Sony MDRIF-5000 Service manual
MDR-IF5000
SERVICE MANUAL
Ver 1.0 1998. 11
MDR-IF5000 is the component model block one in
•
MDR-DS5000.
COMPONENT MODEL NAME FOR MDR-DS5000
DIGITAL SURROUND PROCESSOR DP-IF5000
CORDLESS STEREO HEADPHONES MDR-IF5000
E Model
SPECIFICATIONS
Modulation System Frequency modulation
Carrier wave frequency Right channel 2.8 MHz
Left channel 2.3 MHz
Frequency response 12 – 24,000 Hz
Power requirements Rechargeable Ni-Cd
batteries (supplied) or
R6 (size AA) batteries
(dry-cell or
rechargeable, sold
separately)
Mass Approx. 280 g
(including the
supplied rechargeable
Ni-Cd batteries)
Design and specifications are subject to
change without notice.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
CORDLESS STEREO HEADPHONES
MICROFILM
– 1 –
– 2 –
SECTION 1
GENERAL
This section is extracted
from instruction manual.
– 3 –
SECTION 2
t
)
DISASSEMBLY
• The equipment can be removed using the following procedure.
Set Frame assy
Hanger (L)
Band Assy, Head
Frame assy
Hanger (R)
Band Assy, HeadRX board
Note : Follow the disassembly procedure in the numerical order given.
2-1. FRAME ASSY
• Remove the left and right ear
pads in the same manner.
1
pad (outer), ear
5
P 2.6X6
6
claws
2
pad (inner), ear
4
driver assy
7
plate, front
3
claws
plate, fron
8
frame assy
spread
9
hanger
spread
2-2. HANGER (L) 2-3. HANGER (R)
2
P 2.6X6
1
P 2.6X6
4
5
RX PD2
board (L-CH)
4
RX PD1 board (L-CH
RX PD2
board
(R-CH)
hanger
frame assy
1
P 2.6X6
3
RX PD1 board (R-CH)
3
hanger (L)
– 4 –
2
hanger (R)
2-4. RX BOARD
1
P 2.6X6
2
RX board
2-5. BAND ASSY, HEAD
5
band assy, head
4
claws
3
stopper, PC board
2
RX SW board
1
wire
When installing,
take care to avoid extrusion
of wire from the hanger.
– 5 –
SECTION 3
)
–
r
ELECTRICAL ADJUSTMENTS
Notes:
1. These adjustments are performed in the order that they are
discribed.
2. Adjustment and measurement are performed for each channel
unless otherwise specified.
3. Adjustment is made for right channel first and then the left
channel.
4. The power voltage at the headphones section is supplied with
1.2 V.
5. The processor section is used as jig to adjust the headphones
section (MDR-IF5000).
6. Adjustment is made with the RX SW board and RX PD1 and
RX PD2 boards (for both L-ch and R-ch) connected to the RX
board with wires (normal part).
0 dB=0.775 V
Tuning Adjustment
Preparation:
processor
(DP-IF5000)
headphones
(MDR-IF5000
Adjustment Location:
TP9
TP11
TUNING
ADJUSTMENT
(L-ch)
TUNING
ADJUSTMENT
(R-ch)
L34
L35
L54
L55
– RX board (component side)
1. Set the processor section (DP-IF5000) in test mode and operate
the set to generate a signal of 1 kHz and –10 dB. (Refer to
DP-IF5000 service manual page 7.)
2. Supply 1.2 V to between VCC and ground on the RX board.
3. Adjust RV11 (volume control) on the RX board to the minimum
level.
Setting:
distortion mete
RX board
TP11 (L-ch)
TP9 (R-ch)
+
–
1. Connect a distortion meter to TP11 (L-ch) and TP9 (R-ch) on
the RX board.
2. Adjust L34 and 35 for L-ch and L54 and 55 for R-ch on the
RX board so that the reading on the distortion meter is
minimized.
– 6 –
4-1. BLOCK DIAGRAM
B+
(+3.0V)
SECTION 4
DIAGRAMS
L34,35
TUNING
(L)
QUAD COIL
8
AUDIO (L) MIXER LIMITER
IC31
SQUELCH TRIGGER
WITH
HYSTERESIS
MUTE
MDR-IF5000
14
INFRARED
SENSOR
D1-4
04
B+
(+1.7V)
RF AMP
Q1-3
BUFFER
Q4
B+
(+3.0V)
BPF
L54,55
TUNING
GND
AF
AMP
AF
AMP
OUT
VCC
OUT
MUTE
GND
VCC
15
AF
-1
L
B+
4
(+3.0V)
RV10
BALANCE
RV11
VOL
AF
B+
(+1.8V)
B+
(+1.7V)
-2
R
9
14
15
4
(+3.0V)
D10
POWER
++
B+
++
(POWER)
S10
VIN
4
3
FC1
FC2
2
VCC
6
VIN
4
3
FC1
FC2
2
VCC
6
DRIVER AMP (L-CH)
IC32
–
+
–
+
BIAS
CIRCUIT
DRIVER AMP (R-CH)
IC52
–
+
–
+
BIAS
CIRCUIT
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION R6)
2PCS, 3V
NICKEL CADMIUM
BATTERY
(NC-AA)
700mAh 2.4V
VO1
VO2
VO1
VO2
5
8
5
8
SP31
L-CH
SP51
R-CH
• Signal path
: RF
OR
: ANALOG
OSC
2
OSC
OSCILLATOR
1
MIXER
16
16
1
2
8
IN
MIXER
IN
OSC
OSC
QUAD COIL
OSCILLATOR
BPF
(R)
MIXER
MIXER DEMODULATOR
MIXER
OUT
MIXER
OUT
AUDIO (R) MIXER LIMITER
2.3MHz BPF
3 5 9
L33
2.8MHz BPF
3 5
L53
IC51
LIMITER
IN
LIMITER
AMP
LIMITER
IN
LIMITER
AMP
SQUELCH TRIGGER
WITH
HYSTERESIS
DEMODULATOR
– 7 – – 8 –
MDR-IF5000
4-2. PRINTED WIRING BOARDS
A
B
C
D
E
F
1
-2
R
2345678910111213
L-CH
INFRARED
SENSOR
-1
L TP11
TP9
( )
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION R6)
2PCS, 3V
OR
NICKEL CADMIUM
BATTERY
(NC-AA)
700mAh 2.4V
R-CH
B+
GND
G
• Semiconductor
Location
Ref. No. Location
D1 C-13
D2 F-13
D3 C-10
D4 F-10
D10 D-2
D51 D-5
D52 D-5
IC31 D-3
IC32 F-3
IC51 D-4
IC52 F-4
Q1 B-3
Q2 B-4
Q3 B-4
Q4 B-5
Note:
• X : parts extracted from the component side.
®
•
• : Pattern from the side which enables seeing.
• : Pattern of the rear side.
: Through hole.
– 9 – – 10 –
R-CH
L-CH
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