Sony PCG-XG500,PCG-XG700 Service Manual
PCG-XG500/XG700
SERVICE MANUAL
Illust : PCG-XG700
US Model
Canadian Model
S400
Confidential
9-872-177-11
NOTEBOOK COMPUTER
Information in this document is subject to change without notice.
Sony and VAIO are trademarks of Sony . Intel logo and Intel Inside
logo are registered trademarks of Intel Corporation. Pentium MMX
is a trademark of Intel Corporation. Microsoft, MS-DOS, W indows,
the W indows 95 and W indows 98 log o are trademarks of Microsoft
Corporation.
All other trademarks are trademarks or registered trademarks of
their respective owners. Other tr ademarks and trade names may be
used in this document to refer to the entitles claiming the marks and
names or their produces. Sony Corporation disclaims any proprietary
interest in trademarks and trade names other than its own.
Caution Markings for Lithium/Ion Battery - The following or similar
texts shall be provided on battery pack of equipment or in both the
operating and the service instructions.
CAUTION: Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer. Discard used batteries according to the
manufacturer’s instructions.
CAUTION: The battery pack used in this de vice may present a f ire
or chemical burn hazard if mistreated. Do not disassemble, heat
above 100°C (212°F) or incinerate.
Dispose of used battery promptly.
Keep away from children.
CAUTION: Changing the back up battery.
• Overcharging, short circuiting, reverse charging, multilation or
incineration of the cells must be avoided to prev ent one or more of
the following occurrences; release of toxic materials, release of
hydrogen and/or oxygen gas, rise in surface temperature.
• If a cell has leaked or vented, it should be replaced immediately
while avoiding to touch it without any protection.
Service and Inspection Precautions
1. Obey precautionary markings and instructions
Labels and stamps on the cabinet, chassis, and components identify areas
requiring special precautions. Be sure to observe these precautions, as well
as all precautions listed in the operating manual and other associated
documents.
2. Use designated parts only
The set’s components possess important safety characteristics, such as
noncombustibility and the ability to tolerate large voltages. Be sure that
replacement parts possess the same safety characteristics as the originals.
Also remember that the 0 mark, which appears in circuit diagrams and
parts lists, denotes components that have particularly important safety
functions; be extra sure to use only the designated components.
3. Always follow the original design when mounting
parts and routing wires
The original layout includes various safety features, such as inclusion of
insulating materials (tubes and tape) and the mounting of parts above the
printer board. In addition, internal wiring has been routed and clamped so
as to keep it away from hot or high-voltage parts. When mounting parts or
routing wires, therefore, be sure to duplicate the original layout.
4. Inspect after completing service
After servicing, inspect to make sure that all screws, components, and wiring
have been returned to their original condition. Also check the area around
the repair location to ensure that repair work has caused no damage, and
confirm safety.
5. When replacing chip components...
Never reuse components. Also remember that the negati ve side of tantalum
capacitors is easily damaged by heat.
6. When handling flexible print boards...
•The temperature of the soldering-iron tip should be about 270C.
•Do not apply the tip more than three times to the same pattern.
•Handle patterns with care; never apply force.
Caution: Remember that hard disk drives are easily damaged by
vibration. Always handle with care.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Confidential
PCG-XG500/XG700 (UC)
— 2 —
TABLE OF CONTENTS
Section Title Page
CHAPTER 1. REMOVAL
1-1. Flowchart ......................................................................... 1-1
1-2. Main Electrical Parts Location Diagram ......................... 1-1
1-3. Removal ........................................................................... 1-2
1. Hinge Cover ..................................................................... 1-2
2. Keyboard Unit..................................................................1-2
3. HDD Assy ........................................................................ 1-3
4. Hou Flap Assy, Flap Base Plate ....................................... 1-3
5. Hou Palmrest Assy, Display Base, IFX-70 Board ........... 1-4
6. Display Assy .................................................................... 1-4
7. MBX-43 Board Assy ....................................................... 1-5
8. Speaker Assy, V/L Richargeable Battery,
CNX-75 Board, ANL-17 Board.......................................1-5
9. IFX-69 Board, CNX-74 Board, RO-38 Board,
PWS-7 Board, IFX-76 Board, MBX-43 Board ............... 1-6
10.LCD Section (XG700 Model) – Made by HI – ............... 1-7
1. Flash Panel, Bezel Housing Assy ................................ 1-7
2. LCD Unit, Inverter Assy, LCD Cable .......................... 1-8
11.LCD Section (XG500 Model) – Made by SA – .............. 1-9
1. Flash Panel, Bezel Housing Assy ................................ 1-9
2. LCD Unit, Inverter Assy, LCD Cable ........................ 1-10
(to 1-10)
CHAPTER 2. SELF DIAGNOSTICS
2-1. Required Tools and Peripheral Devices ........................... 2-1
2-2. Tools and Peripheral Device Connection.........................2-3
2-3. Starting up the Service Diagnostics ................................. 2-4
2-4. Outline of Service Diagnostics Functions ....................... 2-4
2-5. Inspecting W indo ws......................................................... 2-8
2-6. Self diagnostics Change History...................................... 2-8
(to 2-8)
CHAPTER 3. BLOCK DIAGRAM............................... 3-1
(to 3-2)
CHAPTER 4. FRAME HARNESS DIAGRAM........ 4-1
(to 4-2)
CHAPTER 5. EXPLODED VIEWS AND
PARTS LIST............................................5-1
5-1. Main Section (XG700 Model) ......................................... 5-2
5-2. Main Section (XG500 Model) ......................................... 5-5
5-3. LCD Section
(XG700 Model) – Made by HI – ..................................... 5-9
5-4. LCD Section
(XG500 Model) – Made by SA – .................................. 5-11
• Abbreviations
UC : US model / Canadian model
(to 5-12)
— 3 —
Confidential
PCG-XG500/XG700 (UC)
1-1. Flowchart
CHAPTER 1.
REMOVAL
HINGE
COVER
P 1-2
POWER
OFF
FDD
CD-RW
DVD-ROM
BATTERY
PACK
KEY BOARD
UNIT
P 1-2
HOU FLAP
ASSY
P 1-3
• P XX means pages that appears in this manual.
SO-DIMM
P 1-6
HOU PALM
REST
P 1-4
FLAP BASE
PLATE
P 1-3
HDD
P 1-3
∗ : XG700 Model
( ) : XG500 Model
IFX-70
BOARD
P 1-4
DISPLAY
ASSY
P 1-4
HEAT
SINK U
P 1-5
FLASH
PANEL
∗P 1-7
(P 1-9)
MBX-43
ASSY
P 1-5
SPEAKER
ASSY
P 1-5
LITHIUM
BATTERY
P 1-5
CNX-75
BOARD
P 1-5
MODULAR
JACK
P 1-5
ANN-17
BOARD
P 1-5
BEZEL
HOUSING
ASSY
∗P 1-7
(P 1-9)
• Remember that hard disk drives are easily damaged by vibration. Always handle with care.
1-2. Main Electrical Parts Location Diagram
IFX-69
BOARD
P 1-6
I/O
BRACKET
P 1-6 P 1-6
PC CARD
CONNECTOR
P 1-6
IFX-76
BOARD
P 1-6
RO-38
BOARD
P 1-6
MBX-43
BOARD
P 1-6
LCD
UNIT
∗P 1-8
(P 1-10)
DC FAN
INVERTER
ASSY
∗P 1-8
(P 1-10)
LCD
CABLE
∗P 1-8
(P 1-10)
PWS-7
BOARD
P 1-6
CPU
P 1-6
CNX-74
BOARD
P 1-6
Battery Pack
MBX-43 Board
Touch Pad
PWS-7 Board
SO-DIMM
Speaker
Inverter Assy
CNX-74 Board
CNX-75 Board
Speaker
IFX-76 Board
LCD Unit
CPU
HDD
IFX-69 Board
RO-38 Board
IFX-70 Board
ANL-17 Board
FD Drive
or
DVD-ROM Drive
or
CD-RW Drive
or
Battery Pack Weight Saver
Confidential
1-1 PCG-XG500/XG700 (UC)
1-3.Removal
1. Hinge Cover
2
1 Hinge Cover (L)
1 Hinge Cover (R)
3
2. Keyboard Unit
2
Clip or the
like
Latch (Key)
Keyboard Unit
5
3
4
Confidential
1 0-Number P3 Kind
Screw (M2)
1-2PCG-XG500/XG700 (UC)
MBX-43 Board
CN902
3. HDD Assy
4
Special Head
Screws
Hou Flap Assy
Flap Base Plate
(X2)
2
3
+B M2
5
(X4)
HDD Assy
6
1 Special Head
Screws (x9)
MBX-43 Board CN1101
4. Hou Flap Assy, Flap Base Plate
2 Hou Flap Assy
3 Screws (M2 EG) (x2)
1 Special Head Screws (M2) (x4)
Flap Base Plate
4
3 Screws (M2 EG) (x2)
Confidential
1-3 PCG-XG500/XG700 (UC)
5. Hou Palmrest Assy, Display Base, IFX-70 Board
4 Special Head
Screw (M2)
6
Hou Palmrest Assy
2 0-number P3 Kind
Screw (M2) (X4)
5 Claws
MBX-43 Board
CN901
3 +P 2x10 (X2)
0 Claws
1
1
qa Display Base
9 Dial
8 IFX-70 Board
7 +B M2 (X2)
2 0-number P3 Kind
Screw (M2) (X3)
MBX-43 Board
CN903
6. Display Assy
1 Special Head
Screws
3 +B M2
(M2) (X2)
2
Display Assy
5
4 Special Head
Screws (M2) (X2)
3 +B M2
MBX-43 board CN301
4 Special Head
Screws (M2) (X2)
Confidential
1-4PCG-XG500/XG700 (UC)
7. MBX-43 Board Assy
MBX-43 Board Assy
6
2 +B2x12
1 Special Head Screws (M2) (X3)
3 Heat Sink U
5 +B M2
IFX-76 board
CN8501
(XG700 Model)
Modular 2PJack
9
Modem Cap
q; Cover (FFC)
MBX-43 board
CN1501
(XG500 Model)
Modular Jack
9
8
qa
7
4
5 +B M2
MBX-43 board
CN551
8. Speaker Assy, V/L Richargeable Battery, CNX-75 Board, ANL-17 Board
CNX-75 Board
CN6006
CNX-75 Board
CN6005
2 Speaker Assy
5 +B M2 (X2)
3
1
4 V/L Richargeabl Battery
Cover (BATT)
6
7 CNX-75 Board
8 +B M2
9 ANL-17 Board
Confidential
1-5 PCG-XG500/XG700 (UC)
9. IFX-69 Boar d, CNX-74 Board, RO-38 Boar d, PWS-7 Board, IFX-76 Board, MBX-43 Boar d
0 CNX-74 Board
SO-DIMM
7 ACE (M2), Lock
8 I/O Bracket
5 Screws (X2)
6 Screw
(HEX) (X2)
IFX-69 Board CN4001
3 IFX-69
Board
MBX-43 Board CN1301
qk PWS-7 Board
CNX-74 Board
CN 5001
4
ws +B2X12 (x3)
wk MBX-43 Board
MBX-43 Board
CN 1102
ql Special Head
Screw (M2)
wd PC Card (Ejector) Connector
qj
wa
IFX-76
Board
w;
9 Special Head
Screw (M2) (X2)
wf Nu+M2 (3)
wh
wg CPU
qa
wj Stand
Off (X3)
wd Screw
(M2) (X3)
qf Washer
qd DC Fan
qg
MBX-43 Board CN751
qs Special Head
Screw (M2) (X2)
qh RO-38 Board
Order of releasing
the SO-DIMM
A → C
A
B
C
P3 (X2)
1
2 Special
Head Screw
(M2) (X2)
A
Confidential
1-6PCG-XG500/XG700 (UC)
110. LCD Section (XG700 Model) – Made by HI –
1. Flash Panel, Bezel Housing Assy
2 Panel Lock
8 LCD Front
Screw (L) Seal
7 LCD Front
Screw Seal (x2)
4
1
2 Panel Lock
1
3 Flash Panel
qa Special Head Screw (M2) (x2)
qs Latch Cover
9 Tapping P3
Screw (B2) (x4)
5 LCD Side Seal (x2)
6 Special Head
Screw (M2) (x2)
8 ID Label
9 Special Head
Screw (M2) (x6)
0 Bezel Housing Assy
qd Latch (LCD)
qf Spring Latch
6 Special Head
Screw (M2) (x2)
5 LCD Side Seal (x2)
Confidential
1-7 PCG-XG500/XG700 (UC)
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