Sony MZNH-600 Service manual

MZ-NH600

SERVICE MANUAL

Ver 1.0 2004.05

US and foreign patents licensed from Dolby Laboratories.

• SonicStage, MD Simple Burner, OpenMG, “Magic Gate”, “MagicGate Memory Stick”, “Memory Stick”, Hi-MD, Net MD, ATRAC, ATRAC3, ATRAC3plus and their logos are trademarks of Sony Corporation.

• Microsoft, Windows, Windows NT and Windows Media are trademarks or registered trademarks of Microsoft Corporation in the United States and /or other countries.

• IBM and PC/AT are registered trademarks of International Business Machines Corporation.

• Macintosh is a trademark of Apple Computer, Inc. in the United States and/or other countries.

• MMX and Pentium are trademarks or registered trademarks of Intel Corporation .

• All other trademarks and registered trademarks are trademarks or registered trademarks of their

respective holders.

SPECIFICATIONS

AEP Model

E Model

Model Name Using Similar Mechanism NEW MD Mechanism Type MT-MZNH900-181 Optical Pick-up Name ABX-U

Audio playing system

MiniDisc digital audio system

Laser diode properties

Material: GaAlAs Wavelength: λ = 790 nm Emission duration: continuous Laser output: less than 44.6 µW (This output is the valu e measu red at a dist ance of 200 mm from the lens surface on the optical pick-up block with 7 mm aperture.)

Recording and playback time

When using HMD1G (1GB disc):

Maximum 34 hours in Hi-LP stereo

When using MDW-80 in Hi-MD mode:

Maximum 10 hours and 10 min. in Hi-LP stereo

When using MDW-80 in MD mode:

Maximum 160 min. in monaural Maximum 320 min. in LP4 stereo

Revolutions

350 rpm to 3,000 rpm (CLV)

Error correction

Hi-MD:

LDC (Long Distance Code)/BIS (Burst Indicator Subcode)

MD:

ACIRC (Advanced Cross Interleave Reed Solomon Code)

Sampling frequency

44.1 kHz

Sampling rate converter

Input: 32 kHz/44.1 kHz/48 kHz

Coding

Hi-MD:

ATRAC3plus (Adaptive TRansform Acoustic Coding 3 plus)

MD:

ATRAC ATRAC3 − LP2/LP4

Modulation system

Hi-MD:

1-7RLL (Run Length Limited)/PRML (Partial Response Maximum Likelihood)

MD:

EFM (Eight to Fourteen Modulation)

Frequency response

20 to 20,000 Hz ± 3 dB

Inputs

LINE IN (OPT)1):

stereo mini-jack for analog input (minimum input level 49 mV) optical (digital) mini-jack for optical (digital) input

The LINE IN (OPT) jack is used to connect either a digital (optical) cable or a line

(analog) cable.

PORTABLE MINIDISC RECORDER

Outputs

i: stereo mini-jack

Maximum output (DC)

Headphones:

3 mW + 3 mW (16 Ω) (European models) 5 mW + 5 mW (16 Ω) (Other models)

Power requirements

One LR6 (size AA) alkaline battery AC power adaptor DC 3V

Operating temperature

+5°C (+41° F) to +35° C (+95° F)

Battery life

Hi-MD mode (When using a 1GB Hi-MD disc)

When Linear

Recording continuously

Playing continuously

When using a new Sony LR6 (size AA) alkaline dry battery (produced in Japan)

Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries Association) standard.

(Unit: approx.hours)(JEITA3))

Hi-SP Hi-LP

PCM

2.5 3.5 4.5

11.0 18.5 21.5

– Continued on next page –

9-877-840-01

Sony Corporation

Personal Audio Company Published by Sony Engineering Corporation

MZ-NH600

Hi-MD mode (When using a 60/74/80minute standard disc)

(Unit: approx.hours)(JEITA)

When

Recording

Hi-SP Hi-LP

Linear PCM

5.0 8.0 9.5

continuously Playing

9.5 17.0 20.0

continuously

MD mode

When

Recording

(Unit: approx.hours)(JEITA)

LP2

Stereo

7.5 9.5 11.0

LP4 Stereo

continuously Playing

20.5 24.0 26.0

continuously

Dimensions

Approx. 83.6 × 28.9 × 77.0 mm (w/h/d)

/8 × 13/16 × 31/8 in.) (excluding projecting

parts and controls)

Mass

Approx. 101 g (3.6 oz) (the recorder only)

Supplid accessories

Headphones/earphones (1) Dedicated USB cable (1)

Clamp filters for the AC power adaptor (2) Attach the clamp filters when using the optional AC power adaptor CD-ROM (SonicStage Ver. 2.0/MD Simple Burner Ver. 2.0) (1)*

*Do not play a CD-ROM on an audio CD player.

When using the optional AC power

adaptor AC-E30HG:

Before using th e AC power a d aptor AC-E30HG, do the following procedure to

attach the clamp filters to the cord of the AC power adaptor. (You must affix the ferrite cores to comply with applicable EMC standards.)

1 Open the clamp filters.

2Wind the AC power cord into the clamp

filters as shown below.

Maximum length: approx. 4 cm

3Close the clamp filters.

Make sure the clasps are fully engaged.

Design and specifications are subject to change without notice.

MZ-NH600

1. SERVICING NOTES ............................................... 4

2. GENERAL ................................................................... 5

3. DISASSEMBLY

3-1. Disassembly Flow ........................................................... 6

3-2. Case (Lower) Section ...................................................... 7

3-3. MAIN Board.................................................................... 7

3-4. Case (Upper) Section....................................................... 8

3-5. Mechanism Deck Section (MT-MZNH900-181),

MD Standard Pin ............................................................. 8

3-6. Set Chassis Assy .............................................................. 9

3-7. Gear (BSA), Gear (SB) ................................................... 9

3-8. Op Service Assy .............................................................. 10

3-9. DC Motor SSM18D/C-NP (Spindle) (M701),

DC Motor (Sled) (M702), DC Motor Unit

(Over Write Head Up/Down) (M703) ............................. 10

3-10. Holder Assy ..................................................................... 11

4. DIAGRAMS

4-1. Block Diagram –MD SERVO Section – ......................... 13

4-2. Block Diagram –AUDIO Section –................................. 14

4-3. Block Diagram –POWER SUPPLY Section – ................ 15

4-4. Schematic Diagram –MAIN Section (1/9) – ................... 17

4-5. Schematic Diagram –MAIN Section (2/9) – ................... 18

4-6. Schematic Diagram –MAIN Section (3/9) – ................... 19

4-7. Schematic Diagram –MAIN Section (4/9) – ................... 20

4-8. Schematic Diagram –MAIN Section (5/9) – ................... 21

4-9. Schematic Diagram –MAIN Section (6/9) – ................... 22

4-10. Schematic Diagram –MAIN Section (7/9) – ................... 23

4-11. Schematic Diagram –MAIN Section (8/9) – ................... 24

4-12. Schematic Diagram –MAIN Section (9/9) – ................... 25

4-13. Printed Wiring Board –MAIN Section (1/2) – ................ 26

4-14. Printed Wiring Board –MAIN Section (2/2) – ................ 27

5. EXPLODED VIEWS

5-1. Case (Lower) Section ...................................................... 40

5-2. Case (Upper) Section....................................................... 41

5-3. Chassis Section ................................................................ 42

5-4. Mechanism Deck Section (MT-MZNH900-181) ............ 43

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher

than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

6. ELECTRICAL PARTS LIST................................ 44

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

MZ-NH600

SECTION 1

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.

OPERATION CHECK WHEN THE LID IS OPEN

In performing the repair with the power supplied to the set, removing the MAIN board causes the set to be disabled. In such a case, make a solder bridge to short SL894 (OPEN/CLOSE) on the MAIN board in advance.

– MAIN Board (Conductor Side) –

Providing the required system environment

System requirements

The following system environment is required in order to use the SonicStage Ver. 2.0/MD Simple Burner Ver. 2.0 software for the MD Walkman.

Computer IBM PC/AT or Compatible

Operating System

Display High Color (16bit) or higher, 800 × 600 dots or better (1024 × 768 dots

Others • Internet access: for Web registration, EMD services and CDDB

This software is not supported by the following environments:

•OSs other than the indicated above

•Personally constructed PCs or operating systems

•An environment that is an upgrade of the original manufacturer-installed operating system

•Multi-boot environment

•Multi-monitor environment

•Macintosh

Notes

•We do not ensure trouble-free oper a tion on all computers that satisfy the syste m requirements.

•The NTFS format of Windows XP/Windows 2000 Professional can be used only with the standard

(factory) settings.

•We do not ensure trouble-free operatio n of th e syste m suspend, sleep, or hibernation function on all computers.

•For Windows 2000 Professional users, insta ll Serv ic e Pack 3 or late r version be fore using the software.

• CPU: Pentium II 400 MHz or higher (Pentium III 450 MHz or higher is recommended.)

• Hard disk drive space: 200 MB or more (1.5 GB or more is recommended) (The am ount space will vary accordin g to Windows version and t h e number of music files stored o n the hard disk.)

• RAM: 64 MB or more (128 MB or more is recommended)

Others

• CD drive (capable of digital playback by WDM)

• Sound Board

• USB port (supports USB (previously USB 1.1))

Factory in st alled: Windows XP Media Center Edition 2004 /Windows XP Media Cent er Edition/Windows XP Professional/Windows XP Home Edition/ Windows 2000 Professional/Windows Millennium E di tion/Windows 98 Second Edition

or better is recommended)

• Window s Media Player (version 7.0 or higher) installed for playing WMA files

SL894

(OPEN/CLOSE)

Looking at controls

123456

The recorder

SECTION 2

GENERAL

MZ-NH600

This section is extracted from instruction manual.

A x (stop) CANCEL button B OPEN switch C Display window D T MARK/REC (+N) button

NA VI/ MENU button

Press lightly to go to the NAVI (navigation) setting mode Press for 2 seconds or more to go to the MENU setting mode.

F GROUP button G DC IN 3V jack

When you use the optional AC power adaptor, connect it to th is jack.

H X (pause) button I Jog dial

J 5-way control key

The display window of the recorder

Operation Function

Press NENT Press towards . find the beginning

Press towards > find the beginning

Press towards

VOL + VOL −.

There are tactile do ts beside the NENT and

VOL +

play, enter

of the previous track, rewind

of the next track, fast forward

volume

buttons.

K USB cable connecting jack L LINE IN (OPT) jack M Battery compartment (at the bottom) N HOLD switch

Slide th e switch in the direction o f the arrow to disa ble the buttons on the recorder. To prevent the buttons from being accide nt al ly op er at ed when you carry the recorder, use this function.

O i (headphones/earphones) jack

A Character information display

Displays the disc and track names, date, error messages, track numbers, etc.

B SYNC (synchro-r ecor di ng ) i ndic at ion C Hi-MD/MD indication

“Hi-MD” lights up when the operation mode of the recorder is in Hi-MD mode and “MD” lights up when the operation mode is in MD mode.

D REC indication

Lights up during recording or file transfers from the computer. When flashing, the recorder is in record standby mode.

E Battery indication

Shows the approximate remaining battery power. If the battery is weak, the indication becomes empty and starts flashing.

F Disc indication

Shows that the disc is rotating for recording or pl aying.

78 9

G Track mode (PCM, Hi-SP, Hi-LP, SP,

LP2, LP4, MONO) indication

H Sub play mode/Repeat play

indications Shows the selected Sub play mode (single-track play, shuffle play, etc.) or Repeat play.

I Main play mode indications

Shows the selected main play mode (group play, bookmark play, etc.).

MZ-NH600

• This set can be disassembled in the order shown below.

3-1. DISASSEMBLY FLOW

Note 1: The process described in can be performed in any order. Note 2: Without completing the process described in , the next process can not be performed.

SET

3-2. CASE (LOWER) SECTION

(Page 7)

SECTION 3

DISASSEMBLY

3-3. MAIN BOARD

(Page 7)

3-5. MECHANISM DECK SECTION (MT-MZNH900-181),

MD STANDARD PIN (Page 8)

3-7. GEAR (BSA), GEAR (SB)

(Page 9)

3-8. OP SERVICE ASSY

(Page 10)

3-9. DC MOTOR SSM18D/C-NP (SPINDLE) (M701),

DC MOTOR (SLED) (M702), DC MOTOR UNIT (OVER WRITE HEAD UP/DOWN) (M703) (Page 10)

3-4. CASE (UPPER) SECTION

(Page 8)

3-6. SET CHASSIS ASSY

(Page 9)

3-10. HOLDER ASSY

(Page 11)

3-2. CASE (LOWER) SECTION

two screws (M1.4)

MZ-NH600

two screws (M1.4)

3-3. MAIN BOARD

motor flexible board (CN701)

Remove the case (lower) section in the direction of the arrow.

LCD module flexible board (CN471)

OP flexible board (CN501)

MAIN board

leaf spring (USB)

screw (M1.4)

three screws (M1.4)

Remove two solders of over write head flexible board.

MZ-NH600

3-4. CASE (UPPER) SECTION

case (upper) section

boss

herical torsion spring (L)

LCD module flexible boaed (CN471)

two step screws

Open the case (upper) section.

3-5. MECHANISM DECK SECTION (MT-MZNH900-181), MD STANDARD PIN

two step screws (MD)

MD standard pin

mechanism deck section (MT-MZNH900-181)

3-6. SET CHASSIS ASSY

extension spring (R)

two screws

torsion coil spring (R)

set chassis assy

MZ-NH600

compression coil spring (open)

3-7. GEAR (BSA), GEAR (SB)

gear (SB)

open slider

self tap screw

thrust retainer spring

washer (0.8-2.5)

gear (BSA)

battery case

MZ-NH600

3-8. OP SERVICE ASSY

OP service assy

Remove lead screw block assy.

rack spring

screw (M1.4)

3-9. DC MOTOR SSM18D/C-NP (SPINDLE) (M701), DC MOTOR (SLED) (M702),

DC MOTOR UNIT (OVER WRITE HEAD UP/DOWN) (M703)

two screws (M1.4)

DC motor (sled)

Remove two solders of flexible board.

self tap screw

DC motor unit (over write head up/down) (M703)

(M702)

Remove four solders of flexible board.

three self tap screws

DC motor SSM18D/C-NP (spindle) (M701)

motor base assy

3-10. HOLDER ASSY

Remove the holder assy to the direction of the arrow

Open the holder assy.

boss

MZ-NH600

boss

MZ-NH600

MEMO

SECTION 4

DIAGRAMS

4-1. BLOCK DIAGRAM – MD SERVO Section –

OPTICAL PICK-UP

BLOCK

(ABX-U)

VREF

PLSE_XDC

CONT

TRK+

RF AMP, FOCUS/TRACKING ERROR AMP

11 10 12 13

IX JX JY

A B C D

IIN

TRK+

1 54 55 50 51 52 49

15 14

VREF10

RF_IY RF_IX RF_JX RF_JY

IX JX JY A B

C D

A_C

D_C

PD_BUF

PD_I

PDO_SOURCE

IC501

ADIP_IN

NPPO

RFO

ABCD

ADFG

PD-NI

CLK

OFTRK

VREF09

PEAK

BOTM

SBUS

SCK

S-MON

XRESET

MZ-NH600

OVER WRITE HEAD DRIVE

IC601 (1/2)

HR601

OVER

WRITE

HEAD

145 VI N

48 47

33 32 21

RF BUFFER

Q504

101

108

109

114

153

142

174 FS256_OUT

180

123

110

106 107

251 252 113

225

209 210 254 272

RFI

ABCD

ADFG

APCREF_DA

OFTRK

VREF_MON

PEAK BOTM

SSB_DATA SSB_CLK SE

XRF_RST

PF1/S0DO PF2/S1DO LDPEN XLSRCK

OVER WRITE HEAD DRIVE

Q601, 602

M703

OVER WRITE

HEAD

UP/DOWN

TO IC801 (2/3)

(AUDIO SECTION)

69 78 70

TRK+ TRK–

FCS+ FCS–

HB HBB HB HBA

OUTA

OUTB

CLK

EFM

EFM_CLK

LATCH

SYSTEM CONTROLLER,

DIGITAL SIGNAL PROCESSOR

IC801 (1/3)

FOCUS/TRACKING

COIL DRIVE, SPINDLE/SLED MOTOR DRIVE

IC701

FO2

32, 33

RO2

35, 36

FO1

16, 17

RO1

13, 14

175

245

XCS_REC_DRV

FI2

RI2

FI1

RI1

182

158

EFMO

CHOPPERCLK

FS4

TFDR

155

TRDR

154

FFDR

156

FRDR

157

CLK

(Page 15)

TRK–

FCS+

FCS–

MVCC

PVCC

VCC

L1 L2

• SIGNAL PATH

MDVCC REG2 B+ REG3 B+

L1 B+ L2 B+

: PLAYBACK : REC

TRK–

FCS+

FCS–

M702

(SLED)

M701

(SPINDLE)

39, 40

42, 43 26 46 25 28

9, 10

6, 7

3 24 21

UO2

CPUI2

VO2 CPVI2 WO2 CPWI2 COM2

UO1

CPUI1

VO1

CPVI1

WO1 CPWI1 COM1

CPWO2

54 53 52

SLD MON W

CPVO2

CPUO2

SLD MON V

SLD MON U

PWM2

PWM1

STALL

CPWO1

CPVO1

59 60 61

CLV MON W

CLV MON V

CLV MON U

UI2

VI2

WI2

ST2

UI1

VI1

WI1

ST1

55 238

CPUO1

SLD_MON

216

SRDR

172

SLDV

167

SLDW

168

15951 SFDR

28945 HI_Z_SLO

SPDL_MON

232

SPRD

160

SPDV

162

SPDW

163

161 SPFD

2904 HI_Z_SPDL

XRST_MTR_DRV

SLCU SLCV

SPCU SPCV

SPCW

169 170 171SLCW

164 165 166

SLD MON U SLD MON V

SLD MON W

CLV MON U CLV MON V

CLV MON W

1313

MZ-NH600

4-2. BLOCK DIAGRAM – AUDIO Section –

J301

LINE IN

(OPTICAL)

B+ SWITCH

Q301

VC01 B+

A/D CONVERTER

IC301

LIN RIN

AVDD

SDT0

MCLK

BCLK

LRCK

PDN

CDTI

CCLK

CSN

+1.2V

REGULATOR

IC302

FROM IC801 (1/3)

(MD SERVO SECTION)

REG1 B+

173 DI N

307 AD D T 306 FS256 309 XB C K 308 LR CK 190 XP D _ADC

196 SO 0 197 SC K 0 189 XC S _ADC

AOUTL

AOUTR

XMUTE/MUTE

PF3/RTG3

REFERENCE VOLTAGE

BEEP_IN

CN451

(USB)

DATA+

DATA–

VBUS

SWITCHING

Q351

RVDD

J352

RVDD DTCK KEY-R RGND

RMC KEY

• SIGNAL PATH

: PLAYBACK

: REC

: OPTICAL IN

: LINE IN

: USB CHECK OUT

: USB CHECK IN

(Page 15)

HEADPHONE

AMP

IC352

147

148

212

211

199BEEP

313DTCK 131RMC_KEY

314UDP 318UPUEN 315UDM

VREF_IN

INA

INB

OUTA

BEEP_OUTA

OUTB

BEEP_OUTB

MT_SW

PW_SW

1517 18

(Page 15)

XRST2

DDC3 B+

+2.4V

REGULATOR

IC471

WAKE UP SWITCH

Q803

REG VSTB B+

DVDD

208 XOPT_CTL

185 OPT_DET 186 XJACK_DET

USB_WAKE

193

WK_DET

128

XWK

REC_KEY/DOWNLOAD

SI1

T_MARK

213

SDI

MODULE

SO1

214

215

SDO

LCD

133

SCK1

236

SCK

XCS_LCD

SET_KEY_1

SET_KEY_2

124

125

SET_KEY_1

SET_KEY_2

248

JOG_A

249

JOG_A

JOG_B

XHOLD_SW

227

183

HOLD

JOG_B

PAUSE_KEY

192

PAUSE

SYSTEM CONTROLLER,

DIGITAL SIGNAL PROCESSOR

XRST_LCD

RESET

SWITCH

Q471

RST

IC801 (2/3)

DDC3 B+

VB B+

HALF_LOCK_SW/

OPEN_SW

135

S892 HALF LOCK

OPEN_CLOSE_SW

188

S893

OPEN/CLOSE

DETECT

PROTECT

184

S894–1

PROTECT

DETECT

VBUS

X801

48MHz

319

UOSCI

–1 –2

320

UOSCO

HIMD_PROTECT

253

S894–2

Hi-MD

PROTECT

DETECT

(Page 15)

X802

22.5792MHz

310

OSCI

311

OSCO

224

XTEST

SL801 (TEST)

EEPROM

IC892

195SI0 196SO0 197SCK0 239XCS_NV

SDO0

SCK0

SCK

2 1

XCS

SDO0, SCK0

(Page 15)

XWK1, XWK2, XWK4

XWK1

XWK4

XWK2

1414

4-3. BLOCK DIAGRAM – POWER SUPPLY Section –

MZ-NH600

(Page 14)

SDO0 SCK0

XRST2

218 233

YUZU_SLEEP

SYSTEM CONTROLLER

IC801 (3/3)

CC_CTL/VI_CTL

BATT_MINUS_MON

229

XRST2_DET

XCS_PWR_IC

XRST

DACVREFH

MDVCC_CTL

RECP

RECP_MON

PWM_L1 PWM_L2

VBUS_DET

USBHOLD SUSPEND

RST_CONT

VBUS_VB_CTL

CHG_PWM CHG_I_CTL2 CHG_I_CTL3

CHG_MON

CHG_TYPE2

GND_SW

XWK1, XWK2,

XWK4

REC KEY

VBUS

REGULATOR

Q433

CLK

THP401

Q401

(Page 13)

(Page 14)

J402

DC IN 3V

–

CN451 (2/2)

(USB)

D401

DRY BATTERY

SIZE "AA"

(IEC DESIGNATION R6)

1PC. 1.5V

GROUND LINE

SWITCHING

Q403, 406

SDO0 SCK0

RESET SIGNAL

GENERATOR

IC902

B+ SWITCH

Q616, 617

136

RESET

SWITCH

Q618

141

204

181 231

L1 B+ L2 B+

Q501

299 300

250 316 317

132

121VB_MON 129VBUS_MON 127HIDC_MON

205

226VREC_SEL

237 240 221 222 122 255

130

246

USB IF VDD

VB B+ VBUS B+ DC IN B+

NI_VI_CTL

CHG_PWM CHG_I_CTL2 CHG_I_CTL3

CHG_MON

CHG_TYPE2

VOLTAGE

DETECT

IC607

REG4 B+

REG5 VSTB B+ REG5 TSBV B+

REG F B+

REG5 OSC B+

+3V

REGULATOR

IC502

REGULATOR

REG5 B+

VC B+

B+ SWITCH

Q801, 802

+1.2V

IC604

DDC3 B+

VOLTAGE

DETECT

IC606

D609 D610

+1.2V

REGULATOR

IC602

+2.5V

REGULATOR

IC804

OR GATE

IC605

91 DV DD_OUT

98 REG_OUT

61 VIF 12 VC 13 VC

106 VSTB_OUT 102 TSBV_OUT

67 RECP

93 OS C_OUT

108 V33RO

66 VG 2 73 VG 3

21 V3O_1 22 V3O_2 28 V3FB

51 VBUS_DET 86 HOLD_OUT 99 SUS_IN

95 RST_IN

87 64 94 59 58

RST_OUT

POWER CONTROL

IC601 (2/2)

SDO0

SLEEP_IN

VBUSSEL2

TSBV_IN

REG_IN

DVDD_IN

VSTB_IN VREF_IN

VREC_IN VREC_IN

VRECO_1 VRECO_2

UP_1T

UP_1B DW_1T DW_1B

POWFB

UP_3B

VPDRV

PVBUS

VBUSSEL

POWP1 POWP2

SCK0

DATA

VREC

L1_1 L1_2

L3_2 L3_1

VBUS

CLP

CLM

SCK

B+ SWITCH

Q502, 503

B+ SWITCH

Q609

B+ SWITCH

Q352, 353

B+ SWITCH

RVDD

83 101 97 90 105 18

VREC B+

112 80 81

5 4

7 6

3 2

7 6

25 24 17

54 36 88 43 38 42 37 41

RVDD

Q611

SWITCHING

MDVCC

Q612

VSTB

B+

B+ SWITCH

VCO2

B+

Q603

B+ SWITCH

Q608

VC01

B+

REG1 B+ REG2 B+ REG3 B+

DC IN DETECT

D611

Q607

VG B+

58 60

64 59 34 17

VC B+

12 10 23

11 40

54 51 47

+3.2V

REGULATOR

IC603

DATA SCK

SLEEP STRB XRST2 XRST1

POWER CONTROL

IC901

VO1 VC1 VG

VCO1 VCO2

VSTB VREF

REGO1 REGO2 REGO3

NI_VI_CTL CHG_PWM CHG_I_CTL2 CHG_I_CTL3 CHG_MON

CLK

XWK4 XWK2

XWK1

VRMC XWK3

REGI1 REGI2 REGI3

LVB

L1 L1

L2 L2

DW_2T DW_2B

B+ SWITCH

Q614, 615

B+ SWITCH

CONTROL

Q613

CHARGE ON/OFF

CONTROL

CHG_TYPE2

Q407

2 4

6 3

55 52 48

13 14

37 38

43 44

WAKE UP SWITCH

Q902

DDC3 B+

B+ SWITCH

Q901

VI_CTL

CHG_CTL

I_CTL2

I_CTL3

A/D

TYPE2

CHARGE CONTROL

IC401

IN1–

I_CTL1

RF1

BAT+

BAT–

VOLTAGE

LIMITER

Q451, 452

DC IN B+VB B+

6 12 20

26 31

DC IN DETECT

1515

MZ-NH600

1.0 Vp-p

5.7 µs

2.3 Vp-p

• Note For Printed Wiring Boards and Schematic Diagrams

Note on Printed Wiring Board:

• X : parts extracted from the component side.

• Y : parts extracted from the conductor side.

• : Pattern from the side which enables seeing.

(The other layers' patterns are not indicated.)

Caution: Pattern face side: Parts on the pattern face side seen from (Conductor Side) the pattern face are indicated. Parts face side: Parts on the parts face side seen from (Component Side) the parts face are indicated.

• Main board is multi-layer printed board. However, the patterns of intermediate-layer have not been included in this diagrams.

• Lead Layouts

Lead layout of conv entional IC CSP (chip size package)

surfac

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums.

• All resistors are in Ω and 1/ specified.

• f : internal component.

• C : panel designation.

Note: The components identified by mark 0 or dotted line

with mark 0 are critical for safety. Replace only with part number specified.

• A : B+ Line.

• Total current is measured with MD installed.

• Power voltage is dc 1.5 V and f ed with regulated dc power

supply from battery terminal.

• Voltages and waveforms are dc with respect to ground in playback mode. no mark : PLAYBACK

∗ : Impossible to measure

• Voltages are taken with a V OM (Input impedance 10 MΩ).

Voltage variations may be noted due to normal production tolerances.

• Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances.

• Circled numbers refer to waveforms.

• Signal path.

E : PLAYBACK j : REC J : OPTICAL IN F : LINE IN d : USB CHECK OUT G : USB CHECK IN

• Abbreviation EE : East European model

W or less unless otherwise

• Waveforms

IC501 8 (RFO)

(MD Play Mode)

500 mV/DIV, 500 ns/DIV

IC501 ra (FE)

(MD Play Mode)

100 mV/DIV, 500 ns/DIV

IC501 rs (TE)

(MD Play Mode)

200 mV/DIV, 500 ns/DIV

IC801 <zb, (FS4)

Approx. 280 mVp-p

Approx. 100 mVp-p

IC301 8 (BCLK)

IC301 9 (MCLK)

IC301 q; (LRCK)

2.2 Vp-p

354 ns

1 V/DIV, 100 ns/DIV

2.5 Vp-p

88 ns

1 V/DIV, 50 ns/DIV

2.3 Vp-p

22.8 µs

1 V/DIV, 10 µs/DIV

2.6 Vp-p

88 ns

1 mV/DIV, 50 ns/DIV

IC801 <zmv (FS256_OUT)

1 mV/DIV, 2 µs/DIV

IC801 <czz (OSCO)

2.6 Vp-p

44 ns

1 V/DIV, 20 ns/DIV

1616

+ 36 hidden pages

Sony MZNH-600 Service manual

TABLE OF CONTENTS

SERVICING NOTES

GENERAL

DISASSEMBLY

MAIN board

case (upper) section

set chassis assy

OP service assy

DIAGRAMS