Sony Ericsson C510 Diagram

Component Replacement

- electrical -

C510

1223-6749 Rev 7

© Sony Ericsson Mobile Communications AB – Company Internal

Component Replacement Repair Drawing Additional Soldering Process/

CONTENTS

1 Replaceable Components ............................................................. 3

2 Component Placing ........................................................................ 6

3 Repair Actions ................................................................................ 7

3.1 Shield Can Fence Modifications .......................................................... 7

3.2 Additional Repair Info ........................................................................... 8

4 Revision History ........................................................................... 10

For general information about electrical repair related issues, refer to
1220-1336: Generic Repair Manual - electrical

1223-6749 Rev 7

© Sony Ericsson Mobile Communications AB – Company Internal

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Component Replacement Repair Drawing Additional Soldering Process/

1 Replaceable Components

EXPLANATION OF ABBREVIATIONS USED IN THE COLUMN ‘COMMENTS’ BELOW

COMPONENT LOCATION

P = Primary Side
S = Secondary Side

MOISTURE SENSITIVITY LEVEL

MSLX (X = 1, 2, 2A, 3, 4, 5, 5A or 6)

For more information on moisture sensitivity levels:
Refer to 1220-1336: Generic Repair Manual – electrical, section ‘Moisture & Baking’!

REPAIR METHOD

HA = Hot Air (removal & mounting)
ST = Soldering Tool (removal & mounting)
HA/ST = Hot Air for removal - Soldering Tool for mounting
BGA = BGA Station
BH = Bottom Heater

ADDITIONAL INFORMATION

Ö1 (2,3,4, etc.) = Proceed to ‘Additional Repair Info’ for further instructions in the indicated section(s).

CALIBRATION

C = Calibration of the phone is required after replacing the component

Calibration to be done by authorized centers only!

1223-6749 Rev 7

© Sony Ericsson Mobile Communications AB – Company Internal

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