Sony ICX084AL Datasheet

Description
The ICX084AL is a diagonal 6mm (Type 1/3) interline CCD solid-state image sensor with a square pixel array which supports VGA format. Progressive scan allows all pixels signals to be output independently within approximately 1/30 second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High sensitivity and low dark current are achieved through the adoption of HAD (Hole-Accumulation Diode) sensors.
This chip is suitable for applications such as two­dimensional bar code readers, PC input cameras, etc.
Features
Progressive scan allows individual readout of the
image signals from all pixels.
High vertical resolution (480 TV-lines) still image
without a mechanical shutter.
Square pixel unit cell
Supports VGA format
Horizontal drive frequency: 12.27MHz
No voltage adjustments (reset gate and substrate
bias are not adjusted.)
High resolution, high sensitivity, low dark current
Continuous variable-speed shutter
1/30 (Typ.) to 1/10000s
Low smear
Excellent antiblooming characteristics
Horizontal register: 5V drive
16-pin high precision plastic package (enables dual-surface standard)
Device Structure
Interline CCD image sensor
Image size: Diagonal 6mm (Type 1/3)
Number of effective pixels: 659 (H) × 494 (V) approx. 330K pixels
Total number of pixels: 692 (H) × 504 (V) approx. 350K pixels
Chip size: 5.84mm (H) × 4.94mm (V)
Unit cell size: 7.4µm (H) × 7.4µm (V)
Optical black: Horizontal (H) direction Front 2 pixels, rear 31 pixels
Vertical (V) direction Front 8 pixels, rear 2 pixels
Number of dummy bits: Horizontal 16
Vertical 5
Substrate material: Silicon
– 1 –
ICX084AL
E95307E99
Diagonal 6mm (Type 1/3) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
16 pin DIP (Plastic)
A
A
A
Pin 1
V
2
31
2
8
Pin 9
H
Optical black position
(Top View)
AAA AAA AAA
– 2 –
ICX084AL
Pin No. Symbol Description Pin No. Symbol Description
1 2 3
4 5 6 7 8
Vφ3 Vφ2 Vφ1
NC GND CGG GND VOUT
Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock
GND Output amplifier gate
1
GND Signal output
9 10 11
12 13 14 15 16
VDD SUBCIR GND
φSUB VL RG Hφ1 Hφ2
Supply voltage Supply voltage for the substrate
voltage generation GND Substrate clock Protective transistor bias Reset gate clock Horizontal register transfer clock Horizontal register transfer clock
Pin Description
9
10
11
12
13
14 15
16
Note)
Note) : Photo sensor
V
OUT
GND
C
GG
GND
NC
Vφ
1
Vφ
2
Vφ
3
V
DD
SUBCIR
GND
φSUB
V
L
RG
Hφ
1
Hφ
2
Horizontal register
Vertical register
1
2
3
4
5
6
7
8
Block Diagram and Pin Configuration
(Top View)
Item
–0.3 to +36 –0.3 to +18
–22 to +9
–15 to +16
to +10 to +15
to +16 –16 to +16 –10 to +15 –55 to +10
–65 to +0.3 –0.3 to +27.5 –0.3 to +20.5 –0.3 to +17.5
–30 to +80 –10 to +60
V V V V V V V V V V V V V
V °C °C
2
Ratings Unit Remarks
Absolute Maximum Ratings
2
+24V (Max.) when clock width < 10µs, clock duty factor < 0.1%.
Substrate clock φSUB – GND
VDD, VOUT, CGG, SUBCIR – GND
Supply voltage
VDD, VOUT, CGG, SUBCIR – φSUB Vφ1, Vφ2, Vφ3 – GND
Clock input voltage
Vφ1, Vφ2, Vφ3 φSUB Voltage difference between vertical clock input pins Voltage difference between horizontal clock input pins Hφ1, Hφ2 – Vφ3 Hφ1, Hφ2 – GND Hφ1, Hφ2 φSUB VL φSUB Vφ2, Vφ3 – VL RG – GND Vφ1, Hφ1, Hφ2, GND – VL Storage temperature Operating temperature
1
DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of 1000pF or more.
– 3 –
ICX084AL
Item
VDD VL φSUB
14.55 15.4515.0
12
V
Symbol Min. Typ. Max. Unit Remarks
Bias Conditions
DC Characteristics
Supply voltage Protective transistor bias Substrate clock
Item
Supply current IDD 6 8 mA
Symbol Min. Typ. Max.
Unit
Remarks
Item
Readout clock voltage
VVT VVH02 VVH1, VVH2, VVH3 VVL1, VVL2, VVL3 Vφ1, Vφ2, Vφ3 I VVL1–VVL3 I VVHH VVHL VVLH VVLL VφH VHL
VφRG VRGLH – VRGLL VRGH VφSUB
14.55 –0.05
–0.2 –8.0
6.8
4.75
–0.05
4.5
VDD
+0.4
21.5
15.0 0 0
–7.5
7.5
5.0 0
5.0
VDD
+0.6
22.5
15.45
0.05
0.05 –7.0
8.05
0.1
1.0
2.3
1.0
1.0
5.25
0.05
5.5
0.8
VDD
+0.8
23.5
V V V V V V V V V V V V
V V V V
1 2 2 2 2 2 2 2 2 2 3 3
4 4 4 5
VVH = VVH02
VVL = (VVL1 + VVL3)/2
High-level coupling High-level coupling Low-level coupling Low-level coupling
Input through 0.01µF capacitance
Low-level coupling
Horizontal transfer clock voltage
Reset gate clock voltage
Substrate clock voltage
Vertical transfer clock voltage
Symbol Min. Typ. Max. Unit
Waveform
diagram
Remarks
Clock Voltage Conditions
1
VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used.
2
Set SUBCIR pin to open when applying a DC bias to the substrate clock pin.
– 4 –
ICX084AL
Clock Equivalent Circuit Constant
Item
Capacitance between vertical transfer clock and GND
CφV1 CφV2 CφV3 CφV12 CφV23 CφV31 CφH1, CφH2 CφHH CφRG CφSUB R1, R2 R3 RGND RφH1, RφH2 RφRG
560
470 1500 1500 1500 1000
43 39
5
570
20 56 43 10 39
pF pF pF pF pF pF pF pF pF pF
Ω Ω Ω Ω Ω
Capacitance between vertical transfer clocks
Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND
Vertical transfer clock series resistor
Vertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor
Symbol Min. Typ. Max. Unit Remarks
Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit
RφRG
RGφ
Cφ
RG
Reset gate clock equivalent circuit
RφH1 RφH2
Hφ2
CφH1
CφH2
CφHH
Vφ1
CφV12
Vφ2
Vφ3
CφV2
RGND
R3
R1
R2
CφV1
Cφv31
Cφv23
Hφ1
CφV3
– 5 –
ICX084AL
Drive Clock Waveform Conditions
(1) Readout clock waveform
(2) Vertical transfer clock waveform
II II
100%
90%
10%
0%
VVT
tr twh tf
φM
0V
φM
2
Vφ1
Vφ3
Vφ2
VVH1
VVHH VVH
VVHL
VVLH
VVL1
VVL01
VVL
VVLL
VVH3
VVHH
VVH
VVHL
VVLH
VVL03
VVL
VVLL
VφV1 = VVH1 – VVL01 VφV2 = VVH02 – VVL2 VφV3 = VVH3 – VVL03
VVH = VVH02 VVL = (VVL01 + VVL03)/2 VVL3 = VVL03
VVLH
VVL2
VVLL
VVL
VVH
VVHH
VVH02
VVH2
VVHL
VT
Note) Readout clock is used by composing vertical transfer clocks Vφ2 and Vφ3.
– 6 –
ICX084AL
(3) Horizontal transfer clock waveform
tr twh tf
90%
10%
twl
Vφ
H
VHL
Hφ1, Hφ2
(4) Reset gate clock waveform
Point A
twl
VφRG
VRGH
VRGL + 0.5V V
RGL
VRGLH
RG waveform
V
RGLL
Hφ1 waveform
twhtr tf
φ
RG
2.5V
VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL.
VRGL = (VRGLH + VRGLL)/2
Assuming VRGH is the minimum value during the interval twh, then:
VφRG = VRGH – VRGL
(5) Substrate clock waveform
90%
100%
10%
0%
V
SUB
tr twh tf
φM
φM
2
φSUB
(A bias generated within the CCD)
VφSUB
Loading...
+ 11 hidden pages