Sony Vaio SVZ131 Series Service Manual

Sony Condential

SVZ131 Series

SERVICE MANUAL

Ver 1-2011E

9-890-896-01

PERSONAL COMPUTER

Revision History



Design and specications are subject to

change without notice.



󲨘

本機の仕様および外観は ,󲨘改良のため予告なく変󲨘

󲨘 更することがありますが ,󲨘ご了承ください。

-2-

SVZ131 Series (9-890-896-XX)

Sony Condenti al

Informat ion in this document is su bject to
change without notice.

Sony, VAIO and CLIE are trademarks or regis­tered trademarks of Sony. Microsoft, Windows,
Windows Media, Outlook, Bookshelf and other
Microsoft products are trademarks or registered
trad emarks of M icroso ft Corpor ation in the
United States and other countries . The wo rd
Bluetooth and the Bluetooth logo are trademarks
of Bluetooth SIG, Inc. AMD, the AMD logo, other
AMD product names and combinations thereof
are trademarks of Advanced Micro Devices, Inc.
Intel Inside logo, Pentium, Celeron and Core are
trademarks or registered trademarks of Intel Cor­p

oration. Transmeta, the Transmeta logo, Crusoe
Processor, the Crusoe logo and combinations
thereof are trademarks of Transmeta Corporation
in the USA and other countries. Graffiti, Hot­Sync, PalmModem, and Palm OS are registered
trademarks, and the Hotsync logo and Palm are
trademarks of Palm, Inc. or its subsidiaries. (M)
and Motrola are trademarks of Motrora, Inc. Other
Motrola products and services with (R) mark like
Dragonball are the trademarks of Motrola, Inc.

All other names of systems, products and services
in this manual are trademarks or registered trade­marks of their respective owners. In this manual,
the (TM) or (R) mark are not specified.

Caution Markings for Lithium/Ion Battery - The
following or similar texts shall be provided on
battery pack of equipment or in both the operating
and the service instructions.

CAUTION:

Danger of explosion if battery is
incorrectly replaced. Replace only with the same
or equivalent type recommended by the manu­facturer. Discard used batteries according to the
manufacturer’s instructions.

CAUTION: The battery pack used in this device
may present a fireor chemical burn hazard if mis­treated. Do not disassemble, heat above 60°C
(140°F) or incinerate. Dispose of used battery
promptly. Keep away from children.

CAUTION: Changing the back up battery.

Overcharging, short circuiting, reverse charg­ing, multilation or incineration of the cells must
be avoided to prevent one or more of the fol­lowing occurrences; release of toxic materials,
release of hydrogen and/or oxygen gas, rise in
surface temperature.
If a cell has leaked or vented, it should be
replaced immediately while avoiding to touch
it without any protection.

Service and Inspection Precautions

1. Obey precautionary markings and
instructions

Labels and stamps on the cabinet, chassis, and
components identify areas requiring special pre­cautions. Be sure to observe these precautions,
as well as all precautions listed in the operating
manual and other associated documents.

2. Use designated parts only

The set’s components possess important safety
characteristics, such as noncombustibility and
the ability to tolerate large voltages. Be sure that
replacement parts possess the same safety charac­teristics as the originals. Also remember that the

mark, which appears in circuit diagrams and
parts lists, denotes components that have particu­larly important safety functions; be extra sure to
use only the designated components.

3. Always follow the original design

when mounting parts and routing
wires

The original layout includes various safety fea­tures, such as inclusion of insulating materials
(tubes and tape) and the mounting of parts above
the printer board. In addition, internal wiring has
been routed and clamped so as to keep it away
from hot or high-voltage parts. When mounting
parts or routing wires, therefore, be sure to du­plicate the original layout.

4. Inspect after completing service

After servicing, inspect to make sure that all
screws, comp onents, and wiring have been
returned to their original condition. Also check
the area around the repair location to ensure that
repair work has caused no damage, and confirm
safety.

5. When replacing chip components...

Never reuse components. Also remember that
the negative side of tantalum capacitors is easily
damaged by heat.

6. When ha ndling fl ex ib le print
boards...

The temp erature of the solder ing-ir on tip

should be about 270°C.

z

z

z

z

z

Do not apply the tip more than three times to

the same pattern.

Handle patterns with care; never apply force.

Caution: Remember that hard disk drives are
easily damaged by vibration. Always handle
with care.

ATTETION AU COMPOSANT AYANT

RAPPORT

À LA SÉCURITÉ!
LES C OMPO SANT S IDENT IFÉS PAR UNE
M AR Q UE S U R L ES D IAG R AM M ES
SCHÉ MATIQUES ET LA LISTE DES PIÈCES
SONT CRI TIQUE S POU R LA SÉCURITÉ DE
FON CTIONNEMENT. NE REMPL ACER CES
COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉSDANS
CE MANUE L OU DAN S LE S SU PPÉMENTS
PUBLIÉS PAR SONY.

The components identified by mark contain
confidential information.
Strictly follow the instructions whenever the
components are repaired and/or replaced.

-3-

SVZ131 Series (9-890-896-XX)

Sony Condenti al

TABLE OF CONTENTS

Section Title Page

CHAPTER 1. BLOCK DIAGRAM

................................................................................................1-1

(to 1-1)

CHAPTER 2. FRAME HARNESS DIAGRAM

........................................................................2-1

(to 2-1)

CHAPTER 3. EXPLODED VIEWS

Main Section

MS-1 ........................................................................................................................................................3-2

LCD

L-1 ...........................................................................................................................................................3-3

Accessories

A-1 ...........................................................................................................................................................3-4

Accessories (DOCKING STATION)

A-2 ...........................................................................................................................................................3-5

Accessories (STAND)

A-3 ...........................................................................................................................................................3-6

(to 3-6)

CHAPTER 4. OTHERS

4-1. Note for WAN Board Replacement .......................................................................................................4-1

4-2. Note for WiMAX Board Replacement ..................................................................................................4-2

(to 4-2)



History of the changes is shown as the "Revision

History" at the end of this data.



変更履歴は、

“ Revision History ”

として、 本データ末に

󲨘 記載してあります。

1-1

CHAPTER 1.

BLOCK DIAGRAM

SVZ131 Series (9-890-896-XX)

Sony Condenti al

(END)

8

01

31

1

4

PECI

IMVP7.0

VR

XDP

USB

USB3.0

2

1

PCI Express

SATA

0

1

LPC

Azalia

Touch

PAD

BUTTONs

LID

Button/SW

Power

­ASSIST ­VAIO ­Web

-

LEDs

Power ­Cherge

­Keyboard -

num/ caps/ scr lk

(Except EC)

SSD ­Wireless ­Camera ­MS, SD -

Memory

NAF

TACH

FDI DMI

2

9

PCle[8:7]

11

USB 14ports

EHCI #1:8ports

XHICI ports

EHCI #2:6ports

PCI Express

8ports

SATA

6ports

NAF

1

0

FAN

0

21

PCIex4: 0-3

Processor

Intel

Ivy Bridge-QC/DC

eDP

Block Diagram

Docking Station

DDR3 1600 MHz

DDR3 1600 MHz

LCD 13.1"

1920x1080

1600x900

1st BatteryCN2nd Battery

CN

DC jack

DC jack

DC

Plug

Eagle Ridge

Eagle Ridge

Eagle Ridge

PCIe

Bridge

CIO

Bridge

CIO

Bridge

Optional

Module

CIO

Bridge

GbE

Controller

Realtek

RTL8111E

USB2.0

Hub

NEC

uPD720114GA

USB3.0

Host
NEC

uPD720200A

PCIe-SATA

Bridge

Marvell

88SE6121

PCIe

Bridge

PCIe

Bridge

OE

Module

RGB

RGB

USB2.0

USB2.0

USB3.0

ODD

HDMI

HDMI

USB3.0

/Charge

Optional

CN

Optional CN

/USB3.0

Memory Card

Controller Chip

Magic Gate

Realtek

RTS5209

Digital
NCHP

CS47L01

Internal SP

Internal MIC

Normal or

Back lit KBD

Audio Codec

w/ HWEQ

Realtek
ALC275

EC

smsc

MEC1621

Ambient

Light

Sensor

MS

SD

HP

PCH

Intel

Panther Point

SSD

TPM
Infineon
FW3.19

DEBUG

Thermal

diode

(For Memory)

(For AOAC)

Thermal

diode

LEDs

SPI Flash

64Mbit

FP or non

AuthenTec AES1660

Camera or non

WLAN/WiMAX

GbE

Controller

Realtek

RTL8111F

WAN or non

Gobi3000(EU,AP)

LTE(EU,JP,RU)

BT

RJ-45

VRAM:1GB

(64M x 16 , 8 pcs)

VRAM VRAM

VRAM

VRAM

VRAM

VRAM

VRAM

VRAM

AMD

WHISTLER_XT

RJ-45

BU22

Ricoh R5U8710

Kilmer Peak/

Jackson Peak2/Puma Peak

CHAPTER 2.

FRAME HARNESS DIAGRAM

2-1

SVZ131 Series (9-890-896-XX)

Sony Condenti al

(END)

From boardto connector(direct connection)
Harness (connectorat bothend)

Harness (solderedat oneend)

基板からコネクタへ（ダイレクト接続）

ハーネス（両端がコネクタ付き）

ハーネス（一方が半田付け）

HD CAMERA
MODULE

L Side

Bottom

R Side

MN-LI RECHARGEABLE
BATTRY

FPC-296

BUTTON

FINGER PRINT
SENSOR

FP Model

BACK LIGHT
KB Model

Docking Station Model

FPC-224

FPC-232

FPC-282

FPC-283

Bottom

Bottom

HARNESS DC JACK

FFC (MBX257-SWX386)

FFC
(IFX615-LEX97)

FFC (IFX615-TP)

FPC-225

LCD

MAIN
BOARD
Side A

MM-19
BOARD
Side A

MM-19
BOARD
Side A

IFX-615
BOARD
Side A

IFX-612
BOARD
Side A

IFX-613
BOARD
Side A

SWX-386 BOARD
Side A

LEX-97
BOARD
Side A

KEYBOARD
UNIT

BATTERY

2nd

BATTERY

TOUCH PAD

SSD

FUN UNIT

Front

SPEAKER L

SPEAKER
R

JUMPER CABLE WITH OE MODULE

Top

WIRELESS

Camera Model

HARNESS

Front

N.C.

BATTERY
OFF BUTTON

MIC

HARNESS
(DC JACK)

L Side

Rear

HARNESS (RJ-45)

IFX-578
BOARD
Side A

R Side

POWER
LAMP

FUN
UNIT

LEX-98 BOARD
Side A

ODD

FFC (IFX578-LEX98)

FPC-229

DOCKING
CONNECTOR

IN USE

BT
MODULE

Ext BT Model

BLU

BT ANTENNA

WIRELESS-LAN,

WLAN/WiMAX COMBO,

WLAN/BT COMBO

CARD

ANTENNA (WiMAX/WLAN)

WLAN 3rd Model

BLK

GRY

WHT

1

3

2

SUB 3rd MAIN

Rear

SIM CARD

WAN Model

WAN Model
WWAN ANTENNA

MINI
CARD

BLK

MAIN AUX

GRY