Sony MZ-R50 - MD Walkman MiniDisc Recorder, MD Walkman MZ-R50 Service Manual

MICROFILM
MZ-R50
SERVICE MANUAL
PORTABLE MINIDISC RECORDER
SPECIFICATIONS
US Model
Canadian Model
UK Model
E Model
Australian Model
Tourist Model
Model Name Using Similar Machanism NEW MD Machanism Type MT-MZR-50-143 Optical Pick-up Type KMS-280A
US and foreign parts licensed Dolby Laboratories Licensing Corporation.
System
Audio playing system MiniDisc digital audio system Laser diode properties Material: GaAIAs Wavelength: λ = 780 nm Emission duration: continuous Laser output: less than 44.6 µW (This output is the value measured at a distance of 200 mm from the lens surface on the optical pick-up block with 7 mm aperture.) Recording and playback time Maximum 74 minutes (MDW-74, stereo recording) Maximum 148 minutes (MDW-74, monaural recording) Revolutions 400 rpm to 900 rpm (CLV) Error correction Advanced Cross Interleave Reed Solomon Code (ACIRC) Sampling frequency
44.1 kHz Sampling rate converter Input: 32 kHz / 44.1 kHz / 48 kHz Coding Adaptive Transform Acoustic Coding (ATRAC) Modulation system EFM (Eight to Fourteen Modulation) Number of channels 2 stereo channels 1 monaural channel
Frequency response 20 to 20,000 Hz ± 3 dB Wow and Flutter Below measurable limit Inputs Microphone: stereo mini-jack, 0.22-0.78 mV Line in: stereo mini-jack, 69-194 mV Optical (Digital) in: optical (digital) mini-jack Outputs Headphones: stereo mini-jack, maximum output level 5 mW+ 5 mW, load impedance 16 ohm Line out: stereo mini-jack, 194 mV, load impedance 10 kilohm
General
Power requirements Sony AC Power Adaptor (supplied) connected at the DC IN 6 V jack:
120 V AC, 60 Hz (US, Canadian model) 220-230 V AC, 50/60 Hz (AEP model) 230-240 V AC, 50/60 Hz (UK, Hong Kong model) 240 V AC, 50/60 Hz (Australian model)
100-240 V AC, 50/60 Hz (E, Tourist model) Lithium ion rechargeable battery LIP-8 (supplied) Two LR6 (size AA) alkaline batteries (not supplied)
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Specifications ........................................................................... 1
1. SERVICING NOTE....................................................... 3
2. GENERAL
Location and Function of Controls .................................... 4
3. DISASSEMBLY
3-1. Upper Panel Assy, Bottom Panel Assy Removal...... 20
3-2. Main Board Removal ............................................... 21
3-3. Mechanism Deck (MT-MZR50-143) Removal ........ 21
3-4. Optical Pick-up Assy, REC Board Removal ............ 22
3-5. CLV Board Removal ................................................ 22
3-6. Battery Case Assy Removal ..................................... 23
3-7. Power Board, Switch Board Removal ...................... 23
3-8. Switch Unit (with JOG Dial) Removal .................... 24
4. TEST MODE................................................................. 25
5. ADJUSTMENTS ......................................................... 31
6. DIAGRAMS
6-1. Explanation of IC Terminals..................................... 35
6-2. Block Diagrams ........................................................ 39
6-3. Circuit Boards Location ........................................... 43
6-4. Printed Wiring Boards – Main Section –.................. 45
6-5. Schematic Diagram – Main (1/3) Section – ............. 49
6-6. Schematic Diagram – Main (2/3) Section – ............. 53
6-7. Schematic Diagram – Main (3/3) Section – ............. 57
7. EXPLODED VIEWS
7-1. Upper Panel, Bottom Panel Section ......................... 65
7-2. Chassis Section ......................................................... 66
7-3. Mechanism Deck Section ......................................... 67
8. ELECTRICAL PARTS LIST.................................... 68
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE ! SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during repairing.
• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
TABLE OF CONTENTS
This MiniDisc Recorder is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the buttom exterior.
For customers in Europe
Battery operation time See “Battery life” Battery life
Batteries Recording Playback
LIP-8 lithium ion Approx. Approx. Rechargeable battery 4 hours 7 hours
Two LR6 (size AA) Approx. Sony alkaline dry batteries 12 hours
LIP-8 + Two LR6 (size AA)
Approx.
22 hours
Dimensions Approx. 109.5 x 19.7 x 77 mm (w/h/d) (4 3/8 x 25/32 x 3 1/8 in.) Mass Approx. 190 g (6.8 oz) the recorder only Approx. 240 g (8.5 oz) incl, a recordable MD, and LIP-8 lithium ion rechargeable battery Supplied accessories AC power adaptor (1) Headphones with a remote control (1) LIP-8 lithium ion rechargeable battery (1) Dry battery case (1) Ear pads (2) Carrying case (1)
Design and specifications are subject to change without notice.
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SECTION 1
SERVICING NOTE
When repairing this device with the power on, if you remove the main board or open the upper panel assembly, this device stops working. In this case, you can work without the device stopping by fastening the hook of the Open/Close detection switch (S817) with tape
Upper panel ass
y
Main board
Door open/close switch (S817)
Tape
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SECTION 2
GENERAL
This section is extracted from instruction manual.
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