• SA-WSLF1 is amplifier/subwoofer and tuner
system in DAV-LF1.
SPECIFICATIONS
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND
TOTAL HARMONIC
DISTORTION:With 4 ohm loads, both
Amplifier section
Stereo mode (rated)86 W + 86 W (4 ohms at
Surround modeFront: 86 W (each)
(reference)(with SS-TSLF1)
music power outputCenter*:
*Depending on the sound field settings and the source,
there may be no sound output.
InputsVIDEO/TV/SAT:
PhonesAccepts low-and high-
channels driven, from
200 – 20,000 Hz; rated
65 watts per channel
minimum RMS power,
with no more than 0.7 %
total harmonic distortion
from 250 milli watts to
rated output.
interval set at 9 kHz)
530 – 1,710 kHz (with the
interval set at 10 kHz)
S video:
Y: 1 Vp-p 75 ohms
C: 0.286 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
P
B/CB
75 ohms
Video: 1 Vp-p 75 ohms
, PR/CR: 0.7 Vp-p
US Model
Canadian Model
AEP Model
UK Model
E Model
Subwoofer
Speaker systemBass reflex
Speaker unit180 mm (7
dia. cone type
Rated impedance4 ohms × 2
Dimensions (approx.)241 × 606 × 241 mm
(9
inches) (w/h/d)
Mass (approx.)14 kg (30 lb 14 oz)
Power requirements
North American and
Mexican models:120 V AC, 60 Hz
Taiwan model:120 V AC, 50/60 Hz
Other models:220-240 V AC, 50/60 Hz
Power consumption120 W
0.3 W (a t the Power
Saving mode)
Design and specifications are subject to change
without notice.
Audio Group
Published by Sony Engineering Corporation
SA-WSLF1
r
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT -540A. Follow the manuf acturers’ instructions to use these
instruments.
2. A battery-operated A C milliammeter . The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC v oltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate lo w-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V A C range are suitable. (See
Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU D ANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
6.ELECTRICAL PARTS LIST .................................. 45
3
SA-WSLF1
SECTION 1
SERVICING NOTES
• The units that are required for the system operation check during repair service
Unit.
need to
checking
Units required for
operation
check
DVD player :
HCD-LF1
Sub woofer :
SA-WSLF1
Front speaker :
SS-TSLF1(R)
SS-TSLF1L(L)
Center speaker :
SS-CTLF1
Surround speaker :
SS-TSLF1W(R)
SA-TSLF1(L)
Remote
commander :
RM-SP320
DVD player : HCD-LF1
Sub woofer : SA-WSLF1
Front speaker : SS-TSLF1(R)
SS-TSLF1L(L)
Center speaker :
SS-CTLF1
Surround speaker : SS-TSLF1W(R)
SA-TSLF1(L)
Remote commander :
RM-SP320
*1 Only the defective unit. *2 Either one of them.
Units with a mark: The units that are required for the system operation check during repair service
However, there can be a case that some units of the system need to not be brought into repair shop depending on the unit. that became defective.
aaa
aaa
aaa
aaaa
*1
*2
a
a
*1
a
a
[The check method of the output signal from DIAT TRANSMITTER board]
Procedure:
1. A spectrum analyzer is connected to pin 2 and pin 1 of the output connector CN803 of DIAT TRANSMITTER board.
digital
DIAT TRANSMITTER
board
10 Ω(0.5%)
CN803 Pin 1
Pin 2
voltmeter
2. Confirm that it is spectrum as shown in a figure with the spectr um analyzer . It is normal if the signal of a 3MHz to 6MHz zone (a center
is 4.5MHz) can be checked.
3. When the output signal from DIAT TRANSMITTER board is normal, pin 8 (SDATA), pin 4 (LRCKO) and pin 5 (BCKO) of the input
signal connector CN801 are investigated.
4
•NOTE:
Turn the woofer upside down and remove the AMP block.
• SERVICING POSITION (SW-MAIN Board)
SA-WSLF1
Connect the SW-MAIN board and the VIDEO-I/O board
using the extension cable and check the SW-MAIN board.
•CAUTION:
Keep your eyes 10 cm or more away from the infrared laser unit (DIR-T1).
Do not view directly the laser beam.
J-2501-245-A
(1mm/23P/L300)
IC525 on the SW-MAIN board
5
SA-WSLF1
(AEP, UK, Russian models)
Subwoofer (Rear Panel)
OUTPUT(TO TV)
SECTION 2
GENERAL
This section is extracted
from instruction manual.
EURO AVANTENNA
A PHONES jack (39)
B EURO AV OUTPUT (TO TV) T jacks
(25)
C DIR-T1 jack (18)
D AM terminals (23)
E FM 75Ω COAXIAL jack (23)
F SPEAKER jacks (18)
(EXCEPT AEP, UK, Russian models)
Subwoofer (Rear Panel)
PHONES
REMOTE
CONTROL
VIDEO
VIDEO DIR-T1
IN
IN
AUDIO
AUDIO
IN
IN
OPTICAL
LL
R
VIDEO
DIGITAL IN
R
SAT
AM
CENTER FRONT L
FRONT R
IMPEDANCE USE 4
FM
75
COAXIAL
SYSYTEM CONNECTOR
SPEAKER
G SYSTEM CONNECTOR jack (15)
H SAT OPTICAL DIGITAL IN jack (26)
I SAT (VIDEO IN/AUDIO IN (L/R)) jacks
(25)
J VIDEO (VIDEO IN/AUDIO IN (L/R)) jacks
(25)
K REMOTE CONTROL jack (18)
VIDEO
S VIDEO (DVD ONLY)
MONITOR OUTPUT
PHONES
REMOTE
CONTROL
A PHONES jack (41)
B MONITOR OUTPUT (VIDEO/S VIDEO)
jacks (25)
C COMPONENT VIDEO OUT jacks (25)
D COMPONENT VIDEO OUT/SCAN
SELECT switch (88)
E AM terminals (23)
F FM 75Ω COAXIAL jack (23)
COMPONENT VIDEOOUT ANTENNA
PB/CBPR/CRSCAN SELECT
Y
VIDEO
VIDEO DIR-T1
IN
IN
AUDIO
AUDIO
IN
IN
OPTICAL
LL
R
VIDEO
DIGITAL IN
R
SAT
INTERLACESELECTABLE
AM
CENTER FRONT L
FRONT R
IMPEDANCE USE 4
FM
75
COAXIAL
SYSYTEM CONNECTOR
SPEAKER
H SYSTEM CONNECTOR jack (15)
I DIR-T1 jack (18)
J SAT OPTICAL DIGITAL IN jack (26)
K SAT (VIDEO IN/AUDIO IN (L/R)) jacks
(25)
L VIDEO (VIDEO IN/AUDIO IN (L/R)) jacks
(25)
M REMOTE CONTROL jack (18)
G SPEAKER jacks (18)
6
SECTION 3
p
ELECTRICAL ADJUSTMENT
DIAT SIGNAL RF LEVEL ADJUSTMENT
This adjustment is performed in order to adjust the transmission
distance of RF signal for DIAT communication.
Connection:
SA-WSLF1
DIA T TRANSMITTER
board
TP815
(RF AMP OUT)
Procedure:
1. Connect the oscilloscope to TP815 (RF AMP OUT) and GND
on the DIAT TRANSMITTER board.
2. Connect DIR-T1 to DIR-T1 jack (J908).
3. Adjust RV801 on the DIAT TRANSMITTER board so that
the center of waveform becomes Trig level 1.05 Vp-p.
(*Trigger position: –4 div)
4. Confirm trigger is locked.
5. Adjust RV801 on the DIAT TRANSMITTER board so that
the center of waveform becomes 2.2 to 2.4 Vp-p.
oscilloscope
VOLT/DIV : 500 mV
TIME/DIV : 500 ns
level : 2.2 to 2.4 Vp-
RF Signal Reference Waveform
Adjustment Location:
– DIAT TRANSMITTER Board (SIDE A) –
IC804
IC805
TP815
(RF AMP OUT)
7
SA-WSLF1
SECTION 4
DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Schematic Diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except f or electrolytics and
tantalums.
• All resistors are in Ω and 1/
specified.
• f: internal component.
• C : panel designation.
Note:
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part
number specified.
• A : B+ Line.
•Voltages and wavef orms are dc with respect to ground under no-signal (detuned) conditions.
no mark : DVD STOP
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage v ariations ma y be noted due to normal production
tolerances.
•Waveforms are taken with a oscilloscope.
Voltage v ariations ma y be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: AUDIO
d: TUNER
J: CD PLAY
c: DVD PLAY
L: VIDEO
E: Y
a: CHROMA
r: COMPONENT VIDEO
q: R, G, B
e: AUX IN (AUDIO)
h: DIGITAL IN
i : AUX IN (VIDEO)
4
W or less unless otherwise
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
For Printed Wiring Boards.
Note:
• X : parts extracted from the component side.
• a: Through hole.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(SIDE A) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE B) the parts face are indicated.
• Indication of transistor.
C
Q
B
E
•Abbreviation
CND: Canadian model.
E41: Chilean and peruvian models.
EA: Saudi Arabia model.
HK: Hong Kong model.
KR: Korea model.
MX: Mexican model.
RU: Russian model.
SP: Singapore model.