Sony M-430 Service manual
M-430
MICROFILM
SERVICE MANUAL
Ver 1.3 2000. 11
With SUPPLEMENT-1
(9-926-960-81)
With SUPPLEMENT-2
(9-926-960-82)
SPECIFICATIONS
US Model
AEP Model
E Model
Model Name Using Similar Mechanism NEW
T ape T ransport Mechanism Type MZ-430-99
Tape
y (normal position type)
Recording system
2-track 1-channel monaural
Speaker
Approx. 3.6 cm (1
Tape speed
2.4 cm/s (
Frequency range
250 - 4,000 Hz (with TAPE SPEED switch at 2.4 cm/s)
Output
Earphone jack (minijack) for 8 - 300 ohms earphone
Power output (at 10% harmonic distortion)
160 mW
Power requirements
3 V DC batteries size AA (R6) × 2/External DC 3 V power sources
Dimensions (w/h/d)
Approx. 62.2 × 121.5 × 24.3 mm (2
parts and controls
Mass
Approx. 125 g (4.5
7/16 in.) dia.
15/16 ips), 1.2 cm/s (15/32 ips)
1/2 × 4 7/8 × 31/32 in.) incl. projecting
oz.)
Supplied accessory
Microcassette tape MC-30 (1)
Design and specifications are subject to change without notice.
– 1 –
MICROCASSETTE
-CORDER
TM
TABLE OF CONTENTS
1. GENERAL ....................................................................3
2. DISASSEMBLY
2-1. Lid Assy, Cassette ...............................................................4
2-2. Lid, Battery Case ................................................................ 5
2-3. Cabinet (Rear) Assy ............................................................ 5
2-4. Main Board ......................................................................... 6
2-5. Mechanism Deck................................................................. 6
2-6. Head, Ceramic..................................................................... 7
3. MECHANICAL ADJUSTMENTS..............................8
4. ELECTRICAL ADJUSTMENTS ...............................8
5. DIAGRAMS
5-1. Block Diagram .................................................................. 10
5-2. Printed Wiring Board ........................................................ 11
5-3. Schematic Diagram ........................................................... 13
6. EXPLODED VIEWS
6-1. Cabinet Section ................................................................. 15
6-2. Mechanism Deck Section.................................................. 16
7. ELECTRICAL PARTS LIST.....................................17
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
– 2 –
SECTION 1
GENERAL
This section is extracted
from instruction manual.
– 3 –
SECTION 2
DISASSEMBLY
• The equipment can be removed using the following procedure.
Set Lid assy,
cassette
Lid,
battery case
Note : Follow the disassembly procedure in the n umerical order given.
2-1. LID ASSY, CASSETTE
Cabinet (rear)
assy
Main
board
Mechanism
deck
Head,
ceramic
top view
4
lid assy,
cassette
3
cabinet (front)
precision screwdriver
or equivalent
2
Stop the lid assy, cassette
halfway.
precision screwdriver
or equivalent
1
Note : When removing the cassette lid, put cloth on the end of a
screwdriver or use a polyacetal driver to avoid damage to
the cabinet.
7
6
8
– 4 –
5
9
lid assy, cassette
2-2. LID, BATTERY CASE
3
claws
2
2
1
5
lid, battery case
2-3. CABINET (REAR) ASSY
Note : When installing, fit the knobs and switches .
1
screw (1.7x16)
knob
3
screw (B1.7x5), tapping
2
screw (1.7x16)
5
claw
6
cabinet (rear) assy
4
claws
switch
– 5 –
2-4. MAIN BOARD
6
mic assy
1
Unsolder the 2 places.
7
(M1.4x3.0), locking
2
Unsolder the 2 places.
8
(M1.4x3.0), locking
3
Unsolder the 4 places.
4
Unsolder the 2 places.
9
MAIN board
5
Unsolder the 2 places.
2-5. MACHANISM DECK
2
button (REC)
3
button (PLAY)
1
4
button (STOP)
mechanism deck
(MZ-430-99)
– 6 –
2-6. HEAD, CERAMIC
4
M1.4, special head
5
head, ceramic
2
arm (pinch roller) assy
3
M1.4, special head
1
claw
– 7 –
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