2412, C2311, C2419
C2313 to C2319
Are
all Components
Ok
Yes
No
Yes
Yes
SL 5 Replace
C2226 and L2201
SL 4 Escalate
SL 5 Replace
V2206 or N2000
SL 4 Escalate
SL 5 Replace
D2000
SL 4 Escalate
SL 5 Replace
N2000
SL 4 Escalate
Go to
Display illumination
Problems
1.8 Volt DC at
MP Z4202_Pins
5,6,7,8
Yes
No
Display Backlights
Ok
Yes
Turn off the phone
Disconnect: Display and Keypad
Restart the phone
Use Fault trace SW
MMI
Display pattern
Init Screen Testing
Activate: TV Test Pattern
Yes
1.8 Volt DC at
No
MP Z4202_Pins
1,2,3,4
No
Display Problems
Fault trace SW
MMI
Display pattern
Init Screen Testing
Activate:
RGB Color Pattern
Yes
SL 5 Replace
D2000
SL 4 Escalate
2.6 Volt DC
at MP 4 (ST4201) and
1.8 Volt DC at
MP 3 (ST4202)
Yes
1.8 Volt DC
at MP 2 (ST4205) and
0 Volt DC at
MP 1 (C4228)
0 Ohm
Between
MP Z4202_Pins
5,6,7,8 and Shield
Can Fence
No
START
Step 1:
Connect: Display, Keypad and VBATT
If the Display is working properly on the
Use TRS Fixture
Start the Phone!
TRS Fixture then replace Display
If not then continue with step 2.
Step 2:
Load ITP SW into the phone
Connect: DCIO/SEPI
Continue with
Display Problems TRS guide
SL 5 Replace
No
N2000
SL 4 Escalate
SL 5 Replace
No
D2000
SL 4 Escalate
SL 5 Replace
Yes
Z4202
SL 4 Escalate
TROUBLESHOOTING
Yes
Step 1:
Disconnect
VBATT and DCIO/SEPI
Step 2:
Connect: Display and Keypad
to the PBA
Step 3:
Connect Only: VBATT
Step 4:
Activate EMMA SW
Press the ”C” key and
connect USB Cable from PC
Flash the Phone with ITP SW
No
Is
any of
C2239 or
C2342 to C2347
short circuit
Yes
SL 5 Replace
Faulty Component
SL 4 Escalate
ITP SW Flash
Successful
No
No
Yes
3.8 Volt DC
at MP 8 (N2202_Pin 1)
and MP 9 (ST2216)
SL 5 Replace
D2020
SL 4 Escalate
Go to
Flash Problems
No
Yes
No
SL 5 Replace
Faulty Component
SL 4 Escalate
SL 5 Replace
C2238 and N2202
SL 4 Escalate
SL 5 Replace
N2202
SL 4 Escalate
More than
1.8V Pk-Pk Pulses
at MP Z4200_Pins 5,6,7,8
short after TV Test was
activated
Yes
More than
1.8V Pk-Pk Pulses
at MP Z4201_Pins 5,6,7,8
short after TV Test was
activated
Yes
Replace
X4202
at MP Z4200_Pins 1,2,3,4
No
No
short after TV Test was
at MP Z4201_Pins 1,2,3,4
short after TV Test was
More than
1.8V Pk-Pk Pulses
activated
No
More than
1.8V Pk-Pk Pulses
activated
No
Yes
SL 5 Replace
D2000
SL 4 Escalate
Yes
SL 5 Replace
D2000
SL 4 Escalate
0 Ohm
Between
MP Z4200_Pins
5,6,7,8 and Shield
Can Fence
No
0 Ohm
Between
MP Z4201_Pins
5,6,7,8 and Shield
Can Fence
No
Yes
Yes
1221-7857 rev. 1
SL 5 Replace
Z4200
SL 4 Escalate
SL 5 Replace
Z4201
SL 4 Escalate
10 (115)
Page 11
TROUBLESHOOTING
Display Illumination Problems - Key Problems part 1
SEMC Troubleshooting Manual
C702
Fault trace SW
MMI
Misc
Activate:
Display Backlight
Display Backlights
Ok
No
Disconnect Display from the PBA
Use Fault trace SW and go to:
MMI
Misc
Deactivate:
Display Backlight
3.7 V - 3.8 V DC
at MP 58 (TP4200)
Yes
Yes
Display Illumination problems
Flash the phone with
EMMA SUCR SW
Fault trace SW
MMI
Misc
Activate:
Display Backlight
4.5 Volt
Pk-Pk Pulses
(
± 0.5V) at MP
V4200_Pin 3
No
15 Volt DC
at MP 58 (TP4200)
START
Step 1:
Use TRS Fixture
Connect Display and Keypad.
If the Display is working properly at the
TRS Fixture then replace theDisplay
If not then continue with step 2.
Load ITP SW into the phone
Display Illumination Problems TRS guide
Yes
Step 2:
Use TRS Fixture
Connect: Display
VBATT and DCIO/SEPI
Continue with the
SL 5 Replace
V4200 or L4200
SL 4 Escalate
No
SL 5 Replace
N2000
SL 4 Escalate
SL 5 Replace
V2402
SL 4 Escalate
Yes
Problem with
Phone
Off Key
Key Problems part 1
START
Step 1:
Connect: Display, Keypad and VBATT
Perform Keyboard Test in Service Tests Menu
If All Keys are working properly on the
No
Use TRS Fixture
Step 2:
TRS Fixture then replace Keypad
If not then continue with the
Key Problems TRS guide part 1
Problem with
Phone
On Key
Yes
Press the
On/Off Key
S2504
Yes
3.6V-3.7V DC
at MP 49
(V2402_Cathode)
No
Remove
S2504
Replace
S2504
No
TROUBLESHOOTING
0 Volt DC at
MP 49
(V2402_Cathode)
Yes
SL 5 Replace
V2505 or N2000
SL 4 Escalate
No
3.6V-3.7V DC
At MP 49
(V2402_Cathode)
Yes
No
3.7 V - 3.8 V DC
at MP 37 (V4201
Anode)
No
Yes
SL 5 Replace
V4201
SL 4 Escalate
SL 5 Replace
L4201 and L4203
SL 4 Escalate
Yes
0Volt DC at
MP 57 (TP4201) when
Display Backlight
Is On
No
Yes
Replace
X4202
SL 5 Replace
V4206 or N2000
SL 4 Escalate
No
Problem with
Volume Down
Key
No
Yes
1.8 Volt DC at
MP 73 (S2502_Pin C)
and MP 75
(S2502_Pin D)
No
Remove
S2502
1.8 Volt DC at
MP 73 (S2502_Pin C)
and MP 75
(S2502_Pin D)
Yes
No
Press the
Volume Down Key
S2502
SL 5 Replace
V2511 or D2000
SL 4 Escalate
Replace
S2504
SL 5 Replace
V2511 or D2000
SL 4 Escalate
Yes
0 Volt DC at
MP 73 (S2502_Pin C)
and MP 75
(S2502_Pin D)
No
Replace
S2502
Go to
Key Problems part 2
Yes
Replace
S2502
1221-7857 rev. 1
11 (115)
Page 12
TROUBLESHOOTING Key Proble m s part
2 - LED Problems
SEMC Troubleshooting Manual
C702
START
Key Problems part 2
Note!
Before following this guide the
Key Problems part 1 must be
finished
Problem with
Volume Up
Key
No
Yes
Key Problems part 2
1.8 Volt DC at
MP 69 (S2503_Pin C )
and MP 70
(S2503_Pin D)
No
Remove
S2503
1.8 Volt DC at
MP 69 (S2503_Pin C )
and MP 70
(S2503_Pin D)
Yes
No
Press the
Volume Up Key
S2503
SL 5 Replace
V2512 or D2000
SL 4 Escalate
SL 5 Replace
V2512 or D2000
SL 4 Escalate
Yes
0 Volt DC at
MP 69 (S2503_Pin C)
and MP 70
(S2503_Pin D)
No
Replace
S2503
START
Load ITP SW into the phon e
Use TRS Fixture
Connect: Keypad FPC, Display
VBATT and DCIO/SEPI
Use Fault Trace SW
MMI
Init Screen Testing
Activate LED
according to following se quence:
Display Backlight
Upper Keypad LED
Lower Keypad LED
Camera Keypad LED
NOTE !
If all Keypad LED and Display LED are
working properly on the TRS F i xture
then replace Keypad or Display.
If not then continue with the
LED Problems TRS guide.
Display
Backlight
Ok
Yes
No
LED Problems
TROUBLESHOOTING
Go to
Display illumination
Problems
Problem with
All other
Keys
No
Flash the Phone with
EMMA SUCR SW
Yes
Replace
X2402
Problem solved
Yes
No
Yes
Replace
S2503
Claim Component
X2402
SL 5 Replace
D2000
SL 4 Escalate
Problem with
Upper Keypad LED
No
Problem with
Lower Keypad LED
No
Problem with
Camera Keypad LED
Yes
Yes
Yes
0.3 Volt DC at
MP 60 (TP2004)
Yes
Replace
X2402
0.8V-0.9V DC at
MP 61 (TP2003)
Yes
Replace
X2402
3.5 Volt DC at
MP 59 (TP2005)
No
No
No
0.2 Volt DC at
MP 11 (V4205_Pin 1)
0.7V-0.8V DC at
MP 12 (V4205_Pin 4)
2.5 Volt DC at
MP 10 (V4206_Pin 1)
No
No
Yes
Yes
Yes
SL 5 Replace
V4205
SL 4 Escalate
SL 5 Replace
N2000
SL 4 Escalate
SL 5 Replace
V4205
SL 4 Escalate
SL 5 Replace
N2000
SL 4 Escalate
SL 5 Replace
V4206
SL 4 Escalate
No
Flash the Phone with
EMMA SUCR SW
Yes
Replace
X2402
No
SL 5 Replace
N2000
SL 4 Escalate
1221-7857 rev. 1
12 (115)
Page 13
TROUBLESHOOTING
M a in & VGA Camer a - Cam e ra D oo r Se n so r & Flash LE D Proble m s
SEMC Troubleshooting Manual
C702
VGA Camera
Ok
Replace
VGA Camera
Replace
X4301
Retest
Main and VGA
Camera
Yes
Is the
Application
Result GPIO:
GPIO_02 = HIGH and
GPIO_09 = LOW
No
SL 5 Replace
D2000
SL 4 Escalate
Yes
No
No
No
VGA Camera
No
problem with
Main Camera
Main Camera
Main Camera
Main Camera
Fault trace SW
1: MMI, Misc
Init Screen Testing
Activate:
VGA Camera Test
2: Logic, GPIO Manager
Application
GPIO-Read:
GPIO_02 and GPIO_09
Application
Result GPIO:
GPIO_02 = LOW and
GPIO_09 = HIGH
Main and VGA Camera Problems
Claim
Main and VGA
Cameras having
Replace
X4300
Is the
Yes
Replace
Ok
Yes
Claim
Yes
Is the
Yes
No
Load ITP SW into the phone
Use TRS Fixture
Display, VBAT and DCIO/SEPI
Main and VGA Camera
must be mounted on the PBA !
Use Fault Trace SW
Perform Main and VGA Camera Test
Fault trace SW:
MMI, Misc, Init Screen Testing
Main Camera Test and VGA Camera Test
Main and VGA
Camera working
Fault trace SW
1: MMI, Misc, Init Screen Testing,
2: Logic, GPIO Manager, Application, GPIO-Read:
Main Camera Test
GPIO_02, GPIO_03
GPIO_04, GPIO_05 and GPIO_09
Result GPIO:
GPIO_03, GPIO_04 and
GPIO_05 = HIGH
Are both
problems
Yes
Connect:
Perform:
properly
No
Activate
Is the
Application
Yes
START
Go to
Service Tests Menu and
perform:
Main and VGA Camera
Test
Flash the phone with
Yes
No
EMMA SUCR SW
SL 5 Replace
D2000
SL 4 Escalate
Replace
X4201
SL 5 Replace
L8100
SL 4 Escalate
Camera Door Sensor and Flash LED Problems
START
Flash the phone with the EMMA SUCR SW
If successful claim SW Flash, if not go to Step 2.
Replace Flash FPC and retest the phone
If successful claim Flash FPC, if not go to Step 3.
Load ITP SW into the phone
Camera Door Sensor and Flash LED Problems TRS guide
No
No
Step 1:
Step 2:
Step 3:
Use Fault Trace SW
Use TRS Fixture
Connect: Flash FPC,
VBATT and DCIO/SEPI
and continue with the
1.5 V - 1.8 V DC
at MP 78 (R4231)
Yes
3.7 V - 3.8 V DC
at MP 88 (V8100
Anode)
Yes
3.8 Volt DC
at MP 87 (ST8101)
Yes
Restart the Phone!
Fault trace SW
MMI
Misc
Init Screen Testing
Activate:
Camera Flash LED
No
TROUBLESHOOTING
SL 5 Replace
V8101
SL 4 Escalate
Yes
Is
V8101
Short Circuit
No
SL 5 Replace
V8100
SL 4 Escalate
SL 5 Replace
D2000
SL 4 Escalate
Replace
N2209
No
No
13 MHz at
MP 76 (ST4304) and
1.8 Volt at
MP 74 (ST4303)
Yes
2.8V DC at
MP 71 (TP2207
VCAMSA) and 1.8V DC
at MP 52 (TP2208
VCAMIO)
1.3 Volt DC
at MP 72 (TP2204
VCAM12)
Yes
2.8 Volt DC at
MP 77 (TP2210
VCAMAF)
No
NoYes
SL 5 Replace
N2212
SL 4 Escalate
Replace
N2206
SL 5 Replace
N8100
SL 4 Escalate
No
4.5 V – 5.0 V DC
at MP 87 (ST8101)
Claim Component
X4201
SL 5 Replace
D2000
SL 4 Escalate
Yes
Yes
No
Replace
X4201
Is
Problem Solved
1221-7857 rev. 1
13 (115)
Page 14
Vibrator Problems
START
Load ITP SW into the phone
Connect: VBATT and DCIO/SEPI
Use Fault Trace SW and go to:
MMI-Misc-Init Screen Testing
If the Vibrator is working properly on the TRS Fixture
then replace vibrator if not then continue with
Vibrator Problems TRS guide
Step 1:
Step 2:
Use TRS Fixture
Activate:
Vibrator Test
NOTE !
TROUBLESHOOTING Vibrator Problems
SEMC Troubleshooting Manual
C702
TROUBLESHOOTING
Clean Pad B4200 A
Clean Pad B4200 B
Scrap
PBA
SL 5 Replace
L4204
SL 4 Escalate
Yes
Yes
Connection
between
PBA GND and
MP 79 (B4200_Pad B)
Ok
No
Is
L4204
Max 1.5 Ohm
No
Yes
2.8 Volt
Pk-Pk Pulses at
MP 82 (C4206
VIBR_OUT)
No
Is
MP 82 (C4206)
short circuit to
Ground
Yes
No
SL 5 Replace
N2000
SL 4 Escalate
SL 5 Replace
C4206, C4207,L4202
SL 4 Escalate
1221-7857 rev. 1
14 (115)
Page 15
TROUBLESHOOTING Charging Problems
- USB/ V BUS Cha rg in g Proble ms
SEMC Troubleshooting Manual
C702
Use TRS Fixture
Connect: VBATT
and DCIO/SEPI
Use Fault Trace SW
Perform
Battery Calibration
3.2V and 4.1V DC
at MP 80 (TP2200) during
Battery Calibration
No
Replace
X2200
SL 5 Replace
R2200
SL 4 Escalate
No
Yes
Charging problems
Battery Calibration.
Passed
Yes
Current Calibration
Passed
No
Use TRS Fixture
Connect: VBATT
and DCIO/SEPI
Use Fault Trace SW
Yes
Is
MP 81 (TP2202)
Short circuit to
Shield Can
Fence
START
Perform System Connector Protection Test
If the test is pass go to step 2
Load ITP SW into the phone
Connect: VBATT and DCIO/SEPI
Logic, Phone Power and perform
Battery and Current Calibration
It is very important to follow
instrument setting instructions during
Battery and Current Calibration.
No
Step 1:
Step 2:
Connect: Dummy Battery
Use Fault Trace SW:
NOTE !
Yes
SL 5 Replace
N2000
SL 4 Escalate
Flash the phone with
EMMA SUCR SW
and go to
Charging Test
Replace
System Connector
X2300
No
USB/VBUS Charging Problems
START
Step 1:
Perform System Connector Protection Test
If the test is pass go to step 2
Step 2:
Use Phone with Normal SW
Use TRS Fixture
Connect: VBATT
Connect
DSU-60/ USB cable
from PC to the phone
5 Volt DC at
MP 102 (C2422)
Yes
No
Is any of
C2421 or C2422
short circuit
No
Yes
TROUBLESHOOTING
SL 5 Replace
C2421 or C2422
SL 4 Escalate
No
Is
Connection
between
Shield Can Fence and
Power Supply GND
Ok
Yes
SL 5 Replace
N2000
SL 4 Escalate
Yes
SL 5 Replace
R2201
SL 4 Escalate
Yes
5 Volt DC at
MP 117 (C2201
DCIO)
Start
Current Calibration
(C.C.)
Phone
Consuming
DCIO/SEPI Current
(During Current
Calibration)
R2201
0.3 Ohm
No
Yes
Phone
consuming more
No
MP 46 (C2241
NoNo
Yes
DCIO_INT)
Higher than
3,8 Volt DC
Yes
MP 121 (R2201
CHSENSEP) Higher
than 3,8 Volt DC
(During C.C.)
No
than 10mA Charger
Current
(DCIO/SEPI)
SL 4 Replace
V2421
SL 5 Replace
C2423 and C2424
SL 5 Replace
N2000
SL 4 Escalate
Yes
SL 5 Replace
N2000
SL 4 Escalate
Replace
N2402
Yes
MP 101 (R2287)
No
5 Volt DC at
Disconnect
VBATT and USB Cable
From the phone
Is
L2407
Max 0.5 Ohm
Yes
No
SL 5 Replace
L2407
SL 4 Escalate
Replace
System Connector
X2300
Replace
V2202
MP 119
(V2202_Pin 2
YesNo
CHREG) Lower than
MP 46 (C2241)
(During C.C.)
1221-7857 rev. 1
15 (115)
Page 16
TROUBLESHOOTING SIM Problem
s - Memor y St ick Proble m s
SEMC Troubleshooting Manual
C702
Flash the phone with
EMMA SUCR SW
Remove Test SIM
Use TRS Fixture
Connect: VBATT
and DCIO/SEPI
Use Fault Trace SW
Activate:
SIMVCC
SIMVCC On
Activate:
SIMRST
Yes
Sim Com Test
Passed
No
1.8 Volt DC at
MP114 (X2403_Pin 1 )
Yes
SL 5 Replace
C2406 or C2411
SL 4 Escalate
SIM Problems
No
Yes
Fault Trace SW
Logic
SIM Card control
Activate:
SIM Com Test
1.8 Volt DC at
MP 47 (C2406)
No
Are any of
C2406 or C2411
Short circuit
START
Load ITP SW into the phone
Yes
No
Step 1:
Step 2:
Insert Test SIM
Connect:
Dummy Battery (VBATT)
and DCIO/SEPI
Use Fault Trace SW
Replace
X2403
SL 5 Replace
N2000
SL 4 Escalate
Fault trace SW
Logic
SIM Card Control
Activate:
Memory Stick Test
Memory Stick Test
Passed
Yes
Flash the phone with
EMMA SUCR SW
Load ITP SW into the phone
Use TRS Fixture
VBATT and DCIO/SEPI
Insert Memory card
Use Fault Trace SW
No
MP 62 (R2406
MSDETECT)
SL 5 Replace
SL 4 Escalate
Memory Stick Problems
Connect :
0 Volt DC at
Yes
N2000
No
No
Is
X2490
damaged
Yes
Replace
X2490
START
TROUBLESHOOTING
1.8 Volt DC at
MP 111 (X2403_Pin 2)
Yes
SIMVCC On
SIMRST On
Activate:
SIMCLK
0.9V-1V DC at
MP 95 (X2403_Pin 3)
Yes
SIMVCC On
SIMRST On
SIMCLK On
Activate:
SIM DATA
Replace
X2403
No
NoYes
No
1.8 Volt DC
at MP 92 (V2404 )
No
SL 5 Replace
N2000
SL 4 Escalate
No
0.9V-1V DC at
MP 48 (ST2400)
1.8 Volt DC
at MP 91 (V2408)
Yes
MP 89 (X2403_Pin 5)
Connected to the
PBA GND
Yes
No
Yes
Replace
X2403
SL 5 Replace
V2407
SL 4 Escalate
No
0.9V-1V DC at
MP 93 (V2407)
Is
MP 91 (V2408)
Short circuit to
GND
10 Kohm
Between MP 96
(X2403_Pin1) (Red
Probe) and MP 90
(X2403_Pin 7)
(Black Probe)
No
Yes
Yes
No
Replace
X2403
SL 4 Replace
X2403
SL 5 Replace
V2408
SL 5 Replace
N2000
SL 4 Escalate
SL 5 Replace
R2419
SL 4 Escalate
Problem solved
Yes
Claim Component
N2000
No
SL 5 Replace
D2000 and X2490
SL 4 Escalate
Yes
SL 5 Replace
N2000
SL 4 Escalate
1221-7857 rev. 1
16 (115)
Page 17
TROUBLESHOOTING Audio Internal Problems -
Audio Exter n al Problem s
SEMC Troubleshooting Manual
C702
0 Volt DC at
MP 109
(V2420_Cathode)
Yes
0 Volt DC
at MP 23 (V2405_Pin
3) and Access: Result
GPIO_02=HIGH
Yes
2.6 Volt DC
at MP 22
(V2405_ Pin 5)
Yes
1.8 Volt DC
at MP 21 (R2435)
Yes
No
No
No
No
Audio Internal problems
Go to
Audio External
Problems
SL 4 Replace
V2420
SL 5 Replace
R2440
Replace
V2405
Replace
N2400
SL 5 Replace
D2000
SL 4 Escalate
MP 17 (X3100) and MP 16
and MP 15 (L3104 BEARN)
when blowing in the PBA
Yes
SL 5 Replace
V3101, V3102,
L3103 or L3104
SL 4 Escalate
No
More than
100m Volt AC Pk-Pk at
(X3101)
when blowing in the
PBA Mic
Yes
More than
100m Volt AC Pk-Pk
at MP 14 (L3103 BEARP)
Mic
No
More than
100mVolt AC Pk-Pk
at MP 28 (R3132) when
blowing in the
PBA Mic
START
If Mic problem go to step 2.
If Loudspeaker or Earphone problem
replace Speaker Box or Earphone and
retest the phone. If successful claim
Speaker Box or Earphone
System Connector Protection Test.
If the test is pass go to step 2
Load ITP SW into the phone.
Connect VBATT and DCIO/SEPI
Audio Internal Problems TRS guide
Yes
Step1
If not then go to step 2.
Step 2:
Perform
Step 3:
Use TRS Fixture.
and continue with the
Fault Trace SW
Audio and FM Radio
Audio Loop test
Audio Input: Mic1
Loop Mode: Analog
Audio Output:
Earphone
Apply Audio Loop
Blow into the
PBA Mic
SL 5 Replace
N2000
SL 4 Escalate
No
More than
100mV AC Pk-Pk
At MP 104 (C2415 SPR)
and MP 103 (C2416 SPL)
when blowing in to the
AUX mic
Disconnect
DCIO/SEPI cable
and Insert PHF set
Blow into the
AUX Mic
Can you
hear anything in
AUX earphone when
blowing into the
AUX Mic
Disconnect
Yes
VBATT and
DCIO/SEPI
Audio External problems
Fault trace SW
Audio and FM Radio
Audio Loop Test
Audio Input: AUX1
Loop Mode: Analog
Audio Output:
AUX Earphone
Apply Audio Loop
Yes
Audio Internal
Tested
L2403 and L2404
Max 2 Ohm
START
Step 1:
System Connector Protection
If the test is pass go to step 2
Connect: VBATT and DCIO/SEPI
continue with the Audio External
No
Yes
Is
No
Yes
Perform
Test
Step 2:
Load ITP SW into
the phone.
Use TRS Fixture
Use Fault Trace SW and
Problems TRS guide.
Go to
Audio Internal
problems
Flash the phone
with
EMMA SUCR SW
Replace
L2403 or L2404
Replace
System Connector
X2300
TROUBLESHOOTING
Fault Trace SW
Logic
GPIO Manager
Access:
Set GPIO_03 to High
Application:
Set GPIO_01 to High
Access
GPIO_02 Read
SL 4 Replace
V3105 or V3106
SL 5 Replace
C3137 or C3123
Yes
Are any of
V3105, V3106
C3137 or C3123
short circuit
No
1.9 Volt DC
at MP 56 (L3108) and
MP 55 (L3109)
Yes
Fault Trace SW
Audio and FM Radio
Audio Loop test
Audio Input: Mic1
Loop Mode: Analog
Audio Output: Loudspeak er
Apply Audio Loop
Whistle as close as possible
in the PBA Mic
More than
100mVolt AC Pk-Pk at
MP 54 (X3102) and MP 53
(X3103) when whistle in
the PBA Mic
No
NoYes
Yes
1.9 Volt DC
at MP 54 (X3102) and
MP 53 (X3103)
No
SL 5 Replace
L3108 and L3109
SL 4 Escalate
No
2.2 Volt DC
at
MP 27 (R3131)
No
Are any of
V3103 and V3104
Short circuit
More than
100mVolt AC Pk-Pk
at MP 35 (C3137) and MP
36 (C3123) when whistle
in the PBA
Mic
Yes
1.8 Volt DC
at MP 18 (R3137
AMPCTRL)
No
Yes
Yes
No
No
Yes
Replace
B3100
SL 5 Replace
V3103 or V3104
SL 4 Escalate
SL 5 Replace
N2000
SL 4 Escalate
Replace
N3100
SL 5 Replace
D2000
SL 4 Escalate
No
More than
100mV AC Pk-Pk
at MP 33 (C3124 MICP_int)
and MP 30 (C3125 MICN_int)
when blowing in to the
AUX mic
No
Is
MP 107
(X2300_Pin 10)
Connected to
MP 105 (L2401)
Yes
Is
MP 108
(X2300_Pin 9)
Connected to
MP 106 (L2402)
Yes
More than
100mV AC Pk-Pk
Yes
at MP 32 (C3113) and
MP 29 (C3120) when
blowing in to the
AUX mic
Yes
No
L2401
Ok
Yes
NoNo
L2402
Ok
Yes
2.2 Volt DC at
MP 99 (C3169)
No
No
No
Yes
SL 4 Replace
C3113 and C3120
SL 5 Replace
N2000
Replace
N3101
Replace
L2401
Replace
System Connector
X2300
Replace
L2402
Replace
System Connector
X2300
Replace
N3101
SL 5 Replace
N2000
SL 4 Escalate
1221-7857 rev. 1
17 (115)
Page 18
TROUBLESHOOTING FM Radio Problem
s - Bluetooth Problems
SEMC Troubleshooting Manual
C702
Fault trace SW
1: Audio and FM Radio
FM Radio
Audio Output: Loudspeaker
Frequency: According to
Signal Generator Instrument Settings
2: Logic, GPIO Manager, Application
C3145 or C3146
L3301 and C3301
Set FM Radio
GPIO-Read:
Application
GPIO_Read:
GPIO_00 = HIGH
SL 5 Replace
SL 4 Escalate
Replace
SL 4 Replace
N1400
SL 5 Replace
SL 4 Replace
L2408
SL 5 Replace
L2410
GPIO_00
Is the
No
D2000
Yes
No
into the phone.
Use TRS Fixture
VBATT and DCIO/SEPI
Use Fault Trace SW
Yes
Is any of
C3145 or C3146
Short circuit
No
Is
L2408=Max 1.5 Ohm
L2410=Max 0.5 Ohm
Yes
Replace
System Connector
X2300
FM Radio Problems
Load ITP SW
Connect:
26 MHz BT_CLK
At MP 5 (R2101)
No
Replace
D2105
No
Yes
Yes
FM Radio
is not
working neither with
Loudspeaker nor
PHF set
No
PHF
working properly
during
Voice call
More than
40mVolt AC Pk-PK
1 KHz signal at
MP 34 (C3145) and
MP 31 (C3146)
Yes
Can you
hear 1KHz Tone
out from the
Loudspeaker
No
SL 5 Replace
N2000
SL 4 Escalate
No
Yes
Customized FM Radio Cable
Frequency:
Use free Freq. Channel
Example:
103 MHz in Sweden
Amplitude: 25.0 uVrms
FM Dev:+/-22.5 kHz
FM Rate: 1kHz
START
Perform System Connector
Protection Test
If test is pass
then continue with the
FM Radio Problems
TRS guide.
Replace
N3101
SL 5 Replace
N2000
SL 4 Escalate
Yes
Disconnect:
DCIO/SEPI Cable
Connect:
Black Lab Plug to
TRS Fixture GND Input and
PHF Connector to the
Phone System Connector
Signal Generator
Instrument Settings:
START
Step 1:
Flash the phone with EMMA
SUCR SW and retest the
phone.
If successful claim SW
Flashing
If not then go to Step 2.
Step 2:
Continue with the
Bluetooth Problems TRS
guide.
Load ITP SW
Into the phone
Use TRS Fixture
Connect:
VBATT and DCIO/SEPI
Use Fault Trace SW
Fault trace SW
TX and RX
Bluetooth
Channel 0
Set MaxPwr MOD 0
Use
Spectrum Analyzer
Instrument settings:
Frequency: 2402 MHz
Span: 1MHz
Amplitude: -5dBm
BW: Auto
Use RF Probe with
10:1 Divider
Use Peak Search
Bluetooth Problems
Replace
N1400
No
Is
MOD 1 Freq.
minimum 230 KHz
higher then
MOD 0 Freq.
Fault Trace SW
TX and RX
Bluetooth
Channel 0
Set MaxPwr MOD 1
Use Spectrum Analyzer
with the previous
instrument settings
Yes
Any Signal
at MP 54 (X1302
BT_ANT)
No
26 MHz Signal
At MP 5 (R2101
BT_CLK)
No
Yes
No
Replace
BT Antenna or
X1301 and X1302
Yes
All channel
passed
-13dBm at
MP X1302
BT_ANT
(±5dBm)
No
-13dBm at
MP 63 (Z1400_Pin 5)
and
MP 64 (Z1400_Pin 7)
(±5dBm)
Yes
-10dBm at
MP 65 (Z1400_Pin 1)
(Measure on the top of
Pin 1) (±5dBm)
More
than 60 Kohm
between MP 5 (R2101)
(Red Probe)
and Shield Can Fence
(Black Probe)
Yes
Change the
Bluetooth channels
In Fault Trace SW
and test the output.
Use
Spectrum Analyzer
Span 10MHz
BW: Auto
Use RF Probe with
10:1 Divider
Use Peak Search when
changing the channel.
NOTE! 1MHz channel spacing
Yes
No
Replace
N1400
SL 5 Replace
No
Z1400
SL 4 Escalate
Replace
BT Antenna or
X1301 and X1302
Yes
Replace
D2105
TROUBLESHOOTING
Replace
V2425
No
Signal Ok
Yes
Claim Component
System Connector
X2300
SL 5 Replace
N2000
SL 4 Escalate
No
Yes
2.7 Volt DC at
MP 25 (ST2208
VBT27)
No
1.8 Volt DC
At MP 20 (ST2207
YesNo
VDDE18) and 2.7 Volt DC
at MP 26 (ST2209
VDIG)
Yes
Replace
N1400
SL 5 Replace
N2000
SL 4 Escalate
Replace
N1400
1221-7857 rev. 1
18 (115)
Page 19
TROUBLESHOOTING GSM Network Problems
SEMC Troubleshooting Manual
C702
START
Max
0.5 Ohm between
MP 51 (X1200_Pin 1) and
MP 50 (X1200_Pin 2)
No
Replace
X1202 or X1203
Go to
GSM Network
Problems RX part
Yes
Phone
Reported power
at 850 and 900=33dBm
1800 and 1900=30dBm
(±3dBm)
No
GSM Network Problems TX part
Max
0.5 Ohm between
Yes
Replace
X1200
No
Fault Trace SW
TX and RX GSM
GSM Mode Settings:
TX Switched
GSM Radio Settings:
Select Band: Select Channel: Power Level:
GSM 850 1285
GSM 900385
DCS 1800 5120
PCS 1900 5120
MP 50 (X1200_Pin 2)
and MP 67 (X1201)
Yes
Max
0.5 Ohm between
Shield Can Fence and
MP 66 (X1202)
MP 68 (X1203)
No
Replace
X1201
Yes
Is L2409
Max 0.5 Ohm
Yes
1: Load ITP SW into the
Phone
2: Use TRS Fixture
Connect:
VBATT: 3.8 Volt, Limiter 3A,
DCIO/SEPI and
SMK RF Probe
3: Use Fault Trace SW
Connect Mobile Phone Tester
Instrument Settings:
System Mode:
TX/RX Tester Mode (GSM)
GSM BAND:
Insert Local SIM Card and use the phone with the Normal SW (SSW) and dummy
battery connected to Power Supply Channel 1 VBATT according to Picture 1.
Instrument settings: Voltage: 3.8 Volt, Limiter 3A.
Measure the current when Phone is off. Check the current consumption at Power
Supply Channel 1 VBATT.
Picture 1
Current consumption in off mode should be less than 1mA.
If more than 1mA go to Dead Phone problems part 1 TRS guide.
Step 2:
Start the phone:
Measure the deep sleep current max 6mA typical between 0-3mA.
Make sure that the operator is running with deep sleep. (This operation can be
switched off by operator if the network is busy).
If phone using more than 6mA, then go to EMMA and perform Software Update
Contents Refresh (SUCR).
Step 3 with Mobile Phone Tester Instrument
Insert Test SIM Card and use the phone with the Normal SW (SSW) and dummy
battery connected to Power Supply Channel 1 VBATT according to Picture 1.
Instrument settings: Voltage: 3.8 Volt, Limiter 3A.
Use Mobile Phone Tester Instrument in signalling mode directly connected to the
phone with RF Connector or use Shield Box if not possible. Phone Display must be
on during these tests to get correct current measurements.
TROUBLESHOOTING
120L0LN2402 if higher or
lower
X2300 if higher
L2407 if higher
C2421 if lower
C2422 if lower
Perform Radio TX measurements at GSM and WCDMA Band and compare with limits
according to text below.
-Transmitter current 850 MHz at Ch: 128 power level 5. Typical 375mA
-Transmitter current 900 MHz at Ch: 1 power level 5. Typical 450mA
-Transmitter current 1800 MHz at Ch: 512 power level 0. Typical 365mA
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TROUBLESHOOTING Current Consumption Test
SEMC Troubleshooting Manual
C702
- Transmitter current 1900 MHz at Ch: 512 power level 0. Typical 365mA
- Transmitter current WCDMA BAND I Low RX Ch: 10562 at 23dBm output
power. Max 700mA
If current consumption is not correct, the fault could be fixed by running SERP
calibration, if not then go to GSM and WCDMA Network problems TRS guides.
If the current consumptions are equal to test limits then go to Charging Test.
Step 4 with Fault Trace SW application:
-Flash the phone with ITP SW
-Use TRS Fixture
-Connect the:
Power Supply Channel 1 VBATT:
Instrument settings: Voltage: 3.8 Volt, Limiter 3A
Power Supply Channel 2 DCIO/SEPI
Instrument settings: Voltage: 5 Volt, Limiter 2A
-Connect DCIO/SEPI Cable to the phone
Perform the following tests:
-Max TX Power DCS 1800 MHz
Fault Trace SW settings:
TX and RX GSM
GSM Mode Settings:
TX Switched
GSM Radio Settings:
Select Band: DCS 1800
Channel: 512
Power Level: 0
-Max TX Power PCS 1900 MHz
Fault Trace SW settings:
TX and RX GSM
GSM Mode Settings:
TX Switched
GSM Radio Settings:
Select Band: PCS 1900
Channel: 512
Power Level: 0
TROUBLESHOOTING
-Max TX Power GSM 850 MHz
Fault Trace SW settings:
TX and RX GSM
GSM Mode Settings:
TX Switched
GSM Radio Settings:
Select Band: GSM 850
Channel: 128
Power Level: 5
-Max TX Power GSM 900 MHz
Fault Trace SW settings:
TX and RX GSM
GSM Mode Settings:
TX Switched
GSM Radio Settings:
Select Band: GSM 900
Channel: 1
Power Level: 5
-Max TX Power WCDMA BAND I
Fault Trace SW settings:
TX and RX WCDMA
Radio Settings:
Select Band: BAND I
Fast Select Channels: Ch LOW
Modes: Max Pwr 23dBm
Compare current consumption during Max TX Power Tests with the current
consumption limits below.
-Transmitter current 850 MHz at Ch: 128 power level 5. Typical 255mA
-Transmitter current 900 MHz at Ch: 1 power level 5. Typical 255mA
- Transmitter current 1800 MHz at Ch: 512 power level 0. Typical 225mA
- Transmitter current 1900 MHz at Ch: 512 power level 0. Typical 225mA
- Transmitter current in WCDMA BAND I Low RX Ch: 10562 mode at max
power level 23 dBm and Rx on.Typical 615mA
Tolerance: ±10%
If current consumption is not correct, the fault could be fixed by running SERP
calibration, if not then go to GSM and WCDMA Network problems TRS guides.
If the current consumptions are equal to the sheet then go to Charging Test.
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Page 23
TROUBLESHOOTING Battery and Cur re nt Calib rat io n Tes
t - Backup Capacitor Test
SEMC Troubleshooting Manual
C702
Battery and Current Calibration Test
Use Phone with the ITP SW
Instrument settings for the Battery Calibration Test
Power Supply Channel 1 VBATT:
X Volt according to the Fault Trace SW Test Instructions:
Fault Trace SW-Logic-Phone Power-Battery Calibration and follow test instructions.
Limiter: 2A.
Power Supply Channel 2 DCIO/SEPI:
5.0 Volt
Limiter: 2A
If test is performed at the Core Level then use dummy battery according to the Equipment List
for this test. If using TRS Fixture no dummy battery is needed.
Note: Maximal cable length between Power Supply Channel 1 VBATT and the dummy battery
or TRS Fixture must be 1m. The cable must have a capacity for at least 16A.
Limits Table for the Battery Calibration Test
Voltage Level on VBATT MinMax UNIT
3.2 Volt
3.2 Volt
4.1 Volt
4.1 Volt
Instrument settings for the Current Calibration Test
If test is performed at the Core Level then use dummy battery according to the Equipment List
for this test. If the TRS Fixture is used no dummy battery is needed.
Note: The Power Supply Channel 1 VBATT must allow reverse current.
Note: Maximal cable length between Power Supply Channel 1 VBATT and the dummy battery
or TRS Fixture must be 1m. The cable must have a capacity for at least 16A.
-Power Supply Channel 2 DCIO/SEPI: Instrument settings Voltage: 5V, Limiter: 2A
This test should be performed in 3 steps:
Step1:
Measure the voltage at the backup capacitor by using Fault Trace SW- Logic - ADC
Values – Read ADC Value (Reading 1).
Step2:
This step should be done 30 seconds after Step 1. Measure the voltage at the
Backup capacitor by using Fault Trace SW - Logic – ADC Values - ADC Channels
– Read ADC Value (Reading 2).
Step3:
Compare the difference between Reading 1 and Reading 2 with the reference table
below. If the Reading 1 value is between 50 and 680 go to Interval 1, if between 681
and 800 go to Interval 2, if between 801 and 880 go to Interval 3 and compare with
the Reading 2 – Reading 1 Min and Max Limits.
Reference Table:
MinMaxUnit
Absolute readout
Reading 1
50880Dec
TROUBLESHOOTING
Note: Length of the Power Supply Channel 2 DCIO/SEPI customized cable must be exact
1,3m.
Power Supply Channel 1 VBATT:
3.8 Volt
Limiter 2A
Power Supply Channel 2 DCIO/SEPI:
5.0 Volt
Limiter: 2A
Use dummy battery according to the Equipment List for this test.
Limits Table for the Current Calibration Test
Measured Current Name Min MaxUnit
100mA
800mA
DCIO Current 50150mA
DCIO Current 725875mA
Reading 1 (Dec) Reading 2 – Reading 1 (Dec)
Min Max
Interval 1 (50 – 680) 20210
Interval 2 (681 – 800)530
Interval 3 (801 – 880)010
Note: The upper table contains the absolute limits for the readouts. The lower table
contains the allowed delta between the first and the second readout, separated in
time with 30 seconds.
If the readings is out of limits replace C2217 Backup Capacitor.
If the problem is not solved then SL 5 Replace N2000 SL 4 Escalate.
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Page 24
TROUBLESHOOTING Charging Test
- ASIC Revision Test
SEMC Troubleshooting Manual
C702
Charging Test
To perform this test use:
-Phone with the Normal SW (SSW)
-Dummy Battery connected to Power Supply Channel 1 VBATT
Note! The resistance between GND and BDATA should be approximately 120 KOhm
-Power Supply Channel 1 VBATT instrument settings:
Voltage: 3.0 to 4.2 Volts, according to VBATT row in the Reference Table.
Limiter: 2A
-Disconnect the DCIO/SEPI Cable between each measurement and wait for phone to
shut down when changing VBATT voltage.
-Take a note of Current measurements at Power Supply Channel 2 DCIO/SEPI and
Display charging indicator status, X seconds after DCIO/SEPI cable has been
inserted according to Test Time row in the reference table below.
-Compare test results with reference table below, tolerance +/-20%.
Reference Table
VBATT x Volt 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2
Test Time x sec. 15s15s15s30s30s30s30s30s30s30s30s30s40s
-Fault Trace SW and go to: General – Asic Revisions – Read All
Power Supply Channel 1 VBATT must allow reverse current.
If the charging current is Not equal to the reference table go to Char ging problems TRS
Guide.
If the charging current is equal to the reference table then insert the normal battery and
test the charging current to verify that the phone battery is working properly.
Measure the voltage at the battery to check the current level.
If the battery is receiving the right current, then the phone and the battery are working
properly.
Reference return value table:
ASIC Description Part numberReturn value (hex)
D2000 CPU (Anja) 1200-0186 0xC9
N2000Power
Management
(Vera)
N14001200-6182
N1400FM Radio 1200-6182 0x800
N12001200-0158
Bluetooth
Firmware
Revision
Chip ID 0x0,0x0,0x0,0x0
GSM Radio
1000-8142 0xC7
Ox5,0x1
Will always return 0 on STLC because Chip ID is
not supported.
Charging off 10.00V3.6V3.2V3.8VCharger voltage 0.0 Volt
Charging off 25.0V4.7V4.7V3.8VCharger voltage 5.0 Volt
Charging 100mA5.0V4.8V3.8V3.8VCharger voltage 5.0 Volt
Charging 800mA4.5V4.3V2.3V4.2VCharger voltage 5.0 Volt
VBUS
USB cable connected to PC
MPMP 101 (R2287)Power sup 3.80 Volt
USB Cable disonnected from the
phone0.00V
USB Cable connected to the
phone5.0V
MCLK 26MHz from N1200
MPMP 6 (R2120)
Phone Off0Hz Power sup 3.80 Volt
Phone On26MHz Power sup 3.80 Volt
Charging 100mA: Use
Fault Trace SW:
Start Current Calibration----->
Set VBATT to 3.8
Note: The Current Calibration
Test must be repeted if current
consumtion going under 50mA
at Power Supply Channel 2
when you performing this
measurements.
DCIODCIO_INTCHREGCHSENSEP
VBUS
MCLK
Charging 800mA: Use
Fault Trace SW:Start
Current Calibration-->Set VBAT
to 3.8V-->Perform Step1 Note:
The Current Calibration Test
must be repeted if current
consumtion going under 725mA
at Power Supply Channel 2 when
you performing this
measurements.
TROUBLESHOOTING
VCORE18 from N2202
MPMP 7 (ST2214)
Phone Off0.00V Power sup 0.00 Volt
Phone On1.8V Power sup 3.80 Volt
WCDMA N1210
Use Fault Trace SW to activate and deactivate WCDMA Radio
MPMP 84 (L2207)MP 86 (ST2217)MP 85 (R2299) Power sup 3.80 Volt
WCDMA Radio Off0.00V0.00V0.00V
WCDMA Radio On3.1V-3.3V1.2V-1.8V1.8V
Bluetooth N1400
Use Fault Trace SW to activate and deactivate Bluetooth
MPMP 26 (ST2209)MP20 (ST2207)MP 25 (ST2208)MP5 (R2101)Power sup 3.80 Volt
Bluetooth Off2.7V1.8V2.7V26MHz
Bluetooth On2.7V1.8V2.7V26MHz
FM Radio N1400
Use Fault Trace SW to activate and deactivate FM Radio
MPMP 80 (TP2200)MP20 (ST2207)MP 5 (R2101)Power sup 3.80 Volt
FM Radio Off3.8V1.8V26MHz
FM Radio On3.8V1.8V26MHz
Main and VGA Camera
Use Fault Trace SW to activate and deactivate Main and VGA Camera. Main and VGA Camera must be connected to the PBA
MP
Main Camera Off0.00V0.00V0.00V0.00V0Hz0.00V
Main Camera On1.3V2.8V2.8V1.8V13MHz1.8V
3D games, FM radio, Java, Media, Video streaming, Video viewing
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FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
C702
Baseband Part
Analog Baseband Controller
Power Management
N2000 (Vera)
This component is not replaceable on SL 4 because Baseband calibration is required.
The analog baseband controller is a mixed digital and analog device
that supports the following circuitry:
• Power management circuitry
• Voltage regulation circuitry
• Eight Low Dropout (LDO) regulators and low power regulator
• 600 mA integrated Buck regulator
• Boost step-up DC/DC converter for White Light Emitting Diode (WLED) driving
• Battery charging and communication circuitry
• Battery fuel gauging circuitry
• Analog-to-Digital Converter (ADC)
• SIM interface
• Six programmable LED drivers
• Accurate band gap reference
• Vibrator driver
• Real Time Clock (RTC)
• Eight-byte One-Time Programmable (OTP) memory
• Pulse Code Modulation (PCM) voice coder/decoder
• PCM audio coder/decoder
• Microphone interface
• Stereo line input
• Earphone driver
• Earpiece driver
• 8-Ω speaker driver / Stereo line output
Functional Blocks of the Analog Baseband Controller:
The analog baseband controller is controlled by an I2C™ interface. It also comprises
the main power management circuits, equipped with a number of converters and
regulators for generating the required supply voltages.
FUNCTIONAL OVERVIEW
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FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
C702
Connection Diagram:
Charger Control
A programmable charger is used for battery charging.
Limits can be set for the output voltage at CHSENSE- and the output current from DCIO
through the sense resistor to CHSENSE-. The programmable charger is enabled or disabled by
the assertion/negation of the external signal DCIO. Parts of the programmable charger are
activated and deactivated depending on the level of VBAT. The rest of the programmable
charger is activated and deactivated through I2C.
The programmable charger supports the following functions:
• Constant current charging
• Constant voltage charging
• Trickle charging
• PWM controlled charging
• Over-voltage and over current detection
• Watchdog termination
• DCIO assertion/removal detection
• Voltage and current measure functions
• Low resistive path (reverse mode)
The programmable charger is able to control the voltage and limit the current to a load
seen at CHSENSE-. The programmable charger can also be run in PWM mode to turn
the charging on and off in accordance with the particular period and duty cycle. When the
charging is on, it is set to the current and voltage selected by I2C. A low resistive path from
VBAT to DCIO can be formed when DCIO is not detected. When this setting is done in the
appropriate registers, a lowering of CHREG to 0 V turns on the external pass device. The pass
device is automatically turned off when an external source is detected on DCIO, or when the
watchdog termination block times out. The watchdog termination block must be active when
the external switch is enabled, both in normal charging mode and in the low resistive path
mode. The watchdog is set through the serial interface, and if it has not been set again before
timeout, the watchdog turns off the external switch. The watchdog is disregarded during trickle
charging. When no battery is present, the system can be booted and supplied from DCIO by
applying the correct voltage on DCIO.
FUNCTIONAL OVERVIEW
USB Charger
The analog baseband controller contains a standalone USB charger. The USB charger
has a separate input and incorporates full functionality during low VBAT.
The programmable charger supports the following functions:
• Trickle charging
• Constant current charging
• Watchdog termination
• Trickle LED indication
• VBUS assertion/removal detection
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Page 88
FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
C702
Resistance Identification and Temperature Measurement
The resistance identification mode utilizes the constant current source to feed the battery
data output while monitoring the voltage at the battery data node with general purpose
ADC. The conversion is started through I2C.
Resistance Identification (A) and Temperature Measurement (B)
SIM Interface
The SIM interface supplies level shifting between the digital baseband controller and the
SIM/USIM card. Moreover, hard-wired SIM deactivation functionality manages removal of
a SIM card that has not been powered down.
CODEC Overview
The CODEC is encoding analog audio signals and analog voice signals into digital signals
using ADCs. This is done in the coder section of the CODEC, also named the TX path
(transfer section). The CODEC is also decoding digital audio signals and digital voice
signals into analog signals using DACs. This is done in the decoder section of the
CODEC, also named the RX path (receiver section).
CODEC Block Schematic:
Block Diagram of the SIM Interface:
FUNCTIONAL OVERVIEW
CODEC CCO Voltage Source
There is an internal voltage source CCO that provides the necessary drive current for
electret microphones. The voltage source is I²C programmable to 2.2 V or 2.4 V. The
source can be disabled during standby. A typical use case with a microphone connected
to MIC1 and the CCO is shown in picture below.
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Page 89
FUNCTIONAL OVERVIEW
Technical Description
Digital Baseband Controller (CPU)
D2000 (Anja)
This component is not replaceable on SL 4 because Baseband calibration is required.
The Digital Baseband Controller is divided in two subsystems:
-Application
-Access
Access Subsystem
All modem functionality in the digital baseband controller resides in the Access
subsystem. This includes EDGE/GPRS/GSM interface, WCDMA interface, USB, and other
peripheral modules. The control CPU is an ARM926 and a DSP is used for signal processing and
layer one control code. The main communication between the blocks in the Access subsystem is
done through the Advanced High-performance bus (AHB) matrix, which is a set of control buses
connecting the different parts together. A block called Syscon is responsible for distributing
clocks and resets to all parts of the Access subsystem. This block is under SW control. The
Access subsystem is connected to the Shared EMIF, an interface for communication with an
external SDRAM. The interface has 39 signals (including one chip select) and supports memory
sizes up to 512 Mbit. The Shared EMIF is shared between the Access subsystem and the
Application subsystem.
SEMC Troubleshooting Manual
C702
Earphone Amplifier
The earphone amplifiers (BEARP and BEARN) are mainly intended to be differentially
configured and drive a low impedance dynamic transducer (earpiece) but they can also
be single ended configured. The BEARP and BEARN amplifiers can be powered down by the I2C.
The amplifiers can exhibit high impedance to 1.4 V or low impedance to ground when powereddown. Fifty-one gains are available for BEARP and BEARN: from +15 dB down to –60 dB in
1.5 dB steps. When the BEARP and BEARN outputs are operating in differential mode, an I²C
selectable bit must invert one of the inputs.
Application Subsystem
The Application subsystem contains functionality related to functions such as MMI,
graphics, audio and memory media. The control CPU is an ARM926 with three external
memory interfaces, one shared with the Access subsystem and two dedicated for the
Application subsystem. The Application subsystem contains several blocks. The main
communication between the blocks is done through the Advanced High performance bus (AHB)
matrix, which is a set of control buses connecting the different parts. A block called Syscon is
responsible for distributing clocks and resets to all parts of the Application subsystem. This
block is under SW control. The Application subsystem is connected to the Shared EMIF that is
used for code execution or data storage. In addition, a dedicated EMIF and a Flash IF are also
available. The Application EMIF is a general interface for communication with, for example
external SDRAM, PSRAM, NOR flash, NAND flash and companion chips. The Application EMIF
has a total of 56 signals (including a maximum of 7 chip selects if GPIO is used) and can
be set in several different modes to support different types of memory combinations.
FUNCTIONAL OVERVIEW
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FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
C702
Functional blocks of the Digital Baseband Controller:
RF System Control
The access subsystem of the digital baseband controller controls the overall radio system. In
both EDGE/GSM/GPRS and WCDMA air interface mode, the digital baseband controller controls
the radio system through a 3-wire serial bus.
The digital baseband controller D2000 (Anja) also manages PA band control and the antenna
switch mechanism in the front end module. The 26 MHz VCXO clock residing in the
GSM/GPRS/EDGE transceiver is turned on only when required. The digital baseband controller
D2000 (Anja) initiates turning on of the clock. The GSM/GPRS/EDGE RF system requires control,
which is temperature dependent. The temperature within the RF system is estimated by a
voltage measurement performed by the analog baseband controller N2000 (Vera).
The control flow for the RF system:
Keypad
The keypad interface block supports up to 30 keys with 65 columns and 6 rows and operates in
both scan and idle mode. The keypad scan is performed by software. Any transition in the state
of the column inputs is written directly to the register. The keypad interface differentiates
between single key presses, simultaneous presses of any keys with a function key, and any key
releases. The period between successive scans is programmable over the range 5 ms to 80 ms,
in 5 ms steps. During scan mode, the keypad generates an interrupt whenever a valid keypad
state change occurs (including a release of any pressed keys). The scan function is disabled
during system power-up. The keypad is able to detect at least four simultaneous key presses.
Not all combinations are supported.
Radio Part
Antenna
The mobile system antenna interface connects the Wideband Code Division Multiple
Access (WCDMA) and Global System for Mobile Communication (GSM) input/output to
the antenna of the Mobile Phone. It is a bi-directional RF interface containing signals in the
range 800 MHz to 2.2 GHz. The mobile system antenna interface is the interface between the
Mobile Phone Radio Frequency (RF) input/output and the mobile system antenna. The interface
handles the GSM 850, EGSM 900, GSM 1800, GSM 1900 and WCDMA Band I, RF inputs/outputs.
Mobile System Antenna Interface:
FUNCTIONAL OVERVIEW
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FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
C702
Radio Modules
GSM/GPRS/EDGE Radio Module
N1200 (Thor)
The Front End module block connects the proper block in the radio system to the antenna. The
Front End module has two inputs for GSM/GPRS/EDGE, one for low band and one for high band.
The GSM/GPRS/EDGE power amplifier output is filtered by the low pass filter in the Front End
module and then connected to the antenna through a switch and duplexer. In receive mode,
the GSM/GPRS/EDGE signal from the antenna passes through the duplexer and switch to one of
the four internal receive SAW filters. The SAW filter provides receive band selectivity and
converts the unbalanced receive signal to a differential signal required by the GSM/GPRS/EDGE
receiver. In GSM/GPRS/EDGE systems, transmit and receive operations are divided in time and
the switch connects the proper block in accordance with the mode of operation that is, transmit
or receive: one at a time in the GSM, DCS, and PCS bands. The module is shielded using fence
and lid technology.
End Module and X-tal.
Frequency Generation
The 26 MHz reference signal is used as the reference for the on-chip synthesizer. To
cover the required frequency range, the integrated Voltage Controlled Oscillator (VCO)
operates at twice the frequency for band 1800/1900, and at four times the desired
frequency for band 850/900.
The main components contained are transceiver ASIC, PA module, Front
Block diagram of the GSM/EDGE Transceiver:
GSM/GPRS/EDGE Transceiver
The GSM/GPRS/EDGE transceiver use a digital interface that is shared between receive
and transmit data. The receive interface is based on I and Q data and the transmitter
interface is based on envelope and frequency data. The quad band GSM/GPRS/EDGE
transceiver has the following general features:
The GSM/EDGE transceiver has the following features:
• Individual low-noise amplifiers for the 850, 900, 1800 and 1900 MHz frequency bands
with a common quadrature mixer
• Fully integrated VCO with dividers to generate both receive and transmit frequencies
• I and Q baseband receive channel amplifiers with on-chip antialiasing filtering
• I and Q receiver sigma-delta A to D converters
• Digital interface for the receive I and Q channel
• Multi modulus prescaler for direct VCO modulation in transmit mode
• Integrated phase detector with programmable charge pump
• Transmit output buffer with controllable output power level
• Transmit baluns integrated
• Digital interface for the transmit frequency and amplitude modulation
• 3-wire serial bus interface for control, configuration, and test
• Deep power down function
• Programmable power level to power amplifier (PA)
Transmitter
The transmitter block consists of the following sub-blocks:
A separate block is used to convert the digital bit streams from the baseband into parallel
words to be used in the DAC and the Sigma Delta modulator. This block also includes
programmable delays for optimizing delays between the different modulation paths. The
combined DAC and LP-filter is used to convert the digital words of the digital block into analog
signals. The second FM-path is used to add the high frequency part of the FM to the VCO. It
also includes an auto-tuning block that compensates VCO gain variations. The AM-block
converts the differential voltage from the DAC to a single-ended output that drives the PA. The
output is scaled according to the desired output power, and an offset can be added for PA
linearization. The TX-buffer is used to drive the PA with the correct power level. A divide by 2 or
4 block is used to generate the correct output frequency from the 4 GHz VCO.
TX Frequency, Channel and Power Level Range:
FUNCTIONAL OVERVIEW
GSM 850:
Frequency Range: 824,2 MHZ – 848,8 MHZ
Channel Range: 128 – 251
Power Level: Min 19 – Max 5
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FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
C702
GSM 900:
Frequency Range: 890,2 MHZ – 914,8 MHZ
Channel Range: 1 - 124
Power Level: Min 19 – Max 5
EGSM 900:
Frequency Range: 880,2 MHZ – 889,8 MHZ
Channel Range: 975 - 1023
Power Level: Min 19 – Max 5
DCS 1800:
Frequency Range: 1710,2 MHZ – 1784,8 MHZ
Channel Range: 512 – 885
Power Level: Min 15 – Max 0
PCS 1900:
Frequency Range: 1850,2 MHZ – 1909,8 MHZ
Channel Range: 512 - 810
Power Level: Min 15 – Max 0
Receiver
The receiver is a homodyne receiver with direct conversion of the received radio channel
to baseband I and Q channels. The analog signals are converted to digital bit streams in a
sigma delta A/D converter. The receiver block consists of a front-end with separate LNAs for
each band and a common quadrature mixer. The front-end block is followed by a baseband
block with active antialiasing filters that also suppress blocking signals and interferers. After the
baseband block is a fully integrated Analog to Digital Converter of sigma delta structure with
high dynamic range. The digital output signals are sent over a serial interface to the digital
base-band circuit for further processing and detection.
In WCDMA the differential transmit outputs from the WCDMA transceiver are filtered by an
external SAW filter. The SAW filter cleans up the spectrum and also provides a single ended
drive signal to the power amplifier. For power control, a sample of the transmit output is taken
by a directional coupler and converted to a DC level by the power detection circuit. This signal
is used to control the transmitter output power. The transmit signal passes through an isolator
and then a duplexer. The duplexer output is selected by a switch in the N1200 (Thor) module
for connection to the antenna. In WCDMA receive mode the signal from the antenna is switched
by the duplexer inside N1200 module (Thor). The output from the duplexer is amplified by one
of the low noise amplifiers in the LNA/SAW module, then filtered by an integrated receive SAW
filter. The SAW filter converts the unbalanced receive signal to a differential signal required by
the WCDMA receiver.
MHz clock (WBCLK) and the antenna switch functionality. The module is shielded using fence
and lid technology.
The N1200 (Thor) module supplies the N1210 (Squid) module with a 26
Frequency Generation
The transmitter and receiver frequency synthesizers and the VCOs are fully integrated in
the WCDMA radio circuit. The signal from the crystal oscillator is used as a reference for
the synthesizers. The two synthesizers are controlled through the serial bus from the
access subsystem of the digital baseband controller.
WCDMA Transceiver
The WCDMA transceiver uses differential analog in-phase and quadrature-phase
Interfaces; that is, an IQ-interface, both in the receiver and transmitter information path.
The receiver part of the transceiver consists of an RF front end, a channel filter, and
Automatic Gain Control (AGC), and the transmitter part consists of an analog voltage
baseband I and Q interface, an up mixer and an RF VGA. Each part has an RF VCO and
an RF fractional-N synthesizer PLL. All functions are controlled by a 3-wire serial
programmable bus.
WCDMA BAND I is covered by Squid Module.
Band I (TX Frequency Range: 1920 – 1980 MHz, RX Frequency Range: 2110 – 2170 MHz)
1221-7857 rev. 1
92 (115)
Page 93
FUNCTIONAL OVERVIEW
Technical Description
SEMC Troubleshooting Manual
C702
WCDMA Transceiver Block Diagram:
Bluetooth and FM Radio
The STLC2592 circuit N1400 combines Bluetooth and FM tuner functionality into one.
Bluetooth
The Bluetooth implementation is compliant with Bluetooth specification 2.1 + EDR.
The Bluetooth
MHz. The same band is used for both transmission and reception. This gives 79 frequency
channels.
Receiver
The first stage of the receiver is an external antenna filter, which suppresses unwanted
frequencies. The receiver is of a “near-zero” IF receiver architecture. The local oscillator is
generated by a frequency synthesizer, which allows the receiver to be set at frequencies in
intervals of 1 MHz. The synthesizer is controlled from the logic part. The received signal is
sampled in the logic for later signal processing.
Transmitter
The synthesizer generates the TX frequency which modulated by the BT baseband block. It is
then amplified. The BT system is a class 1 device with maximum of +4 dBm output power
(minimum setting is about -50 dBm).
TM
transceiver has frequency channels with 1 MHz separation from 2402 to 2480
Transmitter
The TX IQ modulator has differential voltage I and Q inputs. It converts input signals to
RF output frequency and is designed to achieve LO and image suppression.
The transmit output stage provides at least +5 dBm at maximum power control at the
differential output. Gain is set through the 3-wire bus. Two 10-bit DAC are used to control the
DC/DC converter and the PA gain. Those DACs are controlled through the 3-wire-bus. One 11bit DAC is used to control the variable gain output of the transceiver chip. The transceiver chip
output feeds the constant gain power amplifier, which means that the transceiver chip sets the
phone’s output power.
Receiver
The receiver converts the antenna RF signal down to a Zero Intermediate Frequency
(ZIF). The first stage after the duplexer is a single-ended LNA with a 23 dB gain step.
This LNA is followed by a SAW filter. The LNA and SAW filter are integrated in the
LNA/SAW module. The output from the LNA/SAW module goes to the input of the N300 circuit
(Inside the Mammoth module) and is buffered by an amplifier and then sent to the IQ downmixer, which consists of two mixers in parallel driven by quadrature phase LO signals. The In
phase (I) and Quadrature phase (Q) ZIF signals are then low pass filtered to provide protection
from high frequency offset interferer and fed into the channel filter. The front-end zero IF I and
Q outputs are applied to the integrated low-pass channel filter. The filter is self-calibrated with
a cut-off frequency around 2.15 MHz.
FM Radio
FM Receiver
The receiver uses a digital low-IF architecture. The receive (RX) section integrates a low noise
amplifier (LNA) supporting the worldwide FM broadcast band (76 to 108 MHz). An automatic
gain control (AGC) circuit controls the gain of the LNA to optimize sensitivity and rejection of
strong interferers. An image-reject mixer down converts the RF signal to low-IF.
The quadrature mixer output is amplified, filtered and digitized with high resolution analog-todigital converters (ADCs). This advanced architecture allows the use of digital signal processing
(DSP) to perform channel selection, FM demodulation and stereo audio processing.
Tuning
The receiver uses frequency synthesizer technology including a completely integrated VCO. The
frequency synthesizer generates the quadrature local oscillator signal used to downconvert the
RF input to a low intermediate frequency. The VCO frequency is locked to the reference clock
and adjusted with an automatic frequency control (AFC) servo loop during reception. The tuning
frequency is defined as:
Freq (MHz) = Spacing (kHz) × Channel + Bottom of Band (MHz)
External Connectors
External units are connected to the transceiver by means of a 12-pin connector on the bottom
of the phone.
FUNCTIONAL OVERVIEW
1221-7857 rev. 1
93 (115)
Page 94
FUNCTIONAL OVERVIEW
FUNCTIONAL OVERVIEW
Technical DescriptionFUNCTIONAL OVERVIEW
SEMC Troubleshooting Manual
C702
System connector (X2300) pin out:
Clocks
Clock Distribution
The clocking for the access and application subsystems is separated. This means that they can
wake up or go to sleep mode independently. The access subsystem is clocked by the 26 MHz
Voltage Controlled Crystal Oscillator B1100 (VCXO) located in the Thor Radio Module (N1200).
When the access subsystem has a job to do, the Master Clock (MCLK) signal is requested from
the RF part. Most other clocks needed within the access subsystem are generated from the
MCLK. Some minor parts like sleep timer and cable detect use the 32 kHz real-time clock. The
32 kHz real-time clock clocks the application subsystem, and all other internal clocks needed
within the application subsystem are generated from this clock. However, when audio is
transferred between the application and the access subsystems, the MCLK is used.
Master Clock
(26 MHz)
as a logical square wave. SYSCLK is derived from the reference modulation clock MCLK from
the access system and is distributed from the D2000 (Anja) to the A-GPS module (N1430).
This 26 MHz clock is synchronized with the cellular network to an accuracy of ±0.1 ppm.
SYSCLK does not however provide an absolute reference to 26 MHz. Owing to the effects of
Doppler under normal (extreme) operational conditions, the absolute accuracy of the cellular
reference cannot be guaranteed better than ±0.5 ppm. Automatic frequency updates can also
cause large frequency corrections, with associated phase discontinuities. In order to isolate the
A-GPS module for the unstable effects of SYSCLK, an external reference clock is required. This
external reference frequency provided by a TCXO (B1430) is required to provide a clock with
very high short term stability. The frequency of the TCXO (B1430) is calibrated against the
cellular reference clock by the A-GPS module enabling the use of a more economical less
accurate TCXO (B1430).
Interface and Control
The Interface and control consists of system timing and control. The control interface includes a
communication link where both data and control information are transferred between the
platform and the A-GPS module. Data and command information is transferred using a fullduplex Universal Asynchronous Receiver Transmitter (UART) interface.
Other control signals include the following:
• A GPIO reset used as a reset signal (nRESET) to the GPS module.
• A Transmission On signal (TXON/ RX_HOLD), is used to indicate to the A-GPS module when
the phone is transmitting. The A-GPS modules receiver is disabled whilst the phone is
transmitting.
• A hardware timing pulse (SYNC) providing the A-GPS module with a highly accurate timing
reference. The A-GPS is able to accurately synchronize its GPS time to this reference pulse.
• A GPIO used as an enable (POWERON) signal to the GPS module.
• A GPIO used for power control for the GPS module.
The 26.00 MHz VCXO-based MCLK is distributed as a square wave signal from the N1001 inside
the Thor Radio Module (GSM/GPRS/EDGE). In order to have full control over the load on the
MCLK, only the access side of the digital baseband controller is allowed to request the MCLK.
However, by indirect means also the application side CPU can issue the request. A VCXO-based
square wave (WBCLK) is also distributed to the Squid Radio Module (WCDMA), but is turned on
only upon a command from the digital baseband controller.
Real-time Clock
(32. 768 KHz)
A 32.768 kHz crystal oscillator (B2101) provides a low frequency clock whenever the phone
has power. This clock is used to keep the Real-Time Clock (RTC) block functioning, so that
the phone can keep track of the time and date. The low frequency clock is generated in the
analog baseband controller N2000 (Vera) and distributed to the digital baseband controller
D2000 (Anja), and if necessary to external devices like Bluetooth, FM radio and A-GPS.
A-GPS
The Assisted GPS functionality in the phone is realized with the Global Locate Hammerhead GPS
module. The Global Locate Hammerhead belongs to the Type 2 GPS solutions.
Clock Reference Frequency
A-GPS Block Diagram:
FUNCTIONAL OVERVIEWFUNCTIONAL OVERVIEW
FUNCTIONAL OVERVIEW
FUNCTIONAL OVERVIEW
The A-GPS module is using two reference frequencies, a 32.768 kHz clock (RTCCLK) from the
N2000 (Vera), and a 26 MHz reference clock (SYSCLK) from the D2000 (Anja). The RTCCLK is
used for the real time clock function. The RTCCLK is distributed to the A-GPS module (N1430)
1221-7857 rev. 1
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Page 95
FUNCTIONAL OVERVIEW Block Diagram
FUNCTIONAL OVERVIEW
SEMC Troubleshooting Manual
ABCDEFGHIJ
C702
D2020
1Gbit NAND
512 Mbit SDRAM
1234567
WP
CE
RE
WE
CLE
ALE
VCORE18
VDD
VSS
D(0-7)
R/B
D2000 ANJA DIGITAL BASEBAND CONTROLLER
MMC
MS Pro
VCAM_SA_EN (GPIO 04)
CAM_CORE_EN (GPIO 05)
CAM_CORE_EN
VCAM_SA_EN
CAM_IO_EN
VCCIO_1
VCCIO_2
Static Memory
CPU
PDI
DAT
KEYOUT
KEYIN
I2C2
FLASH_EN (GPIO 06)
LMU_RSTn (GPIO 07)
LMU_RSTn
FLASH_EN
D+
D-
VCC
Controller
CAMRESn (GPIO 08)
CIF_STANDBY (GPIO 09)
CIF_STANDBY
CAMRESn
VDDE18
VBATi
OV_FLAG (GPIO 11)
MSDETECT (GPIO 12)
ACTIVE_LENS (GPIO 10)
OV_FLAG
ACTIVE_LENS
DCON (GPIO 15)
AMPCTRL (GPIO 13)
AMPCTRL
MSDETECT
DCON
APP UART TX
FM_ANTENNA
VDDE18
VAGPS28
VAGPS20
N1400
BLUETOOTH
BT_RSTn
REFERENCE CLK
BT_RTCCLK
DATA
POWER SUPPLY
BLUETOOTH
BT/FM COMBO
FM RDS Si4700/01
FM RADIO
FM_RADIO_IO
REFERENCE CLOCK
POWER SUPPLY
FM RADIO
N1430 AGPS
POWER SUPPLY
RF REFERENCE CLK
BT_CLKREQ
BTRESn
BT_CLK
PCM
Base
Band
FM
Detector
Base
Band
LP_CLKRTCCLK
RTCCLK
VBT27
VDIG
VDDE18
I2C2
FM_INT
FM_AGPSRESn
RTCCLK
FMR/FML
VBATi
VDDE18
TX_ADSTR
FM_AGPSRESn
TCXO
BT_CLK
CAMSYSCLK
BT_CLKREQ
CPU
WCDMA
Sub system
GSM/GPRS/EDGE
Sub system
SIM Interface
MCLKREQ
MCLK
SYSCLK0
SYSCLK1
SYSCLK2
SYSCLK0REQn
GPIO 00-23 ACCESS
USB
USB_VBUS
TRANSCEIVER IF
SDRAM Controller
UART 0
DTMS - DFMS
AGPS/UART 3
DSP
Sub system
I2C1
I2C1
I2S / PCM0
I2S/PCM (BT)
BD
VP
VM
OE
SUSP
RCV
ENUM
SDRAM Controller
XGAM
KEYPAD
GPIO 00-15 APPLICATION
I2S / PCM1
FM_INT (GPIO00)
CAMIRQ (GPIO 02)
APP_LOG (GPIO 01)
CAM_IO_EN (GPIO 03)
CAMIRQ
APP_LOG
FM_INT
USB Transceiver
LDO
Level
th
shift
VTRM
VBUS
D2404
VAUDIO26
VDDE18
DISPLAY
VIO (1.8V)
VBOOST
VDD (2.65V)
Driver
N2000 VERA, Analog Baseband Controller,
Audio Part
PCM/
I2S
Interface 1
PCM/I2S
Inter-face
0
CTMS
CFMS/
ID_source
C
A
D
AID
RX
RX
Vol
RX
Vol
PGA
RX
Vol
PGA
Vol
PGA
PGA
TX
TX
TX
PGA
TX
PGA
PGA
PGA
Rx
Tx
I
R
ADC
ADC
ADC
AID/ACB/
VPP Flash
_
o
u
D
ADC
t
CCO
VCAMIO
I2CDAT
I2CCLK
VDDE18
CAMSYSCLK
VGA CAMERA
CLK
Interface
STDBY
RESETn
I2CDAT
VCAM_SA_EN
S4300 <NM>
I2CDAT
Power
Management
Power
Management
Interface
Sensor
Array
Image
processing
I2CCLK
CAMIRQ
i2CDAT
I2
VCAM12
VCAMAF
VCAMSA
VCAMIO
C
C
L
K
CAMSYSCLK
MAIN CAMERA
Interface
Power Management
3.2M Pix
Camera
Sensor
STROBE
VDDE18
CAMRESn
CAM_STORB
LED_LCD
CIF_STDBY
QCIFRESn
VCAMSA
KEYPAD
KEYBI[0-4]
KEYBO(0-5)
+
-
VMC18
M2
VBOOST
Memory Stick
MSDETECT
MSDETECT
VBATi
AMPCTRL
N3101
MicP
PGADAC
PGADAC
PGADAC
PGADAC
FM AUDIO
Title/Description
Prepared By
Content responsible if other than preparer
Approved by
MicN
SpL
SpR
Tjate3
FM_ANTENNA
DCIO
Security classDocument type
C702 BLOCK DIAGRAM
Document number
DateRevision
Remarks
C
1
2
3
4
5
6
7
8
9
*
0
#
N3100
AUDIO PA
VDD
SHDN
SYSTEM CONNECTOR
KB_LED
KB_LED1
KB_LED2
X2300
SPREF
Mic+/AUXinL
Mic-/AUXinR
SPL
SPR
VBUS
VIDEO/STROBE
AID/ACB/VPP/RID
D+/DTMS
D-/DFMS
DCIO
GND
BLOCK DIAGRAM
Sheet
FUNCTIONAL OVERVIEW
FUNCTIONAL OVE R VIEW
1221-7857 rev. 1
95 (115)
Page 96
FUNCTIONAL OVERVIEW
Block Diagram
SEMC Troubleshooting Manual
ABCDEFGHIJ
C702
N1210 SQUID MODULE WCDMA BAND I
1234567
PAPA
DCDC_EN
N2205
DC/DC
RF Pow det
PWM/PFM
Switch
VBATi
VBAT
Bias
VBATi
VCC_WPA
Det
EN
WPAVCC
N1200 THOR MODULE GSM/GPRS/EDGE
REF
LX
VBAT
ANTSW 0-2
PA
PA
XO
RTEMP
DCIO
DCON
VBAT
Battery
uPSAFETY
GND
VBAT
BDATA
RX PGC
BUS INTERFACE
MASTERON
GSM/GPRS/EDGE TRX
A
D
BUS
INTERFACE
PLL
TESTOUT
A
A
D
VccA
VCC1
VCC2
Lock Detect
LD
Ref
CLK
TXEN
TXVGA
GIMLI
S
P
F
ΔΣ
MCLK
VDDE18
D2000 ANJA DIGITAL BASEBAND CONTROLLER
MMC
MS Pro
CAM_IO_EN (GPIO 03)
VCAM_SA_EN (GPIO 04)
CAM_CORE_EN (GPIO 05)
System
POR
SIM LVL shift
SIM LDO
Static Memory
Controller
CPU
PDI
DAT
KEYOUT
KEYIN
I2C2
CAMRESn (GPIO 08)
FLASH_EN(GPIO 06)
LMU_RSTn (GPIO 07)
S2504
LDO LP
DCON (GPIO 15)
OV_FLAG (GPIO 11)
AMPCTRL (GPIO 13)
MSDETECT (GPIO 12)
ACTIVE_LENS (GPIO 10)
CIF_STANDBY (GPIO 09)
VBATi
CPU
WBCLK
26MHz
VccA
A
F
VDDE18
WBCLK
MCLK
TESTOUT
26MHz
USB DET
USB CHRG
Control
DAC3
DAC4
VBACKUP
GND
SERCON
DAC2
DAC1
WCDMA
Sub system
GSM/GPRS/EDGE
Sub system
SIM Interface
MCLKREQ
SYSCLK0
SYSCLK1
SYSCLK2
GPIO 00-23 ACCESS
USB_VBUS
RTEMP
GND
GPA7
GPA12
MCLK
USB
DCIO DET
DCIO CHRG
Control
S-D ADC
N2000 VERA ANALOG BASEBAND CONTROLLER
Vibrator
Control
UART
SDRAM ControllerSDRAM Controller
DSP
Sub system
TRANSCEIVER IF
TESTOUT
GPA6
UART 0
DTMS - DFMS
AGPS/UART 3
GND
AID
VAD
GND
GPA3
GPA5
GPA2
GPA1
GPA4
GPA0
BT PCM / I2S
1.2V VCORE12
2.8V
VccA
LDO a
BUCK
Band
Gap
LED
Control
BOOST
PWM
XGAM
KEYPAD
GPIO 00-15 APPLICATION
SPI
I2C1
I2S0 / PCM0
I2S1 / PCM1
FM_INT (GPIO 00)
CAMIRQ (GPIO 02)
APP_LOG (GPIO 01)
I2C1 ANALOG BASE BAND
2.5V
VANA25
1.8V
VMC18
LDO f
LDO g
1/1911-FCP1013471 Uen
LDO c
B2101
32
I2C
kHz
Osc
LDO k
LDO d
LDO h
LDO e
D2020 1Gbit NAND +
512 Mbit SDRAM
CKE
CLK
CS
WE
CAS
RAS
BA0
BA1
LDQMD(0-15)
UDQM
A(0-11)
VCORE12
D2000
ANJA
POWER
MAIN & VGA CAMERA
POWER MANAGEMENT
VANA25
VDDE18
VDD
VDDQ
VSS
VSSQ
VCORE18
VCAM12
VCAMAF
VCAMSA
VCAMIO
FUNCTIONAL OVERVIEW
VDD_LP
VBATi
V
I
B
2.6V
VBEAR26
2.75V
VDIG
2.6V
VAUDIO26
VDDE18
2.75V
VBT27
1.8V
VBACKUP
BACKUP CAPACITOR
C2217
VBATi
VANA25
N2202
DC-DC
In
CE
VBATi
SIM
CARD
VBATi
VCORE18
Out
AGPS_LDO_EN
N2207
DC-DC
In
En
VAGPS20
Out
VBATi
AGPS_LDO_EN
N2208
DC-DC
In
CE
Security classDocument type
VAGPS28
Out
Title/Description
Prepared By
Content responsible if other than preparer
Approved by
C702 BLOCK DIAGRAM
Document number
DateRevision
Remarks
BLOCK DIAGRAM
Sheet
1221-7857 rev. 1
96 (115)
Page 97
Part list Main Board
APPENDIX Replaceable Par ts
SEMC Troubleshooting Manual
C702
Contains only components that are possible to replace on the main board.
Pos. number refers to the components position number on the board.
Some components are noted as MSL X. These components are moisture-sensitive and are rated at
various levels (MSL):
Level 1:Unlimited floor life; does not require dry pack or re-baking.
Level 2:1 year floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked after being
opened if floor life is exceeded.
Level 2A: 4 week floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked after being
opened if floor life is exceeded.
Level 3:168 hours floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked after being
opened if floor life is exceeded.
Level 4:72 hours floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked after being
opened if floor life is exceeded.
Level 5:48 hours floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked
after being opened if floor life is exceeded.
Level 5A: 24 hours floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked
after being opened if floor life is exceeded.
Level 6:6 hours floor life; </=30 C; 60%rh; shipped in dry pack; must be re-baked
after being opened if floor life is exceeded.
NOTE! RF Calibration by using SERP can only be done by authorized repair centers.
Fence modification according to Working Instruction Electrical.
Host Interface
OMS[2:0]=[1,1,1]: UART Interface: Data Input
OMS[2:0]=[1,1,0]: UART Interface: Data Input(Ignored)
OMS[2:0]=[1,0,1]: Selection of I C group address
OMS[2:0]=[1,0,0]: SPI chip select
Host Interface
OMS[2:0]=[1,1,1]: UART Interface: hardware ow control
OMS[2:0]=[1,1,0]: UART Interface: hardware ow control
(Tristated)
OMS[2:0]=[1,0,1]: Selection of I C group address bit 0
OMS[2:0]=[1,0,0]: SPI serial data input
Digital high accuracy frequency reference
Clock signal input. Selectable as digital or analoginput
Digital PLL supply Decoupling
PLL voltage and Low Power core regulator input
Digital I/O supply
Host Interface
OMS[2:0]=[1,1,1]: UART Interface: Data Output
OMS[2:0]=[1,1,0]: UARTInterface: Data Output(Tristated)
OMS[2:0]=[1,0,1]: Selection of I C group address
OMS[2:0]=[1,0,0]: SPI clock
Host Interface
OMS[2:0]=[1,1,1]: UART Interface: hardware ow control
OMS[2:0]=[1,1,0]: UART Interface: hardware ow control
(Ignored)
OMS[2:0]=[1,0,1]: not used (tie to “0”)
OMS[2:0]=[1,0,0]: SPI serial data output
Low Power core regulator output
Serial Data Input (JTAG, IEEE 1149.1)
Low Power supply
Digital core supply
Digital core voltage regulator output
Digital I/O supply
VDD_PLL
VDD_LP_PLLREG_IN
VDD_LPREG_OUT
VDD_LP
LP and PLL S upply
VDD_IO
TDI
JTA G Interface
Pin
Pin
No.
Name
A1 HIF3
UART_RXD /
UART_RXD /
2
C_GROUP1 /
I
SPI_nSCS
A2 HIF4
UART_nRTS /
UART_nRTS /
2
C_A0 /
I
SPI_SI
A3 CNTIN
A4 CLK
A5 VDD_PLL
A6 VDD_LP_PLLREG_I
N
A7 VDD_IO
B1 VSS_DIG
B2 HIF2
UART_TXD /
UART_TXD /
2
C_GROUP0 /
I
SPI_SCK
B3 HIF5
UART_nCTS /
UART_nCTS /
-/
SPI_SO
B4 VDD_LPREG_OUT
B5 TDI
B6 VDD_LP
B7 VDD_CORE
C1 VDD_COREREG_O
UT
C2 VDD_IO
GNDChip Ground All signalsare referred to this
P IPower InSupply to avoltage domain
P OPower OutRegulator Output
P I/OPower OutSupply to a voltage domain and regulator Output
I/ODigital Signal
Pad
AIAnalog Input
AOAnalogOutput
AI/OAnalog Input/
Output
PUInternal Pull Up
PDInternal Pull
Down
Pad
Type
I/O
I/O
II - --
I/AI I-- -
PI/PO-- --
PI --- -
PI --- -
GND --- -
I/O
I/O -
PO --- -
I/O IPU “C” 1 1
PI --- -
PI --- -
PO --- -
PI --- -
All Digital Pads are I / O Pads which are conguredinternally as required.
- All are congured as Push-Pull e xcept those marked as OD (open drain)
- All havehysteresis by default, but is onl y mentioned whenit is required for correct
system operation.
Bidirectional analog pad.
System
Integration
VDD_CO RE
nINTR
RTCCL K
RX_HOLD
POW E RO N
VDD_CO RE
nRESET
VDD_RFREG_IN
VDD_RF
MIX_IN_MINUS
VDD_VCO
VDD_CAP
MIX_IN_PLUS
VCO Mixer
Pad Functional Description
stnemmoCnoitpircseDepyTdaP
OMS2
OMS1
OMS0
EXT_LNA_CTRL
Top view (PCB footprint)
Mode
Operation al
RF Supply
0.3
mm
C3 HIF0
-/
-/
I
-
C4 HIF1
-/
-/
I
-
C5 TDO
C6 TCK
C7 nTRST
D1 VDD_COREREG_IN
D2 VSS_DIG
D3 OMS1
D4 SYNC
D5 VSS_DIG
D6 TMS
D7 VSS_DIG
E1 RTCCLK
E2 POWERON
E3 OMS0
E4 VSS_LNA
E5 VSS_RF
E6 MIX_IN_PLUS
E7 VDD_CAP
F1 nINTR
F2 RX_HOLD
F3 nRESET
F4 VDD_RFREG_IN
F5 EXT_LNA_CTRL0AI/O O-- - External LNA control
F6 MIX_IN_MINUS
F7 VDD_VCO
G1 VDD_CORE
G2 OMS2
G3 VDD_CORE
G4 VSS_RF
G5 VDD_RF
G6 VSS
G7 N.C.
A7B7C7D7E7F7G7
A6B6C6D6E6F6G6
A5B5C5D5E5F5G5
A4B4C4D4E4F4G4
A3B3C3D3E3F3G3
A2B2C2D2E2F2G2
B1C1D1E1F1G1
A1
0.25
mm
0
3.7 mm
I/O
Host Interface
-
-
OMS[2:0]=[1,1,1]: not used (tie to “0”)
-
-
OMS[2:0]=[1,1,0]: not used (tie to “0”)
-
-
OMS[2:0]=[1,0,1]: I C clock
-
-
OMS[2:0]=[1,0,0]: not used (tie to “0”)
Host Interface
-
-
OMS[2:0]=[1,1,1]: not used (tie to “0”)
-
-
OMS[2:0]=[1,1,0]: not used (tie to “0”)
Z
Z
OMS[2:0]=[1,0,1]: I C data
-
-
OMS[2:0]=[1,0,0]: not used (tie to “0”)
Serial Data Output (JTAG, IEEE 1149.1)
Clock (JTAG, IEEE 1149.1)
Reset Input (JTAG, IEEE 1149.1)
Digital core voltage regulator supply
Operational mode select / Bus interface select
Digital reference time pulse
State Machine Control Signal (JTAG, IEEE 1149.1)
32.768kHz clock signal input
Power On signal to chip
Operational mode select / Bus interface select
Dierential mixer input
RF Digital Supply Decoupling
Interrupt request signal to host
RX_HOLD signal (From host to indicate that the host is
transmitting)
Chip reset signal
RF voltage regulator input
Dierential mixer input
Buer capacito r for VCO supply
Digital core supply
Operational mode select
Digital core supply
RF Analog Supply Decoupling
This ball should be left unconnected
2
C_SCL /
2
C_SDA /
I
-
I
-
2
I
CI
-
I
-
I/O
-
I
-
I
2
CI/O
OD
I
I
-
I/O O-Z Z
I/O IPD “C” 0 0
I/O IPD “A” 0 0
PI --- -
GND --- -
I/O I-- -
II - --
GND --- -
I/O IPU “C” 1 1
GND --- -
I/O IHyst - -
I/O I-0 0
I/O I-- -
GND --- -
GND --- -
AI AI -- -
PI/O PI/O -(Z) (Z)
I/O OOD Z Z
I/O I-- -
I/O IHyst 0 1
PI --- -
AI AI -- -
PI/O PI/O -(Z) (Z)
PI --- -
I/O I-- -
PI --- -
GND --- -
PI/0 --- -
AI AI -- -
AO AO -- -
1221-7857 rev. 1
0.275
mm
3.55 mm
0.5 mm
0.275
mm
0.4 mm
m
m
5
.
APPENDIX
100 (115)
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