Sony SCDXA-9000-ES Service manual

SCD-XA9000ES

SERVICE MANUAL

Ver. 1.4 2005.11

Model Name Using Similar Mechanism NEW

CD Mechanism Type

Base Unit Name

Optical Pick-up Name KHM-230AAA

US Model

Canadian Model

AEP Model

E Model

CDM19JB-DVBU4C (Except AEP: Silver type) CDM19JB-DVBU4D (AEP: Silver type) DVBU4C (Except AEP: Silver type) DVBU4D (AEP: Silver type)

When a super audio CD is played

Playing frequency range 2 Hz to 100 kHz Frequency response 2 Hz to 50 kHz (−3 dB) Dynamic range 108 dB or more Total harmonic distortion rate

Wow and flutter Value of measurable limit ( 0.001 %

When a CD is played

Frequency response 2 Hz to 20 kHz Dynamic range 100 dB or more Total harmonic distortion rate

Wow and flutter Value of measurable limit ( 0.001 %

Output connector

ANALOG OUT

DIGITAL (CD) OUT OPTICAL*

DIGITAL (CD) OUT COAXIAL*

PHONES

*Output only the audio signals of the CD

Jack type

Phono jacks

Square optical output connector

Coaxial output connector

Stereo phone jack

0.0012 % or less

W. PEAK) or less

0.0017 % or less

W. PEAK) or less

Output level

2 Vrms (at 50 kilohms)

−18 dBm

0.5 Vp-p

10 mW

Load impedance

Over 10 kilohms

Light emitting wave length:

( )

660 nm

75 ohms

32 ohms

SPECIFICATIONS

i.LINK section

Pin 4 pins Transmission speed S200

Transmission protocol A/M transmission protocol Format (output) Super Audio CD* (DSD PLAIN)

* Conforms to the copy protection technology of DTLA (Revision

1.2).

General

Laser Semiconductor laser

Laser radiant power: 5.47 uW at 650 nm

*These output is the value measured at a distance of about 200mm from the objective lens surface on the optical pick-up.

Power requirements

Power consumption 32 W Dimensions (w/h/d) 430 × 127 × 387 mm

Mass (approx.) 16.2 kg (35 lbs 12 oz.)

(Maximum data transmission speed 200 Mbps)

2 channel linear PCM (IEC 60958-3) Sampling frequency: 44.1 kHz

(SA-CD: λ = 650 nm) (CD: λ = 780 nm) Emission duration: continuous

Taiwan model: 110 V AC, 60 Hz US, Canadian models: 120 V AC, 60 Hz AEP model: 230 V AC, 50/60 Hz

(17 × 5 × 15

/4 in.)

incl. projecting parts

Supplied accessories

Audio connecting cord phono jack × 2 (Red and White) y phono jack × 2 (Red and White) (3) phono jack × 1 (Black) y phono jack × 1 (Black) (2) i.LINK connecting cord (1) Remote commander RM-SX700 (1) Size AA (R6) batteries (2) AC power cord (1) Plug adapter (1) (US, Canadian models only)

Design and specifications are subject to change without notice.

9-961-151-05 Sony Corporation

2005K05-1 Home Audio Division C 2005.11 Published by Sony Engineering Corporation

SUPER AUDIO CD PLAYER

SCD-XA9000ES

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.

SAFETY CHECK-OUT

After correcting the original service problem, perform the following safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.

LEAKAGE TEST

The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods.

1. A commercial leakage tester, such as the Simpson 229 or RCA WT -540A. Follo w the manufacturers’ instructions to use these instruments.

2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a V OM or battery-operated A C voltmeter . The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A)

To Exposed Metal Parts on Set

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

CAUTION

The use of optical instruments with this product will increase eye hazard.

For the customers in Canada

This Class B digital apparatus complies with Canadian ICES-003.

AEP model

1.5 k

0.15 µF

Fig. A. Using an AC voltmeter to check AC leakage.

Ω

Earth Ground

voltmete (0.75 V)

Notes on chip component replacement

•Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

Flexible Circuit Board Repairing

•Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

• Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

SCD-XA9000ES

Ver. 1.3

1. SERVICING NOTES ............................................... 4

2. GENERAL ................................................................... 10

3. DISASSEMBLY

3-1. Disassembly Flow ........................................................... 13

3-2. Case (Top), Side Plate ..................................................... 14

3-3. Loading Panel Assy......................................................... 14

3-4. Front Panel Section ......................................................... 15

3-5. MAIN Board, Bracket (MAIN) ...................................... 15

3-6. RF Board, Mechanism Deck

(CDM19JB-DVBU4C or CDM19JB-DVBU4D) ........... 16

3-7. Disc T able, Belt, Loading Motor (M1)........................... 16

3-8. Optical Pick-up (KHM-230AAA) .................................. 17

3-9. Base Unit (DVBU4C or DVBU4D)................................ 18

4. TEST MODE.............................................................. 19

5. DIAGRAMS

5-1. Block Diagram – RF/SERVO Section – ........................ 26

5-2. Block Diagram – MAIN Section (1/2) – ....................... 27

5-3. Block Diagram – MAIN Section (2/2) – ....................... 28

5-4. Block Diagram – AUDIO Section (1/2) – ..................... 29

5-5. Block Diagram – AUDIO Section (2/2) – ..................... 30

5-6. Block Diagram – LINK Section – ................................. 31

5-7. Block Diagram

– PANEL/POWER SUPPLY Section – .......................... 32

5-8. Note for Printed Wiring Boards and

Schematic Diagrams ....................................................... 33

5-9. Printed Wiring Boards – SERVO Section – .................. 34

5-10. Schematic Diagram – SERVO Section – ....................... 35

5-11. Printed Wiring Board

– MAIN Board (Component Side) – .............................. 36

5-12. Printed Wiring Board

– MAIN Board (Conductor Side) – ................................ 37

5-13. Schematic Diagram – MAIN Board (1/7) – .................. 38

5-14. Schematic Diagram – MAIN Board (2/7) – .................. 39

5-15. Schematic Diagram – MAIN Board (3/7) – .................. 40

5-16. Schematic Diagram – MAIN Board (4/7) – .................. 41

5-17. Schematic Diagram – MAIN Board (5/7) – .................. 42

5-18. Schematic Diagram – MAIN Board (6/7) – .................. 43

5-19. Schematic Diagram – MAIN Board (7/7) – .................. 44

5-20. Printed Wiring Board – D-OUT Board – ...................... 45

5-21. Schematic Diagram – D-OUT Board – ......................... 45

5-22. Printed Wiring Board

– MOTHER Board (Component Side) – ........................ 46

5-23. Printed Wiring Board

– MOTHER Board (Conductor Side) –......................... 47

5-24. Schematic Diagram – MOTHER Board (1/2) –............ 48

5-25. Schematic Diagram – MOTHER Board (2/2) –............ 49

5-26. Printed Wiring Board – AUDIO FRONT Board – ......... 50

5-27. Schematic Diagram – AUDIO FRONT Board – ........... 51

5-28. Printed Wiring Board – AUDIO SURR Board – ........... 52

5-29. Schematic Diagram – AUDIO SURR Board –.............. 53

5-30. Printed Wiring Board – AUDIO C/SW Board – ............ 54

5-31. Schematic Diagram – AUDIO C/SW Board – .............. 55

5-32. Schematic Diagram – LINK Board (1/2) – ................... 56

5-33. Schematic Diagram – LINK Board (2/2) – ................... 57

5-34. Printed Wiring Board – LINK Board – ......................... 58

5-35. Printed Wiring Boards – PANEL Section – .................. 59

5-36. Schematic Diagram – PANEL Section (1/2) – .............. 60

5-37. Schematic Diagram – PANEL Section (2/2) – .............. 61

5-38. Printed Wiring Board

– A-POWER Board (Component Side) – ....................... 62

5-39. Printed Wiring Boards

– A-POWER (Conductor Side)/IC Boards – .................. 63

5-40. Schematic Diagram – A-POWER/IC Boards – ............. 64

5-41. Printed Wiring Board – D-POWER Board –................. 66

5-42. Schematic Diagram – D-POWER Board – ................... 67

5-43. Printed Wiring Boards – AC/AC SW Boards – ............. 68

5-44. Schematic Diagram – AC/AC SW Boards – ................. 69

5-45. IC Pin Function Description ........................................... 74

6. EXPLODED VIEWS

6-1. Case Section .................................................................... 94

6-2. Front Panel Section-1...................................................... 95

6-3. Front Panel Section-2...................................................... 96

6-4. Bottom Section................................................................ 97

6-5. Board Section-1............................................................... 98

6-6. Board Section-2............................................................... 99

6-7. Chassis Section .............................................................. 100

6-8. Mechanism Deck Section .............................................. 101

6-9. Base Unit Section........................................................... 102

7. ELECTRICAL PARTS LIST .............................. 103

SCD-XA9000ES

Ver. 1.4

SECTION 1

SERVICING NOTES

MODEL IDENTIFICATION – Back Panel –

Part No.

Model Part No.

AEP model 4-247-231-0 US and Canadian models 4-247-231-2 Taiwan model 4-247-231-3

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objectiv e lens.

CLEANING OF OPTICAL PICK-UP LENS

In cleaning the lens of optical pick-up, use the air blower. Never use a cotton swab for cleaning the lens of optical pick-up, which otherwise causes a trouble.

RESETTING OPERATION AT POWER ON

If the power is turned on with a disc loaded in the set, a sequence of operation as shown below will be performed. (The operation varies depending on the type of disc) Condition: continue mode

[]

(2) SACD (single layer)

1. Sled reverse move (sled in)

2. Disc detect

3. IC setting for SACD

4. Servo error signal offset auto adjustment

5. Spindle kick for LD on

6. LD on

7. Focus search

8. Focus servo on

9. Spindle kick

10. Spindle servo on

11. E-F balance auto adjustment

12. Tracking & sled servo on

13. Focus bias auto adjustment

14. Focus servo gain auto adjustment

15. Tracking servo gain auto adjustment

16. Jump to lead-in area

17. Read TOC

18. Stop

(3) SACD (dual layer)

1. Sled reverse move (sled in)

2. Disc detect

3. IC setting for SACD

4. Servo error signal offset auto adjustment

5. Spindle kick for LD on

6. LD on

7. Focus search

8. Focus servo on (layer 0)

9. Spindle kick

10. Spindle servo on

11. E-F balance auto adjustment (layer 0)

12. Tracking & sled servo on (layer 0)

13. Focus bias auto adjustment (layer 0)

14. Focus servo gain auto adjustment (layer 0)

15. Tracking servo gain auto adjustment (layer 0)

16. Jump to lead-in area

17. Read TOC

18. Focus jump (layer 0tlayer 1)

19. E-F balance auto adjustment (layer 1)

20. Tracking & sled servo on (layer 1)

21. Focus bias auto adjustment (layer 1)

22. Focus servo gain auto adjustment (layer 1)

23. Tracking servo gain auto adjustment (layer 1)

24. Focus Jump (layer 1tlayer 0)

25. Stop

(1) CD

1. Sled reverse move (sled in)

2. Disc detect

3. IC setting for CD

4. Servo error signal offset auto adjustment

5. Spindle kick for LD on

6. LD on

7. Focus search

8. Focus servo on

9. Spindle kick

10. Spindle servo on

11. E-F balance auto adjustment

12. Tracking & sled servo on

13. Focus bias auto adjustment

14. Focus servo gain auto adjustment

15. Tracking servo gain auto adjustment

16. Jump to lead-in area

17. Read TOC

18. Stop

HOW TO OPEN THE DISC TABLE WHEN POWER SWITCH TURNS OFF

loading panel assy

Draw out the loading panel assy in the direction of arrow

SCD-XA9000ES

Ver. 1.3

cover (CAM)

Insert a tapering driver in the hole at the bottom of the unit, turn the cover (CAM) fully in the direction of arrow

tapering driver

OPTICAL PICK-UP SERVICE POSITION

Place the insulator on the MAIN board, then install the base unit (DVBU4C or DVBU4D) on it as shown in the figure.

DVBU4C: Except AEP (Silver type) DVBU4D: AEP (Silver type)

base unit (DVBU4C or DVBU4D)

MAIN board

insulator

SCD-XA9000ES

Note: Follow the disassembly procedure in the numerical order given.

D-POWER/POWER BOARDS AND RF BOARD SERVICE POSITION

Turn over the set.

– BOTTOM VIEW –

eight screws (3 × 8)

power board

two bottom plate

four screws (3 × 8)

INSTALLATION TWO WIRES (FLAT TYPE) (25/35 CORE) Note: When the wire (flat type) (35 core) is disconnected

from the RF board, then it is again connected, disconnect the wire (flat type) (25 core) once, and reconnect the wire (flat type) (35 core) first.

wire (flat type) (35 core)

RF board

wire (flat type) (25 core)

D-power board

SCD-XA9000ES

MAIN BOARD SERVICE POSITION

In checking the MAIN board, prepare jig (extension cable J-2501-205-A: 1.50 mm Pitch, 7 cores, Length 300 mm/ J-2501-086-A: 1.00 mm Pitch, 19 cores, Length 300 mm).

Note: Be sure to ground the MAIN board with a lead wire when checking it.

connect jig (extension cable J-2501-205-A) to the main board (CN706) and display board (CN801).

lead wire

main board

connect jig (extension cable J-2501-086-A) to the main board (CN701) and mother board (CN301), main board (CN702) and mother board (CN302).

MOTHER board

FRONT PANEL SECTION SERVICE POSITION

front panel section

SCD-XA9000ES

AUDIO MODULE BLOCK SERVICE POSITION

audio module bloc

NOTE FOR INSTALLATION (AUDIO MODULE BLOCK)

Note: When installing the audio module block, insert the audio module block as shown below.

audio module block

NOTE ON POSITION OF WIRE (FLAT TYPE)

SCD-XA9000ES

FRONT

MAIN board

wire (flat type)

heatsink

A-POWER board

Heatsink gets heated up to a high temperature. Be careful to keep the position of wire (flat type).

SCD-XA9000ES

SECTION 2

GENERAL

Front Panel Parts Descriptions

This section is extracted from instruction manual.

POWER

PHONES

TIME/TEXT

PHONE LEVEL

MIN MAX

MULTI/2CH

SACD/CD

i.LINK

1 POWER switch

Press to turn on the player.

2 TIME/TEXT button

Each time you press the button, the playing time of the track, the total remaining time on the disc, or TEXT information appears in the display.

3 SACD/CD button

Each time you press the button while playing back a hybrid disc, the layer to be played back switches between the HD (Super Audio CD) layer and the CD layer.

4 i.LINK button

Each time you press the button, i.LINK function turns on or off.

AMS

PUSH ENTER

9 x button

Press to stop play.

0 PHONES

Connect the headphones. During playback of a Multi-channel Super Audio CD, the same signal that is output from the ANALOG

5.1CH FRONT L/R jacks is output from the PHONES jack.

qa PHONE LEVEL

Adjust the headphones volume.

qs MENU

Press to enter the menu. Press to exit from the menu and return to the normal display.

i.LINK indicator

Lights up when the i.LINK function is used.

5 Disc tray

Press A OPEN/CLOSE to open/close the disc tray.

6 A OPEN/CLOSE button

Press to open or close the disc tray.

7 N button

Press to start play.

N indicator

Lights up during playback.

8 X button

Press to pause play.

X indicator

Lights up during pause.

qd MULTI/2CH button

Press to select the playback area when the 2 channel + Multi-channel Super Audio CD is loaded.

qf Remote sensor qg Display window

Shows various information.

qh . AMS > dial (AMS: Automatic Music Sensor)

When you turn the . AMS > dial counterclockwise by one click, you go back to the preceding track; when you turn the . AMS > dial clockwise by one click, you go to the succeeding track.

Rear Panel Parts Descriptions

CENTER

FRONT SURROUND SUB WOOFER

ANALOG

5.1CH OUT

2CH OUT

OUT

DIGITAL(CD)

OPTICALCOAXIAL

AUDIO OUT

i.LINK S200

SCD-XA9000ES

AC IN

1 ANALOG 5.1CH OUT jacks

Connect to an amplifier equipped with the 5.1CH input jacks (Multi-channel amplifier, AV amplifier, etc.) using the audio connecting cords.

2 DIGITAL (CD) OUT COAXIAL connector

Connect to an audio component using the coaxial digital cable.

3 DIGITAL (CD) OUT OPTICAL connector

Connect to an audio component using an optical digital cable.

4 i.LINK S200 AUDIO OUT jack

Connect to STR-DA9000ES/TA-DA9000ES using the i.LINK connecting cord.

5 AC IN terminal

Connect the AC power cord.

6 ANALOG 2CH OUT L/R jacks

Connect to an audio component (stereo/2 channel) using the audio connecting cord.

Note

Only the audio signals of the CD can be output from the DIGITAL (CD) OUT connectors shown in 2 and 3. Those of the Super Audio CD cannot be output through DIGITAL (CD) OUT connectors.

When the i.LINK indicator is lit

No signal is output from all the other jacks (ANALOG 2CH OUT jacks, ANALOG 5.1CH OUT jacks, PHONES jack, DIGITAL (CD) OUT jacks).

SCD-XA9000ES

Remote Parts Descriptions

1 CONTINUE button

Press to resume normal play from Shuffle Play or Program Play.

SHUFFLE button

Press to select Shuffle Play.

PROGRAM button

Press to select Program Play.

2 DISPLAY MODE button

Press to turn the display information off or on.

3 TIME/TEXT button

Each time you press the button, the playing time of the track, the total remaining time on the disc, or TEXT information appears in the display.

4 Number buttons

Press to enter the track numbers.

10 button

Press to locate a track numbered over 10.

6 REPEAT button

Press repeatedly to play all tracks or only one track on the disc.

7 AyB button

Press to select Repeat A-B Play.

8 H button

Press to start play.

X button

Press to pause play.

x button

Press to stop play.

9 AMS ./> (AMS: Automatic Music Sensor)

buttons

Press to locate a specific track.

0 m/M buttons

Press to locate a portion you want to play within a track.

qs SACD/CD button

Each time you press the button, ”SACD“ or ”CD“ appears in the display. Select the type of CD you want to play.

qd MULTI/2CH button

Press to select the playback area when the 2 channel + Multi-channel Super Audio CD is loaded.

qf ENTER button

Press to decide the selection.

qg CLEAR button

Press to delete a programed track number.

qh LEVEL ADJ button

Press to adjust the output level balance for the Multichannel management function.

qj CHECK button

Press to check the programed order.

PLAY MODE

CONTINUE SHUFFLE

DISPLAY/

MODE

TIME/TEXT

PROGRAM

SACD/CD

MULTI/2CH

123 456

10/0

CHECK

CLEAR

LEVEL

ADJ

>10 ENTER

REPEAT

qa INDEX >/. buttons

Press to locate a specific point marked with an index signal when you play a disc that has index signals.

AMS

INDEX

SECTION 3

DISASSEMBLY

• This set can be disassembled in the order shown below.

3-1. DISASSEMBLY FLOW

Note 1: The process described in can be performed in any order. Note 2: Without completing the process described in , the next process can not be performed.

SET

3-2. CASE (TOP),

SIDE PLATE (Page 14)

3-3. LOADING PANEL

3-3. LOADING PANEL ASSY

(Page 14)

ASSY (Page 14)

SCD-XA9000ES

Ver. 1.3

3-5. MAIN BOARD,

BRACKET (MAIN) (Page 15)

3-6. RF BOARD,

MECHANISM DECK (CDM19JB-DVBU4C or CDM19JB-DVBU4D) (Page 16)

3-7. DISC TABLE, BEL T,

LOADING MOTOR (M1) (Page 16)

3-8. OPTICAL PICK-UP

3-4. FRONT PANEL

(KHM-230AAA) (Page 17)

SECTION (Page 15)

3-9. BASE UNIT

(DVBU4C or DVBU4D) (Page 18)

SCD-XA9000ES

Note: Follow the disassembly procedure in the numerical order given.

3-2. CASE (TOP), SIDE PLATE

two screws (flat head)

two screws (3

two screws (flat head)

case (top)

three screws (flat head)

two screws (3

side plate (right)

side plate (left)

3-3. LOADING PANEL ASSY

loading panel assy

two screws (flat head)

two screws (P 3

10)

cover (CAM)

tapering driver

Insert a tapering driver in the hole at the bottom of the unit, turn the cover (CAM) fully in the direction of arrow

3-4. FRONT PANEL SECTION

)

connector (CN453)

connector (CN994)

connector (CN601)

connector (CN706)

two screws (3

two brackets (F)

SCD-XA9000ES

screw (BVTT 3

front panel section

3-5. MAIN BOARD, BRACKET (MAIN)

main board

connector (CN706)

connector (CN423)

two screws (3

four screws (3

five screws (3

wire (flat type) (25 core) (CN710)

harness

two connectors (CN703, 707)

two wires (flat type) (19 core) (CN701, 702)

two screws (3

wire (flat type) (35 core (CN708)

connector (CN704)

bracket (main)

SCD-XA9000ES

)

Ver. 1.3

3-6. RF BOARD, MECHANISM DECK (CDM19JB-DVBU4C or CDM19JB-DVBU4D)

CDM19JB-DVBU4C: Except AEP (Silver type) CDM19JB-DVBU4D: AEP (Sivler type)

mechanism deck (CDM19JB-DVBU4C or CDM19JB-DVBU4D)

two screws (3 × 8)

wire (flat type) (25 core) (CN003)

bracket (guide wire)

two screws (3

connector (CN001)

two screws (3 × 8)

disc table

connecto (CN002)

Push the disc table in the direction of arrow

three screws (BVTP2.6

3-7. DISC TABLE, BELT, LOADING MOTOR (M1)

guide bar (main)

gear (C)

disc table

belt

RF board

holder (A. P.) assy

two screws (P3

two screws (BVTT M3 S

bracket (loading panel)

tapping screw

Insert a tapering driver in the hole of the cover (CAM) and turn fully in the direction of arrow

cover (CAM)

gear (P)

taper driver

four claws

loading motor (M1)

3-8. OPTICAL PICK-UP (KHM-230AAA)

holder (A. P.) assy

stopper

Draw out the disc table fully in the arrow

direction.

stopper

optical pick-up (KHM-230AAA)

screw (BVTP2.6

insulator

wire (flat type) (25 core) (CN003)

two cone type coil spring (230)

Insert a tapering driver in the hole of the cover (CAM) and turn fully in the direction of arrow

cover (CAM)

taper driver

two screws (BVTT M3 S)

SCD-XA9000ES

)

Ver. 1.3

3-9. BASE UNIT (DVBU4C or DVBU4D)

DVBU4C: Except AEP (Silver type) DVBU4D: AEP (Sivler type)

Insert a taper driver into the cover (CAM), and rotate in the arrow the base unit (DVBU4C or DVBU4D) in the arrow

direction. (Chuck release state)

cover (CAM)

two claws

limiter (R)

screw (BVTT3

direction to raise

screw (BVTT3

limiter (L)

S001

Raising the stable lock (L/R) assy simultaneously in the arrow (DVBU4C or DVBU4D) from the chassis (outseat).

Note: The stable lock (L/R) assy will attempt to

return in the reverse direction of arrow by a spring force. Therefore, take care not to break the shaft of stable lock (L/R) assy when removing the stable lock (L/R) assy from the base unit (DVBU4C or DVBU4D).

direction, remove the base unit

roller (L)

S002

two claws

Up the SWITCH board in the direction of arrow

Note: Take care not to break the shaft of

the switch (S001, S002) when raising the SWITCH board.

screw (PTPWH3 × 8)

stable lock (R) assy

chassis (outseat

stable lock (L) assy

SECTION 4

TEST MODE

SCD-XA9000ES

In this set, various checks are automatically performed by executing the commands in the test mode.

Note: This set makes adjustment e very optical pick-up and stores its result

in the EEPROM (IC903) on the MAIN board. Accordingly, if a combination of optical pick-up and EEPROM is changed, be sure to perform 4-3. SET CHECK. Also, perform 4-1. IC INTERFACE CHECK, 4-2. DISPLA Y CHECK, and 4-6. WAVEFORMS CHECK.

Disc for Test Mode

Various checks of this set require the following discs.

Model Type *1 Category Application

MODEL SATD-S5 (J-2501-215-A) SL SATD-S4 Optical waveform check (J-2501-184-A)

Not specified DL 12 cm disc Operation check PATD-012

(4-225-203-01) YEDS-18 Reference disc (3-702-101-01)

Not specified HYBRID 12 cm disc Operation check

12 cm disc Reference disc

12 cm disc

Adjusted value check, Operation check,

Adjusted value check, Operation check, Optical waveform check

Setting Method of Test Mode

Turn the [POWER] button on while pressing the [ AMS ] dial and the [MENU] button. Release the [MENU] button and the

[ AMS ] dial in this order when “DIAG MODE” is displayed

on the fluorescent indicator tube.

Releasing Method of Test Mode

To release the test mode, turn the [POWER] switch off.

Selection/Entry of Test Mode

To select and enter the “DIAG MODE”, operate as follows.

1. Rotate the [ AMS ] dial to select the menu, and press

2. The test is switched on or off alternately each time the

3. To return to the pre vious step, rotate the [ AMS ] dial

*1 SL: Single Layer

DL: Dual Layer

Test Mode Command List

The contents of test mode are as follows.

Note: Wrong operation in the test mode causes a trouble, thus requiring extreme care.

the [ AMS ] dial to enter.

[ AMS ] dial is pressed.

to select the desired item, and press the [ AMS ] dial

to enter.

LINE command (0X): Use mainly for a manufacturing line.

No. Name Description Remarks

00 RFAmp Read Each register set value of the IC001 (RF AMP) is displayed via RS-232C Not used for the servicing 05 DSP MON1 XUGF, XPCK, C2PO outputted from IC509 (CD DSP) Not used for the servicing 06 DSP MON2 MNT0, MNT1, MNT2, MNT3 outputted from IC509 (CD DSP) Not used for the servicing

07 DSP MON3 RFCK, XPCK, XROF, GTOP outputted from IC509 (CD DSP)

Electrical measurement, CD CLV jitter measurement

STANDARD command (1X): Use when the servo is applied by manual operation.

No. Name Description Remarks

12 LD ON/OFF The laser diode is turned on or off On or off are switched alternately 13 SPIN ON/OFF The spindle motor is rotated with the regulated voltage On or off are switched alternately 14 FSRV ON/OFF The focus servo is turned on or off On or off are switched alternately 15 TSRV ON/OFF The tracking servo is turned on or off On or off are switched alternately

16 CLV ON/OFF

17 SSRV ON/OFF

18 ALL SRV ON All servos are turned on 19 ALL SRV OFF All servos are turned off Stop command in the test mode

The spindle SLV servo is turned on or off Focus and tracking servos must be already turned on

The sled servo is turned on or off Focus, tracking and spindle servos must be already turned on

On or off are switched alternately

FOCUS command (2X): Focus related. (All servos must be already turned on (except command 21))

No. Name Description Remarks

21 FSRCH ON/OFF

22 F-BIAS UP Increase focus bias Focus bias value 23 F-BIAS DOWN Decrease focus bias Focus bias value

24 ADJ FCSBIAS

25 FGAIN UP/DW The focus servo gain is switched between normal and down Normal or down are switched alternately 27 FOCUS AGC The focus servo gain is adjusted automatically

The continuous vertical motion of the optical pick-up lens is turned on or Avoid a long-time use off On or off are switched alternately

The focus bias is adjusted automatically Both + and - directions are searched to search for best jitter point

OFFSET (PI, FE, TE) command (3X): Adjusts the offset of PI, FE and TE signals.

No. Name Description Remarks

31 PI/FE OFSET

Adjusts the offset of PI, FE and TE signals TE offset adjustment is executed for the CD This adjustment must be executed after 61 DISC DETECT only

SCD-XA9000ES

TRACKING command (4X): Tracking servo related.

No. Name Description Remarks

41 TGAIN NM/UP The tracking servo gain is switched between normal and up Normal or up are switched alternately 44 ADJ TRK DSP The traverse AGC and E-F balance adjustment is performed 45 TRACKING AGC The tracking servo gain is adjusted automatically

SEARCH command (5X): Track search related. (Nos. 51 through 53 are not used for the servicing.)

No. Name Description Remarks

51 1-TRCK JUMP One-track jump is performed 52 FINE SEARCH Fine search is performed 53 M-TRCK MOVE M-track movement is performed

DISC DETECT command (6X): Disc type check related.

No. Name Description Remarks

Disc type check is executed Display after judgment

61 DISC DETECT

62 CD SETTING Enter disc type CD setting CD forced setting 63 SL SETTING Enter disc type SL setting SL forced setting 64 DL SETTING Enter disc type DL setting DL forced setting 6F Download Not used for the servicing

DSKMOD CD: Judged as CD Refer to how to apply servo by manual DSKMOD SL: Judged as SACD (SL) operation (See page 21) DSKMOD DL: Judged as SACD (DL) DSKMOD HYB: Judged as HYBRID

LASER command (7X): Laser of optical pick-up related.

No. Name Description Remarks

7A ADDTIME CD

7B ADDTIME HD

7C FJUMP TEST Not used for the servicing

Cumulative light emission time of the laser for CD is displayed (Initialized by 8D command)

Cumulative light emission time of the laser for SACD is displayed (Initialized by 8D command)

TOOLS command (8X): Performs aging, reads adjusting parameters, etc.

No. Name Description Remarks

81 VERSION Firmware version is displayed Example: Ver 1.00 83 TRAY AGING Tray open-close aging is performed Not used for the servicing 87 DISP ADJ DT Automatic adjusting parameters are displayed via RS-232C Not used for the servicing

8D SETUP MODE

8F SETUP U/CA

Set to factory shipping mode Set when repair completed PLAY MODE, etc. are initialized (AEP model only) Refer to 4-5. SHIPPING MODE (See page 24)

Set to factory shipping mode Set when repair completed PLAY MODE, etc. are initialized (US and Canadian models only) Refer to 4-5. SHIPPING MODE (See page 24)

QA command (9X)

No. Name Description Remarks

91 FJUMP CHECK The focus jump is checked Not used for the servicing 92 SET CHECK The set is checked Refer to 4-3. SET CHECK (See page 22) 93 WATER MARK Not used for the servicing

94 SET AGING

95 FJMP CHK BU The focus jump is checked (for jig) Not used for the servicing 9A MIRR MES MIRR signal offset measurement Not used for the servicing

9C BU DENCHO

9D PLAY&RFD ON

9E RFD ON/OFF

The set aging is performed Repeat by the specified number of times or until an error occurred

The S curve waveform, traverse waveform, and RF waveform can be Refer to 4-6.WAVEFORMS CHECK checked successively (See page 24)

SACD playback, RFD output SACD jitter measuring mode

RFD output is turned on or off SACD jitter measuring mode

Not used for the servicing

IC command (AX)

No. Name Description Remarks

A0 IC SELF CHK Each IC and its communication are checked Normal or up are switched alternately

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How to Apply Servo by Manual Operation

In analyzing failures of the set, the servo may be applied by manual operation. To apply servo in the test mode, use the following method.

1. After setting the test mode, rotate the [ AMS ] dial to select a command, and press the [ AMS ] dial to enter .

2. “61 DISC DETECT” (Disc type check)t“18 ALL SR V ON” (All servos on + auto adjustment)

3. If applying servo while checking the condition one by one, “61 DISC DETECT” (Disc type check)t“31 PI/FE OFSET” (Offset automatic adjustment)t“14 FSRV ON/OFF” (Focus servo on)t“16 CLV ON/OFF” (CLV servo on) t“44 ADJ TRK DSP ” (E-F balance adjustment)t“15 TSR V ON/OFF” (Tracking servo on)t“17 SSRV ON/OFF” (Sled servo on)t“24 ADJ FCSBIAS” (Focus bias adjustment)t“27 FOCUS AGC” (Focus auto gain adjustment)t“45 TRACKING AGC” (Tracking auto gain adjustment).

Note: 1. On and off are alternately switched in the same command.

2. For a stop, select “19 ALL SR V OFF” and press the [ AMS ] dial.

4-1. IC INTERFACE CHECK

The communication between microcomputer and main ICs is checked.

Checking Method:

1. After setting the test mode, rotate the [ AMS ] dial to select “A0. IC SELF CHECK” and press the [ AMS ]

dial to enter.

2. A checking will start automatically. (Checking time is about 3 seconds)

3. At successful completion of check, “IC CHECK OK” is displayed. In this case, no error exists in the IC interface.

Note: The check mentioned above tests the communication from micro-

computer to main ICs. Even if the check successfully finished, the IC to be checked is not always normal. Consider it for reference only.

4. In case of an IC communication error, the following display will be given during the checking. Possible causes of error are as listed below.

Error display Causes (typical example)

EEPROM ERROR 1. IC903 (EEPROM) is faulty SAMBA DRAM ERR 1. IC808 (D-RAM) is faulty

(DSD decoder is also 2. IC801 (DSD decoder) is faulty checked) 3. 768fs (33.8688 MHz) is not present to

RF AMP ERROR 1. IC001 (RF AMP) is faulty

SD BUS ERROR 1. IC701 SD bus and IC801 AV decoder

AUDY ERROR 1. IC802 and IC803 (SD-RAM) are faulty

IC801 pin qa (MCKI) Same as cause 3 of DVD DEC. ERROR

4. IC801 pin 9 (XRST) does not go “H”

• IC901 pin q; (XDIS IO) does not go “H”

• IC904 (PLD) is faulty

5. Faulty communication line between IC801 and IC808

•Data line, address line, WE, etc.

6. D904 (1SS367) is faulty D+3.3V is not present to IC808

2. Loose connection between CN708 on MAIN board and CN005 on RF board, or FFC disconnection CN708 pin ql (CLK RF), pin w; (DATA RF) and pin wa (SDEN) must be checked

interface is faulty

2. IC812 to 814 are faulty

2. Faulty communication line between IC802 and IC901

3. Faulty communication line between IC802 and IC803 (SD-RAM)

Causes Common to Each IC:

1. Faulty communication line between microcomputer and each IC. Disconnected patterns, floating series resistors, bridge, etc.

2. Faulty IC supply voltage. Particularly, check D+3.3V voltage.

3. Faulty microcomputer communication port to each IC

Note: In case of more than two errors, the error display is switched over

one after another, thus making the reading difficult. In such a case, press again the [ AMS ] dial to make a recheck for error reading.

Error display Causes (typical example)

DVD DEC. ERROR 1. IC701 (SACD decoder) is faulty

2. IC701 pin <znv (XRST) does not go “H”

• IC901 pin q; (XDIS IO) does not go “H”

• IC904 (PLD) is faulty

3. 768fs (33.8688 MHz) is not present to IC701 pin <znm (XTAL)

• IC811 (3-multiplying circuit) is faulty

• Clock signal 256fs is not sent from

MOTHER board (CN702 pin 4)

• CN702 pin 1 (GND) and pin 3

(+3.3V-D) are open or shorted

• CN701, 702 and FFC connection is loose,

or FFC is disconnected

DVD DRAM ERR 1. IC706 (D-RAM) is faulty

2. IC701 pin <znv (XRST) does not go “H”

• IC901 pin q; (XDIS IO) does not go “H”

• IC904 (PLD) is faulty

3. Faulty communication line between IC701 and IC706

•Data line, address line, WE, etc.

4. D903 (1SS367) is faulty D+3.3V is not present to IC706

CD DSP ERROR 1. IC509 (CD DSP) is faulty

2. 768fs (33.8688 MHz) is not present to IC509 pin ua (XTAL) Same as cause 3 of DVD DEC. ERROR

3. IC509 pin 2 (XRST) does not go “H”

• IC901 pin q; (XDIS IO) does not go “H”

• IC904 (PLD) is faulty

4-2. DISPLAY CHECK

Checking Method:

1. Short the BP (TEST MODE) on the DISPLAY board, then press the [POWER] button to turn on the power.

2. All segments of fluorescent indicator tube will automatically light up, and therefore check that there is no chipped character.

3. The “Remocon Check” will be displayed after the segment check finished successfully, then press a proper key on the remote commander and therefore check that there is reaction to remote commander.

4. After “Key&Led Check” is displayed, press the key on the display one by one. If all key on the display is pressed, LED and segments of fluorescent indicator tube except numbers of calendar will light up, then “Jog Dial-Check” will be displayed.

5. After “Jog-Dial Check” is displayed, the numbers of calendar will be displayed from 1 to 15 each time the [ AMS ]

dial is rotated clockwise.

6. After display up to 15, the numbers of calendar will disappear in order each time the [ AMS ] dial is

rotated counterclockwise.

7. “!%%TEST-END!!%” will be blinked when all are cleared , and display check is completed.

SCD-XA9000ES

4-3. SET CHECK (AUTOMATIC VARIOUS MEASUREMENTS)

The operational stability of the set is checked. The check and OK/NG judgment are performed automatically.

Note: In the set check using the CD, besides a checking, the MIRR time used for the disc check is measured every optical pick-up, and from the measured

result, the threshold value is calculated and it is stored in the EEPROM (IC903) on the MAIN board. Accordingly, if a combination of optical pickup and EEPROM is changed (for example, the optical pick-up or MAIN board is replaced), be sure to perform the set check using the following CD. As the data stored in the EEPROM are overwritten every set check, retry if failed. For the set check using the SACD, only checking is made.

Set Check

92. SET CHECK AUTO CHECK SP?

AUTO CHECK?

DISP RESULT S?

DISP RESULT F?

CHECH END?

The set check is executed to judge OK or NG. (For the CD, the threshold value is stored in the EEPROM)

The set check of measurement only is executed.

The measured result is displayed via RS-232C.

The measured result is displayed on the fluorescent indicator tube.

The set check is finished.

CD and SACD (SL) Disc Operation Check

Checking method:

1. After setting the test mode, rotate the [ AMS ] dial to select “SET CHECK” and press the [ AMS ] dial to enter.

2. Upon display of “AUTO CHECK SP?”, further press the [ AMS ] dial.

3. The tray will open automatically, and then set the test disc*1 of CD or SACD.

4. With the “DISC IN&JOG ON” displayed, press the [ AMS ] dial, and the check will be executed automatically.

5. “SPEC OK!” will be displayed if the measured result is within the specification. Faulty item name and the measured result will be displayed if any measured item is NG.

6. After that, “AUTO CHECK SP?” will be again displayed, and then rotate the [ AMS ] dial to select “CHECK END?”. Further, press the [ AMS ] dial, and the test mode selection display will be back, and then press the [OPEN/CLOSE ] button and take

the test disc out.

*1 Use PATD-012 or YEDS-18 for CD, and SATD-S5 or SATD-S4 for SACD (SL). Using another disc will result in a checking failure.

Measured Items:

Items Description Remarks

RF/VC/FE/TE (ORG) RF (8 bit data in hex notation) RF: A0h

RF/VC/FE/TE (ADJ)

PI/TRVS PP (ORG/ADJ) TRVS PP (ORG): Traverse level before level correction (AGC) Traverse level conversion

PIOR/CCR/TRCR CCR: Set value of FE offset coarse adjusting register

FOCUS/TRK GAIN

FBIAS/TRVSC/TRCR2/CFR

PSP AMPLITUDE SACD only 1-LAST TRK SEEK (msec) Average seek time from first track to last track of disc

ERROR RATE For CD: Average value/Maximum value of C1 and C2

Offset values before RF (PI), VC, FE, TE signal offset adjustment At offset 0

VC, FE, TE (9 bit data in hex notation) VC, FE, TE: 00h Offset values after RF (PI), VC, FE, TE signal offset adjustment VC offset is not adjusted

(Less than ORG value if offset correction is normal) (Measurement only) RF (8 bit data in hex notation) Also, for SACD, the TE offset is VC, FE, TE (9 bit data in hex notation) not measured and adjusted

PI (ORG): PI value at disc type check (decimal data) PI level conversion PI (ADJ): PI value after PI offset adjustment Read value × 12.9mV

TRVS PP (ADJ):Traverse level after level correction (AGC)

PIOR: Set value of PI offset coarse adjusting register Registers in RF amplifier

TRCR: Set value of TE offset coarse adjusting register Auto gain adjusted values of focus and tracking servos

(8 bit data in hex notation) FBIAS: Focus bias set value (9 bit data in hex notation)

TRVSC: Traverse center value (9 bit data in hex notation) TRCR2: Set value of E-F balance coarse adjusting register CFR: Set value of traverse level adjusting register

Error rate measurement

For SACD: Average value/Maximum value of PO, PI1 and PI2

(read value at microcomputer A/D) (decimal data)

(decimal data) Read value × 12.9mV

(decimal data) 12.9mV=3.3V ÷ 256 (8 bit)

TRCR2 adjusts the E-F gain balance and used for CD only (Fixed to 06 for SACD) TRCR2 and CFR are registers in RF amplifier

For the CD, Measure for 7 sec at track No.5 For the SACD, calculation from 100block data at track No.5

SCD-XA9000ES

Specified Value:

Specified value used for OK/NG judgment when executing 92. SET CHECKtAUTO CHECK SP?

Measured Items Specified value

RF AVRG (ADJ) 8Ch to ABh VC AVRG (ADJ) 1F7h to09h

FE AVRG (ADJ)

TE AVRG (ADJ) 1E2h to 1Eh TRVS PP (ADJ) 45h to 73h FCS GAIN 10h to 60h TRK GAIN 10h to 60h

ERROR RATE C2 0

PSP AMPLITUDE (SACD only) 1000 to 4000 1-LAST TRK SEK 3500 or less

Note: The specified values attached with “h” are hexadecimal numbers, and others are decimal numbers.

RF, VC, FE, and TE measured values are hexadecimal data with positive and negative signs. When comparing the measured value with the specified value, refer to the following.

(1) CD 1EEh to 12h (2) SACD 1F1h to 0Fh

(1) CD

(2) SACD

C1 20 or less

PI1 NUM 100 or less PI1 FRAME 5 or less

Hexadecimal (hex) display 9 bit data

FF 011111111 (+255) FE 011111110 (+254)

01 000000001 (+1) 00 000000000 (0) 1FF 111111111 (-1)

101 100000001 (-255) 100 100000000 (-256)

MAX

(+) Side

(-) Side

MIN

Hexadecimal (hex) display 8 bit data

7F 01111111 (+127) 7E 01111110 (+126)

02 00000010 (+2) 01 00000001 (+1) 00 00000000 (0) FF 11111111 (-1) FE 11111110 (-2)

81 10000001 (-127) 80 10000000 (-128)

SCD-XA9000ES

4-4. SACD (DL) DISC OPERATION CHECK

(• Perform as necessary) This checking performs the focus jump using a DL disc, which is a dual-layer HD disc, to verify the stability of the set. A set of layer 0 most-outside track access (only once)tone-second tracetfocus jump (layer 0t1)tone-second tracetfocus jump (layer 1t0) are repeated 5 times.

Checking Method:

1. After setting the test mode, rotate the [ AMS ] dial to select “91 FJUMP CHECK” and press the [ AMS ] dial

to enter.

2. The tray will open automatically, and then set the DL disc.

3. With “DISC IN&JOG ON” displayed, press the [ AMS ]

dial.

4. The tray will be loaded in automatically, and then the test will start.

5. During the test, “NOW TESTiiii” is displayed.

6. Upon successful completion of the check, “OK!” will be displayed and the tray will open automatically. (In case of NG, “NG! ERR FJ-UP” or “NG! ERR FJ-DWN” is displayed)

7. Take the DL disc out and press the [OPEN/CLOSE ] button,

and the test mode selection display will be back

4-5. SHIPPING MODE

The repaired set must be initialized, and for this purpose the set should be set to the shipping mode.

Setting Method:

1. After setting the test mode, rotate the [ AMS ] dial to

select “8D SETUP MODE” (AEP model) or “8F SETUP U/ CA” (US and Canadian models) and press the [ AMS ]

dial to enter.

2. “INITIAL OK” is displayed and the test mode selection display will be back immediately.

3. Press the [POWER] button to turn the power off.

The following setups are established in the shipping mode

1. Initialization of EEPROM (IC903)

• LAYER SELECT SACD

• M/2CH SELECT MULTI

• 2ch SPK MODE 2ch DIRECT

• Mch SPK MODE Mch DIRECT

• REPEAT MODE REPEAT OFF

• LANGUAGE ENGLISH

• DIGIFIL MODE STANDARD

• D.OUT ON

• SPK DISTANCE 3.0 meter/10 feet at each channel

• SPK DIST.UNIT meter (AEP model)/

feet (US and Canadian models)

• i.LINK POWER OFF

• i.LINK (FUNCTION) OFF

• Resetting the cumulative light emission time of the laser

Note: Even if the shipment mode setting mentioned above is made, the

disc check threshold value attained in the 3. SET CHECK is not cleared.

2. The optical pick-up moves to the home position (most-inside track)

4-6. WAVEFORMS CHECK BU Electrical Adjustment Mode

The BU electrical adjustment mode is used to check the S curve waveform, traverse waveform, RF w aveform, and CLV jitter. After a disc is placed on the tray, each time the [ AMS ] dial is

pressed, the check mode is switched in order for S curve waveformt traverse wa veformtRF wa veformtCL V jitter (for the CD).

S Curve Check

Connection:

oscilloscop

MAIN board

TP506 (FE)

TP504 (AVC)

+ –

Checking Method:

1. After setting the test mode, rotate the [ AMS ] dial to

select “9C. BU DENCHO” and press the [OPEN/CLOSE ]

button. Place the test disc (PATD-012 or YEDS-18 or SATDS5 or SATD-S4) on the tray and close the tray, then press

the [ AMS ] dial.

2. At the completion of disc type check, “CD DETECT” will be displayed (for PATD-012 or YEDS-18).

Note: For the SATD-S5 or SATD-S4, “SL DETECT” is displayed.

3. Press again the [ AMS ] dial, and the S curve waveform

check mode will become active and “S-CURVE MODE” will be displayed.

4. Connect an oscilloscope to the TP506 (FE) and TP504 (AVC) on the MAIN board.

5. Check that the level A and B of waveform on the oscilloscope satisfy the specification.

Specified Value:

Disc AB

SATD-S5 or SATD-S4 PATD-012 or YEDS-18

S curve waveform

Note: For easier observation of this waveform, extend the sweep time

and raise the brightness.

0.7 to 1.7 Vp-p –0.1 to +0.1V

Checking and Connecting Location : See page 25.

Error List

Display Description

Toc Error * Error during the time from auto adjustment to TOC

Toc Error **** Illegal SACD (Such as a pirated version)

reading, Different type of disc (Such as a DVD disc), Disc is dirty

SCD-XA9000ES

CLV jitter waveform

Ver 1.1

Traverse Check

Connection:

oscilloscope

MAIN board

TP513 (TE)

TP504 (AVC)

+ –

Checking Method:

1. Under the condition of S curve waveform check mode in step 5, press the

[ AMS ] dial.

2. After “W AIT” is displayed, the traverse wa veform check mode will become active and “TRV MODE ON” will be displayed.

3. Connect an oscilloscope to the TP513 (TE) and TP504 (AVC) on the MAIN board.

4. Check that the level A and B of waveform on the oscilloscope satisfy the specification.

Specified V alue:

Disc AB

SATD-S5 or SATD-S4 PATD-012 or YEDS-18

Traverse waveform

0.9 to 1.4 Vp-p –0.1 to +0.1V

Center fo the waveform

Checking and Connecting Location : MAIN Board

RF Level Check

Connection:

oscilloscope

MAIN board

TP703 (RFAC)

TP704 (AGND)

+ –

Checking Method:

1. Under the condition of traverse waveform check mode in step 4, press the

[ AMS ] dial.

2. Connect an oscilloscope to the TP703 (RFAC) and TP704 (AGND) on the MAIN board.

3. After “W AIT” is displayed, the RF waveform check mode will become active and “PLAY 5th TRACK” (for the SA CD, “RF MODE ON”) will be displayed, and the 5th music on the disc will be played.

4. Check that the RF waveform is clear and the level satisfies the specification.

5. Press the

[ AMS ] dial (for the SACD, “RF JITTER

(5th)” will be displayed, and further press the AMS dial), and “OUTSIDE TRACK” will be displayed and the outward track of the disc will be played.

6. Check that the RF waveform is clear and the level satisfies the specification.

7. Press the

[ AMS ] dial, and “INSIDE TRACK” will be

displayed and the inward track of the disc will be played.

8. Check that the RF waveform is clear and the level satisfies the specification.

9. After checking, press the

[ AMS ] dial, and the test is

over when “BU MEASURE” is displayed.

10. Press the

[OPEN/CLOSE ] button to open the tray, and re-

move the test disc.

11. Using each type of disc, repeat from step 1 of S curve waveform check up to step 10 of RF level check.

12. When the check is over, press the

[POWER] button to turn the

power off.

Note: Take care not to leave the test disc in the set.

Specified Value:

Disc A

SATD-S5 or SATD-S4 PATD-012 or YEDS-18

RF signal waveform

0.9 to 1.4 Vp-p

VOLT/DIV: 200 m TIME/DIV: 500 ns

CLV Jitter Check (CD only)

Connection:

oscilloscop

MAIN board

TP516 (RFCK) TP517(WFCK)

TP808 (DGND)

(CH1)

(CH2)

–

Checking Method:

Under the condition of RF level check mode in step 3, connect the oscilloscope to the TP516 (RFCK) (CH1), TP517 (WFCK) (CH2), and the TP808 (DGND) (GND) on the MAIN board to check that the value A of the waveform satisfies the specification.

Note: Take care not to leave the test disc in the set.

Specified Value:

Disc A

PATD-012 or YEDS-18

35 µsec or less

Checking and Connecting Location:

– MAIN Board (Component Side) –

IC504

(RFAC)

4-7. i.LINK SIGNAL OPERATION CHECK

Connect the set to a unit equipped with the i.LINK terminal to check if the bus reset occurs correctly. By this operation, a loose connection of the connector or a disconnection of the i.LINK cable can be checked.

Note: Do not perform the operation other than the specified operation in

the following i.LINK test mode, as the set otherwise may not operate normally.

Checking Method:

1. Press the

[ AMS ] dial to select the “i.LINK” function (i.LINK

LED (blue) lights up). Then, with the kept pressed, press the and

[POWER] button to turn the power on, and rotate the

[TIME/TEXT] button

[OPEN/CLOSE ] button, [ ] button,

[ ] button in this order, so that the i.LINK test mode is

activated and “<< [B A CK] >>” is displayed on the fluorescent display tube.

2. With “<< [BACK] >>” displayed on the fluorescent display tube, rotate the

[ AMS ] dial clockwise to advance the

display by five steps, so that “B.Rst. [000]” is displayed. T his counter increments by one or several counts each time the bus reset occurs.

3. Turn on the power of the unit equipped with the i.LINK terminal, and connect the set to the unit equipped with the i.LINK terminal using the i.LINK cable to check if the bus reset occurs correctly. If the bus reset does not occur, or if the bus reset occurs continuously, the i.LINK cable will be disconnected or the connector connection will be loose.

Note: The bus reset may not occur unless the power of the unit equipped

with the i.LINK terminal is turned on when it is connected.

4. With the set connected to the unit equipped with the i.LINK terminal using the i.LINK cable, move the i.LINK cable to check if the bus reset occurs. If the bus reset occurs though the i.LINK cable is not removed, the i.LINK cable will be disconnected or the connector connection will be loose.

5. Press the

[ AMS ] dial counterclockwise so as to display “<<

[BACK] >>”, and then press the

[POWER] button to turn the po wer off, or r otate the

[MENU] button, so that the

i.LINK test mode is deactivated.

TP513

(TE)

TP506

TP703

IC509

TP517

(WFCK)

(FE)

TP504

(AVC)

TP516

(RFCK)

IC701

Note: Clear RF waveform refers to the wav eform where ◊ shapes should

be distinctively observed in the center.

TP808

(DGND)

TP704

(AGND)

IC802

Checking and Connecting Location : MAIN Board

IC801

2525

SCD-XA9000ES

5-1. BLOCK DIAGRAM – RF/SERVO Section –

OPTICAL PICK-UP

BLOCK

(KHM-230AAA)

DETECTOR

LASER DIODE

(SACD)

LASER DIODE

(CD)

(+2.5V)

MODULE

CIRCUIT B+

2-AXIS DEVICE

(TRACKING)

(SLED)

(LIMIT)

(SPINDLE)

(LOADING)

DVD_LD

DVD_PD

CD_LD

CD_PD

VMOD

(FOCUS)

SECTION 5

DIAGRAMS

• Signal Path

: SACD PLAY

: CD PLAY (ANALOG OUT)

A B C D

E F

G H

D+3.3V

COMPARATOR

IC081 (1/2)

COMPARATOR

IC081 (2/2)

AUTOMATIC POWER

CONTROL (FOR SACD)

Q001

AUTOMATIC POWER

CONTROL (FOR CD)

Q003

B+ SWITCH

Q002, 005

FD+ FD–

TD+ TD–

SD+ SD–

LOAD+ LOAD–

A+5V

FOCUS/TRACKING COIL DRIVE,

SLED MOTOR DRIVE

12 11

14 13

17 18

27 26

SPINDLE/LOADING

8 9

6 5

3 4 5 6

12 11 10

16 15 14 13

IC502

FOCUS

COIL

DRIVE

STANDBY1

TRACKING

COIL

DRIVE

SLED

MOTOR

DRIVE

STANDBY2

MOTOR DRIVE

IC512

SPINDLE

MOTOR

DRIVE

MOTOR

DRIVE

RFSIN

DVDRFP

CD_A CD_B CD_C CD_D

CD_E

CD_F

DVDLD

DVDPD

CDLD

CDPD

A2 B2 C2 D2

A B C D

MUTE2

MUTE1

ATOP

ATON

FOCUS/TRACKING ERROR AMP

FFDR

FRDR

TFDR

TRDR

SFDR

SRDR

22 21

60 53

SACD/CD RF AMP,

MUTE_LOAD

AIN

AIP

IC001

SP_ON

LOAD_IN

LOAD_OUT

FNP

FNN

DIP

RFAC

MIRR

SDATA

SCLK

LDON

SDEN

A+3.3V

+1.65V

DATA_RF

CLK_RF

LDON

AVC

PI ERROR

AMP

IC004 (2/2)

MIRR

MUTE_2D

SP_ERR

VC BUFFER IC004 (1/2)

FJMP1 FJMP2

SPDA

TFDR

TRDR

SFDR SRDR

DIGITAL SERVO PROCESSOR,

DIGITAL SIGNAL PROCESSOR,

DIGITAL FILTER

IC509

RFAC

RFDC

MIRR

FFDR

FRDR

TFDR

TRDR

SFDR

SRDR

SSTP

DIN

: CD PLAY (DIGITAL OUT)

DOUT

PCMD

BCK

LRCK

XTAI

WDCK

EXCK SBSO

WFCK

C2PO DFCT

LOCK

FOK

COUT

SCOR

GFS SCLK SENS CLOK

XLAT

DATA

MUTE

SQCK

SQSO

MD2

XRST

MDP

66 67 65

71 17 80 79 10 14 21

24 22 19 15 13

8 7 6 5 4

3 77 76 63

ON/OFF SWITCH

MDAT

BCLK LRCK

768_CD

GSCOR

EXCK

SBSO

WFCK

C2PO

DFCT

LOCK

FOK COUT SCOR

GFS

SCLK SENS CLOK XLAT DATA

MUTE_CD

SQCK SQSO

MD2

MDP

SPIN

DIGITAL OUT

IC810

WAVE

SHAPER

IC441

DOON

OPTICAL

TRANSCEIVER

IC442

T441

FJMP1, FJMP2, SPDA

MIRR, DATA_RF, CLK_RF, LDON,

SP_ON, LOAD IN, LOAD OUT,

MUTE LOAD, MUTE_2D, SP_ERR

RFAC

DOUT

OPTICAL

COAXIAL

MDP, SPIN

TE, FE, PI,

J391

(Page 27)

(Page 31)

DIGITAL (CD)

(Page 29)

(Page 27)

(Page 28)

(Page 27)

(Page 28)

OUT

VMOD

SDEN

LIM_SW

XRST_CD

VMOD, SDEN,

LIM SW, XRST_CD

(Page 28)

2626

5-2. BLOCK DIAGRAM – MAIN Section (1/2) –

(Page 26)

RFAC

117

RFIN

SCD-XA9000ES

D+5V

127

WAVRB

CENTER VOLTAGE

GENERATOR

IC503

DSAL

DSAR

DSAC

DSASW

DSALS

DSARS

DLI

DRI

DCI

DLFEI

DLSI

DRSI

DLO

DRO

DCO

DLFEO

DLSO

DRSO

SDATAL

SDATAR

SDATAC

SDATASW

SDATALS

SDATARS

(Page 29)

DRVC +2.5V

126

WARFI

(Page 28)

(Page 26)

(Page 28)

(Page 31)

LEVEL SHIFT

9 – 2

11 – 18

169 – 176

166

SDCK

165

XSHD

167

XSAK

168

SDEF

164

XSRQ

WCK

123

82, 84, 85

78, 79, 81,

IANCO

IFULL

IEMPTY

IFRM

IOUTE

IBCK

XRST

SMUTE

XMSLAT

MSCK MSDATI

MSDATO

6 7

MSREADY

115

TEST1

SD0 – 7

IOUT0 – IOUT5

DSD DECODER

IC801

XWE XCAS XRAS

DCLK

DCKE

PHREFI

BCKAI

MCKI

DQ0 – 7

139 – 136

134 – 131

A0 – 11

152,151,149,148

162–159,157–154

143 144 145 141 142

61 59

768FS

16Mbit D-RAM

IC808

DQ0 – 7

2 ,3 ,5 ,6

8 ,9 ,11 ,12

A0 – 11

20 , 19

21 – 24,27 – 32

CAS

RAS

CLK

CKE

SIN_DY SOUT_DSD SCK_DSD

XCS_DY RST_DY

128FS

64FS

DSD DIGITAL SIGNAL

PROCESSOR

IC802

D0 – D15

A0 – A11

CLK CKE

RAS

CAS

SI SCLK

XCS

73 70

XRST

CLK512

PHRI

BCKAI

768FS

768_DVD

768_CD

CLOCK

GENERATOR

IC811

IOUT5

ANCIO IFULL IEMPTY IFRM IOUTE IBCK

XRST_DSD

MUTE_DSD XLAT_DSD

SCK_DSD SOUT_DSD SIN_DSD RDY_DSD SAMBA_TEST

IC812

5 15

LEVEL

SHIFT

IC813

LEVEL SHIFT IC814

DATA BUS

17 18

104 – 106

I/O0 – I/O15A0 – A9

2 – 5, 7 – 10,

16Mbit D-RAM

IC706

D0 – D7

A0 – A7

DATA BUS

ADDRESS BUS

DVC

GFS_V

JIT

APDO

VC BUFFER IC703 (2/2)

41 – 44, 46 – 49

27 – 32

21 – 24,

RAS

UCAS LCAS

XRST_DVD XHRD XHWR XCS1882 XINIT0 XINIT1

MDP

SPIN

GSCOR EXCK SBSO WFCK C2PO BCLK

MDAT LRCK DFCT SCOR 768_CD

COMPARATOR

IC703 (1/2)

LEVEL SHIFT

IC708

A+3.3V

MDB0 – MDBF

66 – 69, 71, 73 – 75,

96, 97, 99, 101, 102,

79 – 80,

MA0 – MA9

82 – 87, 89, 91

XMWR

XMOE

XRAS

XCAS

1, 2, 4

D0 – D7

172 – 176,

A0 – A7

5, 7, 9 – 14

164

XRST

XRD

XWR XCS

XINT0

XINT1

MDIN2

137

SPO

135

GSCOR

146

EXCK

147

SBIN

148 151

WFCK

155

C2PO

158

BCLK

160

MDAT LRCK

163

DFCT

145

SCOR

150

GFS

107

APEO

109

SACD DECODER

IC701

HDB0 – HDB7

XHWR

XHRD XDRQ

HDB8

XHAC

MA11

XTAL

XTL2

XTL1

32, 30, 27, 24

44, 41, 39, 35,

46 26

167

169

170

IOUT0 –

• Signal Path

97, 98, 100

1 – 5, 7, 8, 90 – 95,

24 – 29

17 – 22,

14 15 13 12 11 10

CLOCK

GENERATOR

IC804

: SACD PLAY

16Mbit SD-RAM

IC803

DQ0 – DQ15

40, 42, 43, 45, 46, 48, 49

2, 3, 5, 6, 8, 9, 11, 12, 39,

27 – 32

19 – 24,

A0 – A11

CLK

CKE

RAS

CAS

256FS

(Page 29)

(Page 28)

2727

SCD-XA9000ES

5-3. BLOCK DIAGRAM – MAIN Section (2/2) –

(Page 26)

(Page 27)

(Page 31)

S001

(LOADING IN)

S002

(LOADING OUT)

D+3.3V

MLS_SIO, MLS_SCK, MLS_RST, MLS_OSC

SIGNAL GENERATOR

OFF

OUT

DATA BUS

ADDRESS BUS

89 – 9614 – 21

CPU

IC901

A0 – A7D0 – D7

XCS_DVD

INIT0_DVD INIT1_DVD

XCS_IO

XDIS_IO

SWGUP

AMUT_MCH

BUSY_DP

SIN_DP

SOUT_DP

SCK_DP

REQ-DP

SIN_DSD

SOUT_DSD

SCK_DSD

XLAT_DSD

RDY_DSD

MUTE_DSD

XCS_DY RST_DY

INIT_DF

LATCH_DF LATCH_DF_B

MODE_SACD

EEPSIO

EEPSCL

MLS_RST MLS_OSC

XRD

XWR

MULTI

12 22 23 85 84

11 10

99 60

51 52

49 50 47 27 28 57

97 98 62

78 79

61 82

XCS1882

XINIT0 XINIT1

XHRD

XHWR

SWGUP

AMUT_MCH

LEVEL SHIFT

IC906 (1/2)

DATA SELECT

IC902

XFBSY

XIFCS

SIN_DSD

SIN_DY

SOUT_DSD

SCK_DSD

XLAT_DSD

RDY_DSD

MUTE_DSD

XCS_DY RST_DY

DATA_DF

CLK_DF

INIT_DF LAT_DF_A LAT_DF_B

MODE_SACD

MULTI

EEPROM

IC903

SDA

SCL

MLS_SIO MLS_SCK MLS_RST MLS_OSC

SIO

SOO

SCO

AMUTE

XFRRST

LEVEL SHIFT

IC906 (2/2)

XRST_DSD SAMBA_TEST

TE FE PI FJMP1 FJMP2 SPDA

DATA_RF

CLK_RF MIRR LDON MUTE_2D SP_ERR

SP_ON MUTE_LOAD LOAD_IN LOAD_OUT

MD2 SENS LOCK FOK GFS DATA XLAT COUT SCLK CLOK MUTE_CD SQCK SQSO SCOR DOON

X901

20MHz

RESET

IC905

APDO

GFS_V

FCS_JMP_1

FCS_JMP_2

SPDA

DATA_RF

83 77

CLK_RF MIRR_RF

LDON

100

MUTE_2D

SP_ERR

SP_ON

MUTE_LOAD

LOAD_IN LOAD_OUT

DOCTRL

SENS_CD

LOCK_CD

FOK_CD

GFS_CD

DATA_CD XLAT_CD

36 29

COUT_CD SCLK_CD

CLOK_CD

35 73

MUTE_CD

SQCK_CD SQSO

SCOR_CD

DOON

APDO

JIT

JITTER

64 58

GFS_DVD

IN_SW

OUT_SW

XTAL

EXTAL

RST

DATA BUS

ADDRESS BUS

XRST_DVD

RST_DVD

XWR XRD

XCS

RST

AMUTE

RST_DP

SI_SELRKSW

RST_DSD

ISBTEST

12 – 16, 19 – 22

I/O EXPANDER

IC904

AD0 – D7

VMOD

RST_CD

SDEN

LIM_SW

XHRD, XHWR, XCS1882,

XINIT0, XINIT1, XRST_DVD

33 32 35 44

VMOD

XRST_CD

SDEN

LIM_SW

SIN_DSD, SIN_DY, SOUT_DSD,

SCK_DSD, XLAT_DSD, RDY_DSD,

MUTE_DSD, XCS_DY, RST_DY,

XRST_DSD, SAMBA_TEST

DATA_DF, CLK_DF, INIT_DF,

LAT_DF_A, LAT_DF_B, MULTI

D0 – D7

A0 – A7

SWGUP, AMUTE,

AMUT_MCH

XFBSY, SIO, SOO,

SCO, XIFCS, XFRRST

LAT_DF_A, LAT_DF_B,

MODE_SACD, MULTI

(Page 27)

(Page 26)

(Page 27)

(Page 30)

(Page 32)

(Page 29)

(Page 30)

2828

5-4. BLOCK DIAGRAM – AUDIO Section (1/2) –

(Page 27)

A/B

(Page 28)

DATA_DF, CLK_DF, INIT_DF, LAT_DF_A, LAT_DF_B, MODE_SACD, MULTI

SDATAL

SDATALS

SDATAC

SDATAR

SDATAS

SDATASW

MULTI

DATA SELECTOR

IC305

SCD-XA9000ES

DIGITAL FILTER,

CURRENT PULSE,

5DATA

LRCK

BCK

SCKI

D/A CONVERTER

IC101

MDI13MC14CS1RST

CLK_DF

LAT_DF_B

DATA_DF

INT_DF

25LOUTL+ 16LOUTR+

26LOUTL– 17LOUTR–

FL–

FL+

(Page 30)

DATA SELECTOR

IC307

SDATAL

SDATAR

A/B

LRCK/G

BCK/G SCKI

(Page 27)

(Page 26)

256FS, 128FS, 64FS

LRCK, BCLK, MDAT

MODE_SACD

11.2896MHz

X301

CLOCK BUFFER

IC302

256FS

COUNTER

IC303

128FS

LRCK

BCLK

MDAT

64FS

SWITCHING

IC304

A/B

INT_DF

25LOUTL+ 16LOUTR+

26LOUTL– 17LOUTR–

DIGITAL FILTER,

CURRENT PULSE,

D/A CONVERTER

IC201

• Signal Path

: SACD PLAY

5DATA

LRCK/G BCK/G SCKI

SCKI

LRCK/G

BCK/G

DATA SELECTOR

A/B

DATA SELECTOR

A/B

IC308

IC306

CDTL/SDTSL

CDTR/SDTSR

CDTL/SDTC

CDTR/SDTSW

LRCK

BCK

SCKI

MDI13MC14CS1RST

DATA_DF

CLK_DF

LAT_DF_A

FR–

FR+

SCKI, LRCK/G, BCK/G

CDTL/SDTSL, CDTR/SDTSR,

CDTL/SDTC, CDTR/SDTSW

(Page 30)

: CD PLAY (ANALOG OUT)

2929

SCD-XA9000ES

5-5. BLOCK DIAGRAM – AUDIO Section (2/2) –

(Page 29)

SCKI, LRCK/G, BCK/G

(Page 29)

DATA_DF, CLK_DF, LAT_DF_A, LAT_DF_B, INIT_DF, MULTI

(Page 28)

CDTL/ SDTSL

LRCK/G BCK/G SCKI

CDTL/ SDTSR

LRCK/G BCK/G SCKI

5 DATA

LRCK

BCK

SCKI

5 DATA

LRCK

BCK

SCKI

MDI13MC14CS1RST

DATA_DF

CLK_DF

LAT_DF_B

MDI13MC14CS1RST

INIT_DF

FL– FL+

FR – FR+

25LOUTL+ 16LOUTR+

26LOUTL– 17LOUTR–

DIGITAL FILTER,

CURRENT PULSE,

D/A CONVERTER

25LOUTL+

16LOUTR+

26LOUTL–

17LOUTR–

DIGITAL FILTER,

CURRENT PULSE,

D/A CONVERTER

IC1101

IC1201

I-V CONVERTER

IC102

I-V CONVERTER

IC202

I-V CONVERTER

IC1102

I-V CONVERTER

IC1202

AUDIO FILTER,

LINE AMP

IC103

AUDIO FILTER,

LINE AMP

IC203

AUDIO FILTER,

LINE AMP

IC1103

AUDIO FILTER,

LINE AMP

IC1203

RELAY DRIVE

Q1151, 1152

RELAY DRIVE

Q394, 395

RY1151

RY353

+ +

• Signal Path

: SACD PLAY

RELAY DRIVE

Q153, 154

RELAY DRIVE

Q1153, 1154

RY152

RY1152

J301

FRONT

J1301

SURROUND

ANALOG

5.1CH OUT

CDTL/ SDTC

LRCK/G BCK/G SCKI

CDTR/ SDTSW

LRCK/G BCK/G SCKI

5 DATA

LRCK

BCK

SCKI

5 DATA

LRCK

BCK

SCKI

DATA_DF

CLK_DF

LAT_DF_A

MDI13MC14CS1RST

DATA_DF

CLK_DF

LAT_DF_B

MDI13MC14CS1RST

DATA_DF

CLK_DF

LAT_DF_A

INIT_DF

25LOUTL+

16LOUTR+

26LOUTL–

17LOUTR–

DIGITAL FILTER,

CURRENT PULSE,

D/A CONVERTER

25LOUTL+

16LOUTR+

26LOUTL–

17LOUTR–

DIGITAL FILTER,

CURRENT PULSE,

D/A CONVERTER

IC2101

IC2201

I-V CONVERTER

IC2102

I-V CONVERTER

IC2202

AUDIO FILTER

IC2203 (1/2)

RELAY DRIVE

Q2155, 2156

AUDIO FILTER,

LINE AMP

IC2103

RY2153

MULTI

LINE AMP

IC2203 (2/2)

RELAY DRIVE

Q2151, 2152

RY2151

RY352

CENTER

J2301

SUB WOOFER

RY2152

J351

ANALOG 2CH OUT

LINE BUFFER

IC351

LINE BUFFER

IC352

RELAY DRIVE

Q2153, 2154

(Page 28)

SWGUP, AMUTE, AMUT_MCH

SWGUP

HEADPHONE

AMP

IC371

MUTING

Q381

MUTING

Q371

RV601

PHONE LEVEL

J601

PHONES

AMUT_MCH

AMUTE

RELAY DRIVE

Q391, 392

RY351

MUTING

CONTROL

Q393

3030

+ 94 hidden pages

Sony SCDXA-9000-ES Service manual

TABLE OF CONTENTS

SERVICING NOTES

GENERAL

DISASSEMBLY

3-1. DISASSEMBLY FLOW

3-2. CASE (TOP), SIDE PLATE

3-3. LOADING PANEL ASSY

3-4. FRONT PANEL SECTION

3-5. MAIN BOARD, BRACKET (MAIN)

3-6. RF BOARD, MECHANISM DECK (CDM19JB-DVBU4C or CDM19JB-DVBU4D)

3-7. DISC TABLE, BELT, LOADING MOTOR (M1)

3-8. OPTICAL PICK-UP (KHM-230AAA)

3-9. BASE UNIT (DVBU4C or DVBU4D)

TEST MODE

5-1. BLOCK DIAGRAM – RF/SERVO Section –

DIAGRAMS

5-2. BLOCK DIAGRAM – MAIN Section (1/2) –

5-3. BLOCK DIAGRAM – MAIN Section (2/2) –

5-4. BLOCK DIAGRAM – AUDIO Section (1/2) –

5-5. BLOCK DIAGRAM – AUDIO Section (2/2) –