Sony SCDXB-790 Service manual

SCD-XB790
General
Laser Semiconductor laser
(Super Audio CD: λ = 650 nm) (CD: λ = 780 nm) Emission duration: continuous
Laser radiant power: 5.47 uW at 650 nm *These output is the value measured at a distance of about 200mm from the objective lens surface on the optical pick-up.
Power requirements 230 V AC, 50/60 Hz
Power consumption 25 W
Dimensions (w/h/d) 430 × 111 × 283 mm incl. projecting
parts
Mass (approx.) 5.8 kg
Supplied accessories
• Audio connecting cord Stereo cable (1)
•Remote commander RM-SX700 (1)
• R06 (size-AA) batteries (2)
Design and specifications are subject to change without notice.
SERVICE MANUAL
Ver 1.0 2003.04
SPECIFICATIONS
When a super audio CD is played
Playing frequency range 2 Hz to 100 kHz
Frequency response 2 Hz to 50 kHz (–3 dB)
Dynamic range 104 dB or more
Total har monic distortion rate
Wow and flutter Val ue of measurable limit (±0.001 %
When a CD is played
Frequency response 2 Hz to 20 kHz
Dynamic range 99 dB or more
Total har monic distortion rate
Wow and flutter Val ue of measurable limit (±0.001 %
0.0018 % or less
W. PEAK) or less
0.002 % or less
W. PEAK) or less
Output connector
Jack type
Output level
Phono
ANALOG OUT
DIGITAL (CD) OUT OPTICAL*
DIGITAL (CD) OUT COAXIAL*
PHONES
*Output only the audio signals of the CD
jacks
Square optical output connector
Coaxial output connector
Stereo phone jack
2 Vrms (at 50 kilohms)
–18 dBm
0.5 Vp-p
10 mW
AEP Model
UK Model
Model Name Using Similar Mechanism SCD-XB780 CD Mechanism Type CDM66B-DVBU6B Base Unit Name DVBU-6B Optical Pick-up Name KHM-234AMA
Load impedance
Over 10 kilohms
Light emitting wave length:
( )
660 nm
75 ohms
32 ohms
9-877-171-01 Sony Corporation
2003D0500-1 Home Audio Company C 2003.04 Published by Sony Engineering Corporation
SUPER AUDIO CD PLAYER
SCD-XB790
This appliance is classified as a CLASS 1 LASER product. This label is located on the rear exterior.
The following caution label is located inside the unit.

TABLE OF CONTENTS

1. SERVICING NOTES ............................................... 3
2. GENERAL ................................................................... 6
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 8
3-2. Case ................................................................................. 9
3-3. Front Panel Section ......................................................... 9
3-4. AUDIO Board, MAIN Board.......................................... 10
3-5. Mechanism Deck (CDM66B-DVBU6B) ....................... 10
3-6. Base Unit (DVBU-6B).................................................... 11
4. TEST MODE.............................................................. 12
5. DIAGRAMS
5-1. Block Diagram – RF/SERVO Section –........................ 20
5-2. Block Diagram – SERVO Section –.............................. 21
5-3. Block Diagram – MAIN Section – ................................ 22
5-4. Block Diagram – AUDIO Section – .............................. 23
5-5. Block Diagram – DISPLAY/KEY CONTROL/
POWER SUPPLY Section – ........................................... 24
5-6. Notes for Printed Wiring Boards and
Schematic Diagrams ....................................................... 25
5-7. Schematic Diagram – RF Board – ................................. 26
5-8. Printed Wiring Boards
– RF/LOADING Boards – .............................................. 27
5-9. Printed Wiring Board
– MAIN Board (Component Side) – .............................. 28
5-10. Printed W iring Board
– MAIN Board (Conductor Side) – ................................ 29
5-11. Schematic Diagram
– MAIN (1/5)/ LOADING Boards – ............................. 30
5-12. Schematic Diagram – MAIN Board (2/5) – .................. 31
5-13. Schematic Diagram – MAIN Board (3/5) – .................. 32
5-14. Schematic Diagram – MAIN Board (4/5) – .................. 33
5-15. Schematic Diagram – MAIN Board (5/5) – .................. 34
5-16. Schematic Diagram – A UDIO/HP Boards – ................. 35
5-17. Printed W iring Board
– AUDIO Board (Component Side) – ............................ 36
5-18. Printed W iring Boards
– AUDIO (Conductor Side)/HP Boards – ..................... 37
5-19. Printed Wiring Boards – DISPLAY/KEY Boards –...... 38
5-20. Schematic Diagram – DISPLAY/KEY Boards – .......... 39
5-21. Printed W iring Boards
– POWER/POWER SW/PT Boards – ............................ 40
5-22. Schematic Diagram
– POWER/POWER SW/PT Boards – ............................ 41
5-23. IC Pin Function Description ........................................... 49
6. EXPLODED VIEWS
6-1. Case Section .................................................................... 61
6-2. Front Panel Section ......................................................... 62
6-3. Chassis Section ............................................................... 63
6-4. Mechanism Deck Section (CDM66B-DVBU6B) .......... 64
6-5. Base Unit Section (DVBU-6B)....................................... 65
Notes on chip component replacement
•Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam­aged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 ˚C dur­ing repairing.
• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra­diation exposure.
7. ELECTRICAL PARTS LIST ............................... 66
2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB­LISHED BY SONY.
SECTION 1

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro­static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis­sion, observe from more than 30 cm away from the objecti ve lens.
CLEANING OF OPTICAL PICK-UP LENS
In cleaning the lens of optical pick-up, use the air blower. Never use a cotton swab for cleaning the lens of optical pick-up, which otherwise causes a trouble.
SCD-XB790
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURNS OFF
tray
A
cam (66)
tapering driver
1
Insert a tapering driver (3 mm in diameter) in the hole at the bottom of the unit, turn the cam (66) fully in the direction of arrow A.
3
SCD-XB790
DISPLAY BOARD SERVICE POSITION
In checking the DISPLAY board, prepare jig (extension cable J-2501-200-A : 1.00 mm Pitch, 11 cores, Length 300 mm.)
MAIN board
CN706
DISPLAY board
CN801
Note: Follow the assembly procedure in the numerical order given.
INSTALLATION OF THE TRANS BOARD
Note : Solder the TRANS board after installing power transformers (T901, T902)
to the chassis. (To prevent the TRANS board from being cracked.)
3
four screws (PTTWH3
×
6)
4
Connect jig (extension cable J-2501-200-A) to the DISPLAY board (CN801) and MAIN board (CN706).
5
Solder seventeen portions.
four screws
3
(PTTWH3
×
6)
2
power transformer (T902)
1
power transformer (T901)
4
RESETTING OPERATION AT POWER ON
If the power is turned on with a disc loaded in the set, a sequence of operation as shown below will be performed. (The operation varies depending on the type of disc) Condition: continue mode
SCD-XB790
(1) CD
1. Sled reverse move (sled in)
2. Disc detect
3. IC setting for CD
4. Servo error signal offset auto adjustment
5. Spindle kick for LD on
6. LD on
7. Focus search
8. Focus servo on
9. Spindle kick
10. Spindle servo on
11. E-F balance auto adjustment
12. Tracking & sled servo on
13. Focus bias auto adjustment
14. Focus servo gain auto adjustment
15. Tracking servo gain auto adjustment
16. Jump to lead-in area
17. Read TOC
18. Stop
(2) SACD (single layer)
1. Sled reverse move (sled in)
2. Disc detect
3. IC setting for SACD
4. Servo error signal offset auto adjustment
5. Spindle kick for LD on
6. LD on
7. Focus search
8. Focus servo on
9. Spindle kick
10. Spindle servo on
11. E-F balance auto adjustment
12. Tracking & sled servo on
13. Focus bias auto adjustment
14. Focus servo gain auto adjustment
15. Tracking servo gain auto adjustment
16. Jump to lead-in area
17. Read TOC
18. Stop
(3) SACD (dual layer)
1. Sled reverse move (sled in)
2. Disc detect
3. IC setting for SACD
4. Servo error signal offset auto adjustment
5. Spindle kick for LD on
6. LD on
7. Focus search
8. Focus servo on (layer 0)
9. Spindle kick
10. Spindle servo on
11. E-F balance auto adjustment (layer 0)
12. Tracking & sled servo on (layer 0)
13. Focus bias auto adjustment (layer 0)
14. Focus servo gain auto adjustment (layer 0)
15. Tracking servo gain auto adjustment (layer 0)
16. Jump to lead-in area
17. Read TOC
18. Focus jump (layer 0tlayer 1)
19. E-F balance auto adjustment (layer 1)
20. Tracking & sled servo on (layer 1)
21. Focus bias auto adjustment (layer 1)
22. Focus servo gain auto adjustment (layer 1)
23. Tracking servo gain auto adjustment (layer 1)
24. Focus Jump (layer 1tlayer 0)
25. Stop
5
SCD-XB790
Front Panel Parts Descriptions
SECTION 2

GENERAL

This section is extracted from instruction manual.
POWER
PHONES
PHONE LEVEL
MIN MAX
1 POWER switch
Press to turn on the player.
2 TIME/TEXT button
Each time you press the button, the playing track, the total remaining time on the disc, or TEXT information appears in the display.
3 SACD/CD button
Each time you press the button while playing back a hybrid disc, the layer to be played back switches between the HD (Super Audio CD) layer and the CD layer.
4 Disc tray
Press A OPEN/CLOSE to open/close the disc tray.
5 Multi-channel indicator
Turns on when you turn on the player, or when the Multi-channel Super Audio CD is loaded and select the Multi-channel playback area by pressing MULTI/ 2CH.
time of
TIME/TEXT SACD/CD
MENU MULTI/2CH
6 A OPEN/CLOSE button
Press to open the disc tray.
7 H button
the
Press to start play.
8 X button
Press to pause play.
9 x button
Press to stop play.
0 l AMS L dial (AMS: Automatic Music Sensor)
When you turn the l AMS L dial counterclockwise by one click, you go back to the preceding track; when you turn the l AMS L dial clockwise by one click, you go to the succeeding track.
qa PHONES
Connect the headphones. During playback of a Multi-channel Super Audio CD, the same signal that is output from the ANALOG
5.1CH FRONT L/R jacks is output from the PHONES jack.
OPEN CLOSE
AMS
PUSH ENTER
qs PHONE LEVEL
Adjust the headphones volume.
qd MENU (13)
Press to enter the menu. Press to exit from the menu and return to the normal display.
qf MULTI/2CH button
Press to select the playback area when the 2 channel + Multi-channel Super Audio CD is loaded.
qg Display window
Shows various information.
qh m/M buttons
ess to locate a portion you want to play within a
Pr track.
Rear Panel Parts Descriptions
ANALOG
2CH OUT 5.1CH OUT OUT
FRONT COAXIAL OPTICALSURR CENTER
L
R
1 ANALOG 2CH OUT L/R jacks
Connect to an audio component (stereo/2 channel) using the audio connecting cord.
2 ANALOG 5.1CH OUT jacks
Connect to an amplifier equipped with the 5.1CH input jacks (Multi-channel amplifier, AV amplifier, etc.) using the audio connecting cords.
3 DIGITAL (CD) OUT COAXIAL connector
Connect to an audio component using the coaxial digital cable.
4 DIGITAL (CD) OUT OPTICAL connector
Connect to an audio component using an optical digital cable.
DIGITAL(CD)
L
SUB
R
WOOFER
Note
Only the audio signals of the CD can be output from the DIGITAL (CD) OUT connectors shown in 3 and 4. Those of the Super Audio CD cannot be output through DIGITAL (CD) OUT.
6
Remote Parts Descriptions
SCD-XB790
1 CONTINUE button
Press to resume normal play from Shuffle Play or Programme Play.
SHUFFLE button
Press to select Shuffle Play.
PROGRAM button
Press to select Programme Play.
2 DISPLAY MODE button
Press to turn off the information.
3 TIME/TEXT button
Each time you press the button, the playing time of the track, the total remaining time on the disc, or TEXT information appears in the display.
4 Number buttons
Press to enter the track numbers.
5
i
10 button
Press to locate a track numbered over 10.
6 REPEAT button
Press repeatedly to play all tracks or only one track on the disc.
7 AyB button
Press to select Repeat A-B Play.
8 H button
Press to start play.
X button
Press to pause play.
x button
Press to stop play.
9 AMS ./> (AMS: Automatic Music Sensor)
buttons
Press to locate a specific track.
0 m /M buttons
Press to locate a portion you want to play within a track.
qa INDEX >/. buttons
Press to locate a specific point marked with an index signal when you play a disc that has index signals.
qs SACD/CD button
Each time you press the button while playing back a hybrid disc, the layer to be played back switches between the HD (Super Audio CD) layer and the CD layer.
qd MULTI/2CH button
Press to select the playback area when the 2 channel + Multi-channel Super Audio CD is loaded.
qf ENTER button
Press to decide the selection.
qg CLEAR button
Press to delete a programmed track number.
qh LEVEL ADJ button
Press to adjust the output level balance for the Multi­channel management function.
qj CHECK button
Press to check the programmed order.
PLAY MODE
CONTINUE SHUFFLE
DISPLAY/
MODE
TIME/TEXT
PROGRAM
SACD/CD
MULTI/2CH
123 456 78
>10 ENTER
REPEAT
9
10/0
CLEAR
CHECK
LEVEL
BA
ADJ
AMS
INDEX
7
SCD-XB790
• This set can be disassembled in the order shown below.

3-1. DISASSEMBLY FLOW

SET
3-2. CASE
(Page 9)
SECTION 3

DISASSEMBLY

3-3. FRONT PANEL SECTION
(Page 9)
3-4. AUDIO BOARD,
MAIN BOARD (Page 10)
3-5. MECHANISM DECK
(CDM66B-DVBU6B) (Page 10)
3-6. BASE UNIT
(DVBU-6B) (Page 11)
8
Note: Follow the disassembly procedure in the numerical order given.
)
3-2. CASE
2
two flat head screws (TP)
2
two flat head screws (TP)
3

case

SCD-XB790
1
two screws
2
two flat head screws (TP
3-3. FRONT PANEL SECTION
4
7

front panel section

1
Pull out the tray. (Refer to page 3, HOW TO OPEN THE TRA Y WHEN POWER SWITCH TURNS OFF.)
2
loading panel assy
connector (CN992)
6
two claws
6
two claws
4
two connector (CN305, 905)
3
wire (flat type) (11 core) (CN706)
5
six screws (BV/RING)
9
SCD-XB790
)

3-4. AUDIO BOARD, MAIN BOARD

8
8
wire (flat type) (30 core) (CN708)
9
connector (CN703)
0
screw (BVTT3
×
6)
qa
wiring stopper
qs
MAIN board
9
two connectors (CN704, 707)
1
two wires (flat type) (19 core) (CN302, 303)
wire (flat type) (11 core) (CN706)
2
four connectors

(CN301, 304, 305, 306)
5
two washers (DIA. 3.6)
0
three screws (BVTT3
6
PC board holder
7
AUDIO board
4
screw (BVTT3
×
6)
3
×
6)
five screws (BVT/RING)
3-5. MECHANISM DECK (CDM66B-DVBU6B)
1
Pull out the tray. (Refer to page 3, HOW TO OPEN THE TRAY WHEN POWER SWITCH TURNS OFF.)
2
loading panel assy
3
Push the tray.
6
three screws (BVTT3
×
8)
7

mechanism deck (CDM66B-DVBU6B)

4
wire (flat type) (30 core (CN708)
10
5
connector (CN151)
3-6. BASE UNIT (DVBU-6B)
)
– BOTTOM VIEW –
cam (66)

base unit (DVBU-6B)

SCD-XB790
2
1
screw (DIA. 12), floating
3
base unit (DVBU-6B
11
SCD-XB790
SECTION 4

TEST MODE

In this set, various checks are automatically performed by executing the commands in the test mode.
Note: This set makes adjustment every optical pick-up and stores its result
in the EEPROM (IC903) on the MAIN board. Accor dingly, if a combination of optical pick-up and EEPROM is changed, be sure to perform 4-3. SET CHECK. Also, perform 4-1. IC INTERFACE CHECK, 4-2. DISPLA Y CHECK, and 4-6. WAVEFORMS CHECK.
Disc for Test Mode
Various checks of this set r equire the following discs.
Model Type *1 Category Application
MODEL SATD-S5 (J-2501-215-A) SL SATD-S4 Optical waveform check (J-2501-184-A)
Not specified DL 12 cm disc Operation check PATD-012
(4-225-203-01) YEDS-18 Reference disc (3-702-101-01)
Not specified HYBRID 12 cm disc Operation check
CD
12 cm disc Reference disc
12 cm disc
Adjusted value check, Operation check,
Adjusted value check, Operation check, Optical waveform check
Setting Method of Test Mode
Turn the dial and the [MENU] button. Release the [MENU] button and the
lL
[ AMS ] dial in this order when “DIAG MODE” is displayed
on the fluorescent indicator tube.
Releasing Method of Test Mode
To release the test mode, turn the [POWER] switch off.
Selection/Entry of Test Mode
To select and enter the “DIAG MODE”, operate as follows.
1. Rotate the [ AMS ] dial to select the menu, and press
the [ AMS ] dial to enter.
2. The test is switched on or off alternately each time the
[ AMS ] dial is pressed.
3. To return to the previous step, rotate the [ AMS ] dial
to select the desired item, and press the [ AMS ] dial to enter.
*1 SL: Single Layer
DL: Dual Layer
Test Mode Command List
The contents of test mode are as follows.
Note: Wrong operation in the test mode causes a trouble, thus requiring extreme care.
[POWER] button on while pressing the [ AMS ]
lL
lL
lL
lL
lL
l
L
LINE command (0X): Use mainly for a manufacturing line.
No. Name Description Remarks
00 RFAmp Read Each register set value of the IC001 (RF AMP) is displayed via RS-232C Not used for the servicing 05 DSP MON1 XUGF, XPCK, C2PO outputted from IC509 (CD DSP) Not used for the servicing 06 DSP MON2 MNT0, MNT1, MNT2, MNT3 outputted from IC509 (CD DSP) Not used for the servicing
07 DSP MON3 RFCK, XPCK, XROF, GTOP outputted from IC509 (CD DSP)
Electrical measurement, CD CLV jitter measurement
STANDARD command (1X): Use when the servo is applied by manual operation.
No. Name Description Remarks
12 LD ON/OFF The laser diode is turned on or off On or off are switched alternately 13 SPIN ON/OFF The spindle motor is rotated with the regulated voltage On or off are switched alternately 14 FSRV ON/OFF The focus servo is turned on or off On or off are switched alternately 15 TSRV ON/OFF The tracking servo is turned on or off On or off are switched alternately
16 CLV ON/OFF
17 SSRV ON/OFF
18 ALL SRV ON All servos are turned on 19 ALL SRV OFF All servos are turned off Stop command in the test mode
The spindle SLV servo is turned on or off Focus and tracking servos must be already turned on
The sled servo is turned on or off Focus, tracking and spindle servos must be already turned on
On or off are switched alternately
On or off are switched alternately
FOCUS command (2X): Focus related. (All servos must be already turned on (except command 21))
No. Name Description Remarks
21 FSRCH ON/OFF
22 F-BIAS UP Increase focus bias Focus bias value 23 F-BIAS DOWN Decrease focus bias Focus bias value
24 ADJ FCSBIAS
25 FGAIN UP/DW The focus servo gain is switched between normal and down Normal or down are switched alternately 27 FOCUS AGC The focus servo gain is adjusted automatically
The continuous vertical motion of the optical pick-up lens is turned on or Avoid a long-time use off On or off are switched alternately
The focus bias is adjusted automatically Both + and - directions are searched to search for best jitter point
OFFSET (PI, FE, TE) command (3X): Adjusts the offset of PI, FE and TE signals.
No. Name Description Remarks
31 PI/FE OFSET
Adjusts the offset of PI, FE and TE signals TE offset adjustment is executed for the CD This adjustment must be executed after 61 DISC DETECT only
12
SCD-XB790
TRACKING command (4X): Tracking servo related.
No. Name Description Remarks
41 TGAIN NM/UP T he tracking servo gain is switched between normal and up Normal or up are switched alternately 44 ADJ TRK DSP The traverse AGC and E-F balance adjustment is performed 45 TRACKING AGC The tracking servo gain is adjusted automatically
SEARCH command (5X): Track search related. (Nos. 51 through 53 are not used for the servicing.)
No. Name Description Remarks
51 1-TRCK JUMP One-track jump is performed 52 FINE SEARCH Fine search is performed 53 M-TRCK MOVE M-track movement is performed
DISC DETECT command (6X): Disc type check related.
No. Name Description Remarks
Disc type check is executed Display after judgment
61 DISC DETECT
62 CD SETTING Enter disc type CD setting CD forced setting 63 SL SETTING Enter disc type SL setting SL forced setting 64 DL SETTING Enter disc type DL setting DL forced setting 6F Download Not used for the servicing
DSKMOD CD: Judged as CD Refer to how to apply servo by manual DSKMOD SL: Judged as SACD (SL) operation (See page 14) DSKMOD DL: Judged as SACD (DL) DSKMOD HYB: Judged as HYBRID
LASER command (7X): Laser of optical pick-up related.
No. Name Description Remarks
7A ADDTIME CD
7B ADDTIME HD
7C FJUMP TEST Not used for the servicing
Cumulative light emission time of the laser for CD is displayed (Initialized by 8D command)
Cumulative light emission time of the laser for SACD is displayed (Initialized by 8D command)
TOOLS command (8X): Performs aging, reads adjusting parameters, etc.
No. Name Description Remarks
81 VERSION Firmware version is displayed Example: Ver 1.00 83 TRAY AGING Tray open-close aging is performed Not used for the servicing 87 DISP ADJ DT Automatic adjusting parameters are displayed via RS-232C Not used for the servicing 8A FL CHECK Display of fluorescent indicator tube and keys are checked
8D SETUP MODE
Set to factory shipping mode Set when repair completed PLAY MODE, etc. ar e initialized Refer to 4-5. SHIPPING MODE (See page 17)
QA command (9X)
No. Name Description Remarks
91 FJUMP CHECK The focus jump is checked Not used for the servicing 92 SET CHECK The set is checked Refer to 4-3. SET CHECK (See page 15) 93 WATER MARK Not used for the servicing
94 SET AGING
95 FJMP CHK BU The focus jump is checked (for jig) Not used for the servicing 9C BU DENCHO
9D PLAY&RFD ON
9E RFD ON/OFF
The set aging is performed Repeat by the specified number of times or until an error occurred
The S curve waveform, traverse waveform, and RF waveform can be Refer to 4-6.WAVEFORMS CHECK checked successively (See page 17)
SACD playback, RFD output SACD jitter measuring mode
RFD output is turned on or off SACD jitter measuring mode
Not used for the servicing
Not used for the servicing
Not used for the servicing
IC command (AX)
No. Name Description Remarks
A0 IC SELF CHK Each IC and its communication are checked Normal or up are switched alternately
13
SCD-XB790
How to Apply Servo by Manual Operation
In analyzing failures of the set, the servo may be applied by manual operation. To apply servo in the test mode, use the following method.
1. After setting the test mode, rotate the [ AMS ] dial to select a command, and press the [ AMS ] dial to enter .
lL
lL
2. “61 DISC DETECT” (Disc type c heck)t“18 ALL SRV ON” (All servos on + auto adjustment)
3. If applying servo while checking the condition one by one, “61 DISC DETECT” (Disc type check)t“31 PI/FE OFSET” (Offset automatic adjustment)t“14 FSRV ON/OFF” (Focus servo on)t“16 CLV ON/OFF” (CLV servo on)t“44 ADJ TRK DSP ” (E-F balance adjustment)t“15 TSRV ON/OFF” (Tracking servo on)t“17 SSRV ON/OFF” (Sled servo on)t“24 ADJ FCSBIAS” (Focus bias adjustment)t“27 FOCUS AGC” (Focus auto gain adjustment)t “45 TRACKING AGC” (Tracking auto gain adjustment).
Note: 1. On and off are alternately switched in the same command.
2. For a stop, select “19 ALL SR V OFF” and press the [ AMS ] dial.
lL
4-1. IC INTERFACE CHECK
The communication between microcomputer and main ICs is checked.
Checking Method:
1. After setting the test mode, rotate the [ AMS ] dial to select “A0. IC SELF CHECK” and press the [ AMS ]
lL
lL
dial to enter.
2. A checking will start automatically. (Checking time is about 3 seconds)
3. At successful completion of check, “IC CHECK OK” is dis­played. In this case, no error exists in the IC interface.
Note: The check mentioned above tests the communication from micro-
computer to main ICs. Even if the check successfully finished, the IC to be checked is not always normal. Consider it for reference only.
4. In case of an IC communication error, the following display will be given during the checking. Possible causes of error are as listed below.
Error display Causes (typical example)
DVD DEC. ERROR 1. IC701 (SACD decoder) is faulty
DVD DRAM ERR 1. IC706 (D-RAM) is faulty
CD DSP ERROR 1. IC509 (CD DSP) is faulty
2. IC701 pin <znv (XRST) does not go “H”
• IC901 pin ts (XDIS IO) does not go “H”
• IC904 (PLD) is faulty
3. 768fs (33.8688 MHz) is not present to IC701 pin <znm (XTAL)
• IC811 (3-multiplying circuit) is faulty
• Clock signal 256fs is not sent from
AUDIO board (CN701 pin qg)
• CN702 pin 6 (GND) and pin 7
(+3.3V-D) are open or shorted
• CN701, 702 and FFC connection is loose,
or FFC is disconnected
2. IC701 pin <znv (XRST) does not go “H”
• IC901 pin ts (XDIS IO) does not go “H”
• IC904 (PLD) is faulty
3. Faulty communication line between IC701 and IC706
•Data line, address line, WE, etc.
4. D903 (1SS367) is faulty D+3.3V is not present to IC706
2. 768fs (33.8688 MHz) is not present to IC509 pin ua (XTAL) Same as cause 3 of DVD DEC. ERROR
3. IC509 pin 2 (XRST) does not go “H”
• IC901 pin ts (XDIS IO) does not go “H”
• IC904 (PLD) is faulty
Error display Causes (typical example)
EEPROM ERROR 1. IC903 (EEPROM) is faulty SAMBA DRAM ERR 1. IC808 (D-RAM) is faulty
(DSD decoder is also 2. IC801 (DSD decoder) is faulty checked) 3. 768fs (33.8688 MHz) is not present to
RF AMP ERROR 1. IC001 (RF AMP) is faulty
SD BUS ERROR 1. IC701 SD bus and IC801 AV decoder
IC801 pin qa (MCKI) Same as cause 3 of DVD DEC. ERROR
4. IC801 pin 9 (XRST) does not go “H”
• IC901 pin ts (XDIS IO) does not go “H”
• IC904 (PLD) is faulty
5. Faulty communication line between IC801 and IC808
•Data line, address line, WE, etc.
6. D904 (1SS367) is faulty D+3.3V is not present to IC808
2. Loose connection between CN708 on MAIN board and CN005 on RF board, or FFC disconnection CN708 pin qj (CLK RF), pin qh (DATA RF) and pin qg (SDEN) must be checked
interface is faulty
2. IC812 to 814 are faulty
Causes Common to Each IC:
1. Faulty communication line between microcomputer and each IC. Disconnected patterns, floating series resistors, bridge, etc.
2. Faulty IC supply voltage. Particularly, check D+3.3V voltage.
3. Faulty microcomputer communication port to each IC
Note: In case of more than two errors, the error display is switched over
one after another, thus making the reading difficult. In such a case, press again the [ AMS ] dial to make a recheck for error reading.
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4-2. DISPLAY CHECK
Checking Method:
1. After setting the test mode, rotate the [ AMS ] dial to select “8A. FL CHECK” and press the [ AMS ] dial to
lL
lL
enter.
2. Respective segments of fluorescent indicator tube will automatically light up in order, and therefore check that there is no chipped character.
3. The “INPUT REMOCON” will be displayed after the segment check finished successfully, and then press a proper key on the remote commander.
4. After “JOG CHECK” is displayed, the numbers of calendar will be displayed from 1 to 15 each time the [ AMS ]
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dial is rotated clockwise.
5. After display up to 15, the numbers of calendar will disappear in order each time the [ AMS ] dial is
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rotated counterclockwise.
6. “TTX-1514?” will be displayed when all are cleared, and then press the [ AMS ] dial.
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7. Upon display of “KEY CHECK”, if a key on the display is pressed, the corresponding segment of fluorescent indicator tube will light up.
8. “FL TEST END” will be displayed if all keys are pressed.
Note: The keys include the [ AMS ] dial. If the segment that
corresponds to the pressed key does not light up, that key is faulty.
l
9. The test mode selection display will be back, if the [ AMS ]
L
lL
dial is pressed.
14
SCD-XB790
4-3. SET CHECK (AUTOMATIC VARIOUS MEASUREMENTS)
The operational stability of the set is checked. The check and OK/NG judgment are performed automatically.
Note: In the set check using the CD, besides a checking, the MIRR time used for the disc check is measured every optical pick-up, and from the measured
result, the threshold value is calculated and it is stored in the EEPROM (IC903) on the MAIN board. Accordingly, if a combination of optical pick­up and EEPROM is changed (for example, the optical pick-up or MAIN board is replaced), be sure to perform the set check using the following CD. As the data stored in the EEPROM are overwritten every set check, retry if failed. For the set check using the SACD, only checking is made.
Set Check
92. SET CHECK AUTO CHECK SP?
The set check is executed to judge OK or NG. (For the CD, the threshold value is stored in the EEPROM)
AUTO CHECK?
DISP RESULT S?
DISP RESULT F?
CHECH END?
The set check of measurement only is executed.
The measured result is displayed via RS-232C.
The measured result is displayed on the fluorescent indicator tube.
The set check is finished.
CD and SACD (SL) Disc Operation Check
Checking method:
1. After setting the test mode, rotate the [ AMS ] dial to select “SET CHECK” and press the [ AMS ] dial to enter.
2. Upon display of “AUTO CHECK SP?”, further press the [ AMS ] dial.
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lL
lL
3. The tray will open automatically, and then set the test disc*1 of CD or SACD.
4. With the “DISC IN&JOG ON” displayed, press the [ AMS ] dial, and the check will be executed automatically.
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5. “SPEC OK!” will be displayed if the measured result is within the specification. Faulty item name and the measured result will be displayed if any measured item is NG.
6. After that, “A UT O CHECK SP?” will be again displayed, and then rotate the [ AMS ] dial to select “CHECK END?”. Further, press the [ AMS ] dial, and the test mode selection display will be back, and then press the [OPEN/CLOSE ] button and take
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lL
A
the test disc out.
*1 Use PATD-012 or YEDS-18 for CD, and SATD-S5 or SATD-S4 for SACD (SL). Using another disc will result in a checking failure.
Measured Items:
Items Description Remarks
RF/VC/FE/TE (ORG) RF (8 bit data in hex notation) RF: A0h
RF/VC/FE/TE (ADJ)
PI/TRVS PP (ORG/ADJ) TRVS PP (ORG): Traverse level before level correction (AGC) Traverse level conversion
PIOR/CCR/TRCR CCR: Set value of FE offset coarse adjusting register
FOCUS/TRK GAIN
FBIAS/TRVSC/TRCR2/CFR
PSP AMPLITUDE SACD only 1-LAST TRK SEEK (msec) Average seek time from first track to last track of disc
ERROR RATE For CD: Average value/Maximum value of C1 and C2
Offset values before RF (PI), VC, FE, TE signal offset adjustment At offset 0
VC, FE, TE (9 bit data in hex notation) VC, FE, TE: 00h Offset values after RF (PI), VC, FE, TE signal offset adjustment VC offset is not adjusted
(Less than ORG value if offset correction is normal) (Measurement only) RF (8 bit data in hex notation) Also, for SACD, the TE offset is VC, FE, TE (9 bit data in hex notation) not measured and adjusted
PI (ORG): PI value at disc type check (decimal data) PI level conversion PI (ADJ): PI value after PI offset adjustment Read value × 12.9mV
TRVS PP (ADJ):Traverse level after level correction (AGC)
PIOR: Set value of PI offset coarse adjusting register Registers in RF amplifier
TRCR: Set value of TE offset coarse adjusting register Auto gain adjusted values of focus and tracking servos
(8 bit data in hex notation) FBIAS: Focus bias set value (9 bit data in hex notation)
TRVSC: Traverse center value (9 bit data in hex notation) TRCR2: Set value of E-F balance coarse adjusting register CFR: Set value of traverse level adjusting register
Error rate measurement
For SACD: Average value/Maximum value of PO, PI1 and PI2
(read value at microcomputer A/D) (decimal data)
(decimal data) Read value × 12.9mV
(decimal data) 12.9mV=3.3V ÷ 256 (8 bit)
TRCR2 adjusts the E-F gain balance and used for CD only (Fixed to 06 for SACD) TRCR2 and CFR are registers in RF amplifier
For the CD, Measure for 7 sec at track No.5 For the SACD, calculation from 100­block data at track No.5
15
SCD-XB790
Specified Value:
Specified value used for OK/NG judgment when executing 92. SET CHECKtAUTO CHECK SP?
Measured Items Specified value
RF AVRG (ADJ) 8Ch to ABh VC AVRG (ADJ) 1F7h to09h
FE AVRG (ADJ)
TE AVRG (ADJ) 1E2h to 1Eh TRVS PP (ADJ) 45h to 73h FCS GAIN 10h to 60h TRK GAIN 10h to 60h
ERROR RATE C2 0
PSP AMPLITUDE (SACD only) 1000 to 4000 1-LAST TRK SEK 3500 or less
Note: The specified values attached with “h” are hexadecimal numbers, and others are decimal numbers.
RF, VC, FE, and TE measured values are hexadecimal data with positive and negative signs. When comparing the measured value with the specified value, refer to the following.
(1) CD 1EEh to 12h (2) SACD 1F1h to 0Fh
(1) CD
(2) SACD
C1 20 or less
PI1 NUM 100 or less PI1 FRAME 5 or less
Hexadecimal (hex) display 9 bit data
FF 011111111 (+255) FE 011111110 (+254)
01 000000001 (+1) 00 000000000 (0) 1FF 111111111 (-1)
101 100000001 (-255) 100 100000000 (-256)
MAX
(+) Side
0
(-) Side
MIN
Hexadecimal (hex) display 8 bit data
7F 01111111 (+127) 7E 01111110 (+126)
02 00000010 (+2) 01 00000001 (+1) 00 00000000 (0) FF 11111111 (-1) FE 11111110 (-2)
81 10000001 (-127) 80 10000000 (-128)
16
SCD-XB790
e
4-4. SACD (DL) DISC OPERATION CHECK
(• Perform as necessary) This checking performs the focus jump using a DL disc, which is a dual-layer HD disc, to verify the stability of the set. A set of layer 0 most-outside track access (only once)tone-second tracetfocus jump (layer 0t1)tone-second tracetfocus jump (layer 1t0) are repeated 5 times.
Checking Method:
1. After setting the test mode, rotate the [ AMS ] dial to select “91 FJUMP CHECK” and press the [ AMS ] dial
lL
lL
to enter.
2. The tray will open automatically, and then set the DL disc.
3. With “DISC IN&JOG ON” displayed, press the [ AMS ]
lL
dial.
4. The tray will be loaded in automatically, and then the test will start.
5. During the test, “NOW TESTiiii” is displayed.
6. Upon successful completion of the check, “OK!” will be displayed and the tray will open automatically. (In case of NG, “NG! ERR FJ-UP” or “NG! ERR FJ-DWN” is displayed)
7. Take the DL disc out and press the [OPEN/CLOSE ] button,
A
and the test mode selection display will be back
4-5. SHIPPING MODE
The repaired set must be initialized, and for this purpose the set should be set to the shipping mode.
Setting Method:
1. After setting the test mode, rotate the [ AMS ] dial to select “8D SETUP MODE” and press the [ AMS ] dial
lL
lL
to enter.
2. “INITIAL OK” is displayed and the test mode selection display will be back immediately.
“8D 000000000 00” will be displayed, and if the scroll starts in
the left direction, the set initialization has completed
3. Press the
[POWER] button to turn the power off.
The following setups are established in the shipping mode
1. Initialization of EEPROM (IC903)
• PLAY MODE CONTINUE
• LAYER SELECT SACD
• M/2CH SELECT MULTI
• 2ch SPK MODE 2ch DIRECT
• Mch SPK MODE Mch DIRECT
• Resetting the cumulative light emission time of the laser
Note: Even if the shipment mode setting mentioned above is made, the
disc check threshold value attained in the 3. SET CHECK is not cleared.
2. The optical pick-up moves to the home position (most-inside
track)
Error List
Display Description
Toc Error * Error during the time from auto adjustment to TOC
Toc Error **** Illegal SACD (Such as a pirated version)
reading, Different type of disc (Such as a DVD disc), Disc is dirty
4-6. WAVEFORMS CHECK BU Electrical Adjustment Mode
The BU electrical adjustment mode is used to check the S curve waveform, traverse waveform, RF wa veform, and CL V jitter . After a disc is placed on the tray, each time the [ AMS ] dial is
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pressed, the check mode is switched in order for S curve waveformt tra verse wa veformtRF waveformtCLV jitter (for the CD).
S Curve Check
Connection:
oscilloscop
MAIN board
TP506 (FE)
TP504 (AVC)
+ –
Checking Method:
1. After setting the test mode, rotate the [ AMS ] dial to
l
select “9C. BU DENCHO” and press the [OPEN/CLOSE ]
L
A
button. Place the test disc (PATD-012 or YEDS-18 or SATD­S5 or SATD-S4) on the tray and close the tray, then press
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the [ AMS ] dial.
2. At the completion of disc type check, “CD DETECT” will be displayed (for PATD-012 or YEDS-18).
Note: For the SATD-S5 or SATD-S4, “SL DETECT” is displayed.
3. Press again the [ AMS ] dial, and the S curve waveform
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check mode will become active and “S-CURVE MODE” will be displayed.
4. Connect an oscilloscope to the TP506 (FE) and TP504 (AVC) on the MAIN board.
5. Check that the level A and B of wa veform on the oscilloscope satisfy the specification.
Specified Value:
Disc AB
SATD-S5 or SATD-S4 PATD-012 or YEDS-18
S curve waveform
VC
Note: For easier observation of this waveform, extend the sweep time
and raise the brightness.
0.7 to 1.7 Vp-p –0.1 to +0.1V
A
B
Checking and Connecting Location : See page 19.
17
SCD-XB790
V
Traverse Check
Connection:
oscilloscope
MAIN board
TP513 (TE)
TP504 (AVC)
+ –
Checking Method:
1. Under the condition of S curve waveform check mode in step 5, press the [ AMS ] dial.
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2. After “W AIT” is displayed, the traverse wa veform check mode will become active and “TRV MODE ON” will be displayed.
3. Connect an oscilloscope to the TP513 (TE) and TP504 (AVC) on the MAIN board.
4. Check that the level A and B of waveform on the oscillo- scope satisfy the specification.
Specified Value:
Disc AB
SATD-S5 or SATD-S4 PATD-012 or YEDS-18
Traverse waveform
VC
0.9 to 1.4 Vp-p –0.1 to +0.1V
Center fo the waveform
A
B
Checking and Connecting Location : See page 19.
RF Level Check
Connection:
oscilloscope
MAIN board
TP703 (RFAC)
TP704 (AGND)
+ –
Checking Method:
1. Under the condition of traverse waveform check mode in step 4, press the [ AMS ] dial.
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2. Connect an oscilloscope to the TP703 (RFAC) and TP704 (AGND) on the MAIN board.
3. After “W AIT” is displayed, the RF waveform check mode will become active and “PLAY 5th TRACK” (for the SACD, “RF MODE ON”) will be displayed, and the 5th music on the disc will be played.
4. Check that the RF waveform is clear and the level satisfies the specification.
5. Press the [ AMS ] dial (for the SACD, “RF JITTER
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(5th)” will be displayed, and further press the AMS dial), and “OUTSIDE TRACK” will be displayed and the outward track of the disc will be played.
6. Check that the RF waveform is clear and the level satisfies the specification.
7. Press the [ AMS ] dial, and “INSIDE TRACK” will be
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displayed and the inward track of the disc will be played.
8. Check that the RF waveform is clear and the level satisfies the specification.
9. After checking, press the [ AMS ] dial, and the test is
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over when “BU MEASURE” is displayed.
10. Press the [OPEN/CLOSE ] button to open the tray, and re-
A
move the test disc.
11. Using each type of disc, repeat from step 1 of S curve wave­form check up to step 10 of RF level check.
12. When the check is over, press the
[POWER] button to turn the
power off.
Note: Take care not to leave the test disc in the set.
Specified Value:
Disc A
SATD-S5 or SATD-S4 PATD-012 or YEDS-18
RF signal waveform
Note: Clear RF waveform refers to the waveform where ◊ shapes should
be distinctively observed in the center.
0.9 to 1.4 Vp-p
VOLT/DIV: 200 m TIME/DIV: 500 ns
A
Checking and Connecting Location : See page 19.
18
CLV Jitter Check (CD only)
e
Connection:
oscilloscop
MAIN board
TP516 (RFCK) TP517(WFCK)
TP808 (DG)
(CH1)
(CH2)
+
+ –
Checking Method:
Under the condition of RF level check mode in step 3, connect the oscilloscope to the TP516 (RFCK) (CH1), TP517 (WFCK) (CH2), and the TP808 (DG) (GND) on the MAIN board to check that the value A of the waveform satisfies the specification.
Note: Take care not to leave the test disc in the set.
Specified V alue:
Disc A
PATD-012 or YEDS-18
CLV jitter waveform
35 µsec or less
SCD-XB790
Checking and Connecting Location:
– MAIN Board (Component Side) –
TP506
(FE)
TP513
(TE)
TP504
(AVC)
IC509
TP704
(AGND)
TP514
(RFCK)
TP517
(WFCK)
TP703
(RFAC)
IC701
A
IC703
TP808 (DG)
IC801
1919
SCD-XB790
SECTION 5

DIAGRAMS

5-1. BLOCK DIAGRAM – RF/SERVO Section –

DETECTOR
OPTICAL PICK-UP
BLOCK
(KHM-234AMA)
MODULE CIRCUIT
2AXIS DEVICE FOCUS/
TRACKING
(Page 21)
COIL
1
DVD LD
CD LD
DVD/CD PD
DVD VR
CD VR
FCS+ FCS–
TRK+ TRK–
SP ERR
RF
A B C D
E
F
G
H
CONTROL SWITCH
CONTROL SWITCH
VC
(+2.5V)
PHOTO DIODE
(FOR SACD)
Q005
PHOTO DIODE
(FOR CD)
Q004
M2
(SLED)
M3
(SPINDLE)
M151
(LOADING)
SUMMING AMP
IC004 (1/4)
SUMMING AMP
IC004 (2/4)
AUTOMATIC POWER
CONTROL (FOR SACD)
Q001
AUTOMATIC POWER CONTROL (FOR CD)
Q003
DVDPDSW
FOCUS/TRACKING COIL DRIVE,
12 5 11 6
14 2 13 3
M
17 24 18 23
25
MM
MM
CBA
D
A
B
C
D
A B C D
CDPDSW
SLED MOTOR DRIVE
IC502
FOCUS COIL
DRIVE
TRACKING COIL
DRIVE
SLED MOTOR
DRIVE
SPINDLE MOTOR
DRIVE
1
63
3 4 5 6
18
17
12
11
10
9
16 15 14 13
21
22
23 24
DVDRFP
RFSIN
A2 B2 C2 D2
CD E
CD F
A
B
C
D
CD A CD B CD C CD D
DVDLD
CDLD
DVDPD
CDPD
STBY1
STBY2
MUX ATT
GCA,
EQ
GCA
MUX
DUAL
APC
9
20
27 26
A
C
B
D
IC512
DRIVE
DRIVE
AIP
59
AIN
60
PHASE
DETECTOR
+ +
+ +
1 241 2
ATON
61
ATOP
62
COMPARATOR MUX
VC
+ –
GCA
L. P. F.
TRACKING COIL DRIVE
CONTROL SWITCH
IC501
SPINDLE/LOADING MOTOR DRIVE
8
SPINDLE MOTOR
9
6
LOADING MOTOR
5
INPUT
BIAS,
AGC
+ –
SACD/CD RF AMP,
FOCUS/TRACKING ERROR AMP
15
16 17
24
23
CLAMP&
ENVELOPE
LEVEL DAC
GCA
IC001
4
BUFFER
BUFFER
PROGRAMMABLE
DIFFERENTIATOR
MUTE2
MUTE1
EQ FILTER
AGCO
+ –
L. P. F.
+ –
+ +
TRACKING COIL DRIVE
SEL
SUB GCA
L. P. F.
L. P. F.
CONTROL SWITCH
IC505
MUTE 2D
SP ON
13
MUTE LOAD
2
LOAD OUT
21
LOAD IN
22
FNP
FNN
AGCO
535254
OFFSET
CANCEL
OFFSET
CANCEL
OFFSET
CANCEL
BOTTOM
ENVELOPE
F JMP1
F JMP2
SPDA
DIP
DIN
55
FULL WAVE
RECTIFER
CHARGE PUMP
FFDR
33
FRDR
34
TFDR
31
TRDR
32
SFDR
29
SRDR
30
AGC
SERIAL
PORT
REGISTER
GCA
MUX
INPUT
BUFFER
PEAK/
BOTTOM
HOLD
DIGITAL SERVO
PROCESSOR
IC509 (1/2)
FOCUS/TRACKING/SLED
RFAC
57
TE TE
39
SDATA
SCLK SDEN
FE
PI
MEVO
MIN
MIRR
LDON
PWM GENERATOR
SDATA
47 46 48 42MNTR
40
PI ERROR AMP
38
32
31
27
26
TE
40 41 39 43
TE
SE
A/D
CONVERTER
FOCUS
TRACKING/SLED
SERVO DSP
D+3.3V
SCLK
SDEN
IC004 (3/4)
PI
FE
FE
RFDC
SSTP
26
PIFETE
DFCT, FOK
DETECTOR
SERVO
INTERFACE
SERVO AUTO
SEQUENCER
TO CPU INTERFACE
S1
(LIMIT)
FOK
MIRR
DFCT
COUT SCLK
RFAC
2
(Page 21)
• SIGNAL PATH
: SACD PLAY
: CD PLAY
TE, FE, PI
SDATA, SCLK, SDEN
FE
PI
22 20 21
19
8
FOK
MIRR
COUT SCLK
AVC
(+1.65V)
WAVRB
DRVC
(+2.5V)
AVC BUFFER
IC004 (4/4)
WAVRB BUFFER
IC503 (1/2)
DRVC BUFFER
IC503 (2/2)
MUTE 2D, SP ON, MUTE LOAD
A+3.3V
D+5V
D+5V
LDON
DVDPDSW, CDPDSW
TRKSW
FOK, MIRR,
COUT, SCLK
LIM SW
SPDA, F JMP1/2
SPIN
LOAD IN/OUT
10
11
12
13
3
4
5
6
7
8
9
(Page 22)
(Page 22)
(Page 21)
(Page 22)
(Page 22)
(Page 22)
(Page 22)
(Page 21)
(Page 21)
(Page 22)
(Page 22)
2020

5-2. BLOCK DIAGRAM – SERVO Section –

SCD-XB790
2
(Page 20)
11
(Page 20)
5
(Page 20)
1
(Page 20)
10
(Page 20)
14
(Page 22)
15
(Page 22)
16
(Page 22)
RFAC
SPIN
LDON
SP ERR
SPDA, F JMP1/2
D0 – D7
A0
XHRD, XHWR
DVC
(+1.65V)
CPU
IC901 (1/3)
LD ON
100
ADDRESS BUS
DVC BUFFER
IC703 (2/2)
DIGITAL SIGNAL
PROCESSOR
RFAC
50
ASYI
49
ASYO
48
SP ERR
59
DATA BUS
IC509 (2/2)
ASYMMETRY CORRECTOR
FCS JMP1
FCS JMP2
7 8
F JMP1
F JMP2
A+3.3V
FILTER
53 55 52 54 12
FILI
PCO
FILO
CLTV
XPCK
DIGITAL PLL
TO SERVO AUTO
SEQUENCER
DIGITAL CLV PROCESSOR
LOCK
MDP
24
25 4 6 5 7 15 79 80 76 77 10 11 13
75
LOCK CD
SPDA
APDO
43 44 64 58 85 84 12 22 23
SPDA
CPU INTERFACE
DATA
SENS
XLAT
CLOK
34 35 36 9 26 33 37 71
XLAT CD
DATA CD
CLOK CD
JITTER
GFS DVD
INTEGRATOR
IC703 (1/2)
DEMODULATOR
PROCESSOR
SBSO
SCOR
SENS CD
SCOR CD
XRD
XWR
XHRD
XHWR
XCS
EFM
SUBCODE
SQSO
EXCK
SQSO CD
XCS DVD
INIT0 DVD
XINT0
XINT1
SQCK
WFCK
RFCK
SQCK CD
A0 – A7 D0 – D7
INIT1 DVD
89 – 96 14 – 21
INTERNAL BUS
EMPH
GFS
68
GFS CD
C4M
32K
RAM
ERROR
CORRECTOR
117
DATA BUS
ADDRESS BUS
RFIN
D+3.3V
6916
XTSL
CLOCK
GENERATOR
D/A
DIGITAL
INTERFACE
MUTE
3
RF
ASSYMMETRY
DASYO
ASF1
111
113 114 115
FILTER
ASF2
XHRD XHWR XCS
XINT0
XINT1
DIGITAL
OUT
MD2
63
3
DASYI
XTAO
XTAI
PCMD
BCK LRCK C2PO
WDCK
DOUT
XRST
DOCTRL
PLL
D0 – D7
A0 – A7
5, 7, 9 – 14 172 – 176, 1, 2, 4
XRD
17
XWR
18
XCS
19
XINT0
20
XINT1
21
XWAIT
16
107
GFS
109
APEO
72 71
66 67 65 14 17
64
XRST CD
2
MUTE CD
IC708 (1/2)
FFM
DEMODULATOR
CPU
INTERFACE,
DMA
CONTROLLER
AUTHENTICATION
XTL2
XTAL
169167
SPINDLE MOTOR DRIVE
IC708 (2/2)
138
ANALOG
BUFFER
XTL1
170
MIXER
142 144 140
135
66 – 69, 71,
2 – 5, 7 – 10
MDIN1
MDSOUT MDPOUT
CLVS
SPO
MDB0 – MDB7
73 – 75
MDIN2
SPINDLE
CONRTOL
MAIN DATA ECC & EDC
DVD-ROM CD-ROM
MDB8, MDB9,
MDBA – MDBF
96, 97, 99, 101,
102, 104 – 106
41 – 44, 46 – 49
D-RAM
IC706
WFCK
SCOR
SBSO
EXCK
147148150151137 153 146 155 163 158 160 164
WFCK
SCOR
SBIN
EXCK
XRCI
GSCOR
C2PO
LRCK
CD DSP INTERFACE
SYNC
CONTROL
DESCRAMBLE
DMA CONTROLLER
(PRIORITY RESOLVE & SEQUENCER)
MA0 – MA9
79, 80, 82 – 87,
89, 91
21 – 24, 27 – 32
A0 – A9I/O8 – I/O15I/O0 – I/O7
BCLK
MDAT
SUBCODE
DEINTERLEAVE & ECC
XRAS
XMWR
MA10/MNT1
XMOE
XCAS
3334
171835
OE
WE
RAS
LCAS
UCAS
MDAT
BCLK LRCK
XRST DVD
XRST
INTERFACE
MA11/MNT2
SACD DECODER
CD ESP
DAC
DBCK
DLRC
DDAT
162
157159939294767895
WAVE SHAPER
Q302
IC701
DMA FIFO
ATAPI
REGISTER
ATAPI
PACKET FIFO
OPTICAL
TRANSCEIVER
IC309
XRST CD, MUTE CD, XRST DVD
HDB0 – HDB7
HDB8
HDB9
HDBA – HDBF
HOST INTERFACE
• SIGNAL PATH
: SACD PLAY
: CD PLAY (ANALOG)
: CD PLAY (DIGITAL OUT)
768FS (33.8688MHz)
26 29
HA0 – HA2
XSAK
46
REDY
51
HINT
54
HCS0
62
HCS1
63
XSHD
49
XDCK
48
XSRQ
53
XHRS
23
RFAC
MDAT, BCLK, LRCK
DIGITAL (CD) OUT OPTICAL
J303
DIGITAL (CD) OUT COAXIAL
SD0 – SD7
32, 30, 27, 24
44, 41, 39, 35,
40, 43, 45
31, 34, 37,
59, 56, 60
XSAK
XSHD XDCK XSRQ
SDEF
XSAK, XSHD, XDCK, XSRQ
WPK
XTAL
17
(Page 22)
18
(Page 22)
19
(Page 23)
20
(Page 22)
21
(Page 22)
22
(Page 22)
23
(Page 22)
24
(Page 22)
25
(Page 22)
2121
SCD-XB790

5-3. BLOCK DIAGRAM – MAIN Section –

(Page 20)
(Page 20)
(Page 20)
(Page 21)
(Page 21)
(Page 21)
(Page 21)
(Page 21)
4
8
3
17
24
22
23
21
SDATA, SCLK, SDEN
FOK, MIRR, COUT, SCLK
TE, FE, PI
REAC
WPK
SDEF
XASK, XSHD, XDCK, XSRQ
SD0 – SD7
XSAK
XSHD
XDCK
XSRQ
LEVEL SHIFT
IC813
A1
2 18
A2
3 17
A3
4
A4
5 15
LEVEL SHIFT
IC814
LEVEL SHIFT
A1 – A8
2 – 9
IC812
D-RAM
IC808
B1
B2
B3
B4
B1 – B8
DQ0 – DQ7
16
11 – 18
2, 3, 5, 6,
8, 9, 11, 12
126 WARFI
123
WCK
168
SDEF
167
XSAK
165
XSHD
SDCK
166
164
XSRQ
169 – 176
SD0 – SD7
134 – 131
139 – 136,
DSD DECODER
IC801
DSALS
MSDATO
MSDATI
MSCK
XMSLAT
SMUTE
MSREADY
DQ0 – DQ7A0 – A11
64
DSAL
66DSAR 74 76DSARS 69DSAC 71DSASW
61PHREFI 59BCKAI
MCKI
11 12
6 4 3 2
10
7
3-MULTIPLYING
IC811
13 1
11
10 4
9 5
8
SDATAL
SDATAR SDATALS SDATARS
SDATAC
SDATALF
2 3
6
64FS
128FS
• SIGNAL PATH
: SACD PLAY
256FS
SDATAL, SDATAR, SDATALS, SDATARS,
SDEN
SDATA SCLK
FOK MIRR COUT SCLK
TE FE
X901
20MHz
83
DATA RF
77
CLK RF
74
FOK CD
25
MIRR RF
29
COUT CD
72
SCLK CD
65
TE FE
67 66PIPI
40 XTAL
41 EXTAL
SIN DSD
48
SOUT DSD
49
SCK DSD
50
XLAT DSD
47
MUTE DSD
51
RDY DSD
27
LATCH DF
98 97
INIT DF
CPU
IC901 (2/3)
LOAD IN
LOAD OUT
IN SW
OUT SW
EEPSIO
EEPSCL
XRST
XCS IO
XDIS IO
45 46
30
31
78 79
38
11
52
LOAD IN
LOAD OUT
S272
(LOADING IN)
S271
(LOADING OUT)
SDA
5 6
SCL
EEPROM
IC903
RESET SIGNAL
GENERATOR
IC905
64FS
FS64
3
128FS
4
35
SDEN
9
XCS
RST
24
FS128
XRD
XWR
ZEROL ZEROR
LMUTE RMUTE
5YO
D0 – D7
12 – 16, 19 – 21
22A
10 11
2
41
38 37
34MULTI
XHRD
XHWR
ZEROL ZEROR
LMUTE RMUTE
SDATAC, SDATALF, 64FS
DATA BUS
LOAD IN/OUT
D0 – D7
A0
XHRD, XHWR
ZEROL, ZEROR
LMUTE, RMUTE
MULTI
26
27
13
14
15
16
28
29
30
(Page 23)
(Page 23)
(Page 20)
(Page 21)
(Page 21)
(Page 21)
(Page 23)
(Page 23)
(Page 23)
(Page 21)
(Page 21)
(Page 20)
(Page 21)
XTAL
25
768FS (33.8688MHz)
18
MUTE 2D, SP ON, MUTE LOAD
12
XRST CD, MUTE CD, XRST DVD
20
20, 19
A0 – A11
21 – 24, 27 – 32,
16
CAS RAS
17
WE
15
CKE
34 35CLK DCLK
152, 151, 149, 148
162 – 159, 157 – 154,
XCAS
144
XRAS
145
XWE
143
DCKE
142 141
ZDFL
ZDFR
TEST1
XRST
26
MUT 2D6SP ON1MUT LOAD
4
DATA
CLK
LATCH
INIT
63 65
115
9
SP ON
MUTE 2D
MUTE LOAD
MUTE CD
73
MUTE CD
XRST DVD XRST CD
42 ZDFL 43 ZDFR
36 ISBTEST
RST DSD
25
RST DVD
31
RST CD
32
RST DP
PROGRAMMABLE
LOGIC DEVICE
IC904
DVDPDSW
CDPDSW
DVDPDSW
33 23
44LIM SW
CDPDSW
1TRKSW
XRST DP
DATA, CLK,
LATCH, INIT
DVDPDSW, CDPDSW
TRKSW
LIMSW
31
32
6
7
9
(Page 24)
(Page 23)
(Page 20)
(Page 20)
(Page 20)
2222

5-4. BLOCK DIAGRAM – AUDIO Section –

HEADPHONE
AMP
IC308 (1/2)
RV601
PHONE LEVEL
SCD-XB790
R-CH
J601
PHONES
27
(Page 22)
19
(Page 21)
28
(Page 22)
26
(Page 22)
SDATAL, SDATR, SDATALS, SDATARS, SDATAC, SDATALF, 64FS
MDAT, LRCK, BCLK
ZEROL, ZEROR
256FS
SDATAL
SDATAR
SDATALS SDATARS
SDATAC SDATALF
64FS
MDAT LRCK BCLK
DSD1
38
DSD3
40
DSD2
39
DSD4
41
DSD5
42
DSD6
43
DSD7
44
DSD8
45
DBCK
37
PDATA1
46
PDATA2
47
PLRCK
51
PBCK
50
LOW-PASS FILTER
CLOCK BUFFER
IC304
65 3
12
DSD
INTERFACE
PCM
INTERFACE
DIGITAL FILTER, D/A CONVERTER,
IC301
4
DSD
FILTER
PCM
FILTER
ZERO
DETECT
ZERO17ZERO2
6
ZEROL
ZEROR
ENHANCED
MULTI LEVEL
DELTA-SIGMA
MODULATOR
SYSTEM
CLOCK
PSCK34DSCK
33
D/A
CONVERTER
FUNCTION
CONTROL
MDIMCMS
2 4 3 36
DATA
CLK
LATCH
OUTPUT
AMP &
LOW-PASS
FILTER
XRST
INIT
VOUT3 VOUT1
VOUT4 VOUT2
VOUT5 VOUT6
VOUT7 VOUT8
MUTING
Q403
10 12
9
11
31 30
29 28
MIX AMP
IC315 (2/2)
R-CH R-CH
R-CH
ANALOG
LOW-PASS
FILTER
IC305 (2/2)
ANALOG
LOW-PASS
FILTER
IC306 (2/2)
MUTING
Q401
MUTING
Q421
R-CH
MUTING
Q402
MUTING
Q422
R-CH
R-CH
R-CH
J301
J302
L
R
L
R
L
R
CENTER
ANALOG 2CH OUT
FRONT
SURR
ANALOG
5.1CH OUT
32
(Page 22)
29
(Page 22)
30
(Page 22)
DATA, CLK, LATCH, INIT
LMUTE, RMUTE
MULTI
X301
11.2896MHz
ANALOG
LOW-PASS
FILTER
IC307
MUTING
CONTROL
SWITCH
Q301
LMUTE
R-CH
MUTING
CONTROL
SWITCH
Q304
RMUTE
MUTING
Q441
MUTING
Q541
MUTING
CONTROL
SWITCH
Q303
MUTING
Q442
MUTING
Q542
• R-ch is omitted due to same as L-ch.
• SIGNAL PATH
: SACD PLAY
: CD PLAY (ANALOG)
SUB WOOFER
2323
SCD-XB790

5-5. BLOCK DIAGRAM – DISPLAY/KEY CONTROL/POWER SUPPLY Section –

S810 – 813
60KEY0
CPU
IC901 (3/3)
S801 – 806
S830
61KEY1
62KEY2
REMOTE
82RM
57LED DRV
CONTROL RECEIVER
IC802
LED
DRIVE
Q701, 702
FLUORESCENT INDICATOR TUBE DRIVER
IC801
ROTARY
ENCODER
D803
(MULTI-CHANNEL)
AMS
PUSH ENTER
+3.3V
Ll
VFL–33V
FLUORESCENT INDICATOR
TUBE DRIVER
(IC801)
F1
+3.3V
REGULATOR
IC302
DAC+5V
A+7V
A+UR
A–7V
A–UR
D922
D302D301
+5V
REGULATOR
IC903
+7V
REGULATOR
IC901
–7V
REGULATOR
IC902
–33V
REGULATOR
Q921
R954
RECT
D905, 906
RECT
D901, 902
RECT
D903, 904
D917 – 920
RECT
T902
POWER
TRANSFORMER
T901
POWER
TRANSFORMER
(Page 22)
31
XRST DP
53FLOUT 54FLCLK
56FLCS
C815, R801
OSC
55 FL. DATA (DI) 54 FL. CLK (CL)
53 FLT (CE)
50 OSC0 51 OSC1
52
FLRST
61 – 64, 1 – 3045 – 3246, 47
31S35
3G – 16G1G, 2G S1 – S34
SEGMENT
DRIVE
Q803
GRID
DRIVE
Q801, 802
F1
F2
+2.5V
FL801
FLUORESCENT
INDICATOR
TUBE
F2
(COIL/MOTOR DRIVE (IC502))
+5V
(MOTOR DRIVE (IC512))
+2.5V
REGULATOR
IC702
D+3.3V
A+3.3V
M+12V
D+5V
A+5V
+5V
REGULATOR
IC504
+3.3V
REGULATOR
IC904
+5V
REGULATOR
IC906
+12V
REGULATOR
IC905
RECT
D909 – 912
RECT
D913 – 916
LINE
FILTER
L901
S991
POWER
(AC IN)
2424
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