The information that is not described in this
Service Manual is described in the LEVEL 2
Service Manual.
When repairing, use this man ual together with
LEVEL 2 Service Manual.
US Model
Canadian Model
AEP Model
UK Model
E Model
Hong Kong Model
Australian Model
Chinese Model
Tourist Model
Korea Model
Japanese Model
This service manual contains information
for japanese model as well.
Contents of LEVEL 2 Service Manual
SERVICE NOTE
1. GENERAL
2. DISASSEMBLY
3. BLOCK DIAGRAMS
4. PRINTED WIRING BOARDS AND
SCHEMATIC DIAGRAMS
5. ADJUSTMENTS
6. REPAIR PARTS LIST
OVERALL
MODE CONTROL
LCD
POWER
CD-333 BOARD
CD-334 BOARD
TK-61 BOARD
CONTROL SWITCH BLOCK (ZK-503)
FS-83 BOARD
JK-208 BOARD
PK-58 BOARD
4-3. WAVEFORMS ······························································4-75
4-4. MOUNTED PARTS LOCATION ·································4-76
6.REPAIR PARTS LIST
6-1. EXPLODED VIEWS ······················································ 6-8
6-1-8.DDX-G2100 COMPLETE ASSEMBLY ························6-8
6-2. ELECTRICAL PARTS LIST ········································6-14
CAUTION
Use of controls or adjustments or performance
procedures other than those specified herein may
result in hazardous radiation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1.Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2.Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
3.Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair . Point
them out to the customer and recommend their replacement.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
4.Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
5.Check the B+ voltage to see it is at the values specified.
6.Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
— 2 —
Page 3
SECTION 2
DISASSEMBLY
The following flow chart shows the disassembly procedure.
Refer to level 2
2-7. SY-67 board
2-8. Base unit (DDX-G2100 complete assembly)
NOTE: F ollo w the disassembly procedure in the numerical order given.
2-16.MD-083 BOARD
After performing “Disassembly” Section 2-7
SY-67 board of MVC-CD200/CD300
Service Manual Level 2 (page 2-7),
do the following.
2-16. MD-083 board
MD-083 board service position
MVC-CD200/CD300
1 Harness (FS-138) (2P)
(door lock plunger)
JK208
6 MD
heat sink
3 Precision
screw
(DIA 1.7 × 4)
2 Flexible board
(from spindle motor 18P)
SY67
M
083
D-
4 Dowel
5 Remove the MD heat sink in the direction of the arrow A.
A
7
SY67
1 Precision
screw
(DIA 1.7 × 4)
JK208
3
8
-0
D
M
3 MD-083 board
B
M
D
-083
C
2 Remove the MD-083 board in the direction of the arrow BC.
4
JK208
4 MD-083 board
2 Flexible board
(from optical device)
(32P)
SY67
3
8
-0
D
M
2-15
3 Ferrite core
1 Flexible
retainer
5
Page 4
[MD-083 BOARD SERVICE POSITION]
When using the CD-R/RW
drive unit. press S101 and S103.
(CD300)
CD-334 board
C
334
Lens block assembly
(CD200)
CD-333 board
D
C
333
Lens block assembly
Control switch block
(RL-503) (6P)
SY-67 board
Extension cable
(J-6082-487-A) (50P)
JK-208 board,
FP-361 flexible
-
D
-
board
FP-364 flexible
board (70P)
JK208
SY-67
-
D
M
083
MD-083 board
Flexible board
(from spindle motor 18P)
AC power
adaptor
1
18
AC IN
CPC-9 jig
(J-6082-393-C)
Adjustment remote
commander (RM-95)
Extension cable
(J-6082-374-A) (18P)
When using the CD-R/RW drive unit.
the dew sensor must be connected.
Harness (FS-140)
(2P) (dew sensor)
2-16E
Page 5
SECTION 3
BLOCK DIAGRAMS
MVC-CD200/CD300
3-8. CAMERA BLOCK DIAGRAM (1/2) (MVC-CD200)
IC101 8
33.3msec
IC101 5
33.3msec
IC101 4,6
3.475µsec
IC101 2
33.3msec
IC101 1,3
IC101 qf
3.475µsec
100µsec
54nsec
100µsec
1.0Vp-p
24.0Vp-p
7.5Vp-p
24.0Vp-p
7.5Vp-p
3.7Vp-p
CD-333 BOARD
(4-15)
IC101
CCD IMAGER
V OUT
V1A
V1B
V3A
V3B
H1
H2
RG
VSHT
CSUB
VDD
LENS UNIT
16
8
5
6
4
V2
2
3
1
V4
15
16
14
11
12
9
13
VL
IC101 qg,qh
54nsec
IRIS
METER
M
H
M001
FOCUS
MOTOR
M
M002
ZOOM
MOTOR
M
FOCUS
RESET
SENSOR
ZOOM
RESET
SENSOR
TEMP
Q102
BUFFER
Q101
SWITCH
3.6Vp-p
DRIVE-
DRIVE+
FOCUS A
FOCUS B
FOCUS B
FOCUS A
ZOOM A
ZOOM B
ZOOM B
ZOOM A
F SENS RST
F SENS VCC
Z SENS RST
Z SENS VCC
TEMP OUT
BIAS+
HALL+
HALL-
CCD OUT
V1A
V1B
V2
V3A
V3B
V4
H1
H2
RG
VSHT
VSUB CONT
CAM 15V
CAM -7.5V
CAM 15V
CAM -7.5V
CAM 3.1V
CAM 15V
CAM -7.5V
XCAM RST
XTG CS
(4-11)
IC303
Q301
CN301
13
12
DRIVE
IRIS
(1/2)
2
1
3
(4-12)
1
(4-12)
IC304
7
(2/4)
3
2
5
6
(1/4)
IC304
11
10
8
BIAS-
9
Q303
(4-11)
IC301
SHUTTER
23
DRIVE
2
IC302
ZOOM
MOTOR
DRIVE
(4-11)
5
7
FOCUS
17
MOTOR
DRIVE
19
24
1820
24
IN1,2
EN1,2
IN3,4
EN3,4
4
3
2
1
D 3.4V
CAP P 5V
1820
D 3.4V
42
75
1917
2321
17
16
15
14
6
7
20
19
Q302
21
( ) : Page No. shown in ( ) indicates the page to refer on the schematic diagram.
DVDD1
DVDD0
CLPDM
XSHD
XSHP
CLPOB
ADCLK
RST
SEN
24 27 33 40
S/H
36.818182MHz
36.5625MHz
29
31
34
10
12
77
5
6
8
19
21
22
24
25
23
16
17
15
14
27
CN704CN203
••
X202
XTAL OSC
X201
XTAL OSC
(4-14)
IC202
A/D CONVERTER
•
AGC
A/D
CONV.
D11
D0
SCLK
SDATA
Q201
XCAM SCK
CAM SO
MCK12
TG CLK
CN203CN704
1266
|
12
1
48
47
PAL/XNTSC
VSUB CNT
IC101
IRIS CONT1
18
IRIS CONT2
19
HALL REF
2
HALL GAIN
3
HALL OFFSET
4
PRELAMP AF ON
7
CNT C
9
SP VOL
8
PE DAC LEVEL1
12
PE DAC LEVEL2
13
DAC STBY
66
|
|
54
54
4242
32
32
38
38
30
30
45
45
46
46
35
35
33
33
AU CLK EN
(4-24)
VCC
11
VDD
10
DI
17
CLK
16
LD
15
39
40
41
43
44
46
47
9
12
13
42
45
14
2
33
IC304
IC303
IC304
119
1210
1513
1614
V2
V4
V1A
V1B
V3A
V3B
VSHT
RG
H1
H2
VH
VL
VDD3
RST
SEN
(4-12)
14
(4-11)
7
(4-12)
10
9
EN1
EN2
EN3
EN4
IC202 e;
IC201
TIMING
GENERATOR
9
IN1
10
IN2
11
12
13
IN3
14
15
IN4
16
124µsec
CLPOB
CLPDM
ADCLK
(4/4)
12
13
(2/2)
6
5
(3/4)
XSHP
XSHD
VDD1
VDD2
VDD4
VDD5
VDD3
MCK0
8
CAM 3.1V
1.0Vp-p
(4-14)
16
17
22
20
23
7
8
15
29
14
30
CKI
26
HDI
35
VDI
34
SCK
32
SSI
31
TH301
CAM 3.1V
CA HD
CA FD
XCAM SCK
CAM SO
XCAM RST
XEAGLE/
XGCAM CS
XCAM RST
XEAGLE/ XGCAM CS
XTG CS
IRIS CONT1
IRIS CONT2
HALL REF
HALL AD
HALL OFFSET
HALL GAIN
MSHUT ON
PE DIR0A
PE DIR0B
PE DIR1A
PE DIR1B
CCD TEMP
XFC RST SENS
XZM RST LED
XLENS RST LED
LENS TEMP AD
IRIS EN
DIR0B
PE EN0
PE EN1
17
13
30
23
22
21
20
16
43
46
29
31
34
10
12
5
6
8
19
21
22
24
25
23
16
17
15
28 28
26 26
18 18
14
27
SY-67 BOARD(1/3)
IC901 2
5.5Vp-p
IC901
CLOCK
GENERATOR
(4-32)
76
MODE CONTROL
(SEE PAGE
of LEVEL 2)
48MHz
CAM 3.1V
CAM SO
XCAM SCK
21nsec
X901
XTAL
OSC
IC901 qh
21nsec
IC901 9
USB CLK
16
MC CLK
11
92
AU CLK
TG CLK
4
61nsec
5.5Vp-p
4.5Vp-p
IC901 4
D 1.8VVCC2
4.3Vp-p
26.8nsec
(4-26)
IC302
64Mbit SDRAM
PRE LAMP AF ON
XRST SYS
PAL/XNTSC
EXT STRB ON
SYS V
CAM 3.1V
1
1427VCC
3
9
43
49
VCCQ
DQML
DQMH
20A0
14|
|
35
A13
2
DQ0
|
13
16 |
42
|
DQ15
53
15
39
16
WE-
17
CAS-
18
RAS-
19
CS-
38
CLK
3-6
STRB ON
STRB PHOTO ON
PHOTO TR OUT
Q311
IC301
CAMERA DSP,MEMORY CONTROL,
VIDEO ENCODER,OPD,OSD,HOST IF,
RES CONTROL,SG,JPEG,L-MODE,
AUDIO I/F,SHUTTER CONTROL,
STROB CONTROL
8
AD IN 11
|
12
|
20
AD IN 00
9
47
83
101
VCC3CAM 3.1V
117
130
141
192
30
71
106
145
196
223
48
MCK12
5
CA HD
6
CA FD
202
VSUB CONT
114
AQ00
|
|
96
AQ13
144
DQ00
|
126
DQ15
125
QDML
124
QDMH
122
XWE
121
XCAS
120
XRAS
118
XCSO
94
QCLK
187
XFC RST SENS
148
XZM RST SENS
149
XFC RST SENS
150
XLENS RST LED
147
IRIS EN
188
PE EN0
189
PE DIR0A
190
PE DIR0B
193
PE EN1
194
PE DIR1A
195
PE DIR1B
198
M SHUT ON
59
XRST SYS
161
PE DAC LEVEL1
172
PE DAC LEVEL2
179
PAL/XNTSC
200
EXT STRB ON
199
STRB ON
158
STRB PHOTO ON
203
STRB AD
162
PY0
168
CR0
165
CB0
(4-25)
NT VD0
IRQ IMG
IRQ JPG
IRQ AUDIO
MC XCS2
MC XCS6
MC HCLK
PEARL FLD
MC DRAK0
MC DREQ0
XPWAD
XPWDA
LCD VD
WRLX
WRHX
9375D00
|
|
16
D15
38
A01
|
|
14
23
A14
184
64
63
66
41
40
72
183
69
67
39
RDX
42
43
AUCLK
218
ACLK
(IC901)
207
SIA
208
SOA
209
LRCK
210
SCLK
211
ADCK
212
213
185
182
HD
173
YO
176
CO
SYS V
IRQIMG
IRQJPG
IRQAUDIO
MC XCS2
MC XCS6
AU LRCK
MC HCLK
PEARLFLD
MC DRAK0
MC DREQ0
MC XRD
MC XWE0
MC XWE1
CAM SO
XCAM SCK
XCAM RST
XTG CS
XEAGLE/XGCAM CS
HALL AD
LENS TEMP AD
AU CLK EN
DAC STBY
CCD TEMP
AU SDTO
AU SDTI
AU LRCK
AU SCLK
AU MCLK
AU XPWAD
AU XPWDA
Y OUT
C OUT
CNT C
SP VOL
CAMERA(2)
(SEE PAGE
3-19)
CAMERA(2)
(SEE PAGE
3-19)
Q305 B
Q305
BUFFER
BUFFER
Q306
0.5Vp-p
H
Q307
BUFFER
CN707
PANEL V
5
HD0
4
PANEL Y
9
PANEL R-Y
8
PANEL B-Y
7
LCD
(PK-58)
(SEE PAGE 3-7
of LEVEL 2)
3-153-16
Q306 B
0.2Vp-p
H
Page 6
MVC-CD200/CD300
3-9. CAMERA BLOCK DIAGRAM (1/2) (MVC-CD300)
IC401 q;
124µsec
IC401 5
33.3msec
IC401 4,6
124µsec
2µsec
IC401 2
33.3msec
IC401 1,3
2µsec
124µsec
IC401 qs
54nsec
1.0Vp-p
22.0Vp-p
7.5Vp-p
22.0Vp-p
7.5Vp-p
3.7Vp-p
CD-334 BOARD
(4-16)
IC401
CCD IMAGER
V OUT
V1A
V1B
V3A
V3B
RG
VSHT
CSUB
VDD
IC401 qd,qf
LENS UNIT
16
V2
V4
H1
H2
VL
54nsec
IRIS
METER
M
M001
FOCUS
MOTOR
M
M002
ZOOM
MOTOR
M
FOCUS
RESET
SENSOR
ZOOM
RESET
SENSOR
Q402
10
BUFFER
5
6
4
2
3
1
14
13
12
16
Q401
17
SWITCH
11
18
CCD OUT
V1A
V1B
V2
V3A
V3B
V4
H1
H2
RG
VSHT
VSUB CONT
CAM 15V
CAM -7.5V
CAM 15V
CAM -7.5V
CAM 5V
CAM 15V
CAM -7.5V
XCAM RST
XTG CS
4.7Vp-p
IC202 qh
54nsec
CN302
IRIS B
3
IRIS B
5
IRIS A
4
IRIS A
2
FOCUS A
6
FOCUS B
7
FOCUS B
5
FOCUS A
8
D 3.4V
CAP P 5V
ZOOM A
10
ZOOM B
9
ZOOM B
12
ZOOM A
11
F SENS RST
15
F SENS VCC
14
Z SENS RST
3
Z SENS VCC
2
Q302
TEMP OUT
TEMP
CN303
D 3.4V
42
75
1917
2321
1820
IC302
(4-11)
ZOOM
MOTOR
DRIVE
21
IC301
4
33
IRIS
MOTOR
2
DRIVE
5
7
FOCUS
MOTOR
17
DRIVE
19
24
1820
24
IN1,2
EN1,2
IN3,4
EN3,4
( ) : Page No. shown in ( ) indicates the page to refer on the schematic diagram.
A/D
CONV.
Q201
CN203 rs
D11
D0
SCLK
SDATA
12
XCAM SCK
CAM SO
MCK12
PAL/XNTSC
TG CLK
VSUB CNT
3.2Vp-p
CN203CN704
54nsec
1266
|
1
48
47
IC101
PRELAMP AF ON
7
CNT C
9
SP VOL
8
PE DAC LEVEL1
12
PE DAC LEVEL2
13
DAC STBY
IC103
12
IRIS
MOTOR
13
PRE-
DRIVE
(4-24)
1
VD
VCC
VDD
CLK
(4-24)
DI
LD
66
|
|
54
54
4242
32
32
38
38
30
30
45
45
46
46
35
35
33
33
AU CLK EN
11
10
17
16
15
CAM SI
6
CAM SO
5
XCAM SCK
4
XTG CS
3
XBEAR RST
9
8
DVDD1
DVDD0
CLPDM
XSHD
XSHP
CLPOB
ADCLK
RST
SEN
24 27 33 40
S/H
36.818182MHz
XTAL OSC
36.5625MHz
XTAL OSC
CN704CN203
29
31
34
IC202
A/D CONVERTER
••
X202
X201
(4-14)
•
AGC
IC202 e;
CAM 3.1V
XSHP
VDD3
MCK0
1.0Vp-p
(4-14)
16
XSHD
17
22
20
23
VDD1
7
VDD2
8
15
VDD4
29
VDD5
14
30
CKI
26
HDI
35
VDI
34
SCK
32
SSI
31
CAM 3.1V
CA HD
CA FD
XCAM SCK
CAM SO
XCAM RST
XEAGLE/
XGCAM CS
XCAM RST
XEAGLE/ XGCAM CS
XTG CS
17
13
30
23
22
21
20
16
43
46
29
31
34
124µsec
IC201
TIMING
GENERATOR
V2
39
V4
40
41
43
44
46
47
9
12
13
42
45
14
2
33
CLPOB
V1A
V1B
CLPDM
ADCLK
V3A
V3B
VSHT
RG
H1
H2
VH
VL
VDD3
RST
SEN
3.4Vp-p
9
IN1
10
EN1
IN2
11
EN2
12
13
IN3
14
EN3
15
IN4
16
EN4
MSHUT ON
PE DIR0A
PE DIR0B
IRIS EN
DIR0B
PE EN0
19
19
21
21
22
22
24
24
25
25
23
23
IC102
119
1210
1513
1614
TH301
PE DIR1A
PE DIR1B
CCD TEMP
XFC RST SENS
XZM RST LED
XLENS RST LED
LENS TEMP AD
PE EN1
16
17
15
28 28
26 26
18 18
14
27
16
17
15
14
27
CN704CN203
IC104
IC105
VD PULSE
GENERATOR
(4-24)
SYS V
M SHUT ON
SY-67 BOARD(1/3)
IC901 2
5.5Vp-p
IC901
CLOCK
GENERATOR
(4-32)
76
(SEE PAGE
of LEVEL 2)
PLL 12
(IC301)
48MHz
CAM 3.1V
CAM SO
XCAM SCK
21nsec
X901
XTAL
OSC
MODE CONTROL
3-6
IC901 qh
21nsec
IC901 9
USB CLK
16
MC CLK
11
92
AU CLK
TG CLK
4
61nsec
5.5Vp-p
4.5Vp-p
IC901 4
D 1.8VVCC2
4.3Vp-p
26.8nsec
(IC103)
(4-26)
IC302
64Mbit SDRAM
DQML
DQMH
20A0
14|
|
35
A13
2
DQ0
|
13
16 |
42
|
DQ15
53
15
39
16
WE-
17
CAS-
18
RAS-
19
CS-
38
CLK
PRE LAMP AF ON
XRST SYS
PAL/XNTSC
EXT STRB ON
STRB ON
STRB PHOTO ON
PHOTO TR OUT
SYS V
CAM 3.1V
1
1427VCC
3
9
43
49
Q311
VCCQ
IC301
CAMERA DSP,MEMORY CONTROL,
VIDEO ENCODER,OPD,OSD,HOST IF,
RES CONTROL,SG,JPEG,L-MODE,
AUDIO I/F,SHUTTER CONTROL,
STROB CONTROL
8
AD IN 11
|
12
|
20
AD IN 00
9
47
83
101
VCC3CAM 3.1V
117
130
141
192
30
71
106
145
196
223
48
MCK12
74
PLL12PLL12
5
CA HD
6
CA FD
202
VSUB CONT
114
AQ00
|
|
96
AQ13
DQ00
144
|
DQ15
126
125
QDML
124
QDMH
122
XWE
121
XCAS
120
XRAS
118
XCSO
94
QCLK
187
XFC RST SENS
148
XZM RST SENS
149
XFC RST SENS
150
XLENS RST LED
147
IRIS EN
188
PE EN0
189
PE DIR0A
190
PE DIR0B
193
PE EN1
194
PE DIR1A
195
PE DIR1B
198
M SHUT ON
59
XRST SYS
161
PE DAC LEVEL1
172
PE DAC LEVEL2
179
PAL/XNTSC
200
EXT STRB ON
199
STRB ON
158
STRB PHOTO ON
203
STRB AD
162
PY0
168
CR0
165
CB0
(4-25)
NT VD0
IRQ IMG
IRQ JPG
IRQ AUDIO
MC XCS2
MC XCS6
MC HCLK
PEARL FLD
MC DRAK0
MC DREQ0
XPWAD
XPWDA
LCD VD
WRHX
WRLX
9375D00
16
|
|
D15
38
A01
14
|
|
23
A14
184
64
63
66
41
40
72
183
69
67
39
RDX
42
43
AUCLK
218
ACLK
(IC901)
207
SIA
208
SOA
209
LRCK
210
SCLK
211
ADCK
212
213
185
182
HD
173
YO
176
CO
SYS V
IRQIMG
IRQJPG
IRQAUDIO
MC XCS2
MC XCS6
AU LRCK
MC HCLK
PEARLFLD
MC DRAK0
MC DREQ0
MC XRD
MC XWE0
MC XWE1
CAM SI
CAM SO
CAM SCK
XCAM RST
XTG CS
XEAGLE CS
HALL AD
LENS TEMP AD
AU CLK EN
DAC STBY
CCD TEMP
XBEAR RST
AU SDTO
AU SDTI
AU LRCK
AU SCLK
AU MCLK
AU XPWAD
AU XPWDA
Y OUT
C OUT
CNT C
SP VOL
CAMERA(2)
(SEE PAGE
3-19)
CAMERA(2)
(SEE PAGE
3-19)
Q305 B
0.5Vp-p
H
Q305
BUFFER
BUFFER
BUFFER
Q306
Q307
CN707
PANEL V
5
HD0
4
PANEL Y
9
PANEL R-Y
8
PANEL B-Y
7
LCD
(PK-58)
(SEE PAGE 3-7
of LEVEL 2)
3-173-18
Q306 B
0.2Vp-p
H
Page 7
MVC-CD200/CD300
3-10.CAMERA BLOCK DIAGRAM (2/2)
SY-67 BOARD(2/3)
94
9
10
11
12
101
105
166
169
185
196
198
199
179
173
174
(4-32)
1
117
CS
6
27
RST
134
90
31
33
115
112
206
207
26
29
161
7462 100
170116 190
201
88
8430
182
159
18
21
IC501
20
57-80
A1-A20D0-D15
XCS LCD DAC
SYS V
IRQ IMG
IRQ JPG
IRQ AUDIO
MC XCS2
MC XCS6
AU LRCK
MC HCLK
PEAL FLD
MC DRAK0
MC DREQ0
MC DREQ1
CAM SI
CAM SO
XCAM SCK
XEEPROM CS
XEEPROM RESET
UCLK
XCAM RESET
XTG CS
XCAM RESET
XTG CS
XEAGLE/XGCAM CS
HALL AD
LENS TEMP AD
DAC ENB
DAC STBY
EXTAL
483622
VCCQ
139
VCC
(4-29)
MC CAM
SH DSP
16
35-53
MC RDXWR
MC XCS3
MC CKE
MC XRAS
MC XCAS
MC XRD
MC XWE0
MC XWE1
MC XCS0
DRAGON RST
MC DACK1
XMD POWER SAVE
MC DREQ
IRQ FDC/CW
MC XCS4
MC XCS5
MC XCLK
USB D+PULLUP
USB TXENL
USB XVDATA
USB D+ IN
USB D– IN
USB SUSPND
USB D– OUT
USB D+ OUT
USB VBUS
HI SO
HI SI
XHI SCK
XMC CS
NMIXMC NMI
XMC HELP
XRESETP
SELF TIMERSELF TIMER
AU HGL SEL
XAU SP MUTE
XAU LINE MUTE
MS BS
MS DIO
MS SCLK
PAL/XNTSC
ACCESS LED
V OUT ON
3-7
(SEE PAGE
of LEVEL 2)
CAMERA(1)
(SEE PAGE
3-16(MVC-CD200),
3-18(MVC-CD300))
16
(PK-58)
LCD
POWER
XCS PANEL D/A
CAM SO
XCAM SCK
16
14
MC XRD
MC XWE0
MC XWE1
SYS V
IRQIMG
IRQJPG
IRQAUDIO
MC XCS2
MC XCS6
AU LRCK
MC HCLK
PEARLFLD
MC DRAK0
MC DREQ0
CAM SI
CAM SO
XCAM SCK
CN707
17
18
19
234
SCK DI DO
IC505
EEPROM
(16KBIT)
USB CLK
(IC901)
AU CLK EN
XBEAR RST
XCAM RST
XTG CS
XEAGLE CS
HALL AD
LENS TEMP AD
CCD TEMP
DAC STBY
MC CLK
(IC901)
CAM 3.1V
D 1.8V
CAM DD ON
LCD DD ON
( ) : Page No. shown in ( ) indicates the page to refer on the schematic diagram.
MC D00
VCC
CAM 3.1V
0.5Vp-p
Y OUT
C OUT
CNT C
SP VOL
AU SDTI
AU SDTO
AU LRCK
AU SCLK
MC D15
MC A01
MC A03
DRAGON RST
MC HCLK
MC XRD
MC XWE0
MC XCS4
MC XCS5
MC DREQ1
IRQ FDC/CW
XMD POWER SAVE
IC201 8
8
13
14
11
10
12
DATA BUS
ADDRESS BUS
16
14
16
2-13
20-35
1
14
96
102
110
111
113
91
92
93
99
23
120
32
199
13
103
104
169
14
187
186
146
145
191
147
148
189
178
171
172
177
106
200
121
122
124
123
193
194
192
210
USB DET
AV JACK IN
8
MS BS
MS DIO
MS SCLK
15
LED DRIVE
Q501
25
CAM 3.1V
XRST FLASH
HI SO
HI SI
XHI SCK
XMC CS
XMC HELP
XRST SYS
VCC
27
3
9
VCCQ
49
43
DQML
15 16 17 18 19 37 38 39
MC XWEO
AV JACK IN
USB JUCK IN
PAL/XNTSC
ACCESS LED
BEEP ON
BEEP
42-53
A0-A13DQ0-DQ15
IC504
SDRAM
64MBIT
WE-
CAS-
RAS-
CS-
MC RDXWR
MC XCAS
MC XRAS
MC XCS3
MC CKE
MODE
(SEE PAGE 3-6
of LEVEL 2)
CKE
CLK
MC HCLK
CONTROL
DQMU
MC XWE1
20
1-9,
16-25,
48
IC503
(4-31)(4-31)
FLASH ROM
RESET-OECE
WE-
11
12 26 28 37
MC XWE1
XRST FLASH
MC XCSO
IC201 1
H
CAMERA(1)
(SEE PAGE
3-16(MVC-CD200),
3-18(MVC-CD300))
16MBIT
DQ0-DQ15A1-A20
MC XRD
29-36
38-45
AU XPWAD
AU XPWDA
AU MCLK
MC DACK1
H
SDTI
SDTO
PW AD
PW DA
MCLK
LRCK
SCLK
IC251
AUDIO AD/DA CONV.
A OUT L
A IN L
MCA1-MCA3
0.4Vp-p
Q301
TRAP
FREQ.
SW
VDD
(4-37)
159
3
5
16
3
(4-33)
Q309,310
IC154
IC155
9
2
14
D6
3
D1
6
D2
12
D3
11
D4
Q303
BUFFER
Q304,308
ATT
EVR
IC158
DELAY
CK
9
(4-33)
19
X OE
1
11
18
15
Q6
2
Q1
7
Q2
12
Q3
10
Q4
IC201
VIDEO AMP
8
Y IN
1
C IN
POWER SAVE
21
V OUT
(4-33)
4
IC156
(4-33)
IC153
214
2
4
1
2
7
1
6
3
5
IC157
(4-28)
3
5
VCC
6
V OUT ON
A 3.4V
IC201 3
IC152
(4-33)
(4-33)
H
IC158
5
9
12
2
1
IC160
(4-34)
(4-33)
4
2.1Vp-p
6
8
11
IC151
53
71
DRAGON RST
USB D+PULLUP
USB TXENL
USB XVDATA
USB D+ IN
USB D– IN
USB SUSPND
USB D– OUT
USB D+ OUT
USB DET
AV JACK IN
MC DACK1
(4-33)
CN701
16
3
CN709
CN707
46
31
HA0-HA2
19
22
18
HRESET
30
DACK
23
IOR
24
IOW
26
16
17
DREQ
29
HINT
21
XMD POWER SAVE
20
MPXO IF
5
DECEFM
2
FM DT
1
16
12
19
9
20
8
21
7
22
6
23
5
17
10
18
11
7
21
8
20
10
18
12
16
26
27
25
26
24
25
HDB0
MDB15
16
HCS1
HCS0
CN101
CN301
3
MD BLOCK
(MD-083)
(SEE PAGE
JK-208 BOARD(1/2)
2
3
IC101
4
5
6
12
(4-61)
13
(SEE PAGE
4-67)
3-21)
D 3.4V
Q103
MS SCLK
MS BS
MS DIO
D+
11
D-
10
V OUT
A OUT
USB
I/F
PK-58 BOARD(1/3)
D+
3
D-
CN102
2
USB
VCC
1
J102
A/V OUT
(MONO)
14
CN301
15
CPC
FOR CHECK
16
(4-38)
IC252
A 3.4V
A 3.4V
A 4.9V
CAM P 5V
BEEP
BEEP ON
Q253
11
16
19
25
10
21
44
48
LINE/SPEAKER AMP
BEEP IN
VOL CTL
PB IN
REC OUT
XBEEP MUTE
VCC
VCCH
SP VCC
LPF SEL
XAUDIO MUTE
LINE OUT
SP OUT+
SP OUT-
MIC IN
SP +
MIC SIG
1
SP -
2
CN706
1
CN711
20
15
46
40
AU HGL SEL
XAU LINE MUTE
XAU SP MUTE
Q251,252
MUTE
1
3
SP+
SP901
SP-
SPEAKER
MIC901
MIC UNIT
3-193-20
Page 8
MVC-CD200/CD300
3-11.MD BLOCK DIAGRAM (1/3)
MD-083 BOARD(1/3)
31
46
19
22
18
29
21
17
16
23
24
26
30
2
1
5
CN404
HDREQ
HINTRQ
XHCS0
XHCS1
XHDAK
XHIOR
XHIOW
IC419
DECEFM
FMDT
BACKUP VCC
(CN404 48 )
XCDR RSTO
41
DATA
ADDRESS
(IC414)
(IC207,404,420)
(4-53)
(IC013)
(SEE PAGE 3-23)
D405
(4-52)
8
XCE1
CE2
X0E
RX/W
CAMERA(2)
(SY-67)
(SEE PAGE
3-20)
HDB0-HDB15
16
HA0-HA2
3
DREQ
HINT
HCS0
HCS1
DACK
IOR
IOW
HRESET
DECEFM
FMDT
MPXO IF
( ) : Page No. shown in ( ) indicates the page to refer on the schematic diagram.
IC401
SRAM
30
6
32
5
14
10 20
31
21
29
XCSSRAM
SRAM CE
XRD
XWR
8
(IC207)
(SEE PAGE 3-23)
(IC404)
A0-A16
17
D8-D15
(4-53)
IC408
4MBYTE
BUFFER
DRAW
(CN404)
(IC404)
84HD0-HD15
102
72HA0-HA2
74
71
82
76
70
69
77
80
81
75
28
5
4
26
25
128
2
127
3
114
126
103
111
15
(4-54)
IC414
ATAPI
CD-R
ENC/DEC
EFM ENC
CONTROL
8
24
88
11
16
3
HDREQ
HINTRQ
XHCS0
XHCS1
XHDAK
XHIOR
XHIOW
XCLRST
XRD
XWR
XCLDINT
XCLHINT
4.6V
XCAS
23
XMOE
22
XRAS
7
XWE
6
BA0-BA11
8
12
21
2
BD0-BD7
5
8
24
27
IC407
BUS
SW
9
8
17
19
2
D8-D15
42
54
47
40
41
33
45
29
61
58
65
57
60
59
55
56
64
62
63
6
(4-53)
ENCEFM
ATSY
CLVM
ENSY
SOCK
WLDON
IC413
IC410
C2PO
EXCK
GRSCOR
SBSO
SQSY
WFCK
FMCK
FMDT
MDATA
LRCK
BCLK
XCSCL
19
1
(4-53)
42
(4-53)
XRD
(IC207)
(SEE PAGE 3-23)
24
(IC201)
(SEE PAGE 3-25)
(IC404)
C34MV
C17MV
(IC207)
(IC207)
(IC013)
(SEE PAGE
3-24)
(SEE PAGE 3-23)
TE
3
IC200IC208
TSHOCK
DETECT
(4-49)
TSNSCMP(IC019)
(SEE PAGE 3-24)
(IC207)
(SEE PAGE 3-23)
(IC414)
1
7
3
NMI
TSHOOK
FSHOOK
IC406
EEPROM
(4-52)
XCLDINT
XCLHINT
IC423
IC400
(CN404)
(IC401)
OR,
LAICH
(4-51)
(Q407)
(IC414)
ENCEFM
MD BLOCK(2/3)
(SEE PAGE
3-23)
(4-51)
100
3
67
1
92
55
2
54
21
96
95
56
19
6
73
12
71
72
LDEN
SLFG
SP ON
XRFRST
WAPCFUP
SENS
SNSCLK
XMRST
C2PO
XGAINT
XSQINT
XRD
XWR
DOOR LOCK
ADDRESS
IC403
4
1
IC418
2
4
IC402
4
2
ASTY
C17MV
(4-51)
TZC
(4-51)
LMT
(CN001)
(IC207)
(IC003)
(IC013)
(IC012)
(IC201)
(SEE PAGE
3-25)
(IC207)
(SEE PAGE
3-23)
(IC207,401,
(SEE PAGE
3-23)
(IC414)
(IC207)
(SEE PAGE
3-23)
(IC013)
(SEE PAGE
(SEE PAGE
3-24)
3-23)
(SEE PAGE 3-26)
(SEE PAGE
3-24)
407,414)
EJECT
XCDR RSTO
SRAM CE
XPD
E2DI
E2DO
3
E2RST
6
XE2CK
2
XE2CS
1
XCLRST
6
5
XCLR
76
62
89
63
16
974
10
99
14
74
75
91
94
A0-A19
(4-51)
IC404
SYSTEM
CONTROL
(MD)
5
8
30
32
53
23
820
D8-D15
MODE CONTROL
(SEE PAGE
3-6
of LEVEL 2)
(SY-67)
XMD POWER SAVE
TH OUT
XLID OPEN
DATA
FM CK
CN405
FM DT
MDATA
LRCK
BCLK
FSHOCK
LMT
1
CW 3.4V (CN404 15 )
D 3.4V (CN404 9 10 )
D 4.6V (CN404 11 12 )
20
CW UNREG
(CN404 13 14 )
TH401
3
IC422
47
14
EJECT
Q403,404,418
(4-53)
(IC404,CN001)
Q407,409
FB410
FB405
DC/DC
CONVERTER
IC425
Q411,417
XPD(IC404)
DSP 3.4V
3.4V
4.6V
4.6V-2
POWER 5V
(4-53)
Q412,416
3.4V
MD BLOCK(2/3)
(SEE PAGE
3-23)
MD BLOCK(3/3)
(SEE PAGE
3-25)
PL902
VCC
DOOR LOCK
PLUNGER
16
3-213-22
Page 9
MVC-CD200/CD300
3-12.MD BLOCK DIAGRAM (2/3)
MD-083 BOARD(2/3)
ENCEFM
49
(4-50)
IC207
ATSY
CLVM
ENSY
SOCK
WLDON
X202
34.574MHz
C34MV
C17MV
LOCKCD
MIRRO
MNTO
MNT1
MNT2
MNT3
SQCK
SQSO
SQSY
XTSL
XCSSRAM
XCDR RSTO
XGAINT
XRD
XSQINT
XWR
NMI
C33M
3.4V
FM CK
FM DT
(1/3)
ADDRESS
DATA
CD-R/RW
53
GA
52
50
51
48
42
41
43
46
128
125
121
122
123
124
118
119
120
131
69
116
133
87
134
88
132
44
74
86101
208
A0-A9D8-D15
16
MD BLOCK
(SEE PAGE
3-22)
(SEE PAGE
3-22)
(SEE PAGE 3-21)
(SEE PAGE3-22)
(SEE PAGE 3-22)
(SEE PAGE 3-25)
(SEE PAGE
(1/3)
(IC414)
(SEE PAGE
3-21)
(IC013,414)
(IC414,404)
(IC201)
(SEE PAGE
3-25)
(IC401)
(IC404)
(IC404)
(IC404)
(IC201)
MD BLOCK
3-22)
( ) : Page No. shown in ( ) indicates the page to refer on the schematic diagram.
EQEFM
33
ODPLS
34
OSCON
36
WAPCRW
32
SPBRK
2
SPREV
57
ACTEN
63
XRW
3
ASMP
26
AGCON
22
ATFG
10
MIRR
15
MPXO
113
MSMP
24
RAPC
31
RC
16
RECD1
21
RECD2
20
RFGUP
23
RSMP
27
RZC
14
SSMP
25
TZC
13
142
WAPC
29
WAMP
28
DFCT
130
XTOK
17
FOK
129
FMCK
11
FMDT
12
Q203
144
MDPGA
60
MDSGA
61
SOFF
59
SPLHLD
143
VREF-
111
VREF+
115
XSDLTRF
5
SDLTDA
6
XSDLTDSP
4
SWDT
8
SDCK
7
SLFG
58
SPFG
56
94
XDFCT2
DFCT
DFCT2
(SEE PAGE 3-25)
(SEE PAGE 3-25)
(CN001)
(IC012)
(IC003)
(Q004)
(IC013)
(IC013,204)
(SEE PAGE
3-25)
(IC014)
(SEE PAGE
3-25,26)
(IC013,014)
(IC019)
(IC201)
(IC404)
(SEE PAGE
3-22)
(SEE PAGE 3-26)
(SEE PAGE 3-21)
(4-50)
IC209
1
2
Q204
(SEE PAGE 3-25)
(SEE PAGE 3-22)
(SEE PAGE 3-26)
(SEE PAGE 3-25)
(SEE PAGE
(SEE PAGE
4
3-25)
3-21)
(SEE PAGE
(SEE PAGE
(CN404)
(IC207)
(IC207)
(IC204,207)
(IC207,404)
(IC207,014)
(IC201,207)
(IC201,207)
(CN404)
(IC201)
3-25)
(IC207,014)
3-25)
(IC404)
(SEE PAGE
3-22)
FM DT
C34MV
ASMP
AGCON
ATFG
MIRR
MPXO
MSMP
RAPC
RC
RECD1
RFGUP
RSMP
RZC
SSMP
WAPC
WAMP
DFCT2
TZC
RECD2
DFCT
FMCK
FMDT
FOK
DECEFM
EQRF
MPP
RRF
XSDLTRF
SWDT
SDCK
XRFRST
VWDC
(4-46)
IC013
49
CD-R/RW
57
RF PROCESS
36
39
47
85
55
61
45
44
35
58
52
56
60
59
46
42
43
46
37
38
48
54
80
11
77
66
65
64
63
6
VRDC
10
8
9
7
5
PD-A
91
PD-H
99
FPDIN
4
TE
TE
13
FE
14
TEO
83
VC
15
VREF+
3
XTOK
41
DIAG
8413
TE,FE
SLMOVE
SL FG
SP FG
SDCK
SWDT
RFAC
4.6V
4.6V-2
IC012
SW
(4-46)
(IC200)
(IC014)
(SEE PAGE
3-25,26)
(IC014,201,207)
(SEE PAGE
3-25,26)
MD BLOCK(3/3)
(SEE PAGE
3-25)
WAPCRW
WAPCFUP
(SEE PAGE3-22)
(IC207)
(IC404)
(SEE PAGE
(SEE PAGE 3-26)
(SEE PAGE 3-25)
(SEE PAGE 3-22)
3-22)
(IC014)
(IC207)
(IC014)
(IC208)
(SEE PAGE
3-22)
HAVCOS
LDLMT
VWDC2
DIAG
SLVOS
SDLTDA
SEOS
SNSCMP
TSNSCMP
SLMOVE
(IC404)
(IC207)
(IC014)
DSP3.4V
BASE UNIT(1/2)
20
21
31
32
30
29
27
26
25
18
7
10
13
16
11
12
19
(DDX-G2100)
LD
DRIVE
PD
IC
FRONT
MONITOR
OPTICAL
DEVICE
LASER
DIODE
CN001
LDD5V
4.6V
W/XR
IC002
2
EJECT
LDEN
1
ODPLS
OSCON
VWDC
VWDC2
VRDC
LDLMT
VREF+
D002
SW
IC007
4.6V
OFFSET
IC019
D/A
CONV.
(EVR)
(4-48)
AMP
HAVCOS
4.6V
12
2
19
6
17
16
15
5
8
7
9
(4-45)
ENBL(IC404)
4
ODON
VWDC1
VWDC2
VRDC
A-H
(4-45)
VCC
VC
FPDON
3-233-24
Page 10
MVC-CD200/CD300
3-13.MD BLOCK DIAGRAM (3/3)
MD-083 BOARD(3/3)
(4-49)
MD BLOCK
(1/3)
(SEE PAGE
3-22)
(SEE PAGE
(SEE PAGE
(SEE PAGE
(SEE PAGE
MD BLOCK
(1/3)
(SEE PAGE
3-22)
(IC207)
3-23)
(IC
3-21)
3-22)
3-21)
(IC404,
(SEE PAGE
3-21,22)
(IC404)
(IC414)
414)
MDATA
LRCK
BCLK
DSP3.4V
LOCKCD
MIRRO
MNTO
MNT1
MNT2
MNT3
SQCK
SQSO
XTSL
414)
SQSY
SENS
SNSCLK
XMRST
EXCK
GRSCOR
SBSO
WFCK
C2PO
LMT
FSHOCK
24
IC201
22
CD DSP
26
AUDIO DAC
100
86
42
41
40
39
58
57
44
54
78
79
60
56
90
55
53
37
( ) : Page No. shown in ( ) indicates the page to refer on the schematic diagram.
TE,FE
SLMOVE
(SEE PAGE
(IC207)
(IC013)
(SEE PAGE
(IC014)
(IC207)
(SEE PAGE
SL FG
SP FG
RFAC
SDCK
SWDT
XDFCT2
(4-49)
3-23)
3-23)
3-23)
(IC207)
(SEE PAGE
3-23)
(IC207)
(SEE PAGE
3-23)
(SEE PAGE
3-23)
SOFF
(SEE PAGE
(SEE PAGE
SAO
SOFF
(IC207)
IC015
(4-48)
(IC207)
(SEE PAGE
3-23)
(IC013)
(IC019)
SW
3-23)
3-24)
Q006
IC011
FAO
TAO
FEIN
TEO
SLVOS
SLMOVE
(4-47)
SWDT
SDCK
XSDLTRF
DFCT2
MDPGA
MDSGA
SPLHLD
FSHOCK
FORCUS
11
SERVO
TRACKING
9
SERVO
73
FE AMP
TEIN
75
TE AMP
71
SLED
39
SERVO
78
7
72
70
SAMO
40
(4-48)
IC014
43
44
42
8
3
SE
SLED
4
POSITION
AMP
5
RECD2
69
XTOK
74
VC
53
VREF+
52
VREF-
51
SEOS
6
68
67
SPINDLE
63
SERVO
SHOCK
SENSOR
16
EC
55
SENS
15
SNSCMP
14
MD BLOCK(2/3)
(SEE PAGE
3-23)
RFAC
12
FAO
94
TAO
93
FEIN
2
TEIN
120
SWDT
81
SDCK
83
XSDLTDSP
82
SAO
92
14
15
87
88
119
118
80
1
3
98
70
71
45
IC204
SW
DFCT
FOK
MPP
RRF
XTOK
SE(IC207,013)
VC
MDPCD
X200
33.868MHz
C33M
FE
TE
DSP3.4V
4.6V
IC010
(SEE PAGE
(IC013)
VC
(IC201)
VREF+
VREF-
(IC019)
(SEE PAGE
(4-47)
AMP
(IC019)
3-24)
(SEE PAGE
3-23,24)
(IC207)
(SEE PAGE
3-23)
3-24)
(SEE PAGE 3-22)
(IC207)
(SEE PAGE
3-23)
FE
(IC404)
(IC013)
(SEE PAGE
POWER5V
4.6V-2
SP FG
SP ON
SP REV
SPBRK
(SEE PAGE
IC001
POWER5V
(4-47)
FCSDRV
2
TRKDRV
15
VCVC
IC009
(4-47)
POWER5V
9
(4-47)
SLFGTKCIN
(4-48)
ACTEN
(IC207)
3-23)
(4-47)
IC003
27
VC
SPINDLE
MOTOR
DRIVE
17
FG
19
S/S
16
RS
Q013
3-24)
BRAKE
VC SW
IC005
IC022
RATORCOMPA
2
1
29
9
14
18
SLED
DRIVE
Q004
LED
DRIVE
FOCUS
DRIVE
TRACKING
DRIVE
U
V
W
VHUIN1,2
VIN1,2
WIN1,2
41
4
6
13
11
12
14
14
IC004
Q003
CN001
FCS+
FCS-
TRK+
TRK-
SD+
SD-
TKC
LED
VCC5
VH+
INV
(4-47)
LMT
CN002
4
2
3
1
3
2
1
4
16
17
18
7
12
13
14
BASE UNIT
(DDX-G2100)
OPTICAL
DEVICE
(2/2)
FOCUS
COIL
TRACKING
COIL
M902
SLED MOTOR
M
SLED
FG
M
SPINDLE
MOTOR
(2/2)
M901
16
3-253-26E
Page 11
SECTION 4
PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
MVC-CD200/CD300
Page 12
MVC-CD200/CD300
4-2. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
SY-67 (LD, PEARL, VIDEO OUT, SH, 16M FLASH MEMORY, 64M SDRAM, CLK GEN., CW, HI CONTROL,
AUDIO PROCESS, CONNECTOR, DC/DC CONVERTER)
PRINTED WIRING BO ARD
— Ref. No. SY-67 Board; 5,000 Series —
For printed wiring board
• Refer to page 4-76 for parts location.
• SY-67 board consists of m ultiple lay ers. How ev er , only
the sides (layers) A and B are shown.
• Chip parts
Transistor Diode
C
BE
5
64
2
13
3
21
There are a few cases that the part printed on
this diagram isn’t mounted in this model.
• Replacement of CSP (Chip Size Package) IC used in
this set require a tool.
CSP IC:IC301, 501, 504
CSP (chip size package)Conventional
SY-67
LD, PEARL, VIDEO OUT, SH, 16M FLASH MEMORY,
64M SDRAM, CLK GEN, CW, HI CONTROL,
AUDIO PROCESS, DC/DC CONVERTER,
FLASH UNIT
TK-61
(LENS CAP DETECT)
CD-334 (CD300)
(LENS DRIVE, CAMERA PROCESS, CCD IMAGER)
LD, PEARL, VIDEO OUT, SH, 16M FLASH MEMORY, 64M SDRAM, CLK GEN, CW, HI CONTROL, AUDIO PROCESS, DC/DC CONVERTER
SY-67
4-20
Page 13
MVC-CD200/CD300
4-21
LD, PEARL, VIDEO OUT, SH, 16M FLASH MEMORY, 64M SDRAM, CLK GEN, CW, HI CONTROL, AUDIO PROCESS, DC/DC CONVERTER
SY-67
Page 14
MVC-CD200/CD300
For Schematic Diagram
• Refer to page 4-19 for printed wiring board.
1
SY-67 BOARD(1/10)
LD(LD BLOCK)
A
-REF.NO.:5000 SERIESXX MARK:NO MOUNT
NO MARK:STILL/PB MODE
S :STILL MODE
P :PB MODE
B
1
TO(2/10)
C
2
TO(4/10)
D
3
TO(10/10)
E
4
TO(2/10)
F
G
H
LENS_TEMP_AD
XCAM_RESET
XEAGLE/XGCAM_CS
2589
PE_EN0
PE_DIR1B
PE_EN1
IRIS_EN
PE_DIR0B
HALL_AD
CCD_TEMP
REG_GND
CAM_P_5V
D_3.4V
CAM_3.1V
CAM_-7.5V
CAM_15V
CAM_5V
CAMTEST0
CAMTEST1
CA_AD00
CA_AD01
CA_AD02
CA_AD03
CA_AD04
CA_HD
SIGNAL PATH
CHROMAY/CHROMA
REC
PB
VIDEO SIGNAL
Y
CAM_SO
XCAM_SCK
TO CD-333/334 BOARD(2/3) CN203
(THROUGH THE FP-364 FLEXIBLE)
• Refer to page 4-45 for note and circuit boards location.
CD-RF PROCESS, SERVO, CD, DSP, CD-R/RW GA, MD SYSTEM CONTROL, EFM/ENC CONTROL
MD-083
4-44
Page 25
For Schematic Diagram
• Refer to page 4-43 for printed wiring board.
OPTICAL
DEVICE
FOCUS
COIL
TRACKING
COIL
2
Measurement at Mark is not possible
physically due to the parts mounted on
Side B.
When disk access fails,supply of power is
stopped due to power save.As the result,
most of the measurement points show"0"(zero).
• MD-083 board consists of multiple layers. However,
only the sides (layers) A and B are shown.
• Chip parts
Transistor Diode
C
BE
3
21
There are a few cases that the part printed on
this diagram isn’t mounted in this model.
MD-083
CD-RF PROCESS, SERVO, CD, DSP,
CD-R/RW GA, MD SYSTEM CONTROL,
EFM/ENC CONTROL
PK-58
(RGB DRIVE, TIMING GENERATOR, BACK LIGHT)
FS-83
(CHARGER)
JK-208
CD-333 (CD200)
(LENS DRIVE, CAMERA PROCESS, CCD IMAGER)
(USB INTERFACE)
4-454-46
CD-RF PROCESS
MD-083 (1/5)
Page 26
MVC-CD200/CD300
For Schematic Diagram
• Refer to page 4-43 for printed wiring board.
CN002
2
18P
18W
17V
16U
15GND
14LMT
13VH+
12UIN2
11UIN!
10VIN2
9VIN1
8WIN1
7WIN2
6VH-
5VCC
4LED
3SD+
2SD-
1TKC
C001
XX
B
1608
C011
R182
C002
XX
CL001
1608
15
16
IN2
VREF
BH6520AFV-E2
FOCUS/TRACKING DRIVESLED DRIVE
CH13CN14OUT1F5VCC16OUT1R7PGND18PREGND
IC001
1CT2
C004
220p
CH
1
MD-083 BOARD(2/5)
SERVO(DRIVE BLOCK)
-REF.NO.:3000 SERIES-
A
XX MARK:NO MOUNT
NO MARK:STILL/PB MODE
Measurement at Mark is not possible
physically due to the parts mounted on
Side B.
When disk access fails,supply of power is
stopped due to power save.As the result,
Measurement at Mark is not possible
physically due to the parts mounted on
Side B.
When disk access fails,supply of power is
stopped due to power save.As the result,
Measurement at Mark is not possible
physically due to the parts mounted on
Side B.
When disk access fails,supply of power is
stopped due to power save.As the result,
most of the measurement points show"0"(zero).
Measurement at Mark is not possible
physically due to the parts mounted on
Side B.
When disk access fails,supply of power is
stopped due to power save.As the result,
IC4088-759-579-83 IC K4F160811D-BC50T
IC4088-759-683-32 IC K4F160811D-BC60T
IC4108-759-058-60 IC TC7SU04FU(TE85R)
IC4138-759-058-60 IC TC7SU04FU(TE85R)
IC4148-759-570-49 IC CL-CR3465-48SC-C
IC4188-759-196-97 IC TC7SH32FU-TE85R
IC4198-759-196-97 IC TC7SH32FU-TE85R
IC4228-759-196-97 IC TC7SH32FU-TE85R
IC4238-759-196-96 IC TC7SH08FU-TE85R
IC4258-759-485-77 IC BA9743AFV-E2
< COIL >
< FERRITE BEAD >
FB0011-216-864-11 METAL CHIP05%1/16W
(Note)
FB0021-414-921-11 FERRITE0uH
FB0041-216-864-11 METAL CHIP05%1/16W
IC0018-759-571-65 IC BH6520AFV-E2
IC0028-759-485-79 IC TC7SET08FU(TE85R)
IC0038-759-571-69 IC LB11998V-TLM
IC0048-759-481-08 IC TC7SET02FU(TE85R)
IC0058-759-571-64 IC BH6521FV-E2
IC0068-759-485-79 IC TC7SET08FU(TE85R)
IC0078-759-075-66 IC TA75S01F(TE85R)
IC0098-759-234-77 IC BU4S66-TR
IC0108-759-075-66 IC TA75S01F(TE85R)
IC0118-759-234-77 IC BU4S66-TR
IC0128-759-448-71 IC BU4053BCFV-E2
IC0138-759-677-23 IC AK8564A
IC0138-759-677-23 IC AK8564A-H
IC0148-759-685-64 IC CXA8094AR
IC0158-759-234-77 IC BU4S66-TR
IC0198-759-064-36 IC MB88346BPFV-EF
IC0228-759-075-70 IC TA75S393F-TE85R
IC2008-759-058-43 IC NJM3404AV(TE2)
IC2018-752-392-44 IC CXD3021R
IC2048-759-234-77 IC BU4S66-TR
IC2078-752-403-97 IC CXD1457R
IC2088-759-066-55 IC TA75W393FU-TE12R
IC2098-759-570-08 IC TC7SET32FU(TE85R)
IC4008-759-083-94 IC TC7W74FU(TE12R)
IC4018-759-561-40 IC TC55V1001AFTI-10L(YEL)
IC4028-759-594-71 IC TC7SH14FU-TE85R
IC4038-759-196-97 IC TC7SH32FU-TE85R
IC4048-759-835-15 IC HD64F2314VTE25
IC4068-759-566-20 IC AK6440BH-E2
IC4078-759-392-77 IC TC74LCX245FT(EL)
Note : Resistors are mounted to the location where FB001, FB004
IC1598-759-524-21 IC TC74VHC174FT(EL)
IC1608-759-196-96 IC TC7SH08FU-TE85R
IC2018-759-688-19 IC NJM2274R(TE2)
IC2518-759-647-71 IC AK4550VT-E2
IC2528-759-655-17 IC AN2905FHQ-EB
IC3018-759-832-22 IC MB87J4030LGA-G-TJ-ER
IC3026-700-079-01 IC HY57V641620HGT-PTRPV (CD200)
IC3028-759-835-16 IC K4S561632B-TC1HT00 (CD300)
IC4018-759-642-45 IC TL1596CPWR
IC4026-800-401-01 IC MB89098RPFV-G-176-BN
IC4036-700-276-01 IC NJU7285DV(TE2)
IC5018-759-669-63 IC HD6417197BT77
IC503Note2IC MBM29LV160BE90TN-S119-ER
IC5048-759-829-96 IC MB81F641642J-15PB-ER
IC5058-759-640-87 IC BR9016RFV-E2
IC0018-759-491-22 IC MB3825APFV-G-BND-ER
IC0026-700-080-01 IC XC62EP3102MR
IC1018-759-831-77 IC BH2221FV-E2
IC1028-759-524-21 IC TC74VHC174FT(EL) (CD300)
IC1038-752-377-38 IC CXD2430N-T4 (CD300)
IC1048-759-256-29 IC TC7S86FU(TE85R) (CD300)
IC1058-759-256-29 IC TC7S86FU(TE85R) (CD300)
IC1518-759-531-92 IC TC7WH04FU(TE12R)
IC1528-759-196-97 IC TC7SH32FU-TE85R
IC1538-759-196-97 IC TC7SH32FU-TE85R
IC1548-759-392-77 IC TC74LCX245FT(EL)
IC1558-759-392-77 IC TC74LCX245FT(EL)
IC1568-759-196-96 IC TC7SH08FU-TE85R
IC1578-759-566-06 IC TC7WH08FU(TE12R)
IC1588-759-524-04 IC TC74VHC125FT(EL)
Note1: Metal chip is mounted to the location where FB701 is
R0131-218-971-11 RES-CHIP33K5%1/16W
R0141-218-970-11 METAL CHIP27K0.5%1/16W
R0151-208-699-11 METAL CHIP4.7K0.5%1/16W
R0161-208-711-11 METAL CHIP15K0.5%1/16W
R0171-208-927-11 METAL CHIP47K0.5%1/16W
R0181-208-695-11 METAL CHIP3.3K0.5%1/16W
R0191-218-990-11 SHORT0
R0201-218-960-11 RES-CHIP3.9K5%1/16W
(CD300)
R0211-208-921-81 METAL CHIP27K0.5%1/16W
(CD300)
R0211-218-990-11 SHORT0 (CD200)
R0221-208-927-11 METAL CHIP47K0.5%1/16W
(CD300)
R0231-208-915-81 METAL CHIP15K0.5%1/16W
(CD300)
R0241-218-970-11 METAL CHIP27K0.5%1/16W
R0251-218-969-11 RES-CHIP22K5%1/16W
R0261-208-721-11 METAL CHIP39K0.5%1/16W
R0271-208-707-11 METAL CHIP10K0.5%1/16W
R0281-208-927-11 METAL CHIP47K0.5%1/16W
R0291-218-949-11 RES-CHIP4705%`1/16W
R0301-208-719-11 METAL CHIP33K0.5%1/16W
R0311-208-695-11 METAL CHIP3.3K0.5%1/16W
R0011-208-719-11 METAL CHIP33K0.5%1/16W
R0031-208-920-81 METAL CHIP24K0.5%1/16W
R0041-218-971-11 RES-CHIP33K5%1/16W
R0051-218-979-11 RES-CHIP150K5%1/16W
R0071-208-719-11 METAL CHIP33K0.5%1/16W
R0671-208-689-11 METAL CHIP1.8K0.5%1/16W
R0681-218-978-11 METAL CHIP120K0.5%1/16W
R0691-218-965-11 RES-CHIP10K5%1/16W
R0701-218-961-11 RES-CHIP4.7K5%1/16W
R0711-208-713-11 METAL CHIP18K0.5%1/16W
R3141-218-958-11 METAL CHIP2.7K0.5%1/16W
R3151-218-973-11 RES-CHIP47K5%1/16W
R3161-218-939-11 METAL CHIP680.5%1/16W
R3171-208-661-11 METAL CHIP1200.5%1/16W
R3181-208-663-11 METAL CHIP1500.5%1/16W
R0721-208-715-11 METAL CHIP22K0.5%1/16W
R0731-208-931-11 METAL CHIP68K0.5%1/16W
R0741-218-965-11 RES-CHIP10K5%1/16W
R0751-500-329-21 FERRITE0uH(Note)
R0761-218-990-11 SHORT0
R3291-218-947-11 RES-CHIP3305%1/16W
R3301-218-952-11 RES-CHIP8205%1/16W
R3311-218-947-11 RES-CHIP3305%1/16W
R3321-208-699-11 METAL CHIP4.7K0.5%1/16W
R3331-218-849-11 METAL CHIP1.2K0.5%1/16W
R3341-208-885-11 METAL CHIP8200.5%1/16W
R3351-218-941-11 METAL CHIP1000.5%1/16W
R3361-218-941-11 METAL CHIP1000.5%1/16W
R3371-218-990-11 SHORT0 (CD300)
R3381-208-663-11 METAL CHIP1500.5%1/16W
R3091-218-990-11 SHORT0
R3101-218-990-11 SHORT0
R3111-218-990-11 SHORT0 (CD300)
R3121-218-945-11 METAL CHIP2200.5%1/16W
R3131-208-663-11 METAL CHIP1500.5%1/16W
Note : Ferrites are mounted to the location where R075, R077
are printed.
R4311-208-943-11 METAL CHIP220K0.5%1/16W
R4321-208-943-11 METAL CHIP220K0.5%1/16W
R4341-218-985-11 METAL CHIP470K0.5%1/16W
R4351-218-985-11 METAL CHIP470K0.5%1/16W
R4361-218-983-11 RES-CHIP330K5%1/16W
2. DDX-G2100 Error Analysis and Repair Work Flow
2-1.Save the Error Status
2-2.Analyze and Repair the Errors due to Mechanical Causes
2-3.Analyze and Repair the Errors due to Electrical Causes
3. Attaching the MD to the BU adjustment jig
4. Connecting the equipment
4-1.Optical Power Meter
4-2.Jitter Meter
5. Installing the “Dencho for DDX-G2100”
5-1.Installing the “Dencho for DDX-G2100”
5-2.Installing the USB Driver
6. Adjustment
6-1.Starting Up “Dencho for DDX-G2100”
6-2.Saving the Error Status and Initializing the EEPROM
6-3.Laser Power Adjustment
6-4.SKEW Adjustment
6-5.Read (CD) Adjustment
6-6.Write (CDR) Adjustment
6-7.Write (CDRW) Adjustment
6-8.Home Position Setting
7. Purpose of Adjustments of “Dencho for DDX-G2100” and
Troubleshooting
8. The Areas that Tend to Break Down When Dropped to
Ground.
— 2 —
Page 48
1.List of Service Tools
ADJUSTMENT
Ref. No.
J-1
J-2
J-3
J-4
J-5
J-6
J-7
J-8
J-9
J-10
J-11
J-12
J-13
J-14
J-15
J-16
J-17
Name
BU adjustment jig
Personal computer with Windows98/Me installed
Dencho for DDX-G2100 (CD-ROM)
USB driver (SPVD-006) (CD-ROM)
USB cable
Optical power meter (ADVANTEST TQ8210)
Optical sensor (ADVANTEST TQ82107)
Jitter meter (KIKUSUI KJM6235A)
Alignment disk (CD-ROM) (SCD-2700)
8cm CD-R (MCR-156A)
8cm CD-RW (MCRW-156A)
Phillips screw driver (No. 0)
Extension cable (50P, 0.5mm)
Extension cable (18P, 0.5mm)
AC power adaptor (AC-L10)
Power cord
BNC cable (RG58)
Parts Code
J-6082-533-A
J-6082-517-A
3-069-219-01
1-757-293-11
J-6082-512-A
J-6082-487-A
J-6082-374-A
1-475-599-11
1-790-107-22
Usage
Included in 32 pin extension cable for extension between
the mechanism deck and MD-083 board (CN001)
Supplied with BU adjustment jig (J-6082-533-A)
Laser power adjustment
Laser power adjustment
SKEW adjustment, Jitter check
SKEW adjustment, Read (CD) adjustment
Write (CD-R) adjustment
Write (CD-RW) adjustment
SKEW adjustment
For extension between the SY-67 board (CN701) and
MD-083 board (CN404)
Supplied with BU adjustment jig (J-6082-533-A)
For extension between the mechanism deck and MD-083
board (CN002)
For BU adjustment jig
For AC power adaptor
For Jitter meter
J-1J-2
J-6
J-7J-8
J-11J-12
J-16
J-17
J-3
J-13
J-4J-5
J-9J-10
J-14J-15
Fig. 1-1.
— 3 —
Page 49
2.Error Analysis and Repair Work Flow
2-1.Save the Error Status
1. Execute [Error Log File].
Check and save the error logs by executing [Error Log File].
Then analyze the error contents more in detail referring to the
error code table.
2. Execute [EEPROM Menu].
Check and save the error logs by executing [EEPR OM Menu].
Then analyze the error contents more in detail referring to the
error code table.
2-2.Analyze and Repair the Errors due to
Mechanical Causes
1. Check the outside appearance for defects.
Inspect the outside appearance of the mechanism. Replace the
defective parts when necessary.
2. Check operations of the machine for any defective
operation.
• Execute [Skew Adjust].
Play the CD back and check that the CD can be played back
correctly and no abnormal sound is generated, by executing
[Skew Adjust]. (Do not perform any adjustment in this step.
Adjustments are performed in the later steps in the work flow .)
Replace the defective parts when necessary.
• Execute [Seek Check] of [Write (CDR) Adjust].
Seek the CD-R and check that the seek operation can be
execute correctly and no abnormal sound is generated, by
executing [Seek Check] of [Write (CDR) Adjust]. Replace
the defective parts when necessary.
2-3.Analyze and Repair the Errors due to
Electrical Causes
1. Perform the electrical adjustments to locate and
analyze the cause of error.
• Perform all the electrical adjustments to reduce and to check
the trouble symptom. (However, never perform [EEPROM
initialize]. Perform [SKEW adjust] to check operation only
and do not perform the skew adjustment.)
If any item of the electrical adjustments cannot produce the
specified adjustment value, we can locate the cause of defect
if error is caused by the OP (optical device) or by any parts
other than the OP.
2. Adjustments after the OP (Optical device) is replaced
1.Execute [EEPROM initialize].
When [EEPROM initialize] is executed, all data is initialized.
2.Execute [Laser Power Adjust].
3.Execute [Skew Adjust].
When [Skew Adjust] is executed, the skew is adjusted.
4.Execute [Read (CD) Adjust].
When the [RF Jitter Check] results in error during [SKEW
Adjust], the [SKEW Adjust] is incorrect, Execute [SKEW
Adjust] again. (See Note.)
5.Execute [Write (CDR) Adjust].
When the [Self RF Jitter Check] results in error during [Write
(CDR) Adjust], the [SKEW Adjust] is incorrect, Execute
[SKEW Adjust] again. (See Note.)
6.Execute [Write (CDRW) Adjust].
When the [Self RF Jitter Check] results in error during [Write
(CDRW) Adjust], the [SKEW Adjust] is incorrect, Execute
[SKEW Adjust] again. (See Note.)
Note: If [RF Jitter Check] and/or [Self RF Jitter Check] results in error
even after the [SKEW Adjust] is e xecuted again, return the original
OP (optical device) back into the machine and replace the MD-083
board and see the result of the MD-083 board replacement.
— 4 —
Page 50
3.Attaching the MD to the BU
r
e
adjustment jig
Note: Remove the power supply from the BU adjustment jig.
1) Before attaching the MD (Mechanism deck of the DDX-G2100)
to the BU adjustment jig, perform the following work on the
MD as the preparation.
1 Remove the screw fixing the MD-083 board. (Fig.3-1)
2 Remove the flexible board (CN002 on the MD-083 board) of the
spindle motor.
3 Open the MD-083 board.
4 Remove the flexible board (CN001 on the MD-083 board) of the
OP (Optical device).
1 Screw
5 Connect CN002 on the MD-083 board and the flexible board of
the spindle motor using the 18 pin extension cable (Note).
(Fig.3-2)
Note: Supplied with the BU adjustment jig. (Or J-6082-374-A)
6 Connect CN001 on the MD-083 board and the 32 pin flexible board
of the OP using the extension cable (Note).
Note: Supplied with the BU adjustment jig.
MD-083 board
6 32 pin
extension cable
CN001
MD-083
CN002
5 18 pin
extension cabl
3 MD-083 board
Ferrite core
4 Flexible board
of the OP
CN001
MD-083
Fig.3-1
CN002
2 Flexible board
of the spindle moto
Flexible board
of the OP
Flexible board
of the spindle motor
Fig.3-2
2) Turn the BU adjustment jig upside down.
3) Install the BU assy in the BU adjustment jig, and fix it. At
same time, put the GND wire in the part of the damper, and fix
it. (Fig.3-3)
BU assy
GND wire
Damper
Fig.3-3
— 5 —
Page 51
4) Fix the MD-083 board in the BU adjustment jig. (Fig.3-4)
MD-083 board
CN001
Fig.3-4
5) Connect CN404 on the MD-083 board of the MD with the
flexible board of the BU adjustment jig. (Fig.3-5)
6) Level the BU adjustment jig.
MD-083 board
CN404
Fig.3-5
— 6 —
Page 52
4.Connecting the equipment
Connect the following measurement equipment to the BU adjustment jig.
AC power adaptor (AC-L10, AC-VQ800 etc.)
Personal computer
Optical power meter (ADVANTEST TQ8210)
Optical sensor (ADVANTEST TQ82107)
Jitter meter (KIKUSUI KJM6235A)
BU adjustment jig
(J-6082-533-A)
RF
Jitter meter
Personal computer
Optical power meter
Optical sensor
USB
DC IN
AC-L10,
AC-VQ800 etc.
AC power adaptor
USB
AC IN
Fig. 4-1
— 7 —
Page 53
4-1.Optical Power Meter
The optical power meter (AD VANTEST TQ8210) is used with the
optical sensor (ADVANTEST TQ82107) attached to it. Attach the
optical power meter to the BU adjustment jig after calibrating the
optical power meter.
Install the “Dencho for DDX-G2100” in a personal computer as
follows.
1) Start up Windows98/Me.
2) Insert the CD-ROM of “Dencho for DDX-G2100” in the CD-
ROM drive.
3) Select CD-ROM drive from “My Computer” of Windows98/
Me, and start up the SETUP file of the “Dencho” folder.
4) Install the “Dencho for DDX-G2100” in accordance with the
instruction on the display.
5) Copy the E2P_pre(.txt) file (Initial data file of EEPROM) to
any desired folder (“My Document” folder for example) of the
PC. (This file is used in the EEPROM Initialize”.)
5-2.Installing the USB driver
Install the USB driver in the PC, that is required for operation of the
“Dencho for DDX-G2100”, as follows.
Note: Be sure to complete installation of the USB driver before connecting
the USB cable. If you connect the USB cable first, you will be unable
to install the USB driver properly.
Installing the USB driver
1) Turn on the PC and allow Windows to load.
Do not connect the USB cable in this step.
2) Insert the CD-ROM of “Dencho for DDX-G2100” in the CD-
ROM drive.
Note: It doesn’t care even if the USB driver CD-R OM (SPVD-006) is
used instead of the disc.
3) Select CD-ROM drive from “My Computer” of Windows98/
Me, and start up the SETUP file of the “SONY USB” folder.
4) Install the USB driver in accordance with the instruction on
the display.
The PC may restart.
5) Connect the BU adjustment jig with the PC using a USB cable.
Note: See “Reinstalling the USB driver” for corrective measures if
the USB cable was connected before installing the driver and
the driver software could not be installed correctly.
6) Connect the BU adjustment jig with the AC po wer adaptor and
turn on the BU adjustment jig.
The PC recognizes the BU adjustment jig, and the Windows
Add Hardware W izard starts.
7) Follow the on-screen messages to have the Add Hardware
Wizard recognize the hardware.
The Add Hardware Wizard starts twice because two different
USB drivers are to be installed. Be sure to allow the installation
to complete without interrupting it.
Reinstalling the USB driver
Perform all steps without skipping.
1) Turn on the PC and allow Windows to load.
2) Connect the BU adjustment jig with the PC using a USB cable.
3) Turn on the main power of the BU adjustment jig.
4) Open [Control Panel] from [My Computer], then double-click
[System].
5) “System properties” is displayed. Click the [Device Manager]
tab located at the top.
6) Click [Sony DSC] in [Other devices], then click the [Delete(E)]
button located at the lower-right corner.
7) After the message appears to verify that you delete the device,
click “OK.”
8) Turn off the main power of the BU adjustment jig, disconnect
the USB cable, and restart the PC.
9) Perform “Installing the USB driver”.
Precautions when using the “Dencho for DDX-G2100” file
• Before replacing the MD, be sue to turn off the main power of
the BU adjustment jig. If the MD is replaced while the main power
is kept ON, the troubles such as communication disabled occurs
or the laser diode is damaged.
• If the main power of the BU adjustment jig is turned OFF then
back ON in the middle of the adjustment, click the [Renewal]
button on the Adjustment Menu (Engineer mode) display. The
communication between the BU adjustment jig and the personal
computer is normal when the message “SONY DSC DDXG2100” appears in the Device Select Column.
• In the adjustments other than the Laser Power Adjustment,
perform adjustment while the BU adjustment jig is position in
the upright position. (i.e. the USB terminal is located on its top.)
• The maximum number of times that the CD-R can be used in the
“Write (CDR) Adjustment” item is about 10 times only.
• The maximum number of times that the CD-RW can be used in
the “Write (CDRW) Adjustment” item is 50 times only.
• If the Direct CD program is running, finish the program.
— 9 —
Page 55
6.Adjustment
6-1.Starting Up “Dencho for DDX-G2100”
Install the “Dencho for DDX-G2100” in a personal computer as
follows.
1) Start up “Dencho for DDX-G2100”.
2) Click the [Engineer] button on the Select the Mode screen.
(Fig.6-1-1.)
3) Confirm that the Adjustment Menu (Engineer) screen appears.
(Fig.6-1-2.)
Fig. 6-1-1
Note: The [Operator] mode is dedicated to the simplified automatic
adjustment procedure only.
Adjustment of the respective items cannot be performed by the
[Operator] mode.
— 10 —
Page 56
Description of the Adjustment Menu (Engineer) Screen
[EEPROM preset] button
When this button is pressed, data of the addresses that are
required for the electrical adjustment only are initialized.
[Error Log File] button
When this button is pressed, the error code .is read from the
MD (Mechanism deck: DDX-G2100) and the log file is created.
[EEPROM Initialize] button
When this button is pressed, data of all the addresses are
initialized.
[EEPROM Menu] button
When this button is pressed, the EEPROM data that is read
from the MD can be saved in the PC or the data from the PC
can be written into the MD.
[Home position] button
The service carton of the MD (DDX-G2100) is designed so
that the OP (optical device) is housed in the specified position
(home position) of the carton. When this button is clicked, the
OP moves to the home position.
Note: When the OP moves to its home position, be sure to open the
disc cover and turn off the main power of the BU adjustment
jig. (If the main power is turned off while the disc cover is kept
close, the OP moves out of the home position.)
[EEPROM Write] option
This option enables selection whether the adjustment data is
saved in the EEPR OM or not. Be sure to select the [On] position
because some adjustment items become the adjustment error
if [Off] position is selected.
[Renewal] button
Press this button in order to recover the communication between
the MD and the BU adjustment jig when the communication
between the MD and the BU adjustment jig is disconnected
once by turning OFF the main power due to replacement of
MD or other reasons and then the main power is turned back
ON.
[Device Select] window
Select “SONY DSC DDX-G2100”.
[Comment] window
Progress of the adjustment is shown in details. It can be check
by scrolling the display.
Fig. 6-1-2
— 11 —
Page 57
6-2.Saving the Error Status and Initializing the
EEPROM
6-2-1.Saving the Error Log File
1) Click the [Error Log File] button on the Adjustment Menu
(Engineer) screen.
2) Confirm that the Error Log screen appear. (Fig. 6-2-1)
3) Type the serial number of MD. (12 digits)
Note: When the serial number is less than 12 digits, type “0” in the
uppermost digital until the total digits become 12 digits.
4) Type the serial number of DDX-G2100 machine
Note: When the serial number is less than 6 digits, the numeral “0” is
type automatically in the upper digits.
5) Click the [Write to File] button.
6) The Error Log File Selection screen appears automatically. type
the filename (See Note) and save it.
Default name: LXXXXXX.TXT
Serial number of the DDX-G2100
Fig. 6-2-1
Fig. 6-2-2
— 12 —
Page 58
6-2-2.Saving the EEPROM Data
1) Click the [EEPROM menu] button on the Adjustment Menu
(Engineer) screen.
2) Confirm that the EEPROM screen appears. (Fig. 6-2-3)
3) Confirm that the EEPROM data is displayed on the MAP
window.
4) Click the [Write File] button.
5) Type the filename and save it.
6) Click the [Close] button to return to the main menu.
Description of the EEPROM Screen
[Select MAP] selector
Either the data that is read from the EEPROM or the data that
is read from the data file can be selected to show the data on
the [MAP] window.
[Address] window
When the address number is clicked, data of the address appears
in the [Data] window.
[Write] button
When the data that is displayed on the [Data] window is selected
using [+], [–] buttons, and when [Write] button is clicked, the
data on the display is written in the EEPROM.
[Read EEPROM] button
When this button is clicked, data is read from the EEPROM
and is displayed in the [MAP] window.
[Write EEPROM] button
When this button is clicked, the data that is read from the file is
written in the EEPROM.
[Read FILE] button
When this button is clicked, the desired data file can be selected
from PC and can be displayed in the [MAP] window.
[Write FILE] button
When this button is clicked, the desired filename can be attached
to the EEPROM data and can be saved in the PC.
Fig. 6-2-3
— 13 —
Page 59
6-2-3.Initializing the EEPROM
The EEPROM data must be initialized before starting the adjustment.
Firstly , create a folder (“My Document” folder for e xample) in the
PC and copy the EEPROM initial data f ile (E2P_pre(.txt)) from the
“Dencho for DDX-G2100” CD-ROM into the ne wly created folder.
1) Click the [EEPROM Initialize] button on the Adjustment Menu
(Engineer) screen.
2) When the EEPROM initial File selection screen appears, Select
the E2P_pre(.txt) file that is copied from the “Dencho for DDXG2100” CD-ROM.
3) Initialize the EEPROM in accordance with the instructions
shown on the screen.
6-3.Laser Power Adjustment
1) Level the BU adjustment jig.
2) Confirm that the disc is not inserted in the machine.
3) Click the [START] button of the [Laser Power Adjust] on the
Adjustment Menu screen of the “Dencho for DDX-G2100”.
[Cover Switch Check]
4) Confirm that the Cover Switch screen appears. (Fig. 6-3-1)
5) Confirm that the message “Please open cover” is displayed.
6) Open the disc cover.
7) Click the [Next] button.
Fig.6-3-1
8) Confirm that the message “Confirming cover open SW ......OK”
appears first then “Please close cover” appears. (Fig. 6-3-2)
9) Close the disk cover.
10) Click the [Next] button.
11) Confirm that the message “Confirming cover open SW ......OK”
appears.
— 14 —
Fig.6-3-2
Page 60
[Read Power Adjustment]
12) Confirm that the Read Power Adjust screen appear s. (Fig.6-3-
3)
13) Calibrate the optical power meter. Then, attach the optical
sensor to the BU adjustment jig.
(Refer to section “4-1. Optical Power Meter of “4. Connecting
the equipment.)
14) Click the [START] button..
[Write Power Adjustment]
18) Confirm that the Write Power Adjust screen is displayed. (Fig.63-5)
19) Click the [START] button..
20) Confirm the maximum write power specification value that is
displayed on the screen. (Fig.6-3-6)
Specification: 11.00 ± 0.25 mW
Fig.6-3-3
15) Check the read power specification value that is displayed on
screen. (Fig.6-3-4)
Specification: 1.00 ± 0.05 mW
16) Click the [+], [–] buttons until the read power becomes the
specification value.
17) Click the [INPUT] button.
Fig.6-3-5
21) Click the [+], [–] buttons until the write power becomes the
specification value.
22) Take reading of the optical pow er meter indication value and
type it in the Laser Power Value column.
Example: 10.933
23) Click the [INPUT] button.
Fig.6-3-4
Fig.6-3-6
— 15 —
Page 61
[Mid Power Measurement]
24) Confirm that the Write Power Differential Efficiency
Measurement screen is displayed.(Fig.6-3-7)
25) Take reading of the optical power meter indication value and
type it in the Laser Power Value column.
Example:5.460
26) Click the [INPUT] button.
Fig.6-3-7
[100h Power Measurement]
27) Confirm that the Write Power Differential Efficiency
Measurement
(100h Power Measurement screen is displayed. (Fig.6-3-8)
28) Take reading of the optical power meter indication value and
type it in the Laser Power Value column.
Example: 2.899
29) Click the [INPUT] button to terminate the Laser Power
Adjustment.
Fig.6-3-8
30) Turn off the power of the B U adjustment jig and turn on again.
31) Click the “Renewal” button on the Adjustment Menu screen.
— 16 —
Page 62
6-4.SKEW Adjustment
1) Stand the BU adjustment jig in the upright position.
2) Connect the jitter meter to the BU adjustment jig.
(Refer to section “4-2. Jitter Meter of “4. Equipment
Connection.)
3) Insert the test CD (SCD-2700).
4) Click the [SKEW Adjust] button on the Adjustment Menu
screen of the “Dencho for DDX-G2100”.
5) Confirm that the SKEW Adjust screen is displayed.
(Fig. 6-4-1)
Fig. 6-4-1
— 17 —
Page 63
6) Perform the tangential adjustment as follows.
1. Rotate the tangential adjustment screw (Fig.6-4-2) slowly
clockwise and stop rotating at the point where jitter is
decreased to the minimum and then starts increasing. (Fig.64-3)
2. Rotate the tangential adjustment screw counter-clockwise
by 180 degrees.
3. Rotate the tangential adjustment screw slowly clockwise and
stop rotating at the point where jitter is minimum.
Note: Be sure to end the adjustment with the clockwise rotation of
the tangential adjustment screw.
If the adjustment screws are rotated clockwise excessively
in steps 1, rotate the screw counter-clockwise by 180 degrees
approximately and perform the adjustment again.
7) Perform the radial adjustment as follows.
1. Rotate the radial adjustment screw (Fig.6-4-2) slowly
clockwise and stop rotating at the point where jitter is
decreased to the minimum and then starts increasing. (Fig.64-3)
2. Rotate the radial adjustment screw counter-clockwise by 180
degrees.
3. Rotate the radial adjustment screw slowly clockwise and
stop rotating at the point where jitter is minimum.
Note: Be sure to end the adjustment with the clockwise rotation of
the radial adjustment screw.
If the adjustment screws are rotated clockwise excessively
in steps 1, rotate the screw counter-clockwise by 180 degrees
approximately and perform the adjustment again.
8) Perform the tangential adjustment again.
The tangential adjustment procedure is the same as step 6).
Note: Be sure to end the adjustment with the tangential adjustment.
9) Rotate the radial adjustment screw clockwise by 45 degrees.
(Guideline of the radial screw adjustment is 45 degrees or more
but must not exceed 90 degrees.)
Note: The skew adjustment of the spindle motor is required when
either the OP device or the spindle motor or the BU chassis is
replaced. The skew adjustment of the spindle motor is performed
until the jitter becomes minimum when the adjustment CD is
played back. However, the optimum adjustment value of the
“During FMDT Jitter” is obtained in a different skew angle. In
the production line, skew of the spindle motor is adjusted until
both the CD jitter and the During FMDT Jitter shows the
optimum values at the same time. After that, the radial
adjustment screw shown below is further screwed-in by 45
degrees.
Tangential adjustment
screw
Radial adjustment
screw
Fig. 6-4-2
Jitter
2
1
3
— 18 —
Amount of screw rotation
(clockwise)
Fig. 6-4-3
Page 64
6-5.Read (CD) Adjustment
1) Stand the BU adjustment jig in the upright position.
2) Connect a jitter meter to the BU adjustment jig.
(Refer to section “4-2. Jitter Meter of “4. Equipment
Connection.)
3) Insert the test CD (SCD-2700).
4) Click the [START] button of the [Read (CD)Adjust] on the
Adjustment Menu screen of the “Dencho for DDX-G2100”.
(Fig.6-5-1)
5) The following adjustments and checks are performed
automatically in order. The asterisk marks “***” appears in
the column in which the adjustment and check is in progress.
When the adjustments and checks are complete, “OK “ is
displayed.
Adjust FE
DPP Balance
TE Gain Offset
Focus gain Tracking Gain
Focus Bias RF
MPP Out Adjust
RF Gain
RF Jitter Check (Note)
Note: During the RF Jitter Check mode, check that the jitter is 8ns or
less with the jitter meter and click the [OK] button. (Fig.6-5-1)
6-6.Write (CDR) Adjustment
1) Stand the BU adjustment jig in the upright position.
2) Connect a jitter meter to the BU adjustment jig.
(Refer to section “4-2. Jitter Meter of “4. Equipment
Connection.)
3) Insert the 8 cm CD-R (MCR-156A)
Note: The maximum number of times that the CD-R can be used in
the “Write (CDR) Adjustment” is about 10 times only.
4) Click the [START] button of the [Write (CDR) Adjust] on the
Adjustment Menu screen of the “Dencho for DDX-G2100”.)
5) The following adjustments and checks are performed
automatically in order. The asterisk marks “***” appears in
the column in which the adjustment and check is in progress.
When the adjustments and checks are complete, “OK “ is
displayed.
Jump Adjust
Adjust WFB
ATER Check
Focus Bias ATIP
Read Asymmetry After A TER
Self RF Jitter Check (Note)
Seek Check
Shock Level Adjust
Note: During the Self RF Jitter Check mode, check that the jitter is
8ns or less with the jitter meter and click the [OK] button. (Fig.66-1) Check the jitter value within 4 seconds after this indication
appears.
Fig. 6-5-1
6) Turn off the power of the B U adjustment jig and turn on again.
7) Clich the “Renewal” button on the Adjustment Menu screen.
Fig. 6-6-1
6) Turn off the power of the BU adjustment jig and turn on again.
7) Click the “Renewal” button on the Adjustment Menu screen.
— 19 —
Page 65
6-7.Write (CDRW) Adjustment
1) Stand the BU adjustment jig in the upright position.
2) Connect a jitter meter to the BU adjustment jig.
(Refer to section “4-2. Jitter Meter of “4. Equipment
Connection.)
3) Insert the 8 cm CD-RW (MCRW-156A)
Note: The maximum number of times that the CD-R W can be used in
the “Write (CDRW) Adjustment” is 50 times only.
4) Click the [START] button of the [Write (CDRW) Adjust] on
the Adjustment Menu screen of the “Dencho for DDX-G2100”.)
5) The following adjustments and checks are performed
automatically in order. The asterisk marks “***” appears in
the column in which the adjustment and check is in progress.
When the adjustments and checks are complete, “OK “ is
displayed.
RW FE
Focus Gain Tracking Gain
Erase Focus Gain
ATER Check
Read Asymmetry After A TER
BLER Check
Self RF Jitter Check (Note)
Note: During the Self RF Jitter Check mode, check that the jitter is
8ns or less with the jitter meter and click the [OK] button. (Fig.67-1) Check the jitter value within 4 seconds after this indication
appears.
6-8.Home Position Setting
Purpose:
The service carton of the MD (DDX-G2100) is designed so that the
OP (optical device) is housed in the specified position (home
position) of the carton. Be sure to return the OP to the home position
when the MD is packed in the service carton.
1) Close the disc cover.
2) Click the [Home Position] button of the Adjustment Menu.
3) Confirm that the message “If you finish adjustment, please open
the cover before you turn the power off” appears. (Fig.6-8-1)
4) Open the disc cover.
5) Confirm that the OP (optical device) comes closer to the spindle
side. (Fig.6-8-2)
6) Turn off the main power of the BU adjustment jig while the
disc cover is left open.
Fig. 6-8-1
Fig. 6-7-1
6) Perform the Write Drive ID only when it is necessory.
Fig. 6-8-2
— 20 —
Page 66
7.Purpose of Adjustments of “Dencho
for DDX-G2100” and Troubleshooting
Note 1: Before replacing the MD, be sure to turn off the main power of
Note 2: If the main power of the BU adjustment jig is turned OFF then
BU adjustment jig. If the MD is replaced while the main power is
kept ON, the troubles such as communication disabled (boot mode)
occurs or the laser diode is damaged.
back ON in the middle of the adjustment, click the [Renewal ]
button on the Adjustment Menu (Engineer Mode) display. The
communication between the BU adjustment jig and the personal
computer is normal when the message “SONY DSC DDX-G2100
“ appears in the Device Select window.
Fig. 7-1
— 21 —
Page 67
7-1.Laser Power Adjustment
7-1-1.EEPROM Preset
Purpose:
Prior to starting the adjustment, confirm the communication between
a PC (personal computer) and the MD (mechanism deck: DDXG2100).
Also, the EEPROM is initialized as minimum as possible that is
required for the adjustment. (Note)
Note: This initialization of the EEPROM aims at the adjustment of
troubleshooting. In the ordinary adjustment work, perform the
minimum initialization for the time being. If the adjustment cannot
be performed by all means, execute [EEPROM Initialize] in the
bottom of the Adjustment Menu (Engineer) screen to initialize all
the data of the EEPROM.
Trouble Symptom
• The check disc operation does not start (the seek sound cannot be
heard) even a disc is inserted in the BU adjustment jig and the
main power is turned on.
• USB cannot be recognized. The message “SONY DSC DDXG2100 “ does not appear in the [Device Select] window of the
Adjustment Menu (Engineer) screen.
Cause of Trouble
• Communica tion is disabled. The possibility of the trouble of
the machine itself is scarce. Most troubles are caused by the
human errors during repair work. For example, flexible board
is inserted while the main power of the BU adjustment jig is
still turned ON.
7-1-3.Read Power
Purpose:
Adjust the read power of OP.
Trouble Symptom (1)
The laser power meter measurement value never increases even
though the [+] button is pressed.
Cause of Trouble
The laser emission is always turned off due to defective laser
power cut-off circuit (IC002 on the MD-083 board).
Remedial Measure
Check IC002.
Trouble Symptom (2)
The laser power meter measurement value does not reach the
specified value even though the [+] button is pressed..
Cause of Trouble
The laser output does not increase due to defect or life of the
laser diode within the OP (optical device).
Remedial Measure
Replace the OP (optical device).
Remedial Measure
• Click [EEPROM Menu] button on the Adjustment Menu screen
to read the EEPROM data. If data of the address 7F is “F5FE”
(backup mode), the communication is normal. If it is any value
(for example “F 5FD”) other than “F5FE”, the communication
is defective. Then, turn of f the main power of the BU adjustment
jig and remove the jumper. Restart the equipment and the
normal communication can be set.
7-1-2.Cover Switch Check
Purpose:
Operation check of the disc cover open/close detection circuit.
Trouble Symptom
The message “Confirming cover open SW.....NG” appears on the
[Cover Switch Sensor] screen.
Cause of Trouble
• IC422 on the MD-083 board is defective.
• Input (pin 2) of IC002 on the MD-083 board is short-circuited.
Remedial Measure
Check IC422 and IC002.
— 22 —
Page 68
7-1-4.LD Initial Check
Purpose:
Initialization to enable setting the read/write laser power values.
Trouble Symptom
NG is displayed.
Cause of Trouble
The write laser power control voltage VWDC (pin 6 of IC013
on the MD-083 board) has increased more than the specification
value because the front monitor output (pin ql of CN001 on
the MD-083 board) of the OP (optical device) is too low.
Remedial Measure
Replace the OP (optical device).
7-1-5.Front Monitor Gain
Purpose:
Set the maximum write power. The relationship between the write
laser power control voltage VWDC1 (pin wj of CN001 on the MD083 board) and the actual laser write power is adjusted.
Trouble Symptom
NG is displayed immediately after clicking the [INPUT] button when
the optical power meter measurement value is written in accordance
with the instructions that are displayed on the Write Power Adjust
screen.
Cause of Trouble
• The laser output is insufficient due to deterioration of laser
diode.
• The laser output does not corresponds to the change of the
VWDC1 voltage. The laser diode is defective.
Remedial Measure
Replace the OP (optical device).
7-2.SKEW Adjustment
7-2-1.SKEW Adjustment
Purpose:
Adjust the amount of skew error caused by the OP (optical device)
to minimum.
Trouble Symptom
No symptom is displayed. (The OK message always appears because
OK/NG judgement is not performed.)
7-3.Read (CD) Adjustment
7-3-1.Adjust FE
Purpose:
Perform this adjustment to minimize the variations in focus error
amplitude and the offset caused by the OP (optical device).
Trouble Symptom
NG is displayed.
Cause of Trouble
As the result of adjustment, variation has exceeded the
specification value.
Remedial Measure
Replace the OP (optical device).
7-3-2.DPP Balance
Note: DPP =Differential Push-Pull
Purpose:
Perform this adjustment to minimize the variations in tracking error
caused by OP (optical device).
Trouble Symptom
NG is displayed.
Cause of Trouble
As the result of adjustment, variation has exceeded the
specification value.
Remedial Measure
Replace the OP (optical device).
7-3-3.TE Gain Offset
Note: TE =Tracking error
Purpose:
Perform this adjustment to minimize the variations in the tracking
error amplitude offset caused by the OP (optical device) and IC.
Trouble Symptom
NG is displayed.
Cause of Trouble
As the result of adjustment, variation has exceeded the
specification value.
Remedial Measure
Replace the OP (optical device).
— 23 —
Page 69
7-3-4.Focus Gain, Tracking Gain
Purpose:
Perform this adjustment to minimize the variations in the focus gain
and the tracking gain caused by the OP (optical device).
Trouble Symptom
NG is displayed.
Cause of Trouble
As the result of adjustment, variation has exceeded the
specification value.
Remedial Measure
Replace the OP (optical device).
7-3-5.Focus Bias RF
Purpose:
Perform this adjustment to minimize the variations of the focus fine
gain to the CD caused by the OP (optical device) and IC.
Trouble Symptom
No symptom is displayed. (The OK message always appears because
OK/NG judgment is not performed.)
7-3-6.MPP Out Adjust
Note: MPP = Main Push Pull
Purpose:
Perform this adjustment to minimize the variations of MPP offset
to the CD caused by the OP (optical device) and IC.
Cause of Trouble
As the result of adjustment, variation has exceeded the
specification value.
Remedial Measure
Replace the OP (optical device).
7-3-7.RF Gain
Purpose:
Adjust the gain of OP (optical device) for the CD.
Trouble Symptom
No symptom is displayed. (The OK message always appears because
OK/NG judgment is not performed.)
7-3-8.RF Jitter Check
Purpose:
Check the variation of jitter caused by OP (optical device) when the
CD is played back.
Trouble Symptom
The measured value of the jitter has exceeded the allowable range
of specifications. (Jitter is 8 ns or less.)
Cause of Trouble
• When the trouble occurs after the OP is replaced.
The SKEW adjustment is incomplete.
• When the trouble is found during troubleshooting.
The actuator of the OP is deformed by dropping the machine
or others.
Remedial Measure
Repeat the SKEW adjustment and the subsequent adjustments.
If the trouble is not remedied even the SKEW adjustment is
performed, execute the Self RF Jitter Check of the Write (CDR)
Adjustment. If the adjustment ends with success, the trouble is
remedied.
— 24 —
Page 70
7-4.Write (CDR) Adjustment
7-4-1.Jump Adjust
Purpose:
• Adjust the amount of overrun after jump of the OP (optical device)
is minimum.
• Adjust the kick voltage in accordance with the convergence status
after jump.
Trouble Symptom
NG is displayed.
Cause of Trouble
Convergence after jump has not ended within the specif ied time.
Remedial Measure
Replace the OP. (The OP that is removed in this step can be
used in other machine without trouble by combining with the
other MD-083 board in most case. Therefore, store the removed
OP and re-use it.)
7-4-2.Adjust WFB
Note: WFB =Write Focus Bias
Purpose:
Check variation of the Write F ocus fine adjustment depending upon
the individual OP (optical device).
Trouble Symptom
No symptom is displayed. (The OK message always appears because
OK/NG judgment is not performed.)
7-4-3.ATER Check
Note: ATER =Absolute time in pre-groove error rate
Purpose:
Measures the number of the ATIP (Absolute time in pre-groove)
errors that have occurs during recording.
Trouble Symptom
NG is displayed.
Cause of Trouble
The number of the ATIP errors during recording have exceeded
the specification value.
(Scars and stain of the CD-R disc can cause this error.)
Remedial Measure
• When the CD-R disc has scars or dust, replace the CD-R
disc with the new one and perform readjustment.
• When the CD-R disc is free from scars or dust, replace the
OP (optical device).
7-4-4.Focus Bias ATIP
Purpose:
Perform self-recording and playback. Read the ATIP (Absolute time
in pre-groove) and perform fine adjustment of focus and
measurement.
Trouble Symptom
No symptom is displayed. (The OK message always appears because
OK/NG judgment is not performed.)
7-4-5.Read Asymmetry After ATER
Purpose:
The segment that is recorded in section “7-4-4. Focus Bias ATIP” is
played back so that the non-uniformity of the signal symmetry of
the 3T and 11T signals are measured.
Trouble Symptom
NG is displayed.
Cause of Trouble
• Asymmetry has exceeded the specification value.
• After ATIP error rate has exceeded the specification value.
• BLER (block error rate) has exceeded the specification value.
• The CD-R disc has scars or dust.
Remedial Measure
• When the CD-R disc has scars or dust, replace the CD-R
disc with the new one and perform readjustment starting from
section “7-4-4. Focus Bias ATIP”.
• When the CD-R disc is free from scars or dust, perform
readjustment starting from “7-1. Laser Power Adjustment”
step.
7-4-6.Self RF Jitter Check
Purpose:
Check the variation of jitter caused by OP (optical device) when the
CD-R is self-recorded/-played back.
Trouble Symptom
The measured value of the jitter has exceeded the allowable range
of specifications. (Jitter is 8 ns or less.)
Cause of Trouble
The SKEW adjustment is incomplete and needs readjustment.
Remedial Measure
Repeat the SKEW adjustment and the subsequent adjustments.
If the trouble is not remedied even the SKEW adjustment is
performed, replace the OP.
7-4-7.Seek Check
Purpose:
Check that the seek operation is not abnormally slow.
Trouble Symptom
NG is displayed.
Cause of Trouble
• Load to the sled mechanism is too large.
• Torque of the sled motor is low.
• A foreign substance sticks to the lead screw or the gear part,
so the movement of them is obstructed.
Remedial Measure
• Replace the OP lead stopper.
7-4-8.Shock Level Adjust Check
Purpose:
Modify the initial value for the detection of the shock detection
circuit of the signal system.
Trouble Symptom
NG is displayed.
Cause of Trouble
Comparator or latch circuit is defective so that the detection
information is not sent to the CPU.
Remedial Measure
• Check the circuit starting from IC013 (RF PROCESS IC)
FE output (pin qf) to CPU (IC404 pin of).
IC013 → IC010 → IC014 → IC423 → IC400 → IC404
• Check the circuit starting from IC013 (RF PROCESS IC)
TE output (pin qd) to CPU (IC404 pin of).
IC013 → IC200 → IC208 → IC423 → IC400 → IC404
— 25 —
Page 71
7-5.Write (CDRW) Adjustment
7-5-1.RW FE
Purpose:
Perform this adjustment to minimize the variations in focus error
amplitude and the offset caused by the OP (optical device).
Trouble Symptom
NG is displayed.
Cause of Trouble
As the result of adjustment, variation has exceeded the
specification value.
Remedial Measure
Replace the OP (optical device).
7-5-2.Focus Gain, Tracking Gain
Purpose:
Perform this adjustment to minimize the variations in the focus gain
and the tracking gain caused by the OP (optical device).
Trouble Symptom
NG is displayed.
Cause of Trouble
As the result of adjustment, variation has exceeded the
specification value.
Remedial Measure
Replace the OP (optical device).
7-5-3.Erase Focus Gain
Purpose:
Perform this adjustment to minimize the variations in the erase focus
gain caused by the OP (optical device).
Trouble Symptom
NG is displayed.
Cause of Trouble
As the result of adjustment, variation has exceeded the
specification value.
Remedial Measure
Replace the OP (optical device).
7-5-4.ATER Check
Note: ATER =Absolute time in pre-groove error rate
Purpose:
Measures the number of the ATIP (Absolute time in pre-groove)
errors that have occurs during recording.
Trouble Symptom
NG is displayed.
Cause of Trouble
The number of the ATIP errors during recording have exceeded
the specification value.
(Scars and stain of the CD-RW disc can cause this error.)
Remedial Measure
• When the CD-RW disc has scars or dust, replace the CDRW disc with the new one and perform readjustment.
• When the CD-RW disc is free from scars or dust, replace the
OP (optical device).
7-5-5.Read Asymmetry After ATER
Purpose:
The segment that is recorded in section “7-5-4. ATER Check” is
played back so that the non-uniformity of the signal symmetry of
the 3T and 11T signals are measured.
Trouble Symptom
NG is displayed.
Cause of Trouble
• Asymmetry has exceeded the specification value.
• After ATIP error rate has exceeded the specification value.
• The CD-RW disc has scars or dust.
Remedial Measure
• When the CD-RW disc has scars or dust, replace the CDRW disc with the ne w one and perform readjustment starting
from section “7-5-4. A TER Check”.
7-5-6.BLER Check
Note: BLER =Block error rate
Purpose:
The segment that is recorded in section “7-5-5. Read Asymmetry
After A TER” is played back so that the BLER are measured.
Trouble Symptom
NG is displayed.
Cause of Trouble
The BLER has exceeded the specification value.
Remedial Measure
• When the CD-RW has scars or dust, replace the CD-RW
with the new one and perform readjustment starting from
“7-5-5. Read Asymmetry After ATER”.
• When the CD-RW is free from scars or dust, perform
readjustment starting from “7-1. Laser Power Adjustment”
step.
7-5-7.Self RF Jitter Check
Purpose:
Check the variation of jitter caused by OP (optical device) when the
CD-RW is self-recorded/-played back.
Trouble Symptom
The measured value of the jitter has exceeded the allowable range
of specifications. (Jitter is 8 ns or less.)
Cause of Trouble
The SKEW adjustment is incomplete and needs readjustment.
Remedial Measure
Repeat the SKEW adjustment and the subsequent adjustments.
If the trouble is not remedied even the SKEW adjustment is
performed, replace the OP.
7-5-8.Write Drive ID
Purpose:
Writing down the ID when the MD adjustment is completed.
(“FFFF” is written in the address 50 and “0000 “ is written in the
address 51 of the EEPROM.)
— 26 —
Page 72
8.The Areas That Tend To Break Down
y
Cabinet
BU chassis
When Dropped To Ground
[Symptom]
The typical failure pattern when the machine is dropped to ground
is shown. Refer to the failure pattern when the dropped machine is
brought to service station for repair.
[Typical Failure Pattern]
1.“Settling” of the OP lead stopper
"Settling"
Fig. 8-1.
2.Damper guide is broken.
C
A
B
Fig. 8-4.
Three damper guides are used. The trouble is reported that one or
two damper guides are broken.
When the damper guide A or B or C is broken. → Replace the BU
chassis.
Fig. 8-2.
* When the machine in which the above trouble occurs, is operated,
the tooth of the OP lead stopper gear rides over and goes across
the screw peaks of the lead screw that generates the crunching
sound.
[Repair method]
Replace the OP lead stopper.
Amount of playAmount of pla
OK
Position setting
Fig. 8-3.
When the OP lead stopper is going to be attached, adjust the position
of the OP lead stopper as the figure, and tighten the screw.
— 27 —
Page 73
3.The main shaft retainer of the BU chassis is broken.
When the portion that retains the main guide as shown, is
broken. The main guide becomes loose and shaky that results
in abnormal operation of the OP unit. → Replace the BU
chassis.
Main shaft retainer
Broken here.
Main shaft
Fig. 8-5.
4.Dowel that determines the spindle motor position on the BU
chassis is broken.
When the dowel that determines the spindle motor position on
the BU chassis is broken, the spindle motor can be moved to
the wrong position. → Replace the BU chassis.
* When the BU chassis is replaced, the spindle motor adjustment
is required. When spindle motor is re-adjusted, perform the skew
adjustment at the same time.
Dowel
Fig. 8-6.
— 28 —
Page 74
TROUBLESHOOTING
1.FLOW OF TROUBLE ANALYSIS AND REPAIR
Flow of Trouble Analysis and Repair of DDX-G2100
1. Saving the Trouble Status
2. Analysis and Repair due to
Mechanical Causes
3. Analysis and Repair due to
Electrical Causes
a. Confirm and save the error log using Error Log File.
Analyze the error log contents referring to the separate error code table.
b. Create a backup file of the EEPROM using EEPROM Menu.
It helps to recover the present status without fail.
a. Check if any errors can be noticed when
viewing the outside appearance.
b. Check the operational errors as follows.
Perform operational check by reading
CD using SKEW Adjust
(Check only without adjustment)
Make an attempt of CD-R seek
Using Seek Check
a. Analyze the errors by performing the electrical adjustment.
Perform all the adjustment items of the electrical adjustment.
Do not perform [EEPROM Initialize].
Go through the [SKEW Adjust] for watching the movement of the machine but not
performing any adjustments.
Replace the parts as required.
Check if there is any errors
such as some parts do not
start working, or abnormal
sound is heard, etc..
Replace the parts as required.
Check if the error reappears or not.
Create a summary of default items.
Is the optical unit (OP unit) defective?
b. When the optical unit (OP unit) is replaced:
Initialize all the data using [EEPROM Initialize]. Then start the electrical adjustment.
Because all the discrete parts are known to be good, other adjustments are
expected to be performed without any trouble if the [SKEW Adjust] is performed
correctly. Result of the [SKEW Adjust] is judged by the items [RF Jitter Check] and
[Self RF Jitter Check].
If result is found to be unacceptable, perform the [SKEW Adjust] again. If the error
cannot be solved still, return the optical unit (OP unit) to the machine and make an
attempt replace the electrical printed circuit boards.
— 29 —
Page 75
2.DENCHO FOR DDX-G2100 MENU
[EEPROM preset]
Initializes the areas that are necessary for electrical adjustment only .
[Error Log File]
Acquires the error code and create the log.
[EEPROM Initialize]
Initialization of all contents.
Default setup when shipped from the factory.
[EEPROM Menu]
Saves the contents in a PC or loads data from a PC.
[EEPROM Write]
The radio button determines if result of adjustment is saved in
EEPROM or not. Be sure to select the ON button. If the OFF b utton
is selected, there are some items in the latter adjustment steps that
become impossible to implement the adjustments. (In the case when
the adjustment is performed using result of preceding adjustment.
OK all the time
[Renewal]
When the main power is turned off once and then back on in such a
case as replacing the drive unit, the drive unit can be displayed by
using the Device Select. (It eliminates need to look up the My
Computer of a PC.)
[Comment]
As the progress of adjustment is displayed while the adjustment is
in progress, analyze the trouble status by scrolling the comment
when an error occurs.
OK all
the time
OK when ended
[Home Position]
When adjustment is completed, moves the OP (optical unit) to the
specified position and place it on the service part carton. When
turning off the main power, be sure to open the front lid before
turning off the main power . (If the main power is turned of f with the
front lid closed, position of the OP (optical unit) moves is shifted.)
— 30 —
Page 76
Error Log File
[Drive Serial Number]
Type the BU drive serial number
[Model Serial Number]
Type the Model serial number
[Write to file]
Write down the error logs to the file
[Drive Serial Number]
Serial number of the drive.
(Be sure to type the serial number of 12 digits)
[Model Serial Number]
Input the serial number of the machine.(7 digits)
When any number less than 7 digits is input, 0 is added to the top.
[Write to file]
Input the “drive, model and serial number” are input, click here.
The emergency data is read from EEPROM and the text data as
shown in (A) is created. At the same time, the window to save the
file is opened. Type the filename
(default: L010548.TXT) and save the file.
— 31 —
Page 77
EEPROM Menu
[Select MAP]
Select the display either “Data that is read from EEPROM” or “Data that is read from the file”.
[Read EEPROM]
Reads data from EEPROM.
(to be displayed on the MAP)
[Read File]
Reads data from file.
(to be displayed on the MAP)
A
[Address]
Click the desired address. Data of the selected address is displayed
in the window (A).
Home Position
[Write File]
Saves the data that is read from EEPROM, into the file.
[Write EEPROM]
Saves the data that is read from the file, into the EEPROM.
[Write]
Data is written into EEPROM after changing the data using the
positive (+) and negative (–) button.
— 32 —
Page 78
3.TROUBLESHOOTING THE DDX-G2100
Caution:
Before starting to replace the drive unit, be sure to turn of f the main power . If the driv e unit is replaced with the main power ON, communication
can become difficult (due to boot mode) or the optical laser unit can be damaged. When the main po wer is once turned off and ba ck on again
while the adjustment is in progress, press the [Renewal] button without starting the electrical adjustment software. If the message appears in
the Device Select Run as the [Renewal] button is pressed, it indicates that there are no problems.
CONTENTS
1.Laser Power Adjust
1-1. EEPROM preset → NG
1-2. Cover Switch Check → NG
1-3. Read Power → NG
1-4. LD Initial Check → NG
1-5. Front Monitor Gain → NG
2.SKEW Adjust → NG
3.Read (CD) Adjust
3-1. Adjust FE → NG
3-2. DPP (Differential Push-Pull: One of the Tracking Error Detection Methods) Balance → NG
3-3. TE Gain Offset → NG
3-4. Focus Gain, Tracking Gain → NG
3-5. Focus Bias RF → NG (Judgment is not performed.)
3-6. MPP Out Adjust → NG
3-7. RF Gain → NG (Judgment is not performed.)
3-8. RF Jitter Check → NG
4.Write (CDR) Adjust
4-1. Jump Adjust → NG
4-2. Adjust WFB → NG (Judgment is not performed.)
4-3. ATER (Absolute Time in pre-groove Error Rate) Check → NG
4-4. Focus Bias ATIP (Absolute Time In Pre-groove) → NG (Judgment is not performed.)
4-5. Read Asymmetry After ATER → NG
4-6. Self RF Jitter → NG (Judgment is not performed.)
4-7. Seek Check → NG
4-8. Shock Level Adjust → NG
5.Write (CDRW) Adjust
5-1. RW FE → NG
5-2. Focus Gain, Tracking Gain → NG
5-3. Erase Focus Gain → NG
5-4. ATER (Absolute Time in pre-groove Error Rate) Check → NG
5-5. Read Asymmetry After ATER → NG
5-6. BLER (Block Error Rate) Check → NG
5-7. Self RF Jitter → NG (Judgment is not performed.)
5-8. Write Drive ID → NG (Judgment is not performed.)
— 33 —
Page 79
OUTLINE OF TROUBLESHOOTING THE DDX-G2100 AND REMEDIAL MEASURE IN CASE OF FAILURE
1.Laser Power Adjust
1-1. EEPROM preset t NG
Purpose
Prior to start all the adjustments,
check the communication between USB and ATAPI. At the
same time, the minimum portion
of the EEPROM is initialized to
enable adjustment. See note.
Note: This item aims at the analysis of trouble using the electrical adjustment jig. The normal adjustment can be started with this item by the minimum
initialization of the EEPROM as described above. If the adjustment cannot be performed even though this item is performed, use the “EEPROM
Initialize” button below to completely initialize the EEPROM and restart the adjustment.
1-2. Cover Switch Check t NG
Purpose
Checks operation of the lid open
detection circuit.
Trouble Symptom
The disk check (seek sound) does
not start even though a disc is inserted in the repair jig. USB is not
recognized.
Communication doesn’t go well
because resetting of the microcomputer isn’t sufficient.
Trouble Symptom
Cover Open is detected: NG
Cause
Communication is faulty.
Abnormality of the machine is not
suspected.
Communication becomes faulty
when, for example, a flexible
printed wiring board is inserted
while the main power is turned on.
The microprocessor enter the boot
mode that makes communication
impossible.
Cause
The microprocessor detects the
High signal regardless of the
“open” detection information
from the jig. IC422 is defective or
input of IC002 is shorted.
Repair
Do it again from the start of the
jig and the PC.
Repair
Check IC422 and IC002.
1-3. Read Power t NG
Purpose
Read power adjustment
1-4. LD Initial Check t NG
Purpose
Initialization for setting the read/
write laser power value and confirmation of control voltage.
1-5. Front Monitor Gain t NG
Purpose
Set the maximum write power.
Match the relationship between
the maximum write power setup,
the control voltage and the generated power. Obtain the relation
between the laser power change
against VWDC1 and reject the deteriorated laser unit.
Trouble Symptom
(1) The laser power meter does
not show any value e ven if the
+ key is pressed.
(2) The laser power meter indica-
tor does not increase to the
specified value even if the +
key is pressed.
Trouble Symptom
The NG indication appears.
Trouble Symptom
When command is entered as
specified on the screen, the measurement value is input. The NG
indication appears.
Cause
The laser OFF signal is output all
the time due to defective laser
power cutoff circuit IC002.
Output of the laser power is low
due to life or faulty of the laser
power diode in the OP unit.
Cause
Because output of the front monitor of the OP unit is low , the write
laser power setup voltage WVDC
has increased exceeding the specified value.
Cause
Output of the optical laser is low
due to deterioration of the laser
unit (OP unit). Either the laser
output does not correspond to the
change of the VWDC voltage or
the laser unit (OP unit) is defective.
Repair
Check IC002.
Replace the OP unit.
Repair
Replace the OP unit.
Repair
Replace the OP unit.
— 34 —
Page 80
2.SKEW Adjust
2-1. SKEW Adjust t NG (Judgement is not performed)
Adjust the skew error caused by
OP unit to minimum.
Trouble Symptom
OK is shown all the time. The OK/
NG judgement is not performed.
Cause
3.Read (CD) Adjust
3-1. Adjust FE t NG
Purpose
Adjust the focus error amplitude
and non-uniformity of the offset
of the OP unit
3-2. DPP (Differential Push- Pull: One of the Tracking Error Detection Methods) Balance t NG
Purpose
Adjust non-uniformity of the
tracking error balance of the OP
unit.
3-3. TE Gain Offset t NG
Purpose
Adjust non-uniformity of the
tracking error amplitude and offset
due to the OP unit and IC.
Trouble Symptom
NG indication appears.
Trouble Symptom
NG indication appears.
Trouble Symptom
NG indication appears.
Cause
Result of the adjustment has
exceeded the non-uniformity
specifications of the OP unit.
Cause
Result of the adjustment has exceeded the non-uniformity specifications of the OP unit.
Cause
Result of the adjustment has exceeded the non-uniformity specifications of the OP unit.
Replace the OP unit.
Replace the OP unit.
Replace the OP unit.
RepairPurpose
Repair
Repair
Repair
3-4. Focus Gain, Tracking Gain t NG
Purpose
Adjust non-uniformity of the
focus gain and that of the tracking
gain due to the OP unit.
3-5. Focus Bias t NG (Judgment is not performed.)
Purpose
Adjust non-uniformity of the focus fine adjustment against CD,
caused by OP unit and IC.
3-6. MPP Out Adjust t NG
Purpose
Adjust to minimize the variations
of MPP offset to the CD cased by
the OP and IC.
Trouble Symptom
NG indication appears.
Trouble Symptom
OK is shown all the time. The OK/
NG judgment is not performed.
Trouble Symptom
NG indication appears.
Cause
Result of the adjustment has exceeded the non-uniformity specifications of the OP unit.
CauseRepair
Cause
V ariation has exceeded the specification value.
Repair
Replace the OP unit.
Repair
Replace the OP unit.
— 35 —
Page 81
3-7. RF Gain t NG (Judgment is not performed.)
Purpose
Coarse RF gain adjustment of the
OP unit for the CD. It prevents the
OP unit from mis-recognition of
the RF signal for the CD.
3-8. RF Jitter Check t NG
Purpose
Measurement of the CD jitter
caused by the OP unit
4.Write (CDR) Adjust
4-1. Jump Adjust t NG
Purpose
Adjustment of the jump address
of the OP unit and adjust for
minimum overrun of the OP unit.
Trouble Symptom
OK is shown all the time. The OK/
NG judgment is not performed.
Trouble Symptom
The measurement value of the
jitter meter for the RF jitter of the
CD does not show the value of 8
ns or less.
Trouble Symptom
NG indication appears.
CauseRepair
Cause
If the defective RF jitter is found
as the result of trouble analysis,
the OP actuator is distorted as it
is dropped causing skew. If the
defective RF jitter is found after
replacement of the OP unit, the
skew adjustment is incomplete.
Cause
Convergence after jump cannot be
obtained within the specified time
even though the sled offset is
changed at the jump of the slid
profile system. Conver gence after
jump cannot be obtained within
the specified time even though the
kick voltage is adjusted at the
jump of the 2N type.
Repair
Readjust the OP unit starting from
the skew adjustment. If readjustment cannot produce satisfactory
result, go to section “4-6. Self RF
Jitter” of CD- R. If section “4-6.
Self RF Jitter” shows the good
result, there is no problem.
Repair
When a proper combination of the
OP unit and the circuit board is
selected after the OP unit is replaced, the satisfactory result can
be obtained. The replaced OP unit
or the board can be re-used.
4-2. Adjust WFB t NG (Judgment is not performed.)
Purpose
Check non-uniformity of the write
focus bias of the OP unit.
4-3. ATER (Absolute Time in pre-groove Error Rate) Check t NG
Purpose
Measures the number of the ATIP
errors that have occurred during
writing.
4-4. Focus Bias ATIP (Absolute Time In Pre-groove) t NG (Judgment is not performed.)
Purpose
Performs the fine adjustment of
read-out focus and the measurement by self recording and playback.
Trouble Symptom
OK is shown all the time. The OK/
NG judgment is not performed.
Trouble Symptom
NG indication appears.
Trouble Symptom
OK is shown all the time. The OK/
NG judgment is not performed.
CauseRepair
Cause
Error rate has exceeded the specifications. (There can be a case that
disc is dirty.)
CauseRepair
Repair
Check if the disc is dirty or not. If
disc is found dirty, clean and readjust the parts. If not replace the
OP unit.
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Page 82
4-5. Read Asymmetry After ATER t NG
Purpose
Measures non-uniformity of the
asymmetry between 3T and 11T
pit signals by self recording and
playback
4-6. Self RF Jitter t NG (Judgment is not performed.)
Purpose
Measurement of the CDR jitter by
performing the self recording and
playback of CDR with OP unit.
Trouble Symptom
NG indication appears.
Trouble Symptom
The measurement value of the
jitter meter for the RF jitter of the
CDR does not show the value of
8 ns or less.
Cause
Asymmetry has exceeded the
specification value, or the After
A TIP Error Rate has exceeded the
specification value, or BLER has
exceeded the specification value.
(There can be a case that disc is
dirty.) This tr ouble occurs if the
laser power adjustment is incomplete up to this step of adjustment.
Cause
Incomplete skew adjustment.
Repair
• Perform the adjustments again
starting from section 4-4 since
the segments that are recorded
in section 4-4 are used in the
subsequent adjustment items.
• Check if disc is not dirty or not.
Re-perform adjustment from
section 4-4 using a new disc.
• Perform the adjustments again
starting from the skew adjustment.
• Perform the adjustments again
starting from the first laser
power adjustment.
Repair
• Perform adjustment again starting from the skew adjustment.
• If re-adjustment cannot solve
the problem, replace the OP
unit.
4-7. Seek Check t NG
Purpose
Check the seek operation. Reject
the OP unit that shows an abnormally slow seek speed.
4-8. Shock Level Adjust t NG
Purpose
Set the initial value of the detection adjustment of the shock detection signal circuit.
Trouble Symptom
NG indication appears.
Trouble Symptom
NG indication appears.
Cause
Load to the sled mechanism is large
or the sled motor torque is low.
Cause
As the result of adjustment, nonuniformity has exceeded the
specifications.
Repair
Replace the OP stopper or replace
the read screw.
Repair
The detection information is not
sent to CPU due to defective comparator and the latch circuit.
Check the circuit from the FE and
TE outputs to the CPU (IC404).
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Page 83
5.Write (CDRW) Adjust
5-1. RW FE t NG
Purpose
Adjust the focus error amplitude
and non-uniformity of the offset
of the OP unit
5-2. Focus Gain, Tracking Gain t NG
Purpose
Adjust non-uniformity of the
focus gain and that of the tracking
gain due to the OP unit.
5-3. Erase Focus Gain t NG
Purpose
Adjust non-uniformity of the
focus gain and that of the tracking
gain due to the OP unit.
5-4. ATER (Absolute Time in pre-groove Error Rate) Check t NG
Trouble Symptom
NG indication appears.
Trouble Symptom
NG indication appears.
Trouble Symptom
NG indication appears.
Result of the adjustment has exceeded the non-uniformity specifications of the OP unit.
Result of the adjustment has exceeded the non-uniformity specifications of he OP unit.
Result of the adjustment has exceeded the non-uniformity specifications of the OP unit.
Cause
Cause
Cause
Repair
Replace the OP unit.
Repair
Replace the OP unit.
Repair
Replace the OP unit.
Purpose
Measures the number of the ATIP
errors that have occurred during
writing.
Trouble Symptom
NG indication appears.
Cause
Error rate has exceeded the specifications. (There can be a case that
disc is dirty.)
Repair
Check if the disc is dirty or not. If
disc is found dirty, clean and readjust the parts. If not replace the
OP unit.
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Page 84
5-5. Read Asymmetry After ATER t NG
Purpose
Measures non- uniformity of the
asymmetry between 3T and 11T
pit signals by self recording and
playback
5-6. BLER (Block Error Rate) Check t NG
Trouble Symptom
NG indication appears.
Cause
Asymmetry has exceeded the
specification value, or the After
A TIP Error Rate has exceeded the
specification value. This trouble
occurs if the laser power adjustment is incomplete up to this step
of adjustment.
Repair
• Perform the adjustments again
starting from section 5-4 since
the segments that are recorded
in section 5-4 are used in the
subsequent adjustment items.
• Check if disc is not dirty or not.
Re-perform adjustment from
section 5-4 using a new disc.
• Perform the adjustments again
starting from the skew adjustment.
• Perform the adjustments again
starting from the first laser
power adjustment.
Purpose
Measurement of the BLER (Block
Error Rate) at the maximum speed
of CDRW reading.
5-7. Self RF Jitter t NG (Judgment is not performed.)
Purpose
Measurement of the CDRW jitter
by performing the self recording
and playback of CDRW with OP
unit.
5-8. Write Drive ID t NG (Judgment is not performed.)
Purpose
Write the drive ID. (Write FFFF.
0000 to h50 and h51 of EEPROM.)
Trouble Symptom
NG indication appears.
Trouble Symptom
The measurement value of the jitter meter for the RF jitter of the
CDRW does not show the value
of 8 ns or less.
Trouble SymptomCauseRepair
Cause
The C1 error has exceeded the
specified value 80. (There can be
a case that the reference CDRW
is stained or gets scarred.)
Cause
Incomplete skew adjustment.
Repair
Check if the reference CDRW has
no scar. If it is damaged, replace
the reference CDRW with the ne w
one. Or replace the OP unit.
Repair
• Perform adjustment again starting from the skew adjustment.