Sony ICX075AK Datasheet

Description
The ICX075AK is a diagonal 8mm (Type 1/2) interline CCD solid-state image sensor with a square pixel array. Progressive scan allows all pixels signals to be output independently within approximately 1/50 second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High resolution and high color reproductivity are achieved through the use of R, G, B primary color mosaic filters.
Further, high sensitivity and low dark current are achieved through the adoption of HAD (Hole­Accumulation Diode) sensors.
This chip is suitable for image input and processing applications.
Features
Progressive scan allows individual readout of the
image signals from all pixels.
High vertical resolution (580TV-lines) still picture
without a mechanical shutter.
Square pixel unit cell
R, G, B primary color mosaic filters on chip
High resolution, high color reproductivity, high sensitivity,
low dark current
Continuous variable-speed shutter
Low smear
Excellent antiblooming characteristics
Reset gate: 5V drive (bias: no adjustment)
Device Structure
Image size: Diagonal 8mm (Type 1/2)
Number of effective pixels: 782 (H) × 582 (V) approx. 460K pixels
Total number of pixels: 823 (H) × 592 (V) approx. 490K pixels
Interline CCD image sensor
Chip size: 8.10mm (H) × 6.33mm (V)
Unit cell size: 8.3µm (H) × 8.3µm (V)
Optical black: Horizontal (H) direction: Front 3 pixels, rear 38 pixels
Vertical (V) direction: Front 8 pixels, rear 2 pixels
Number of dummy bits: Horizontal 19
Vertical 5
Substrate material: Silicon
– 1 –
ICX075AK
E95706F99
Diagonal 8mm (Type 1/2) Progressive Scan CCD Image Sensor with Square Pixel for Color Video Cameras
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
22 pin DIP (Cer-DIP)
A
A
A
Pin 1
V
3
38
2
8
Pin 12
H
Optical black position
(Top View)
Wfine CCD is a registered trademark of Sony Corporation.
Represents a CCD adopting progressive scan, primary color filter and square pixel.
AAA AAA AAA
– 2 –
ICX075AK
Horizontal Register 1 Horizontal Register 2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Note)
Note) : Photo sensor
V
OUT2
GND
C
GG2
C
GG1
VHOLDφ
Vφ
1
Vφ
2
HIGφ
1
V
DD
VOGφ
SUB
V
L
RG
POGφ
Hφ
1
Hφ
2
Vertical Register
15
16
17
18
19
20
21
22
HHGφ
1
HHGφ
2
HIG
2
V
OUT1
Vφ
3
HIS
G R G R G R
B
G
B
G
B
G
G R G R G R
B G B G B G
Block Diagram and Pin Configuration
(Top View)
Pin No.
Symbol Description
Description
Pin No.
Symbol
Pin Description
1
DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of 1µF or more.
2
Regarding the test pins: apply the same voltage as the supply voltage to HIS, and ground HIGφ1, HIG2, and POGφ.
Test pin
2
Test pin
2
Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register final
stage accumulation clock GND Output amplifier 1 gate
1
decoupling capacitor Signal output 1 Output amplifier 2 gate
1
decoupling capacitor Signal output 2
1
2
3
4
5
6
7
8
9
10
11
HIGφ1 HIS Vφ3 Vφ2 Vφ1
VHOLD
φ
GND
CGG1 VOUT1 CGG2
VOUT2
12 13 14 15 16
17
18
19 20 21
22
VDD RG VL SUB Hφ1
Hφ2
HHGφ1
HHGφ2 HIG2 POGφ
VOGφ
Supply voltage Reset gate clock Protective transistor bias Substrate (overflow drain) Horizontal register transfer clock
Horizontal register transfer clock Inter-horizontal register
transfer clock Inter-horizontal register
transfer clock Test pin
2
Test pin
2
Vertical register final stage transfer clock
– 3 –
ICX075AK
Item
–0.3 to +55 –0.3 to +18
–55 to +10 –15 to +20
to +10 to +15
to +17 –17 to +17 –10 to +15 –55 to +10
–65 to +0.3 –0.3 to +27.5 –0.3 to +22.5 –0.3 to +17.5
–30 to +80 –10 to +60
V V V V V V V V V V V V V
V °C °C
1
Ratings Unit Remarks
Absolute Maximum Ratings
1
+27V (Max.) when clock width < 10µs, clock duty factor < 0.1%.
Substrate voltage SUB – GND
VDD, VOUT1, VOUT2, HIS, CGG1, CGG2 – GND
Supply voltage
VDD, VOUT1, VOUT2, HIS, CGG1, CGG2 – SUB Vφ1, Vφ2, Vφ3, VHOLDφ, VOGφ – GND
Clock input voltage
Vφ1, Vφ2, Vφ3, VHOLDφ, VOGφ – SUB Voltage difference between vertical clock input pins Voltage difference between horizontal clock input pins Hφ1, Hφ2 – VOGφ Hφ1, Hφ2 – GND Hφ1, Hφ2 – SUB VL – SUB Vφ2, Vφ3, VDD, VOUT1, VOUT2, HIS, HIGφ1, HIG2, POGφ – VL RG – GND Vφ1, CGG1, CGG2, Hφ1, Hφ2, HHGφ1, HHGφ2, VOGφ, VHOLDφ – VL Storage temperature Operating temperature
– 4 –
ICX075AK
1
Indications of substrate voltage (VSUB) setting value The setting value of the substrate voltage is indicated on the back of image sensor by a special code. Adjust the substrate voltage (VSUB) to the indicated voltage.
VSUB code — two characters indication
Integer portion Decimal portion
The integer portion of the code and the actual value correspond to each other as follows.
Item
VDD
VSUB
VL
14.55
9.0
Indicated
voltage – 0.1
15.45
18.5
Indicated
voltage + 0.1
15.0
Indicated
voltage
2
V V
V
1
Symbol Min. Typ. Max. Unit Remarks
Bias Conditions
DC Characteristics
Value 9 10 11 12 13 14 15 16 17
18
9 A C d E f G h
J
K
<Example> "A5" VSUB = 10.5V.
2
VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used.
3
(1) Current to each pin when 18V is applied to VDD, VOUT1, VOUT2, HIS, RG, CGG1, CGG2, GND and SUB
pins, while all pins that are not tested are grounded.
(2) Current to each pin when 20V is applied sequentially to Vφ1, Vφ2 and Vφ3 pins, while all pins that are not
tested are grounded. However, 20V is applied to SUB pin.
(3) Current to each pin when 15V is applied sequentially to RG, Hφ1 and Hφ2 pins, while all pins that are not
tested are grounded. However, 15V is applied to SUB pin.
(4) Current to VL pin when 25V is applied to Vφ2, Vφ3, POGφ, HIGφ1, HIG2, VDD, VOUT1 and VOUT2 pins or
when, 15V is applied to Vφ1, VHOLDφ, VOGφ, CGG1, CGG2, Hφ1, Hφ2, HHGφ1 and HHGφ2 pins, while VL pin is grounded. However, GND and SUB pins are left open.
(5) Current to GND pin when 20V is applied to the RG pin and the GND pin is grounded.
4
Current to SUB pin when 55V is applied to SUB pin, while pins that are not tested are grounded.
Supply voltage Substrate voltage
adjustment range Substrate voltage
adjustment precision Protective transistor bias
Item Supply current Input current Input current
IDD IIN1 IIN2
10
1
10
mA
µA µA
34
Symbol Min. Typ. Max. Unit Remarks
Integer portion of code
– 5 –
ICX075AK
Item
VVT VVH02 VVH1, VVH2, VVH3 VVL1, VVL2, VVL3 VφV I VVL1 – VVL3 I VVHH VVHL VVLH VVLL VφH VHL
VφRG V
RGLH
V
RGLL
VRGH VφSUB
VVHOLDH, VVOGH VVHOLDL, VVOGL VHHG1H, VHHG2H VHHG1L, VHHG2L VHHG1M, VHHG2M
14.55 –0.05
–0.2 –8.0
6.8
4.75
–0.05
4.5
VDD
+0.4
21.5
–0.05
–8.0
4.75 –8.0
–0.05
15.0 0 0
–7.5
7.5
5.0 0
5.0
VDD
+0.6
22.5 0
–7.5
5.0
–7.5
0
15.45
0.05
0.05 –7.0
8.05
0.1
0.5
0.5
0.5
0.5
5.25
0.05
5.5
0.8
VDD
+0.8
23.5
0.05 –7.0
5.25 –7.0
0.05
V V V V V V V V V V V V
V V V V
V V V V V
1 2 2 2 2 2 2 2 2 2 3 3
4 4 4 5
6 6 7 7 7
VVH = VVH02
VVL = (VVL01 + VVL03)/2 VφV = VVHn – VVLn (n = 1 to 3)
High-level coupling High-level coupling Low-level coupling Low-level coupling
Input through 0.01µF capacitance
Low-level coupling
Readout clock voltage
Vertical transfer clock voltage
Horizontal transfer clock voltage
Reset gate clock voltage
Substrate clock voltage Vertical final stage
accumulation clock voltage transfer clock voltage
Inter-horizontal register transfer clock voltage
Symbol Min. Typ. Max. Unit
Waveform
diagram
Remarks
Clock Voltage Conditions
– 6 –
ICX075AK
Clock Equivalent Circuit Constant
Item
CφV1 CφV2 CφV3 CφV12 CφV23 CφV31
CφVHOLD
CφVOG CφHHG1
CφHHG2 CφH1 CφH2
CφHH
CφRG
CφSUB R1, R2, R3
RGND RφH1 RφH2
820 820
820 3300 2200 2200
19
12 19
19 68 68
47
10
400
22 15 24 24
pF pF pF pF pF pF
pF
pF pF
pF pF pF
pF
pF
pF
Ω Ω Ω Ω
Capacitance between vertical transfer clock and GND
Capacitance between vertical transfer clocks
Capacitance between vertical final stage accumulation clock and GND
Capacitance between vertical final stage transfer clock and GND
Capacitance between inter-horizontal register transfer clock and GND
Capacitance between horizontal transfer clock and GND
Capacitance between horizontal transfer clocks
Capacitance between reset gate clock and GND
Capacitance between substrate clock and GND
Vertical transfer clock series resistor Vertical transfer clock ground resistor
Horizontal transfer clock series resistor
Symbol Min. Typ. Max. Unit
Remarks
RφH1 RφH2
Hφ2
CφH1 CφH2
CφHH
Vφ1
CφV12
Vφ2
Vφ3
CφV2
RGND
R3
R1
R2
Vertical transfer clock equivalent circuit
Horizontal transfer clock equivalent circuit
CφV1
Cφv31
Cφv23
Hφ1
CφV3
– 7 –
ICX075AK
Drive Clock Waveform Conditions
(1) Readout clock waveform
(2) Vertical transfer clock waveform
II II
100%
90%
10%
0%
VVT
tr twh tf
φM
0V
φM
2
Vφ1
VVH1
VVH1
VVHH VVHH
VVH
VVHL
VVHL
VVLH
VVLH
VVL1
VVL1
VVL01
VVL
VVLL VVLL
Vφ3
VVH3
VVH3
VVHH
VVHH VVH
VVHL
VVHL
VVLH
VVLH
VVL3
VVL03
VVL
VVLLVVLL
VφV1 = VVH1 – VVL01 VφV2 = VVH02 – VVL2 VφV3 = VVH3 – VVL03
VVH = VVH02 VVL = (VVL01 + VVL03)/2
Vφ2
VVLH
VVL2
VVLL
VVLH
VVL2
VVL
VVLL
VVH
VVHH
VVH02
VVHH
VVH2
VVHL
VVH2
VVHL
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