Sony SPP-888 Service Manual

SPP-888

SERVICE MANUAL

Base phone Cordless

SPECIFICATIONS

General

Dial signal

Tone, 10 PPS (pulse) selectable

Supplied accessories

See page 3.

Cordless handset

Power source

Rechargeable battery pack BP-T16

Battery life

Standby: Approx. 8 days Talk: Approx. 6 hours

Battery charging time

Approx. 12 hours

Dimensions

Approx. 54 × 195 × 49 mm (w/h/d), antenna excluded (approx. 2 1/4 × 7 3/4 × 1 15/16 inches) Antenna: Approx. 285 mm (approx. 11 1/4 inches)

Mass

Approx. 255 g (approx. 8 oz), battery included

E Model

handset

Base phone

Power source

DC 9V from AC power adaptor

Dimensions

Approx. 185 × 95 × 215 mm (w/h/d), antenna excluded (approx. 7 3/8 × 3 3/4 × 8 1/2 inches) Antenna: Approx. 700 mm (approx. 27 5/8 inches)

Mass

Approx. 755 g (approx. 27 oz)

Cordless handset charge cradle

Power source

DC 9V from AC power adaptor

Dimensions

Approx. 68 × 90 × 220 mm (w/h/d) (approx. 2 3/4 × 3 5/8 × 8 3/4 inches)

Mass

Approx. 180 g (approx. 6 oz), wall bracket included

Design and specifications are subject to change without notice.

MICROFILM

CORDLESS TELEPHONE

TABLE OF CONTENTS

1. GENERAL

Read this first........................................................................... 3

Checking the package contents ...............................................3

Setting up the base phone ........................................................ 3

Preparing the battery pack ....................................................... 4

Making calls ............................................................................ 4

Receiving calls......................................................................... 6

One-touch dialing .................................................................... 6

Speed dialing ........................................................................... 7

Phone Directory....................................................................... 7

Switching the phones during a call.......................................... 9

Talking between the phones (Intercom) .................................. 9

Voice paging ............................................................................ 9

Transferring a call..................................................................10

First digit “0” call restriction ................................................. 10

Changing the digital security code ........................................ 11

Mounting the cordless handset charge cradle........................ 11

2. DISASSEMBLY

2-1. Cabinet (Lower) ................................................................ 13

2-2. Base LCD Board ............................................................... 13

2-3. Base Key Board................................................................. 14

2-4. Base Mic Board................................................................. 14

2-5. Base Main Board............................................................... 15

2-6. Cabinet (Rear) ................................................................... 15

2-7. Hand Main Board .............................................................. 16

4. ELECTRICAL ADJUSTMENTS

Base Phone Section ............................................................... 22

Handset Section ..................................................................... 24

5. DIAGRAMS

5-1. IC Pin Description............................................................. 26

5-2. Block Diagram –Base Phone Section– ............................. 27

5-3. Block Diagram –Handset Section– ................................... 28

5-4. Printed Wiring Board –Base Key Section– ....................... 29

5-5. Schematic Diagram –Base Key Section–.......................... 29

5-6. Printed Wiring Boards –Base Main Section–.................... 30

5-7. Schematic Diagram –Base Main (1/3) Section– ............... 31

5-8. Schematic Diagram –Base Main (2/3) Section– ............... 32

5-9. Schematic Diagram –Base Main (3/3) Section– ............... 33

5-10. Printed Wiring Board –Base LCD Section–...................... 34

5-11. Schematic Diagram –Base LCD Section– ........................ 35

5-12. Printed Wiring Board –Hand Main Section– .................... 36

5-13. Schematic Diagram –Hand Main Section– ....................... 37

5-14. Printed Wiring Board –Hand Key Section– ...................... 38

5-15. Schematic Diagram –Hand Key Section–......................... 39

6. EXPLODED VIEWS

6-1. Base Phone Section ........................................................... 44

6-2. Handset Section................................................................. 45

7. ELECTRICAL PARTS LIST ........................................ 46

3. TEST MODE

Base Phone Section ............................................................... 17

Handset Section ..................................................................... 19

Notes on Chip Component Replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PAR TS WHOSE P ART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

SECTION 1

GENERAL

This section is extracted from instruction manual.

456789101112

SECTION 2

DISASSEMBLY

Note : Follow the disassembly procedure in the numerical order given.

2-1. CABINET (LOWER)

P3x10

cabinet (lower)

P3x1

2-2. BASE LCD BOARD

CN301

BTP2.6x8

BASE LCD board

2-3. BASE KEY BOARD

CN302

BASE KEY board

BTP2.6x8

2-4. BASE MIC BOARD

Unsolder the 2 places.

BTP2.6x8

BASE MIC board

2-5. BASE MAIN BOARD

BASE MAIN board

BTP2.6x8

Unsolder the 2 places.

2-6. CABINET (REAR)

claw

cabinet (rear)

claws

battery case lid (hand)

BTP 2.6x10

claws

2-7. HAND MAIN BOARD

discharge gap (CP101)

Unsolder the

3 places.

HAND MAIN board

!™

HAND KEY board

Unsolder.

!¢

speaker

Unsolder.

BTP 2x8

1 CN3

BVTP 2x8

Unsolder.



!£

claws

Unsolder.

!¡

charge terminals (hand)

SECTION 3

TEST MODE

BASE PHONE SECTION

MANUAL TEST MODE

Set the Test Mode:

1. Set the DIAL MODE switch to “P” (pulse).

2. While pressing the INTERCOM key, insert the AC adaptor (Reset start).

3. With the INTERCOM key, still held down, switch the DIAL MODE switch “T” (tone) n “P” (pulse).

4. When the INTERCOM key is released, test mode starts.

Release the Test Mode:

1. Pull out the AC adaptor or turn off the power.

MACHINE TEST MODE

Set the Test Mode:

1. Connect between TP306 (TEST SW) and GND.

2. Set the Channel Setting terminal (See page 18.)

3. Turn on the power to start the test mode.

Release the Test Mode:

1. Pull out the AC adaptor or turn off the power.

2. Remove the short plug and turn on the power again.

OPERATION AT START OF TEST MODE

• The ringer sounds for 500 msec.

• Setting of channel: CH1 for manual test mode and the Channel Setting terminal for machine test mode. (See page 18.)

• TX is set ON and the handset is allowed to call outside. RSSI is set to Hi sensitivity.

• Liquid crystal display panel is turned ON for 1 sec. and then the channel is displayed (for example, Ch1 CH1=01). LINE LED and back light are to be still ON. The pulse dial “0” is output once.

OPERATION IN TEST MODE

• In test mode, RSSI is continuously monitored. LINE LED is turned ON with RSSI (Low) and OFF without RSSI (High).

• In test mode, any key input is continuously monitored. Each key input causes the set to switch to the state as listed below.

TP337 TP335

– base main board (conductor side) –

TP320

TP306

TP336 TP334

+ 37 hidden pages