Sony SPP-SS964 Service Manual

Page 1

SPP-SS964

SERVICE MANUAL

SPECIFICATIONS

E Model

AC power adaptor (AC-T46) Telephone line cord Wall bracket/stand for base phone Rechargeable battery pack (BP-T24) Directories

CORDLESS TELEPHONE

MICROFILM

Page 2

TABLE OF CONTENTS

1. SERVICING NOTES............................................... 3

2. GENERAL

Setting up the base phone ............................................... 4

Preparing the battery pack .............................................. 4

Making calls .................................................................... 5

Receiving calls ................................................................ 6

One-touch dialing............................................................ 6

Speed dialing ................................................................... 7

Phone directory ............................................................... 7

Switching the phones during a call................................. 8

Talking between the phones (Intercom) ......................... 8

Voice paging .................................................................... 9

Transferring a call ........................................................... 9

3. DISASSEMBLY ......................................................... 10

4. 900 MHz SYSTEM OPERATION

4-1. Access Method ................................................................ 13

4-2. Protocol ........................................................................... 13

5. TEST MODE

5-1. Base Unit Section............................................................ 16

5-2. Handset Section............................................................... 17

5-3. RF Testing ....................................................................... 18

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be damaged by heat.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANU AL OR IN SUPPLEMENTS PUBLISHED BY SONY.

6. ELECTRICAL ADJUSTMENTS

6-1. Base Unit Section............................................................ 20

6-2. Handset Section............................................................... 21

7. DIAGRAMS

7-1. Block Diagram – BASE UNIT Section –....................... 25

7-2. Block Diagram – HANDSET Section – ......................... 27

7-3. Notes for Printed Wiring Boards

and Schematic Diagrams ................................................ 29

7-4. Printed Wiring Board

– BASE MAIN Board (Side A)/

BASE MICROPHONE Board – ..................................... 31

7-5. Printed Wiring Board

– BASE MAIN Board (Side B) – ................................... 33

7-6. Schematic Diagram – BASE MAIN Section (1/3) – ...... 35

7-7. Schematic Diagram – BASE MAIN Section (2/3) – ...... 37

7-8. Schematic Diagram – BASE MAIN Section (3/3) – ...... 39

7-9. Printed Wiring Board – BASE KEY Section – ............. 41

7-10. Schematic Diagram – BASE KEY Section – ................ 42

7-11. Printed Wiring Board – HAND MAIN Section – ......... 43

7-12. Schematic Diagram – HAND MAIN Section – ............ 45

7-13. IC Pin Function Description ........................................... 48

8. EXPLODED VIEWS ................................................ 53

9. ELECTRICAL PARTS LIST ............................... 55

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Page 3

SECTION 1

SERVICING NOTES

CABLE FASTENING METHOD

• TDD noise may be generated in the intercom or handset speech depending on how the cables are fastened, and therefore fasten the cables as shown below.

1 Erect the cabinet (upper) 90 degrees. 2 Insert the wires in the ribs at A and B. 3 Clamp them at C and D. 4 Affix the sponges at E and F positions. 5 Fix the cables with tapes at G to L positions.

Note:Tape over the

diode (D1001).

Direction for drawing speaker lead wires

black

Cable fasting direction

red

Affix position Bottom flushed

white

Note:Make sure the wires do not

rise above the shield plate.

clamp stopper

25~30 mm

Cable fasting direction

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SECTION 2

GENERAL

This section is extracted from instruction manual.

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Page 6

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Page 7

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Page 8

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Page 9

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Page 10

SECTION 3

DISASSEMBLY

Note: Follow the disassembly procedure in the numerical order given.

• HANDSET REAR CABINET

two screws (BTP 2.6

10)

Remove the battery case lid to direction of the arrow

Remove the rear cabinet to direction of the arrow B.

two claws

claw

two claws

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Page 11

HAND MAIN BOARD

)

connector screw (BTP2.6 × 8)

Removal of the HAND MAIN board direction of the arrow A.

(CN401)

four screws (P3 × 16)

connector (CN302)

three screw (BTP2.6 × 8

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Page 12

• BASESET

BASESET (UPPER) ASS’Y

two screws (P3

12)

baseset (upper) ass’y

two screws (P3

12)

two claw

BASE MAIN BOARD

connector (CN601)

connector (CN202)

four screws (BTP2.6 × 8)

connector (CN802)

BASE MAIN board

four screws (P3 × 16)

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Page 13

SECTION 4

900 MHz SYSTEM OPERATION

4-1. ACCESS METHOD

1. Transfer format & rate

The transfer format & rate of our system is as follows;

Table 4-1. Transfer method

Access method FDMA-TDD Channel number 20 channel Channel spacing 1.2 MHz Modulation method DBPSK Baseband transfer rate 960 Kbps Spread method Direct Sequence Spread Spectrum Chip rate 12 chips/bit Data transfer rate 80 Kbps

2. Channel Number & Frequencies

RF channels occupy the frequency band 902 – 928 MHz are numbered 1 to 20. RF channel numbers & center frequencies are specified as follows.

Table 4-2. Channel number & Channel frequency

Channel Channel Center Channel Channel Center

Number Frequency (MHz) Number Frequency (MHz)

1 903.6 11 915.6 2 904.8 12 916.8 3 906.0 13 918.0 4 907.2 14 919.2 5 908.4 15 920.4 6 909.6 16 921.6 7 910.8 17 922.8 8 912.0 18 924.0 9 913.2 19 925.2

10 914.4 20 926.4

4-2. PROTOCOL

1. General

This system realizes the TX/RX superframe by TDD system. The relation of master/slave dose not decide identification regarding the protocol between BS and HS, but the initiated side is the master and the requested side is the slave when the RF link has been established.

2. Initial acquisition

In order to establish the RF link between BS and HS, both of BS and HS need to have the same system ID. When “power” is applied to this system, the system have to do Initial Acquisition in order to have the same system ID. It is to exchange a parameter when the HS is parked on the BS, as soon as the system do System Parameters Re-initialization.

3. System parameter re-initialization

This System Parameters Re-initialization can realize that the HS is parked on the BS. So after the BS recognized to be parked the HS, the BS calculates a system parameter, and then it outputs this data from the ARTO port, and then the system establishes the RF link. In order to establish this link, the HS send the A-Frame to the BS after the HS received the system parameter, and then the BS send the A-Frame to the HS. The process of System Parameters Re-initialization is as follows.

Base Station Handset

(PARK)

(Park Detect)(Park Detect)

System Parameters

A-Frame

System ID confirmed

A-Frame

Fig. 4-1. System Parameters Re-initialization

System ID

confirmed

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4. Stand-by Mode Operation

(1) HS

When the HS is the stand-by mode (sleep mode), the HS do the intermittent operation for power save, because the HS is the battery operation. This process of stand-by mode operation is as follows.

10 sec

Heart-Beat

10 sec

Heart-Beat Heart-Beat

RX RX RX RX RX

1 sec 1 sec

10 sec

1 sec

2 msec

2 msec 10 msec

10 msec

RXTXRX

Heart-Beat (Exchange A-Frame for Link confirmation purpose)

Fig. 4-2. Stand-by mode operation (HS)

(2) BS

The BS is supplied the power by AC line. While the BS is the stand-by, the BS is always a wake state. While the BS monitors the current channel, the BS monitors also the other channel at the same time Because if the current channel can not use by some interference, the system needs the clear channel information as a part of system parameter for a channel hop. If the BS can not receive the A-Frame of Heart-beat from the HS, it become “link error”, and the system become error recovery mode.

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5. Link Establishment

Master TX

Master RX

Slave RX

Slave TX

Master

Time Slot

Trip Delay

TX RX TX RX TX

A' V

VA'

According to the following Fig. 4-1, the requested side for link establishment is the master. The system have to exchange the A-Frame for link establishment, and each system ID should be the same ID, and then the system link is established. The protocol and timing chart of link establishment are as follows.

Master Slave

A-Frame

System ID

confirmed

A-Frame V-Frame V-Frame V-Frame V-Frame

Fig. 4-3. Link Establishment protocol

System ID confirmed

Fig. 4-4. Link Establishment Timing Chart

6. State Change/Termination

After the RF link between HS and BS was established, a movement of each state (State: ON-Hook, OFF-Hook, P A GE, InterCom, etc) is sent through supervisory bits.

7. Error Recovery

In case of the following situation, The system becomes “Error Recovery Mode”.

(1) The system failed to move to “Heart-Beat” during “Stand-by

mode, or failed “link establishment”.

(2) The system failed to keep the link.

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SECTION 5

TEST MODE

5-1. BASE UNIT SECTION

[Start-up]

1. Set the [DIALMODE] switch to the P (PULSE) side.

2. Keeping the [INTERCOM] button pressed, turn the power on.

3. After a start-up acknowledge tone sounds, set the [DIALMODE] switch from P (PULSE) to T (TONE) side, then return to the P (PULSE) side.

4. Release the[INTERCOM] button, and the T est Mode will start.

5. Allow for normal ringer to sound at high level f or duration of 500 msec after start-up, then close the line and dial Pause → 0 (DP) → (mode change) → 1 (tone) → 4 (tone) → 8 (tone) → # (tone).

6. After dialing, the base unit will go in Test Mode Idle status.

[Ring Detection Test]

1. The LINE LED blinks in synchronization with the RING sgnal and at the same time, Normal Ringer sounds, if the RING signal is detected in the Test Mode Idle status.

[Charge Detection • ARTO Output Test]

1. Square-wave signal (2.4 kHz) is output to the IC751 pin #¢ (ARTO ter minal) when the CHARGE signal is detected (IC751 pin ^™ (PARKP terminal) H → L) in the Test Mode Idle status.

2. At this time, the EEPROM (IC951) is reset.

[Charge Control Test]

1. IC751 pin *¶ (CHG-HIGH RA TE terminal) outputs H → L → H once, if IC751 pin *£ (VCHG-MON terminal) changes to H → L → H when the CHARGE signal is detected in the Test Mode Idle status.

[Test Mode by Manual Input]

• T he key input in the Test Mode Idle status can change the set

status to the following modes. However, the transition to another mode within respective test mode groups (A-J) is possible directly, but in case of transition to other test mode group, the set must be returned to the T est Mode Idle status once by enter ing the command “0-1-#”.

A) Test mode termination

Command Mode/Operation

0-0-# Terminate the Test mode.

B) Return test mode idle

Command Mode/Operation

0-1-# Return to Test Mode Idle status.

C) Continuous receiving test group (Note 1)

Command Mode/Operation

1-1-# CH1 continuous receiving status (LNA, AGC ON)

D) Continuous transmission test group (Note 1)

Command Mode/Operation

2-1-# CH1 continuous transmission status (TX Power High) 2-2-# CH1 continuous transmission status (TX Power Mid) 2-3-# CH1 continuous transmission status (TX Power Low)

Note 1: Each time the [*] key is pressed, the channels change over as

follows:

CH1 → CH2 → CH3 → … → CH20

E) Loopback test group 1

Command Mode/Operation

3-1-# CODEC Forward Loopback (L1)

(Speech path: Talk status) (LINE IN → LINE OUT: CODEC LINE IN→ SPKR OUT)

3-2-# ADPCM Forward Loopback (L2)

(Speech path: Talk status) (LINE IN → CODEC → ADPCM → CODEC → LINE OUT)

3-3-# ADPCM → RF Loopback

(Speech path: Talk status) (LINE IN → CODEC → ADPCM → RF → ADPCM → CODEC → LINE OUT)

F) TDD test group 1

Command Mode/Operation

4-1-# CH1 TDD mode (Master timing, Power High) status 4-2-# CH1 TDD mode (Master timing, Power Mid) status 4-3-# CH1 TDD mode (Master timing, Power Low) status 4-4-# TDD mode (Slave timing, Standby) status. Power

(Note 2) control

Note 2: To make a speech with the handset, first operate the set in Slave

mode by “4-4-#” command, and operate the counterpart in the Master mode by “6-1-#” command. However, the ID must be same. To set the same ID, perform ON-Charge in advance, or clear the EEPROM by “7-1-#” command. In this case, howe v er, the speech path should be the intercom status.

G) MMI test group

Command Mode/Operation

5-1-# Key test.

• Press the keys successively in the following order:

[PGM] → [SPEEDDIAL] → [REDIAL/PAUSE]

→ [FLASH] → [1] → [2] → [3] → [4] → [5] → [6] → [7] → [8] → [9] → [*] → [0] →

[#] →[INTERCOM] →[HOLD] → [SPEAKERPHONE]

• If key input sequence is correct: An acknowledge tone sounds, and the set returns to the T est Mode Idle status.

• If key input sequence is wrong: An error tone sounds, and the set returns to the Test Mode Idle status.

5-4-# LED test.

[LINE] LED lights up when the LED test mode is

selected.

H) TDD test group 2

Command Mode/Operation

6-1-# TDD mode (Master timing) status. Power control.

Refer to the description of “4-4-#” command.

I) Memory clear test group

Command Mode/Operation

7-1-# The contents of EEPROM are cleared. In case of

successful clear, an acknowledge tone sounds.

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J) Loopback test group 2

Command Mode/Operation

8-1-# ADPCM Forward Loopback

(Speech path: Intercom status) (MIC IN → SPEAKER OUT: CODEC MIC IN → ADPCM → CODEC LINE OUT (Speech path: Intercom status)

5-2. HANDSET SECTION

[Start-up]

1. With the power supplied, press taneously, and the Test Mode will start.

2. Allow for normal ringer to sound at high level for duration of 500 msec after start-up, then the handset will go in Test Mode Idle status.

3. The RF in Talk/Intercom status is as follows.

[Test Mode by Manual Input]

• The key input in the Test Mode Idle status can change the set

status to the following modes. However, the transition to another mode within respective test mode groups (A-J) is possible directly, but in case of transition to other test mode group, the set must be returned to the Test Mode Idle status once by entering the command “0-1-#”.

A) Test mode termination

Command Mode/Operation

0-0-# The Test mode terminates. The contents of EEPROM

are cleared. In case of successful clear, an acknowledge tone sounds.

B) Return test mode idle

Command Mode/Operation

0-1-# Return to Test Mode Idle status.

C) Continuous receiving test group (Note 1)

Command Mode/Operation

1-1-# CH1 continuous receiving status (LNA, AGC ON)

D) Continuous transmission test group (Note 1)

Command Description

2-1-# CH1 continuous transmission status (TX Power High) 2-2-# CH1 continuous transmission status (TX Power Mid) 2-3-# CH1 continuous transmission status (TX Power Low)

[TALK], [0], and [1] keys simul-

F) TDD test group 1

Command Mode/Operation

control

G) MMI test group

Command Mode/Operation

5-1-# Key test.

• Press the keys successively in the following order:

[TALK,FLASH] → [OFF] → [HOLD] → [VOL/PGM]

→ [INTERCOM] → [REDIAL/PAUSE] → [1] → [2] → [3] → [4] → [5] → [6] → [7] → [8] → [9] →

[*] → [0] → [#] → [A] → [B] → [C]

• If key input sequence is correct: An acknowledge tone sounds, and the set returns to the Test Mode Idle status.

• If key input sequence is wrong: An error tone sounds, and the set returns to the Test Mode Idle status.

5-2-# JOG shuttle test. (Note 2) 5-3-# LCD test.

All dots on LCD lights up immediately when the LCD test mode is selected.

Note 2: JOG shuttle test

The JOG shuttle test mode makes a check with the LCD display when JOG shuttle is rotated clockwise or counterclockwise, or the button is pressed.

JOG shuttle LCD display

Rotate clockwise “R” is displayed at 1st digit on 1st line Rotate counterclockwise “L” is displayed at 1st digit on 1st line Press button “P” is displayed at 1st digit on 1st line

H) TDD test group 2

Command Mode/Operation

6-1-# TDD mode (Master timing) status.

I) Memory clear test group

Command Mode/Operation

7-1-# The contents of EEPROM are cleared. In case of

successful clear, an acknowledge tone sounds.

Note 1: Each time the [*] key is pressed, the channels change over as

follows:

CH1 → CH2 → CH3 → … → CH20

E) Loopback test group 1

Command Mode/Operation

3-1-# CODEC Forward Loopback (L1)

(MIC → SP) (within CODEC)

3-2-# ADPCM Forward Loopback (L2)

(MIC → CODEC → ADPCM → CODEC → SP)

3-3-# ADPCM → RF Loopback

(MIC → CODEC → ADPCM → RF → ADPCM → CODEC → SP)

J) Battery save mode

Command Mode/Operation

9-0-# Battery Save mode.

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5-3. RF TESTING

This test is for checking the RF system without disassembling the set in servicing. Perform measurement using the spectrum analyzer and jig antenna.

• T ransmission Wave:

ATTEN 10 dB

RL 0 dBm 10 dB/

MKR –16.00 dBm

903.392 MHz

5-3-1. RF Testing method

Please follow the below instruction to perform RF test.

[Setting Condition]

Connect a receiving antenna to RF INPUT of Spectrum analyzer and set the unit 10 cm (4 inches) away from the receiving antenna.

Measuring tool: Spectrum analyzer (equivalent to HP8595E) Jig: Receiving antenna (for Spectrum analyzer)

10 cm

Spectrum analyzer

Jig antenna (Utilize the antenna for handset)

10 cm

MKR

903.392 MHz –16.00 dBm

CENTER 903.600 MHz RBW 30 kHz

XdB

–7

–8

–9

VBW 30 kHz

–3

–4

–5

–6

Fig. 1

–1

–2

SPAN 5.000 MHz

SWP 50.0 msec

Spectrum analyzer

[Check the Transmission Wave]

Purpose

It is necessary to check spectrum wave of transmission wa ve which is an important factor in order to confirm operational performance of Spread Spectrum models. If this wave deviates from correct wave form, normal data transmission cannot be made and, as a result of that, possibility that occurrence of mute increases and communication distance becomes shorter will increase.

Measuring process

• Setting Spectrum analyzer: Center frequency : 903.6 MHz (CH1) RBW :30 kHz VBW :30 kHz Span :3 MHz (or 5MHz)

• Setting Test mode:

Continuous Transmit mode (CH1 High Power) (Refer to “Test Mode” on page 16)

• Measurement:

Measure transmitting wave.

• Specifications:

Acceptable level [XdB] difference between the highest peak and the lowest peak of odd side band (the first to seventh side band from Center Frequency ; Transmission Frequency f0: CH1) is under 10 dB. (Refer Fig. 1 and Fig. 2) If output wave form deteriorates, side band appears like Fig. 3 and Fig. 4.

ATTEN 10 dB

RL 0 dBm 10 dB/

MKR

903.233 MHz –14.67 dBm

CENTER 903.600 MHz RBW 30 kHz

VBW 30 kHz

f–1f

Fig. 2

Fig. 3

MKR –14.67 dBm

903.233 MHz

SPAN 5.000 MHz

SWP 50.0 msec

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Page 19

18dB

• Measurement: Measure peak level by Spectrum analyzer.

–5

–6

–7

–8

–9

–1

–4

–3

–2

PEAK LOG

10 dB/

WA SB

SC FC

CORR

PLOTTER ADRS 0

903.587 MHzMKR –3.67 dBmAT 10 dB.0 dBmREF

Fig. 4

[Check Center Frequency]

Measuring process

• Setting Spectrum analyzer: Center frequency : 903.6 MHz (CH1) RBW : 10 kHz VBW : 10 kHz Span : 1 MHz

• Setting Test mode:

Continuous Transmit mode (CH1 High Power) (Refer to “Test Mode” on page 16)

• Measurement:

Measure transmitting wave f0 (Formula of center frequency) (Refer Fig.5)

• Specification:

903.6 MHz ± 27 kHz

• Center Frequency:

10dB/

–2

–1

Tr-A

CENTER 903.600 MHz

RES BW 1.0 MHz

VBW 100 kHz

SPAN 5.000 MHz

SWP 20.0 msec

DATA (UNIT; dbm)

NO HANDSET BASESET

HIGH MID LOW HIGH MID LOW 1 –3.93 –20.95 -34.53 –2.36 –19.17 –32.81 2 –3.70 –20.36 –33.75 –1.52 –18.33 –30.79 3 –4.47 –21.48 –34.78 –4.36 –18.65 –33.3 4 –4.64 –21.85 –35.12 –4.25 –19.37 –33.05 5 –4.52 –21.18 –35.54 –2.35 –19.05 –32.95 6 –4.02 –21.57 –35.12 –2.96 –19.14 –33.45 7 –5.03 –22.14 –35.45 –4.12 –19.12 –33.01 8 –5.58 –22.35 –35.61 –2.89 –18.56 –32.12 9 –4.03 –21.32 –35.82 –5.01 –18.33 –32.41

10 –4.43 –19.69 –33.92 –2.74 –17.28 –31.33

× –4.435 –21.29 –34.96 –3.256 –18.7 –32.52 σ 0.5336 0.7634 0.6747 1.0562 0.5895 0.8273

× + 4σ –2.301 –18.24 –32.27 0.9687 –16.34 –29.21 × – 4σ –6.569 –24.34 –37.66 –7.481 –21.06 –35.83

• Specification: HANDSET MIN –17 dBm (at High power: Include location loss) BASE SET MIN –18 dBm (at High power: Include location loss)

Fig. 5

[Confirm Transmitting output]

Measuring process

• Setting Spectrum analyzer: Center frequency : 903.6 MHz (CH1) RBW : 1 MHz VBW : 100 kHz Span : 5 MHz

• Setting Test mode:

Continuous Transmit mode (CH1 High Power) (Refer to “Test Mode” on page 16)

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SECTION 6

P N

ELECTRICAL ADJUSTMENTS

6-1. BASE UNIT SECTION

• Make the set in Test mode (see page 16)

1. Checking RX I & Q Output Level

Setting:

oscilloscope

–

SSG

Procedure:

1. Place the base unit in the Continuous Receive mode (CH1, LNA ON, AGC ON).

2. Set the SSG frequency to the frequency on CH1 + 300 kHz, and the RF output level to –95 dBm.

3. Measure the output level of RXIN, RXIP, RXQN and RXQP with a level meter. At this time, confirm with an oscilloscope that a sine wave of 300 kHz is output.

4. Confirm that the measured output level is –31.0 to –24.0 (TYPICAL –27.0) dBV. If IC951 was replaced (there is no ID data), the output level is –31.0 to –24.0 dBV.

5. Also, execute steps 1 through 4 for the channels 10 and 20.

level meter

+ –

TP906: RXIP TP905: RXIN TP904: RXQ TP903: RXQ

TP919: GND

ANTENNA TERMINA

3. Checking TX Output

Setting:

peak power meter

–

ANTENNA TERMINA

Procedure:

1. Place the base unit in the Continuous Transmit mode (CH1, High power).

2. Measure the ANT OUT output of the RF module in the base unit using a peak power meter.

3. Confirm that the measured output is 80 mW (MIN 30 mW).

4. Also, execute steps 1 through 4 for the channels 10 and 20. CH10: 80 mW (MIN 30 mW) CH20: 75 mW (MIN 25 mW)

* For the frequency on each channel, see page 13.

2. Checking TX Center Frequency

Setting :

• short: TP918 ↔ TP919

frequency counter

+ –

Procedure:

1. Short TP918 and TP919 (GND) on the B ASE MAIN board in the base unit.

2. Place the base unit in the Continuous Transmit mode (CH1, High power).

3. Measure the ANT OUT frequency of the RF module in the base unit using a frequency counter.

4. Confirm that the measured frequency is 903.600 MHz ± 27 kHz.

5. Also, execute steps 1 through 4 for the channels 10 and 20.

ANTENNA TERMINA

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Page 21

6-2. HANDSET SECTION

P N

• Make the set in Test mode (see page 17)

1. Checking RX I & Q Output Level

Setting:

oscilloscope

+ –

SSG

Procedure:

1. Place the handset in the Continuous Receive mode (CH1, LNA, AGC ON).

2. Set the SSG frequency to the frequency on CH1 + 300 kHz, and the RF output level to –95 dBm.

3. Measure the output level of RXIN, RXIP, RXQN, and RXQP with a level meter. At this time, confirm with an oscilloscope that a sine wave of 300 kHz is output.

4. Confirm that the measured output level is –31.0 to –24.0 (TYPICAL –27.0) dBV. If IC502 was replaced (there is no ID data), the output level is –31.0 to –24.0 dBV.

5. Also, execute steps 1 through 4 for the channels 10 and 20.

level meter

–

TP520: RXIP TP521: RXIN TP522: RXQ TP523: RXQ

TP553: GND

ANTENNA TERMINA

3. Checking TX output

Setting:

peak power meter

+ –

ANTENNA TERMINA

Procedure:

1. Place the handset in the Continuous Transmit mode (CH1, High power).

2. Measure the ANT OUT output of the RF module in the handset using a peak power meter.

3. Confirm that the measured output is 80 mW (MIN 20 mW).

4. Also, execute steps 1 through 3 for the channels 10 and 20. CH10: 80 mW (MIN 20 mW) CH20: 50 mW (MIN 10 mW)

* For the frequency on each channel, see page 13.

2. Checking TX Center Frequency

Setting:

• short: TP555 ↔ TP553

frequency counter

+ –

ANTENNA TERMINA

Procedure:

1. Short TP555 and TP553 (GND) on the HAND MAIN board in the handset.

2. Place the handset in the Continuous Transmit mode (CH1, High power).

3. Measure the ANT OUT frequency of the RF module in the handset using a frequency counter .

4. Confirm that the measured frequency is 903.600 MHz ± 27 kHz.

5. Also, execute steps 1 through 4 for the channels 10 and 20.

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Page 22

Adjustment Location:

[BASE MAIN board]

(Side B)

SW951 T ˜ P

ANTENNA TERMINAL SSG : Checking RX I & Q Output leve frequency counter : Checking TX Center Frequenc peak power meter : Checking TX Output

TP918 and TP919 short : Checking TX Center Frequency

level meter : Checking RX I & Q Output Level

TP919: GND TP918: TEST

TP903: RXQN TP904: RXQP TP905: RXIN TP906: RXIP

CN902

CN901

RFU901

RF UNIT

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Page 23

[HAND MAIN board]

(Side A )

ANTENNA TERMINAL SSG : Checking RX I & Q Output leve frequency counter : Checking TX Center Frequenc peak power meter : Checking TX Output

CN501

S502

CN502

RFU501

RF UNIT

TP553: GND TP555: TEST

TP523: RXQN TP522: RXQP TP521: RXIN

TP520: RXIP

TP555 and TP553 short : Checking TX Center Frequency

level meter : Checking RX I & Q Output Level

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Page 24

SECTION 7

DIAGRAMS

7-1. BLOCK DIAGRAM – BASE UNIT Section –

SPP-SS964

ANT901

TELESCOPIC

ANTENNA

RFU901

RF UNIT

VBAT (FOR RX)

LNAATN

VBAT (FOR TX)

VBAT (FOR PLL)

TX.DATA

TXPWR0

TXPWR1

TXRXSW

SYNDATA

SYNCLK SYNSTB

REFOSC

• SIGNAL PATH : RX : TX : RX (INTERCOM) : TX (INTERCOM) : BELL

RXIP RXIN

RXQP

RXQN

RXEN

AGC

TXEN

SYNEN

CN901

1 6 5 4 3

8 7 2

CN902

4 5

6 3

11 13 15

SW951-2

DIAL MODE

SW952

RINGER

B+

Q751

Q750, 751 TX POWER

ATTENUATOR

D1002

LINE

OFF

Q750

B+

9.6MHz

B+

X752

RXIP

RXIN

RXQP

RXQN

LNAATN

RXEN

AGC

TXDATA

TXPWR0

TXPWR1

TXEN

TXRXSEL

SYNDATA

SYNCLK

SYNSTB

SYNEN

SYNTH5MCLK

LINE-LED

DIALMODE

RING MODE ON/OFF

XTALI

XTALO

ASIC

IC751

CDCDATAO

CDCFRAME

CDCICLK

CDCMCLK

CDCDATAI

AFC (BEEP)

DIALMUT

INTC & HOLD

KEY MATRIX

S1001 – 1019

RESETO

CTRL

CODEC

IC701

DATAI

32 28 26 27

59 95 20

KEY-OUT0 – KEY-OUT3KEY-IN0 – KEY-IN5

36, 35, 31, 2210 – 15

20 21 26 25

SW951-1

DIAL MODE

Q212, 213

FRAME ICLK MCLK RESETB

DATAO

AF AMP

NVDI

76 77

5 6

SDA

EEPROM

IC951

16 BIT

CONTROL

16 BIT

DIAL MUTE

SWITCH

Q214

26 23

NVDO

SCL

MODULATOR &

FILTER

MODULATOR &

FILTER

DTMF MUTE

SWITCH

RLI1 TLI1

HYBRID

RESETI

Q215

ATTENUATOR

CONTROL CIRCUIT

LEVEL DETECTOR

AMP

HTIHTO–

RESET SIGNAL

GENERATOR

IC602

SW601 RESET

SPEAKER

RXI

DIAL TONE DETECTOR

LINEO

LINE AMP

SPKPO

SPKMO

AMP

LINE-IN

LINE AMP

MICIN

MIC

AMP

B.P.F.

ATTENUATOR

VOICE SPEAKERPHONE

IC103

TXO

ATTENUATOR

B+

19 18

ARTO

B.P.F.

MUTE SWITCH

B.P.F.

RXO

VLC

RLI2

TLI2

TXI

D1001

CHARGE

INTERCOM

Q216

20 17

SPEAKER

VOLUME

MCO

PARKP

62 87

RV201

AF AMP

Q203, 204

INTERCOM

MUTE SWITCH

Q217

MCI

MIC

AMP

MUT

86 92

SPKEN

CHG-HIGH RATE

QUICK/NORMAL

CHARGE CONTROL

Q601, 655

DIAL MUTE

Q210

TEL AMP

Q201, 202

AF AMP

Q208, 209

VIN

POWER AMP

IC104

MIC501

MIC

AUDIO SYSTEM B+

DIGITAL SYSTEM B+

CHARGE DETECT

SP-MUT

VO1

VO2

Q653

TRANSFORMER

PROTECT

OFF HOOK MUTE

SWITCH

Q211

+5V

REGULATOR

IC603

+5V

REGULATOR

IC601

T101 LINE

Q101

LEVEL SHIFT

SP101

(SPEAKER)

Q852

BRANCH DETECT

PH102,

Q102, 103

BRANCH-DET

CHARGE

CONTROL

Q651, 652, 654

D105 – 108

HOOK ON/OFF

PH103

HOOK ON/OFF

CONTROL

Q207

OFFHOOK

ART

MJ101

LINE

RINGER DETECT

PH101

BUFFER

Q206

RINGIN

J601

–

DC IN 9V

–

CHARGE

TERMINAL

– 25 – – 26 –

Page 25

SPP-SS964

7-2. BLOCK DIAGRAM – HANDSET Section –

ANT501

(ANTENNA)

RFU501

RF UNIT

VBAT (FOR RX)

RXIP

RXIN RXQP RXQN

LNAATN

RXEN

AGC

VBAT (FOR TX)

VBAT (FOR PLL)

TX.DATA

TXPWR0

TXPWR1

TXEN

TXRXSW

SYNDATA

SYNCLK SYNSTB

SYNEN

REFOSC

1 6 5 4 3

8 7 2

4 5

3 12 11 13 15 14

CN501

CN502

B+

Q504

Q504, 505

TX POWER

ATTENUATOR

Q505

RXIP

RXIN

RXQP

RXQN

LNAATN

RXEN

AGC

TXDATA

TXPWR0

TXPWR1

TXEN

TXRXSEL

SYNDATA

SYNCLK

SYNSTB

SYNEN

SYNTH5MCLK

ASIC

IC501

CDCDATAO

CDCFRAME

CDCICLK

CDCMCLK

RESETO

CDCDATAI

NVDI

NVDO

CODEC

IC401

LINE AMP

LINEO

BUZZER DRIVE

Q502

BZ401

(BUZZER)

• SIGNAL PATH : RX : TX : BELL

DATAI

32 28 26 27

76 77

20 21 26 25

5 6

FRAME ICLK MCLK RESETB

DATAO

SKDI DO

EEPROM

IC502

16 BIT

CONTROL REGISTER

16 BIT

MODULATOR &

FILTER

MODULATOR &

FILTER

10 – 15

KEYPADI0 – KEYPADI5

KEY MATRIX

SW1 – 20, S502

KEYPADB0 – KEYPADB3

SPEAKER

AMP

LINE AMP

MIC

AMP

36, 35, 31, 22

SPKPO

SPKMO

LINE-IN

MICIN

19 18

MIC AMP

SW601

(JOG)

LIQUID CRYSTAL DISPLAY UNIT

69 70 39

JOG (A)

JOG (B)

6 – 9

D4 – D7

MIC401

(MIC)

SP401

(SPEAKER)

LCD501

78 67

LCDRW

LCDRS

LCDCS

B+ SWITCH

Q501

LCDPWRP

B+

XTALO

XTALI

97 98

X501

9.6MHz

S501 RING

RINGOFF

B+

OFF

RESETI

RESET SWITCH

Q302, 303

RESET SIGNAL

GENERATOR

IC301

B+

PARKP

RECHARGEABLE

BATTERY (BP-T24)

CHARGE ON

DETECT

Q301

ARTI

D301 – 304

LEVEL SHIFT

Q503

D305

ART

CHARGE

TERMINAL

–

– 27 –

– 28 –

Page 26

SPP-SS964

4 Vp-p

104 ns

7-3. NOTES FOR PRINTED WIRING BOARDS

AND SCHEMATIC DIAGRAMS

Note on Printed Wiring Board:

• X : parts extracted from the component side.

• Y : parts extracted from the conductor side.

• p : parts mounted on the conductor side.

• b : Pattern from the side which enables seeing.

Caution: Pattern face side: Parts on the pattern f ace side seen from (Side B) the pattern face are indicated. Parts face side: Parts on the parts face side seen from (Side A) the parts face are indicated.

• Indication of transistor.

These are omitted.

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

• All resistors are in Ω and 1/ specified.

• C : panel designation.

Note: The components identified by mark ! or dotted line

with mark ! are critical for safety. Replace only with part number specified.

• U : B+ Line.

• Power voltage is dc 9 V and fed with regulated dc power supply from external power voltage jack (J601 on the BASE MAIN board).

• Power voltage is dc 12 V and fed with regulated dc power supply from modular jack (MJ101 on the BASE MAIN board) with 100 Ω in series.

• Power voltage is dc 3.6 V and fed with regulated dc power supply from battery terminal (CN301 on the HAND MAIN board).

• Voltages and wavef orms are dc with respect to ground in test mode.

• Voltages are taken with a V OM (Input impedance 10 MΩ). Voltage variations may be noted due to normal production tolerances.

• Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances.

• Circled numbers refer to waveforms.

• Signal path.

N : RX F : RX(INTERCOM) O : TX e : TX(INTERCOM) P : bell

W or less unless otherwise

• Waveforms – BASE MAIN Board –

1 IC751 (¶ (XTALI)

– HAND MAIN Board –

1 IC501 (¶ (XTALI)

2.9 Vp-p

104 ns

– 29 –

– 30 –

Page 27

SPP-SS964

7-4. PRINTED WIRING BOARDS – BASE MAIN Board (Side A)/BASE MICROPHONE Board –

• Semiconductor Location (SIDE A)

Ref. No. Location

IC602 G-4 IC701 F-2 IC751 D-3 IC951 B-4

Q208 E-9 Q209 F-10 Q210 F-11 Q211 F-10

(Page 33)

– 31 –

(Page

41)

– 32 –

Page 28

7-5. PRINTED WIRING BOARD – BASE MAIN Board (Side B) –

SPP-SS964

• Semiconductor Location (SIDE B)

Ref. No. Location

D100 B-6 D102 B-11 D103 A-11 D104 C-11 D105 A-10 D106 A-10 D107 B-10 D108 B-10 D110 C-9 D601 I-9 D602 E-8 D603 I-9 D652 H-9 D653 H-9 D701 F-3 D702 F-3 D703 F-3 D704 H-2 D705 H-2

IC103 K-5 IC104 I-5 IC601 C-6 IC603 F-8

PH101 D-11 PH102 E-8 PH103 C-10

Q101 C-9 Q102 C-10 Q103 B-9 Q201 E-10 Q202 E-9 Q203 F-10 Q204 F-10 Q206 D-11 Q207 D-10 Q212 G-11 Q213 H-11 Q214 G-9 Q215 G-9 Q216 I-10 Q217 D-10 Q601 I-8 Q651 H-8 Q652 H-8 Q653 I-7 Q654 I-9 Q655 I-9 Q750 C-5 Q751 B-4 Q852 H-10

– 33 –

(Page 31)

– 34 –

Page 29

SPP-SS964

7-6. SCHEMATIC DIAGRAM – BASE MAIN Section (1/3) – • See page 30 for Waveform. • See page 47 for IC Block Diagrams.

(Page 42)

(Page 37)

– 35 –

(Page 39)

– 36 –

Page 30

7-7. SCHEMATIC DIAGRAM – BASE MAIN Section (2/3) – • See page 47 for IC Block Diagrams.

(Page

36)

SPP-SS964

(Page 39)

– 37 –

– 38 –

Page 31

SPP-SS964

7-8. SCHEMATIC DIAGRAM – BASE MAIN Section (3/3) – • See page 47 for IC Block Diagrams.

(Page

36)

(Page 37)

(Page 35)

– 39 –

– 40 –

Page 32

7-9. PRINTED WIRING BOARD – BASE KEY Section – 7-10. SCHEMATIC DIAGRAM – BASE KEY Section –

(Page 35)

SPP-SS964

(Page 31)

– 41 –

Note

• b : Pattern of the side which is seen. (Carbon pattern)

• : Pattern from the side which enables seeing.

– 42 –

Page 33

SPP-SS964

7-11. PRINTED WIRING BOARD – HAND MAIN Section –

• Semiconductor Location (SIDE A)

Ref. No. Location

D502 B-3 D503 B-3

Q501 A-3 Q504 C-2 Q505 C-2

• Semiconductor Location (SIDE B)

Ref. No. Location

D301 B-11 D302 B-10 D303 A-11 D304 A-10 D305 B-10 D306 A-9 D401 C-12 D402 C-12 D505 B-11

IC301 B-9 IC401 A-6 IC501 C-4 IC502 C-2

Q1 A-11 Q301 B-9 Q302 B-9 Q303 C-8 Q502 C-12 Q503 B-11

Note:

• Y : carbon pattern

– 43 –

– 44 –

Page 34

7-12. SCHEMATIC DIAGRAM – HAND MAIN Section – • See page 30 for Waveform. • See page 47 for IC Block Diagrams.

SPP-SS964

– 45 –

– 46 –

Page 35

• IC Block Diagrams

IC103 MC34118DW (BASE MAIN BOARD)

RLI1

CPR

GND

LEVEL

DETECTOR

LEVEL

DETECTOR

FILTER

AMP

RLO1

RXO

TLO1

2526 24

HYBRID

VCC

AMP 2

TLI1

RX ATTENUATOR

BACKGROUND

NOISE

DETECTOR

COMPARATOR

AGC

+ –

HTO+

HTO–

HYBRID

AMP 1

RXI

DIAL

TONE

DETECTOR

ATTENUATOR

CONTROL BLOCK

+ –

HTI

BACKGROUND

DETECTOR

COMPARATOR

TXO

IC401 10497-15 (HAND MAIN BOARD) IC701 10497-15 (BASE MAIN BOARD)

REFCNTL

XCLKONCICLK

FRAM

SPKPO

SPKMO

LINEO

1719 182021222324

RESETB

MCLK

DVSS DVDD DATAI

DATAO

25 26 27 28 29 30 31

16 BIT

REGISTOR

CONTROL REGISTOR

16 BIT

REGISTOR

MODULATOR

& FILTER

MODULATOR

& FILTER

2 345 6 7 8

NCNCNCNCNC

AGND

VREF

MICBIAS

NOISE

RLI2

RLO2

ATTENUATOR

TXI

VOXRNT VOXSND

15 14

AVDD LINE-IN

AVSS

MICIN

RBIAS

IC104 MC34119DR2 (BASE MAIN BOARD)

TLO2

LEVEL

DETECTOR

LEVEL

DETECTOR

MIC AMP

MCO

TLI2

CPT

VREF

+ –

VLC

MCI

MUT

VO2

GNDVcc

8 7 6 5

BIAS

CIRCUIT

CF 2

IC502 S-24C16AFJ-TB (HAND MAIN BOARD) IC951 S-24C02AFJ-TB (BASE MAIN BOARD)

VCC

START LOGIC

STOP

LOAD

R/W

TEST INPUT

CONTROL

LOGIC

WORD ADDRESS COUNTER

OUT

ACK

START CYCLE

XDEC

INC

SCL

CF 1

H.V. GENERATION

TIMING

& CONTROL

E PROM

32 x 32

DATA REGISTER

4321

YDEC

V in

7-13. IC PIN FUNCTION DESCRIPTION

• HAND MAIN BOARD IC501 M7012-11 (ASIC)

Pin No. Pin Name I/O Function

VO1

SDA

OUT

VSS

1 KEYPADB5 O 2D0I

3, 4 D1, D2 I/O

5D3I

6 to 9 D4 to D7 O

10 to 15

KEYPADI0 to

KEYPADI5

16 VSSC — 17 VDDC — 18 VDDP — 19 VSSC — 20 OSCI I 21 OSCO O 22 23

KEYPADB3 KEYPADB4

O 24 CDCDATAI I 25 CDCDATAO O 26 CDCMCLK O 27 RESETO O 28 CDCICLK O 29 VDDP — 30 VSSP — 31 KEYPADB2 O 32 CDCFRAME O 33 ARTI I 34 ARTO O

35, 36

KEYPADB1, KEYPADB0

37 GPIOB7 O 38 VDDP — 39 LCDCS O 40 VDDC — 41 VSSC — 42 TEST I 43 LNAATN O 44 RXEN O 45 VDDA — 46 VSSA — 47 VDDA — 48 VSSA — 49 TXDATA O 50 VRP O 51 RXIP I 52 RXIN I 53 RXQP I 54 RXQN I 55 NC —

Key output terminal Not used (open) Selection input of the model Fixed at “L” in this set Not used (open) Selection input of the test mode Not used (open) Serial data output to the liquid crystal display unit (LCD501)

Key return signal input from the key matrix “L” input when key pressing

Ground terminal (for core) Power supply terminal (+5V) (for core) Power supply terminal (+5V) (for pad) Ground terminal (for core) Sub system clock input terminal (32.768 kHz) Not used (open) Sub system clock output terminal (32.768 kHz) Not used (open) Key send signal output to the key matrix Key output terminal Not used (open) Transmit data input from the CODEC (IC401) Receive data output to the CODEC (IC401) Master clock signal output to the CODEC (IC401) Reset signal output to the CODEC (IC401) “L”: reset Interface clock signal output to the CODEC (IC401) Power supply terminal (+5V) (for pad) Ground terminal (for pad) Key send signal output to the key matrix Frame output to the CODEC (IC401) ART input from the base unit ART output terminal Not used (open)

Key send signal output to the key matrix

Not used (open) Power supply terminal (+5V) (for pad) Chip select signal output to the liquid crystal display unit (LCD501) “L” active Power supply terminal (+5V) (for core) Ground terminal (for core) Setting terminal for the test mode “L”: test mode Normally: fixed at “H” LNA gain selection signal output to the RF unit “H”: low gain RX system enable signal output to the RF unit “H”: enable Power supply terminal (+5V) (for analog) Ground terminal (for analog) Power supply terminal (+5V) (for analog) Ground terminal (for analog) Transmit data output to the RF unit Analog reference voltage output terminal Receive data (I positive) input from the RF unit Receive data (I negative) input from the RF unit Receive data (Q positive) input from the RF unit Receive data (Q negative) input from the RF unit Not used (open)

– 47 –

– 48 –

Page 36

Pin No. Pin Name I/O Function

56 IBIAS I 57 AGND — 58 BATTERY I 59 AFC O 60 AGC O 61 CALLER-ID O 62 PARKP I 63 VDDC — 64 VSSP — 65 SYNDATA O 66 SYNTH5MCLK O

67 LCDRS O

68 LED4 O 69 JOG (A) I 70 JOG (B) I 71 SYNCLK O 72 SYNSTB O 73 VDDP — 74 VSSP — 75 SYNEN O 76 NVDI I/O 77 NVDO O

78 LCDRW O

79 TXEN O 80 TXPWR1 O 81 GPIOB6 O 82 TXRXSEL O 83 RINGOFF I

84 BASEP I

85 TXPWR0 O

86, 87

100 VSSP —

GPIOB5, GPIOB0

88 GPIOA7 O 89 LED1 O 90 VDDC — 91 VSSC —

92 LCDPWRP O

93 SLEEP O 94 GPIOB4 O 95 NVCLK O

96 RESETI I

97 XTALI I 98 XTALO O 99 VDDP —

Analog bias input terminal Analog ground terminal Battery voltage detection input terminal Not used (open) Auto gain control signal output to the RF unit Not used (open) Charge detection input terminal “L”: charge on Power supply terminal (+5V) (for core) Ground terminal (for pad) Synthesizer data output to the RF unit Synthesizer reference oscillator output to the RF unit (9.62 MHz) Register selection signal output to the liquid crystal display unit (LCD501)

“L”: instruction register, “H”: data register LED drive signal output terminal “L”: LED on Not used (open) Jog dial pulse input of the rotary encoder (SW601) (A phase input) Jog dial pulse input of the rotary encoder (SW601) (B phase input) Synthesizer clock signal output to the RF unit Synthesizer strobe signal output to the RF unit Power supply terminal (+5V) (for pad) Ground terminal (for pad) Synthesizer power control signal output to the RF unit “H”: enable Two-way data bus with the EEPROM (IC502) Clock signal output to the EEPROM (IC502) Data read/write selection signal output to the liquid crystal display unit (LCD501)

“L”: data write, “H”: data read TX system enable signal output to the RF unit “H”: enable PA power selection signal output to the RF unit Not used (open) TX/RX selection signal output to the RF unit “L”: RX, “H”: TX RING on/off switch (S501) input terminal “L”: ringer off, “H”: ringer on Setting terminal for the base/handset selection

“L”: base unit, “H”: handset unit (CMOS receiver with pull-up) PA power selection signal output to the RF unit

Not used (open) Muting control signal output for the speaker amplifier “H” active Not used (open) LED drive signal output terminal “L”: LED on Not used (open) Power supply terminal (+5V) (for core) Ground terminal (for core) Power on/off control signal output for the liquid crystal display unit (LCD501)

“L”: power on, “H”: power off Not used (open) Not used (open) Not used (open) System reset signal input from the reset signal generator (IC301) “L”: reset

For several hundreds msec. after the power supply rises, “L” is input, then it changes to “H” Main system clock input terminal (9.6 MHz) Main system clock output terminal (9.6 MHz) Power supply terminal (+5V) (for pad) Ground terminal (for pad)

– 49 –

Page 37

• BASE MAIN BOARD IC751 C7311-11 (ASIC)

Pin No. Pin Name I/O Function

1 KEY-OUT5 O 2D0I

3, 4 D1, D2 O

5D3I

6 to 9 D4 to D7 O

10 to 15

16 VSSC — 17 VDDC — 18 VDDP — 19 VSSC —

22 23 24 CDCDATAI I 25 CDCDATAO O 26 CDCMCLK O 27 RESETO O 28 CDCICLK O 29 VDDP — 30 VSSP — 31 KEY-OUT2 O 32 CDCFRAME O 33 ARTI I 34 ARTO O

35, 36

37 OFFHOOK O 38 VDDP — 39 LCDCS O 40 VDDC — 41 VSSC — 42 TEST I 43 LNAATN O 44 RXEN O 45 VDDA — 46 VSSA — 47 VDDA — 48 VSSA — 49 TXDATA O 50 VRP O 51 RXIP I 52 RXIN I 53 RXQP I

KEY-IN0 to

KEY-IN5

INTC & HOLD

CTRL

RING MODE

ON/OFF KEY-OUT3 KEY-OUT4

KEY-OUT1, KEY-OUT0

Key output terminal Not used (open) Selection input of the model (fixed at “L” in this set) Not used (open) Not used (open) Not used (open)

Key return signal input from the key matrix “L” input when key pressing

Ground terminal (for core) Power supply terminal (+5V) (for core) Power supply terminal (+5V) (for pad) Ground terminal (for core) Intercom and hold control signal output terminal

“H”: intercom and hold status, Others: “L”

RINGER switch (SW952) input terminal “L”: ringer off, “H”: ringer on

Key send signal output to the key matrix

Key output terminal Not used (open) Transmit data input from the CODEC (IC701) Receive data output to the CODEC (IC701) Master clock signal output to the CODEC (IC701) Reset signal output to the CODEC (IC701) “L”: reset Interface clock signal output to the CODEC (IC701) Power supply terminal (+5V) (for pad) Ground terminal (for pad) Key send signal output to the key matrix Frame output to the CODEC (IC701) ART input terminal Not used (fixed at “H”) ART output to the handset unit

Key send signal output to the key matrix

Hook on/off control signal output terminal “L”: on hook, “H”: off hook Power supply terminal (+5V) (for pad) Chip select signal output for the liquid crystal display Not used (open) Power supply terminal (+5V) (for core) Ground terminal (for core) Setting terminal for the test mode “L”: test mode Normally: fixed at “H” LNA gain selection signal output to the RF unit “H”: low gain RX system enable signal output to the RF unit “H”: enable Power supply terminal (+5V) (for analog) Ground terminal (for analog) Power supply terminal (+5V) (for analog) Ground terminal (for analog) Transmit data output to the RF unit Analog reference voltage output terminal Receive data (I positive) input from the RF unit Receive data (I negative) input from the RF unit Receive data (Q positive) input from the RF unit

– 50 –

Page 38

Pin No. Pin Name I/O Function

54 RXQN I

55 NC —

56 IBIAS I

57 AGND —

58 POWERDOWN I

59 AFC (BEEP) O

60 AGC O

61 MT-CLK O

62 PARKP I

63 VDDC —

64 VSSP —

65 SYNDATA O

66 SYNTH5MCLK O

67 LCD REG-SET O

68 LINE-LED O

69 MT-INT I

70 MT-DATA I

71 SYNCLK O

72 SYNSTB O

73 VDDP —

74 VSSP —

75 SYNEN O

76 NVDI I/O

77 NVDO O

78 LCD-R/W O

79 TXEN O

80 TXPWR1 O

81 RINGIN I

82 TXRXSEL O

83 VCHG-MON I

84 BASEP I

85 TXPWR0 O

86 SPKEN O

88 DIALMODE I

90 VDDC —

91 VSSC —

92 SP-MUT O

93 MT-FSK-EN O

94 BRANCH-DET I

95 DIALMUT O

96 RESETI I

CHG-HIGH

RATE

NEW-CALL LED

Receive data (Q negative) input from the RF unit Not used (open) Analog bias input terminal Analog ground terminal Battery voltage detection input terminal “L”: power down Beep tone signal output terminal Auto gain control signal output to the RF unit Not used (open) Charge detection input terminal “L”: charge on Power supply terminal (+5V) (for core) Ground terminal (for pad) Synthesizer data output to the RF unit Synthesizer reference oscillator output to the RF unit (9.62 MHz) Register selection signal output for the liquid crystal display

“L”: instruction register, “H”: data register Not used (open) LED drive signal output of the LINE LED (D1002) “L”: LED on Caller-ID interrupt input terminal “L” active Not used (open) Caller-ID data input terminal Not used (open) Synthesizer clock signal output to the RF unit Synthesizer strobe signal output to the RF unit Power supply terminal (+5V) (for pad) Ground terminal (for pad) Synthesizer power control signal output to the RF unit “H”: enable Two-way data bus with the EEPROM (IC951) Clock signal output to the EEPROM (IC951) Data read/write selection signal output for the liquid crystal display

“L”: data write, “H”: data read Not used (open) TX system enable signal output to the RF unit “H”: enable PA power selection signal output to the RF unit Detection signal input of the ringer coming “L”: ringer coming TX/RX selection signal output to the RF unit “L”: RX, “H”: TX Battery charge monitor input terminal Setting terminal for the base/handset selection

“L”: base unit, “H”: handset unit (fixed at “L” in this set) PA power selection signal output to the RF unit Enable control signal output to the voice speakerphone (IC103) “L”: enable, “H”: CD Quick/normal charge selection signal output terminal

“L”: normal charge, “H”: quick charge Dial mode switch (SW951) input terminal “L”: pulse, “H”: tone

New arrival call ID LED drive signal output terminal “L”: LED on Not used (open) Power supply terminal (+5V) (for core) Ground terminal (for core) Speaker muting on/off control signal output to the power amplifier (IC104) “H”: muting Caller-ID frequency shift keying enable signal output terminal Not used (open) Reserve cancellation detect signal input terminal “H”: cancel status Reception muting during dial transmission “H”: during dial transmission System reset signal input from the reset signal generator (IC602) “L”: reset

For several hundreds msec. after the power supply rises, “L” is input, then it changes to “H”

– 51 –

Page 39

Pin No. Pin Name I/O Function

97 XTALI I 98 XTALO O 99 VDDP —

100 VSSP —

Main system clock input terminal (9.6 MHz) Main system clock output terminal (9.6 MHz) Power supply terminal (+5V) (for pad) Ground terminal (for pad)

– 52 –

Page 40

SECTION 8

EXPLODED VIEWS

NOTE:

• -XX and -X mean standardized parts, so they may have some difference from the original one.

• Color Indication of Appearance Parts Example: KNOB, BALANCE (WHITE) . . . (RED)

↑↑

Parts Color Cabinet's Color

(1) HANDSET SECTION

not supplied

LCD501

SP401

ANT501

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• The mechanical parts with no reference number in the exploded views are not supplied.

• Hardware (# mark) list and accessories and packing materials are given in the last of the electrical parts list.

RFU501

Ref. No. Part No. Description Remark

1 3-012-362-41 CABINET (FRONT) 2 3-371-005-01 GASKET (RECEIVER) (TWN) 3 3-012-365-01 HOLDER (SP) 4 3-012-363-11 CABINET (REAR) 5 X-3375-670-1 LID ASSY, BATTERY CASE

Ref. No. Part No. Description Remark

12 3-935-520-01 CUSHION (BATTERY) 13 3-028-552-01 SHEET (COPPER LEAF. RF) 14 3-029-168-01 SHEET (COPPER LEAF. RF) (B) 15 3-935-518-01 CUSHION (MICROPHONE) 16 3-012-368-01 HOLDER (LCD)

* 7 A-3622-273-A HAND MAIN BOARD, COMPLETE

8 1-771-066-21 SWITCH, RUBBER KEY (HAND) 9 3-012-366-01 TERMINAL (HAND), CHARGE

* 10 3-033-764-01 CUSHION (MIC) * 11 3-012-367-31 PANEL

ANT501 1-501-933-21 ANTENNA LCD501 1-475-241-11 LCD UNIT RFU501 1-475-890-11 RF UNIT SP401 1-504-829-11 SPEAKER (28mm)

– 53 –

Page 41

(2) BASESET SECTION

SP101

not supplied

ANT901

RFU901

Ref. No. Part No. Description Remark * 51 1-671-562-11 BASE KEY BOARD

52 1-771-364-11 SWITCH, RUBBER KEY (BASE) 53 3-024-958-01 BUTTON (12 KEY) 54 3-023-909-01 TERMINAL (CHARGE B/S) 55 3-024-956-02 CABINET (UPPER)

56 3-024-955-01 HOLDER (HAND SET) 57 3-024-963-01 SHEET (LCD), ADHESIVE 58 3-024-959-21 PANEL (LCD) 59 3-910-956-01 HOLDER (MIC)

* 60 1-671-565-11 BASE MICROPHONE BOARD

Ref. No. Part No. Description Remark * 63 A-3622-274-A BASE MAIN BOARD, COMPLETE

64 3-029-168-01 SHEET (COPPER LEAF. RF) (B) 65 3-030-066-01 SHEET (COPPER LEAF. RF) (C) 66 3-936-696-21 FOOT, RUBBER 67 X-3375-888-2 CABINET (LOWER) ASSY

68 3-026-909-01 SHEET (RESET BUTTON)

* 69 3-031-600-01 CUSHION (for PWB) * 70 3-031-601-02 CUSHION (for SHIELD PLATE)

ANT901 1-501-998-11 ANTENNA, ROD RFU901 1-475-890-11 RF UNIT

not supplied

61 3-015-461-01 BRACKET (SP STOPPER) 62 3-018-253-01 CUSHION (BATTERY)

SP101 1-505-802-11 SPEAKER (5.7cm)

– 54 –

Page 42

SECTION 9

ELECTRICAL PARTS LIST

BASE KEY

BASE MAIN

NOTE:

• Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.

• -XX and -X mean standardized parts, so they may have some difference from the original one.

• RESISTORS All resistors are in ohms. METAL: Metal-film resistor. METAL OXIDE: Metal oxide-film resistor. F: nonflammable

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

* 1-671-562-11 BASE KEY BOARD

**************

< LED >

D1001 8-719-946-48 LED SLN210LT (CHARGE) D1002 8-719-055-05 LED PY2222S-B2 (LINE)

************************************************************

* A-3622-274-A BASE MAIN BOARD, COMPLETE

*************************

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• SEMICONDUCTORS In each case, u: µ, for example: uA. . : µA. . uPA. . : µPA. . uPB. . : µPB. . uPC. . : µPC. . uPD. . : µPD. .

• CAPACITORS uF: µF

• COILS uH: µH

C214 1-163-165-00 CERAMIC CHIP 22PF 5% 50V C216 1-126-933-11 ELECT 100uF 20% 16V C217 1-163-038-00 CERAMIC CHIP 0.1uF 25V C218 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C219 1-163-001-11 CERAMIC CHIP 220PF 10% 50V

C220 1-126-963-11 ELECT 4.7uF 20% 50V C221 1-126-934-11 ELECT 220uF 20% 10V C222 1-163-169-00 CERAMIC CHIP 33PF 5% 50V C223 1-163-023-00 CERAMIC CHIP 0.015uF 5% 50V C224 1-163-239-11 CERAMIC CHIP 33PF 5% 50V

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

When indicating parts by reference number, please include the board.

3-018-253-01 CUSHION (BATTERY) 3-029-168-01 SHEET (COPPER LEAF. RF) (B) 3-030-066-01 SHEET (COPPER LEAF. RF) (C)

* 3-031-600-01 CUSHION (for PWB) * 3-031-601-02 CUSHION (for SHIELD PLATE)

7-685-134-19 SCREW +BTP 2.6X8 TYPE2 N-S

< CAPACITOR >

C101 1-162-117-00 CERAMIC 100PF 10% 500V C105 1-162-318-11 CERAMIC 0.001uF 10% 500V C106 1-162-318-11 CERAMIC 0.001uF 10% 500V C107 1-162-318-11 CERAMIC 0.001uF 10% 500V C108 1-162-318-11 CERAMIC 0.001uF 10% 500V

C109 1-136-193-11 FILM 0.47uF 10% 250V C110 1-126-961-11 ELECT 2.2uF 20% 50V C111 1-126-966-11 ELECT 33uF 20% 50V C112 1-124-234-00 ELECT 22uF 20% 16V C113 1-126-157-11 ELECT 10uF 20% 16V

C157 1-163-023-00 CERAMIC CHIP 0.015uF 5% 50V C201 1-126-967-11 ELECT 47uF 20% 50V C202 1-163-038-00 CERAMIC CHIP 0.1uF 25V C203 1-126-961-11 ELECT 2.2uF 20% 50V C204 1-126-961-11 ELECT 2.2uF 20% 50V

C205 1-163-035-00 CERAMIC CHIP 0.047uF 50V C206 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V C207 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C208 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C209 1-126-961-11 ELECT 2.2uF 20% 50V

C210 1-126-961-11 ELECT 2.2uF 20% 50V C211 1-126-967-11 ELECT 47uF 20% 50V C212 1-163-038-00 CERAMIC CHIP 0.1uF 25V C213 1-126-965-11 ELECT 22uF 20% 50V C214 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C226 1-126-963-11 ELECT 4.7uF 20% 50V C227 1-126-960-11 ELECT 1uF 20% 50V C228 1-163-001-11 CERAMIC CHIP 220PF 10% 50V C229 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V C230 1-126-933-11 ELECT 100uF 20% 16V

C231 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C232 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C233 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C234 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C235 1-126-967-11 ELECT 47uF 20% 50V

C236 1-126-964-11 ELECT 10uF 20% 50V C237 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C238 1-163-989-11 CERAMIC CHIP 0.033uF 10% 25V C240 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C241 1-163-019-00 CERAMIC CHIP 0.0068uF 10% 50V

C242 1-163-251-11 CERAMIC CHIP 100PF 5% 50V C243 1-124-234-00 ELECT 22uF 20% 16V C244 1-126-157-11 ELECT 10uF 20% 16V C245 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C246 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V

C247 1-163-001-11 CERAMIC CHIP 220PF 10% 50V C248 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C249 1-164-346-11 CERAMIC CHIP 1uF 16V C250 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V C251 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V

C252 1-126-964-11 ELECT 10uF 20% 50V C253 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C254 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C255 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C256 1-163-005-11 CERAMIC CHIP 470PF 10% 50V

C257 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V C258 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C259 1-126-965-11 ELECT 22uF 20% 50V C260 1-163-239-11 CERAMIC CHIP 33PF 5% 50V

– 55 –

Page 43

BASE MAIN

Ref. No. Part No. Description Remark

C261 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C262 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C267 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C270 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C271 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C272 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C273 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C277 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C278 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C280 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C281 1-163-239-11 CERAMIC CHIP 33PF 5% 50V

C282 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C283 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C285 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C287 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C288 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C289 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C291 1-163-031-11 CERAMIC CHIP 0.01uF 50V C292 1-124-589-11 ELECT 47uF 20% 16V C293 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C297 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C299 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C300 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C301 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C302 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V C303 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C304 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C305 1-163-011-11 CERAMIC CHIP 0.0015uF 10% 50V C309 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C310 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C311 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C312 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C313 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C314 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C315 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C316 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C317 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C318 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C319 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C320 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C323 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C324 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C326 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C327 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C328 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C330 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C331 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C335 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C336 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C337 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C339 1-163-239-11 CERAMIC CHIP 33PF 5% 50V

C340 1-163-033-00 CERAMIC CHIP 0.022uF 50V C601 1-163-033-00 CERAMIC CHIP 0.022uF 50V C602 1-163-033-00 CERAMIC CHIP 0.022uF 50V C605 1-163-038-00 CERAMIC CHIP 0.1uF 25V C606 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V

C607 1-126-916-11 ELECT 1000uF 20% 6.3V

Ref. No. Part No. Description Remark

C608 1-164-505-11 CERAMIC CHIP 2.2uF 16V C609 1-126-963-11 ELECT 4.7uF 20% 50V C611 1-163-033-00 CERAMIC CHIP 0.022uF 50V C612 1-163-033-00 CERAMIC CHIP 0.022uF 50V

C615 1-163-038-00 CERAMIC CHIP 0.1uF 25V C616 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C617 1-126-916-11 ELECT 1000uF 20% 6.3V C619 1-126-963-11 ELECT 4.7uF 20% 50V C650 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C652 1-164-222-11 CERAMIC CHIP 0.22uF 25V C700 1-164-346-11 CERAMIC CHIP 1uF 16V C701 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C702 1-164-222-11 CERAMIC CHIP 0.22uF 25V C703 1-163-031-11 CERAMIC CHIP 0.01uF 50V

C704 1-126-925-11 ELECT 470uF 20% 10V C705 1-164-222-11 CERAMIC CHIP 0.22uF 25V C706 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C707 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C708 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C709 1-163-031-11 CERAMIC CHIP 0.01uF 50V C710 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C712 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V C713 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V C714 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

C715 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C716 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C717 1-164-505-11 CERAMIC CHIP 2.2uF 16V C751 1-163-031-11 CERAMIC CHIP 0.01uF 50V C754 1-163-031-11 CERAMIC CHIP 0.01uF 50V

C755 1-126-964-11 ELECT 10uF 20% 50V C756 1-163-031-11 CERAMIC CHIP 0.01uF 50V C757 1-164-222-11 CERAMIC CHIP 0.22uF 25V C758 1-164-222-11 CERAMIC CHIP 0.22uF 25V C759 1-163-031-11 CERAMIC CHIP 0.01uF 50V

C760 1-163-031-11 CERAMIC CHIP 0.01uF 50V C762 1-163-251-11 CERAMIC CHIP 100PF 5% 50V C766 1-163-031-11 CERAMIC CHIP 0.01uF 50V C767 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C768 1-163-237-11 CERAMIC CHIP 27PF 5% 50V

C901 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C902 1-163-031-11 CERAMIC CHIP 0.01uF 50V C903 1-163-031-11 CERAMIC CHIP 0.01uF 50V C904 1-163-031-11 CERAMIC CHIP 0.01uF 50V C951 1-163-031-11 CERAMIC CHIP 0.01uF 50V

< CONNECTOR >

* CN202 1-506-998-11 PIN, CONNECTOR (PC BOARD) 2P * CN601 1-506-999-11 PIN, CONNECTOR (PC BOARD) 3P

CN802 1-566-010-11 PIN, CONNECTOR (PC BOARD) 13P

* CN901 1-779-773-11 PIN, CONNECTOR (PC BOARD) 8P * CN902 1-779-774-11 PIN, CONNECTOR (PC BOARD) 16P

< DIODE >

D100 8-719-991-33 DIODE 1SS133T-77 D102 8-719-109-89 DIODE RD5.6ESB2 D103 8-719-109-89 DIODE RD5.6ESB2 D104 8-719-991-33 DIODE 1SS133T-77 D105 8-719-970-02 DIODE 1SR139-400

– 56 –

Page 44

BASE MAIN

Ref. No. Part No. Description Remark

D106 8-719-970-02 DIODE 1SR139-400 D107 8-719-970-02 DIODE 1SR139-400 D108 8-719-970-02 DIODE 1SR139-400 D110 8-719-160-55 DIODE RD12F-B1 D601 8-719-109-57 DIODE RD2.4ES-B2

D602 8-719-991-33 DIODE 1SS133T-77 D603 8-719-938-75 DIODE SB05-05CP D652 8-719-991-33 DIODE 1SS133T-77 D653 8-719-991-33 DIODE 1SS133T-77 D701 8-719-991-33 DIODE 1SS133T-77

D702 8-719-991-33 DIODE 1SS133T-77 D703 8-719-991-33 DIODE 1SS133T-77 D704 8-719-991-33 DIODE 1SS133T-77 D705 8-719-991-33 DIODE 1SS133T-77

< FUSE >

F101 1-533-542-11 FUSE (0.5A/250V)

< IC >

IC103 8-759-030-78 IC MC34118DW IC104 8-759-463-98 IC MC34119DR2 IC601 8-759-482-72 IC uPC29M05HF IC602 8-759-519-46 IC S-80730AN-DT-S IC603 8-759-482-72 IC uPC29M05HF

IC701 8-759-530-12 IC 10497-15 IC751 8-759-534-65 IC C7311-11 IC951 8-759-487-04 IC S-24C02AFJ-TB

< JACK >

J601 1-778-380-11 JACK,DC (POLARITY UNIFIED TYPE)

(DC IN 9V)

Ref. No. Part No. Description Remark

L202 1-414-481-11 INDUCTOR 68nH L601 1-410-468-11 INDUCTOR 6.8uH

L602 1-410-468-11 INDUCTOR 6.8uH L611 1-410-468-11 INDUCTOR 6.8uH L612 1-410-468-11 INDUCTOR 6.8uH L750 1-412-945-11 INDUCTOR 3.3uH

< MODULAR JACK >

MJ101 1-766-250-11 JACK, MODULAR (2C) 6P (LINE)

< PHOTO COUPLER >

PH101 8-719-156-73 PHOTO COUPLER PS2501-1LA PH102 8-719-156-73 PHOTO COUPLER PS2501-1LA PH103 8-749-011-58 PHOTO COUPLER PS2533-1

< TRANSISTOR >

Q101 8-729-032-66 TRANSISTOR 2SC5069-TD Q102 8-729-026-49 TRANSISTOR 2SA1037AK-T146-R Q103 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q201 8-729-026-49 TRANSISTOR 2SA1037AK-T146-R Q202 8-729-120-28 TRANSISTOR 2SC1623-L5L6

Q203 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q204 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q206 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q207 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q208 8-729-120-28 TRANSISTOR 2SC1623-L5L6

Q209 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q210 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q211 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q212 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q213 8-729-120-28 TRANSISTOR 2SC1623-L5L6

< SHORT >

JR13 1-216-296-00 SHORT 0 JR14 1-216-296-00 SHORT 0 JR15 1-216-296-00 SHORT 0 JR16 1-216-296-00 SHORT 0 JR20 1-216-296-00 SHORT 0

JR21 1-216-296-00 SHORT 0 JR24 1-216-296-00 SHORT 0 JR25 1-216-296-00 SHORT 0 JR26 1-216-296-00 SHORT 0 JR27 1-216-296-00 SHORT 0

JR28 1-216-296-00 SHORT 0 JR29 1-216-295-00 SHORT 0 JR30 1-216-295-00 SHORT 0 JR150 1-216-295-00 SHORT 0 JR201 1-216-295-00 SHORT 0

JR202 1-216-296-00 SHORT 0 JR203 1-216-295-00 SHORT 0 JR204 1-216-296-00 SHORT 0 JR205 1-216-295-00 SHORT 0 JR206 1-216-295-00 SHORT 0

< COIL >

L101 1-410-470-11 INDUCTOR 10uH L102 1-410-470-11 INDUCTOR 10uH L201 1-414-481-11 INDUCTOR 68nH

Q214 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q215 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q216 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q217 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q601 8-729-120-28 TRANSISTOR 2SC1623-L5L6

Q651 8-729-922-34 TRANSISTOR 2SD1758F5-QR Q652 8-729-026-49 TRANSISTOR 2SA1037AK-T146-R Q653 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q654 8-729-026-49 TRANSISTOR 2SA1037AK-T146-R Q655 8-729-120-28 TRANSISTOR 2SC1623-L5L6

Q750 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q751 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q852 8-729-120-28 TRANSISTOR 2SC1623-L5L6

< RESISTOR/COIL >

R101 1-215-877-11 METAL OXIDE 22K 5% 1W R102 1-215-861-00 METAL OXIDE 47 5% 1W R103 1-215-859-00 METAL OXIDE 22 5% 1W R104 1-216-073-00 METAL CHIP 10K 5% 1/10W R105 1-216-105-00 RES,CHIP 220K 5% 1/10W

R106 1-216-065-00 RES,CHIP 4.7K 5% 1/10W R107 1-216-073-00 METAL CHIP 10K 5% 1/10W R108 1-216-105-00 RES,CHIP 220K 5% 1/10W R109 1-216-113-00 METAL CHIP 470K 5% 1/10W R110 1-249-417-11 CARBON 1K 5% 1/4W

R111 1-216-037-00 METAL CHIP 330 5% 1/10W

– 57 –

Page 45

BASE MAIN

Ref. No. Part No. Description Remark

R154 1-216-085-00 METAL CHIP 33K 5% 1/10W R201 1-216-097-00 RES,CHIP 100K 5% 1/10W R202 1-216-093-00 RES,CHIP 68K 5% 1/10W R203 1-216-049-11 RES,CHIP 1K 5% 1/10W

R204 1-216-085-00 METAL CHIP 33K 5% 1/10W R205 1-216-073-00 METAL CHIP 10K 5% 1/10W R206 1-216-109-00 METAL CHIP 330K 5% 1/10W R207 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R208 1-216-025-00 RES,CHIP 100 5% 1/10W

R209 1-216-073-00 METAL CHIP 10K 5% 1/10W R210 1-216-025-00 RES,CHIP 100 5% 1/10W R211 1-216-089-00 RES,CHIP 47K 5% 1/10W R212 1-216-073-00 METAL CHIP 10K 5% 1/10W R213 1-216-109-00 METAL CHIP 330K 5% 1/10W

R214 1-216-109-00 METAL CHIP 330K 5% 1/10W R215 1-216-069-00 METAL CHIP 6.8K 5% 1/10W R216 1-216-041-00 METAL CHIP 470 5% 1/10W R217 1-216-049-11 RES,CHIP 1K 5% 1/10W R218 1-216-089-00 RES,CHIP 47K 5% 1/10W

R219 1-216-097-00 RES,CHIP 100K 5% 1/10W R220 1-216-105-00 RES,CHIP 220K 5% 1/10W R221 1-216-073-00 METAL CHIP 10K 5% 1/10W R222 1-216-073-00 METAL CHIP 10K 5% 1/10W R223 1-216-073-00 METAL CHIP 10K 5% 1/10W

R224 1-216-025-00 RES,CHIP 100 5% 1/10W R225 1-216-077-00 METAL CHIP 15K 5% 1/10W R226 1-216-105-00 RES,CHIP 220K 5% 1/10W R227 1-216-109-00 METAL CHIP 330K 5% 1/10W R228 1-216-065-00 RES,CHIP 4.7K 5% 1/10W

R229 1-216-049-11 RES,CHIP 1K 5% 1/10W R230 1-216-105-00 RES,CHIP 220K 5% 1/10W R231 1-216-093-00 RES,CHIP 68K 5% 1/10W R232 1-216-077-00 METAL CHIP 15K 5% 1/10W R233 1-216-025-00 RES,CHIP 100 5% 1/10W

R234 1-216-073-00 METAL CHIP 10K 5% 1/10W R235 1-216-053-00 METAL CHIP 1.5K 5% 1/10W R236 1-216-097-00 RES,CHIP 100K 5% 1/10W R237 1-216-097-00 RES,CHIP 100K 5% 1/10W R238 1-216-073-00 METAL CHIP 10K 5% 1/10W

R239 1-216-085-00 METAL CHIP 33K 5% 1/10W R240 1-216-073-00 METAL CHIP 10K 5% 1/10W R241 1-216-097-00 RES,CHIP 100K 5% 1/10W R242 1-216-085-00 METAL CHIP 33K 5% 1/10W R243 1-216-109-00 METAL CHIP 330K 5% 1/10W

R244 1-216-097-00 RES,CHIP 100K 5% 1/10W R245 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R246 1-216-113-00 METAL CHIP 470K 5% 1/10W R247 1-216-025-00 RES,CHIP 100 5% 1/10W R248 1-216-113-00 METAL CHIP 470K 5% 1/10W

R249 1-216-049-11 RES,CHIP 1K 5% 1/10W R252 1-216-089-00 RES,CHIP 47K 5% 1/10W R253 1-216-089-00 RES,CHIP 47K 5% 1/10W R254 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R255 1-216-089-00 RES,CHIP 47K 5% 1/10W

R256 1-216-097-00 RES,CHIP 100K 5% 1/10W R257 1-414-481-11 INDUCTOR 68nH R258 1-216-101-00 METAL CHIP 150K 5% 1/10W R259 1-216-049-11 RES,CHIP 1K 5% 1/10W

Ref. No. Part No. Description Remark

R260 1-216-097-00 RES,CHIP 100K 5% 1/10W

R261 1-216-109-00 METAL CHIP 330K 5% 1/10W R262 1-216-025-00 RES,CHIP 100 5% 1/10W R263 1-216-065-00 RES,CHIP 4.7K 5% 1/10W R264 1-216-089-00 RES,CHIP 47K 5% 1/10W R265 1-216-113-00 METAL CHIP 470K 5% 1/10W

R266 1-216-089-00 RES,CHIP 47K 5% 1/10W R267 1-216-089-00 RES,CHIP 47K 5% 1/10W R268 1-216-105-00 RES,CHIP 220K 5% 1/10W R269 1-216-097-00 RES,CHIP 100K 5% 1/10W R270 1-216-105-00 RES,CHIP 220K 5% 1/10W

R271 1-216-025-00 RES,CHIP 100 5% 1/10W R272 1-216-013-00 METAL CHIP 33 5% 1/10W R273 1-216-077-00 METAL CHIP 15K 5% 1/10W R274 1-216-041-00 METAL CHIP 470 5% 1/10W R275 1-216-065-00 RES,CHIP 4.7K 5% 1/10W

R276 1-216-081-00 METAL CHIP 22K 5% 1/10W R277 1-216-081-00 METAL CHIP 22K 5% 1/10W R278 1-216-097-00 RES,CHIP 100K 5% 1/10W R279 1-216-101-00 METAL CHIP 150K 5% 1/10W R280 1-216-089-00 RES,CHIP 47K 5% 1/10W

R281 1-216-049-11 RES,CHIP 1K 5% 1/10W R282 1-216-065-00 RES,CHIP 4.7K 5% 1/10W R283 1-216-049-11 RES,CHIP 1K 5% 1/10W R284 1-216-041-00 METAL CHIP 470 5% 1/10W R285 1-216-069-00 METAL CHIP 6.8K 5% 1/10W

R286 1-216-049-11 RES,CHIP 1K 5% 1/10W R287 1-216-049-11 RES,CHIP 1K 5% 1/10W R291 1-216-097-00 RES,CHIP 100K 5% 1/10W R292 1-216-025-00 RES,CHIP 100 5% 1/10W R293 1-216-295-00 SHORT 0

R294 1-216-081-00 METAL CHIP 22K 5% 1/10W R295 1-216-081-00 METAL CHIP 22K 5% 1/10W R296 1-216-073-00 METAL CHIP 10K 5% 1/10W R300 1-216-311-00 METAL CHIP 6.8 5% 1/10W R601 1-216-069-00 METAL CHIP 6.8K 5% 1/10W

R602 1-216-073-00 METAL CHIP 10K 5% 1/10W R643 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R650 1-249-403-11 CARBON 68 5% 1/4W R651 1-249-403-11 CARBON 68 5% 1/4W R652 1-216-057-00 METAL CHIP 2.2K 5% 1/10W

R653 1-249-393-11 CARBON 10 5% 1/4W R654 1-216-105-00 RES,CHIP 220K 5% 1/10W R655 1-216-101-00 METAL CHIP 150K 5% 1/10W R656 1-216-097-00 RES,CHIP 100K 5% 1/10W R657 1-216-089-00 RES,CHIP 47K 5% 1/10W

R658 1-216-041-00 METAL CHIP 470 5% 1/10W R659 1-216-101-00 METAL CHIP 150K 5% 1/10W R660 1-216-037-00 METAL CHIP 330 5% 1/10W R661 1-249-389-11 CARBON 4.7 5% 1/4W R662 1-216-081-00 METAL CHIP 22K 5% 1/10W

R664 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R670 1-249-387-11 CARBON 3.3 5% 1/4W R671 1-249-387-11 CARBON 3.3 5% 1/4W R700 1-216-065-00 RES,CHIP 4.7K 5% 1/10W R701 1-216-025-00 RES,CHIP 100 5% 1/10W

R702 1-218-754-11 METAL CHIP 120K 0.5% 1/10W

– 58 –

Page 46

BASE MAIN BASE MICROPHONE HAND MAIN

Ref. No. Part No. Description Remark

R703 1-216-009-00 RES,CHIP 22 5% 1/10W R704 1-216-081-00 METAL CHIP 22K 5% 1/10W R705 1-216-025-00 RES,CHIP 100 5% 1/10W R706 1-216-041-00 METAL CHIP 470 5% 1/10W

R708 1-216-065-00 RES,CHIP 4.7K 5% 1/10W R709 1-216-081-00 METAL CHIP 22K 5% 1/10W R714 1-216-041-00 METAL CHIP 470 5% 1/10W R715 1-216-041-00 METAL CHIP 470 5% 1/10W R716 1-216-041-00 METAL CHIP 470 5% 1/10W

R717 1-216-041-00 METAL CHIP 470 5% 1/10W R718 1-216-041-00 METAL CHIP 470 5% 1/10W R719 1-216-041-00 METAL CHIP 470 5% 1/10W R720 1-216-041-00 METAL CHIP 470 5% 1/10W R721 1-216-041-00 METAL CHIP 470 5% 1/10W

R722 1-216-041-00 METAL CHIP 470 5% 1/10W R723 1-216-041-00 METAL CHIP 470 5% 1/10W R724 1-216-041-00 METAL CHIP 470 5% 1/10W R725 1-216-041-00 METAL CHIP 470 5% 1/10W R727 1-216-041-00 METAL CHIP 470 5% 1/10W

R730 1-216-041-00 METAL CHIP 470 5% 1/10W R731 1-216-041-00 METAL CHIP 470 5% 1/10W R732 1-216-041-00 METAL CHIP 470 5% 1/10W R733 1-216-041-00 METAL CHIP 470 5% 1/10W R734 1-216-081-00 METAL CHIP 22K 5% 1/10W

R736 1-216-041-00 METAL CHIP 470 5% 1/10W R750 1-216-033-00 METAL CHIP 220 5% 1/10W R751 1-216-073-00 METAL CHIP 10K 5% 1/10W R753 1-216-041-00 METAL CHIP 470 5% 1/10W R754 1-216-045-00 METAL CHIP 680 5% 1/10W

Ref. No. Part No. Description Remark

R914 1-216-041-00 METAL CHIP 470 5% 1/10W

R954 1-216-073-00 METAL CHIP 10K 5% 1/10W R955 1-216-089-00 RES,CHIP 47K 5% 1/10W R956 1-216-089-00 RES,CHIP 47K 5% 1/10W R957 1-216-073-00 METAL CHIP 10K 5% 1/10W

< RF UNIT >

RFU901 1-475-890-11 RF UNIT

< VARIABLE RESISTOR >

RV201 1-223-862-11 RES, VAR, SLIDE 20K/20K

(SPEAKER VOLUME)

< SPARK GAP >

SG101 1-533-751-11 ABSORBER, SURGE

< SWITCH >

SW601 1-571-532-32 SWITCH, TACTIL (RESET) SW951 1-692-990-21 SWITCH, SLIDE (DIAL MODE) SW952 1-692-991-11 SWITCH, SLIDE (RINGER)

< TRANSFORMER >

T101 1-431-832-11 TRANSFORMER, LINE

< VIBRATOR >

X752 1-767-566-21 VIBRATOR, CRYSTAL (9.6MHz)

************************************************************

R755 1-216-073-00 METAL CHIP 10K 5% 1/10W R759 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R760 1-216-073-00 METAL CHIP 10K 5% 1/10W R761 1-216-041-00 METAL CHIP 470 5% 1/10W R762 1-216-073-00 METAL CHIP 10K 5% 1/10W

R764 1-216-041-00 METAL CHIP 470 5% 1/10W R765 1-216-001-00 METAL CHIP 10 5% 1/10W R766 1-218-754-11 METAL CHIP 120K 0.5% 1/10W R767 1-216-097-00 RES,CHIP 100K 5% 1/10W R768 1-216-049-11 RES,CHIP 1K 5% 1/10W

R769 1-216-065-00 RES,CHIP 4.7K 5% 1/10W R771 1-216-121-00 RES,CHIP 1M 5% 1/10W R772 1-216-025-00 RES,CHIP 100 5% 1/10W R781 1-216-041-00 METAL CHIP 470 5% 1/10W R782 1-216-017-00 RES,CHIP 47 5% 1/10W

R787 1-216-041-00 METAL CHIP 470 5% 1/10W R790 1-216-041-00 METAL CHIP 470 5% 1/10W R792 1-216-041-00 METAL CHIP 470 5% 1/10W R793 1-216-041-00 METAL CHIP 470 5% 1/10W R794 1-216-041-00 METAL CHIP 470 5% 1/10W

R798 1-216-049-11 RES,CHIP 1K 5% 1/10W R800 1-216-017-00 RES,CHIP 47 5% 1/10W R801 1-216-041-00 METAL CHIP 470 5% 1/10W R802 1-216-041-00 METAL CHIP 470 5% 1/10W R803 1-216-041-00 METAL CHIP 470 5% 1/10W

* 1-671-565-11 BASE MICROPHONE BOARD

**********************

3-910-956-01 HOLDER (MIC)

< CAPACITOR >

C0 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C501 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C502 1-163-235-11 CERAMIC CHIP 22PF 5% 50V

< COIL >

L501 1-414-481-11 INDUCTOR 68nH L502 1-414-481-11 INDUCTOR 68nH

< MICROPHONE >

MIC501 1-542-118-11 MICROPHONE, ELECTRET CONDENSER (MIC)

************************************************************

* A-3622-273-A HAND MAIN BOARD, COMPLETE

**************************

3-012-368-01 HOLDER (LCD) 3-028-552-01 SHEET (COPPER LEAF.RF) 3-029-168-01 SHEET (COPPER LEAF.RF) (B) 3-935-518-01 CUSHION (MICROPHONE) 7-685-134-19 SCREW +BTP 2.6X8 TYPE2 N-S

R902 1-216-041-00 METAL CHIP 470 5% 1/10W R904 1-216-097-00 RES,CHIP 100K 5% 1/10W R906 1-216-033-00 METAL CHIP 220 5% 1/10W R913 1-216-041-00 METAL CHIP 470 5% 1/10W

< BUZZER >

BZ401 1-544-603-11 BUZZER

– 59 –

Page 47

HAND MAIN

Ref. No. Part No. Description Remark

< CAPACITOR >

C0 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C1 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C3 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C4 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C5 1-163-239-11 CERAMIC CHIP 33PF 5% 50V

C6 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C8 1-164-182-11 CERAMIC CHIP 0.0033uF 10% 50V C9 1-125-822-11 TANTALUM 10uF 20% 10V C14 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V C16 1-125-822-11 TANTALUM 10uF 20% 10V

C17 1-125-822-11 TANTALUM 10uF 20% 10V C19 1-125-822-11 TANTALUM 10uF 20% 10V C301 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C302 1-163-031-11 CERAMIC CHIP 0.01uF 50V C303 1-163-031-11 CERAMIC CHIP 0.01uF 50V

C307 1-163-031-11 CERAMIC CHIP 0.01uF 50V C308 1-164-005-11 CERAMIC CHIP 0.47uF 25V C401 1-163-031-11 CERAMIC CHIP 0.01uF 50V C402 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C403 1-163-031-11 CERAMIC CHIP 0.01uF 50V

C404 1-164-222-11 CERAMIC CHIP 0.22uF 25V C407 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C410 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C412 1-107-682-11 CERAMIC CHIP 1uF 10% 16V C413 1-125-822-11 TANTALUM 10uF 20% 10V

C415 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C416 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C420 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C501 1-163-235-11 CERAMIC CHIP 22PF 5% 50V C502 1-163-237-11 CERAMIC CHIP 27PF 5% 50V

C505 1-163-031-11 CERAMIC CHIP 0.01uF 50V C506 1-163-031-11 CERAMIC CHIP 0.01uF 50V C507 1-162-974-11 CERAMIC CHIP 0.01uF 50V C508 1-163-031-11 CERAMIC CHIP 0.01uF 50V C509 1-124-779-00 ELECT CHIP 10uF 20% 16V

C510 1-163-031-11 CERAMIC CHIP 0.01uF 50V C511 1-164-222-11 CERAMIC CHIP 0.22uF 25V C512 1-164-222-11 CERAMIC CHIP 0.22uF 25V C513 1-163-031-11 CERAMIC CHIP 0.01uF 50V C514 1-162-919-11 CERAMIC CHIP 22PF 5% 50V

C515 1-126-603-11 ELECT CHIP 4.7uF 20% 35V C516 1-163-251-11 CERAMIC CHIP 100PF 5% 50V C523 1-163-031-11 CERAMIC CHIP 0.01uF 50V C530 1-126-603-11 ELECT CHIP 4.7uF 20% 35V C555 1-164-346-11 CERAMIC CHIP 1uF 16V

C585 1-163-031-11 CERAMIC CHIP 0.01uF 50V

< CONNECTOR >

CN301 1-766-180-11 PIN, CONNECTOR (PC BOARD) 2P

* CN302 1-506-985-11 PIN, CONNECTOR (PC BOARD) 3P * CN401 1-506-984-11 PIN, CONNECTOR (PC BOARD) 2P * CN501 1-779-773-11 PIN, CONNECTOR (PC BOARD) 8P * CN502 1-779-774-11 PIN, CONNECTOR (PC BOARD) 16P

Ref. No. Part No. Description Remark

< DIODE >

D301 8-719-938-75 DIODE SB05-05CP D302 8-719-938-75 DIODE SB05-05CP D303 8-719-938-75 DIODE SB05-05CP D304 8-719-938-75 DIODE SB05-05CP D305 8-719-914-43 DIODE DAN202K

D306 8-719-066-61 DIODE RD5.6P-T1 D401 8-719-914-43 DIODE DAN202K D402 8-719-914-43 DIODE DAN202K D502 8-719-914-42 DIODE DA204K D503 8-719-914-42 DIODE DA204K

D505 8-719-914-42 DIODE DA204K

< IC >

IC301 8-759-519-46 IC S-80730AN-DT-S IC401 8-759-530-12 IC 10497-15 IC501 8-759-534-64 IC M7012-11 IC502 8-759-487-05 IC S-24C16AFJ-TB

< SHORT >

JR1 1-216-296-00 SHORT 0 JR2 1-216-296-00 SHORT 0 JR3 1-216-296-00 SHORT 0 JR4 1-216-296-00 SHORT 0 JR5 1-216-295-00 SHORT 0

JR6 1-216-295-00 SHORT 0 JR7 1-216-295-00 SHORT 0 JR10 1-216-295-00 SHORT 0 JR15 1-216-296-00 SHORT 0 JR18 1-216-296-00 SHORT 0

JR20 1-216-296-00 SHORT 0 JR21 1-216-295-00 SHORT 0 JR24 1-216-295-00 SHORT 0

< COIL >

L501 1-410-198-51 INDUCTOR CHIP 3.3uH

< LIQUID CRYSTAL DISPLAY >

LCD501 1-475-241-11 LCD UNIT

< MICROPHONE >

MIC401 1-542-118-11 MICROPHONE, ELECTRET CONDENSER

< TRANSISTOR >

Q1 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q301 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q302 8-729-026-49 TRANSISTOR 2SA1037AK-T146-R Q303 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q501 8-729-026-49 TRANSISTOR 2SA1037AK-T146-R

Q502 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q503 8-729-026-49 TRANSISTOR 2SA1037AK-T146-R Q504 8-729-120-28 TRANSISTOR 2SC1623-L5L6 Q505 8-729-120-28 TRANSISTOR 2SC1623-L5L6

CN503 1-568-237-11 CONNECTOR, FPC (1.0MM)(ZIF)14P

< RESISTOR/CAPACITOR/COIL >

R1 1-216-295-00 SHORT 0

– 60 –

Page 48

HAND MAIN

Ref. No. Part No. Description Remark

R2 1-164-344-11 CERAMIC CHIP 0.068uF 10% 25V R3 1-216-097-00 RES,CHIP 100K 5% 1/10W R4 1-414-481-11 INDUCTOR 68nH R5 1-216-065-00 RES,CHIP 4.7K 5% 1/10W

R7 1-414-481-11 INDUCTOR 68nH R8 1-216-081-00 METAL CHIP 22K 5% 1/10W R9 1-216-081-00 METAL CHIP 22K 5% 1/10W R11 1-216-295-00 SHORT 0 R12 1-216-295-00 SHORT 0

R13 1-216-295-00 SHORT 0 R14 1-216-295-00 SHORT 0 R17 1-216-033-00 METAL CHIP 220 5% 1/10W R18 1-216-295-00 SHORT 0 R19 1-216-041-00 METAL CHIP 470 5% 1/10W

R20 1-216-295-00 SHORT 0 R21 1-216-295-00 SHORT 0 R22 1-216-053-00 METAL CHIP 1.5K 5% 1/10W R30 1-216-101-00 METAL CHIP 150K 5% 1/10W R301 1-216-093-00 RES,CHIP 68K 5% 1/10W

R302 1-216-085-00 METAL CHIP 33K 5% 1/10W R303 1-216-097-00 RES,CHIP 100K 5% 1/10W R304 1-216-069-00 METAL CHIP 6.8K 5% 1/10W R305 1-216-073-00 METAL CHIP 10K 5% 1/10W R308 1-216-089-00 RES,CHIP 47K 5% 1/10W

R309 1-216-073-00 METAL CHIP 10K 5% 1/10W R310 1-216-049-11 RES,CHIP 1K 5% 1/10W R311 1-216-097-00 RES,CHIP 100K 5% 1/10W R312 1-216-089-00 RES,CHIP 47K 5% 1/10W R401 1-216-017-00 RES,CHIP 47 5% 1/10W

R402 1-218-754-11 METAL CHIP 120K 0.5% 1/10W R410 1-216-097-00 RES,CHIP 100K 5% 1/10W R413 1-216-033-00 METAL CHIP 220 5% 1/10W R414 1-216-033-00 METAL CHIP 220 5% 1/10W R415 1-216-061-00 METAL CHIP 3.3K 5% 1/10W

Ref. No. Part No. Description Remark

R542 1-216-296-00 SHORT 0

R544 1-216-817-11 METAL CHIP 470 5% 1/16W R545 1-216-805-11 METAL CHIP 47 5% 1/16W R546 1-216-821-11 METAL CHIP 1K 5% 1/16W R547 1-216-864-11 METAL CHIP 0 5% 1/16W R548 1-216-295-00 SHORT 0

R549 1-216-295-00 SHORT 0 R550 1-216-295-00 SHORT 0 R551 1-216-041-00 METAL CHIP 470 5% 1/10W R552 1-216-041-00 METAL CHIP 470 5% 1/10W R554 1-216-817-11 METAL CHIP 470 5% 1/16W

R555 1-216-817-11 METAL CHIP 470 5% 1/16W R556 1-216-817-11 METAL CHIP 470 5% 1/16W R557 1-216-017-00 RES,CHIP 47 5% 1/10W R558 1-216-041-00 METAL CHIP 470 5% 1/10W R560 1-216-041-00 METAL CHIP 470 5% 1/10W

R570 1-216-073-00 METAL CHIP 10K 5% 1/10W R571 1-216-073-00 METAL CHIP 10K 5% 1/10W R572 1-216-073-00 METAL CHIP 10K 5% 1/10W R573 1-216-073-00 METAL CHIP 10K 5% 1/10W R574 1-216-097-00 RES,CHIP 100K 5% 1/10W

R575 1-216-097-00 RES,CHIP 100K 5% 1/10W R580 1-216-073-00 METAL CHIP 10K 5% 1/10W R582 1-216-073-00 METAL CHIP 10K 5% 1/10W R583 1-216-045-00 METAL CHIP 680 5% 1/10W R584 1-216-833-11 METAL CHIP 10K 5% 1/16W

R585 1-216-813-11 METAL CHIP 220 5% 1/16W R586 1-216-073-00 METAL CHIP 10K 5% 1/10W R587 1-216-298-00 METAL CHIP 2.2 5% 1/10W R590 1-216-041-00 METAL CHIP 470 5% 1/10W R591 1-216-041-00 METAL CHIP 470 5% 1/10W

R593 1-216-827-11 METAL CHIP 3.3K 5% 1/16W R594 1-216-827-11 METAL CHIP 3.3K 5% 1/16W

R501 1-216-121-00 RES,CHIP 1M 5% 1/10W R502 1-216-025-00 RES,CHIP 100 5% 1/10W R506 1-216-001-00 METAL CHIP 10 5% 1/10W R507 1-218-754-11 METAL CHIP 120K 0.5% 1/10W R508 1-218-754-11 METAL CHIP 120K 0.5% 1/10W

R509 1-218-756-11 METAL CHIP 150K 0.5% 1/10W R510 1-216-073-00 METAL CHIP 10K 5% 1/10W R511 1-216-121-00 RES,CHIP 1M 5% 1/10W R513 1-216-821-11 METAL CHIP 1K 5% 1/16W R514 1-216-097-00 RES,CHIP 100K 5% 1/10W

R515 1-216-065-00 RES,CHIP 4.7K 5% 1/10W R517 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R527 1-216-073-00 METAL CHIP 10K 5% 1/10W R528 1-216-097-00 RES,CHIP 100K 5% 1/10W R529 1-216-073-00 METAL CHIP 10K 5% 1/10W

R530 1-216-049-11 RES,CHIP 1K 5% 1/10W R531 1-216-049-11 RES,CHIP 1K 5% 1/10W R532 1-216-049-11 RES,CHIP 1K 5% 1/10W R533 1-216-049-11 RES,CHIP 1K 5% 1/10W R534 1-216-295-00 SHORT 0

R536 1-216-049-11 RES,CHIP 1K 5% 1/10W R537 1-216-049-11 RES,CHIP 1K 5% 1/10W R538 1-216-049-11 RES,CHIP 1K 5% 1/10W R539 1-216-295-00 SHORT 0

< RF UNIT >

RFU501 1-475-890-11 RF UNIT

< SWITCH/ROTARY ENCODER >

S501 1-692-991-11 SWITCH, SLIDE (RING) S502 1-570-909-21 SWITCH, TACTIL (REFLOW TYPE)

(TALK/FLASH)

SW601 1-475-338-11 ENCODER, ROTARY (JOG)

< VIBRATOR >

X501 1-767-566-21 VIBRATOR, CRYSTAL (9.6MHz)

************************************************************

MISCELLANEOUS

**************

8 1-771-066-21 SWITCH, RUBBER KEY (HAND) 52 1-771-364-11 SWITCH, RUBBER KEY (BASE) ANT501 1-501-933-21 ANTENNA ANT901 1-501-998-11 ANTENNA, ROD SP101 1-505-802-11 SPEAKER (5.7cm)

SP401 1-504-829-11 SPEAKER (28mm)

************************************************************

– 61 –

Page 49

SPP-SS964

Ref. No. Part No. Description Remark

**************

HARDWARE LIST

**************

#1 7-685-650-79 SCREW +P 3X16 TYPE2 NON-SLIT #2 7-685-135-19 SCREW +BTP 2.6X10 TYPE2 N-S #3 7-685-134-19 SCREW +BTP 2.6X8 TYPE2 N-S #4 7-685-648-79 SCREW +P 3X12 TYPE2 NON-SLIT

************************************************************

ACCESSORIES & PACKING MATERIALS

*******************************

! 1-473-475-61 ADAPTOR, AC (AC-T46)

1-528-884-21 BATTERY, NICKEL CADMIUM(BP-T24) 1-696-454-11 CORD (WITH MODULAR PLUG)(LINE)

(2m15cm) 3-012-379-21 CASE (WALL HOOK) 3-026-932-01 LABEL (ADRESS. B)

3-862-955-11 MANUAL, INSTRUCTION

(ENGLISH, SPANISH, PORTUGUESE)

X-3368-367-1 SCREW ASSY

************************************************************

Ref. No. Part No. Description Remark

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

Sony Corporation

Personal & Mobile Communication Company9-926-431-11

– 62 –

Published by Quality Assurance Dept.

99A057021-1

Sony SPP-SS964 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

SERVICING NOTES

GENERAL

DISASSEMBLY

900 MHz SYSTEM OPERATION

TEST MODE

ELECTRICAL ADJUSTMENTS

DIAGRAMS

EXPLODED VIEWS

ELECTRICAL PARTS LIST