Sony ICX074AL Datasheet

Description

The ICX074AL is an interline CCD solid-state
image sensor suitable for EIA black-and-white video
cameras. Progressive scan allows all pixels signals
to be output independently within approximately
1/60 second. This chip features an electronic shutter
with variable charge-storage time which makes it
possible to realize full-frame still image without
mechanical shutter. Individual pixels in a square
matrix make this device suitable for image input and
processing applications.

High sensitivity and low dark current are achieved
through the adoption of HAD (Hole-Accumulation
Diode) sensors.

Features

• Progressive scan allows individual readout of the

image signals from all pixels.

• High vertical resolution (480TV-lines) still picture

without mechanical shutter.

• Square pixel unit cell

• VGA format-compatible

• High resolution, high sensitivity, low dark current

• Continuous variable-speed shutter

• Low smear

• Excellent antiblooming characteristics

• Reset gate: 5V drive (bias: no adjustment)

Device Structure

• Image size: Diagonal 8mm (Type 1/2)

• Number of effective pixels: 659 (H) × 494 (V) approx. 330K pixels

• Total number of pixels: 692 (H) × 504 (V) approx. 350K pixels

• Interline CCD image sensor

• Chip size: 8.10mm (H) × 6.33mm (V)

• Unit cell size: 9.9µm (H) × 9.9µm (V)

• Optical black: Horizontal (H) direction: Front 2pixels, rear 31pixels

Vertical (V) direction: Front 8pixels, rear 2pixels

• Number of dummy bits: Horizontal 16

Vertical 5

• Substrate material: Silicon

– 1 –

ICX074AL

E94478H99

Diagonal 8mm (Type 1/2) Progressive Scan CCD Image Sensor with Square Pixel for EIA B/W Video Cameras

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

22 pin DIP (Cer-DIP)

A

A

A

Pin 1

V

2

31

2

8

Pin 12

H

Optical black position

(Top View)

AAA
AAA
AAA

– 2 –

ICX074AL

Horizontal Register 1

Horizontal Register 2

1

2

3

4

5

6

7

8

9

10

11

12

13

14

Note)

Note) : Photo sensor

V

OUT2

GND

C

GG2

C

GG1

VHOLDφ

Vφ

1

Vφ

2

HIGφ

1

V

DD

VOGφ

SUB

V

L

RG

POGφ

Hφ

1

Hφ

2

Vertical Register

15

16

17

18

19

20

21

22

HHGφ

1

HHGφ

2

HIG

2

V

OUT1

Vφ

3

HIS

Block Diagram and Pin Configuration

(Top View)

Pin
No.

Symbol Description

Description

Pin
No.

Symbol

Pin Description

∗1

DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of
1µF or more.

∗2

Regarding the test pins: apply the same voltage as the supply voltage to HIS, and ground HIGφ1, HIG2, and
POGφ.

Test pin

∗2

Test pin

∗2

Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register final

stage accumulation clock
GND
Output amplifier 1 gate

∗1

decoupling capacitor
Signal output 1
Output amplifier 2 gate

∗1

decoupling capacitor
Signal output 2

1

2

3

4

5

6

7

8

9

10

11

HIGφ1
HIS
Vφ3
Vφ2
Vφ1

VHOLD

φ

GND

CGG1
VOUT1
CGG2

VOUT2

12
13
14
15
16

17

18

19
20
21

22

VDD
RG
VL
SUB
Hφ1

Hφ2

HHGφ1

HHGφ2
HIG2
POGφ

VOGφ

Supply voltage
Reset gate clock
Protective transistor bias
Substrate (overflow drain)
Horizontal register transfer clock

Horizontal register transfer clock
Inter-horizontal register

transfer clock
Inter-horizontal register

transfer clock
Test pin

∗2

Test pin

∗2

Vertical register final stage
transfer clock

– 3 –

ICX074AL

Item

–0.3 to +55
–0.3 to +18

–55 to +10
–15 to +20

to +10
to +15

to +17
–17 to +17
–10 to +15
–55 to +10

–65 to +0.3
–0.3 to +27.5
–0.3 to +22.5
–0.3 to +17.5

–30 to +80
–10 to +60

V
V
V
V
V
V
V
V
V
V
V
V
V

V
°C
°C

∗1

Ratings Unit Remarks

Absolute Maximum Ratings

∗1

+27V (Max.) when clock width < 10µs, clock duty factor < 0.1%.

Substrate voltage SUB – GND

VDD, VOUT1, VOUT2, HIS, CGG1, CGG2 – GND

Supply voltage

VDD, VOUT1, VOUT2, HIS, CGG1, CGG2 – SUB
Vφ1, Vφ2, Vφ3, VHOLDφ, VOGφ – GND

Clock input voltage

Vφ1, Vφ2, Vφ3, VHOLDφ, VOGφ – SUB
Voltage difference between vertical clock input pins
Voltage difference between horizontal clock input pins
Hφ1, Hφ2 – VOGφ
Hφ1, Hφ2 – GND
Hφ1, Hφ2 – SUB
VL – SUB
Vφ2, Vφ3, VDD, VOUT1, VOUT2, HIS, HIGφ1, HIG2, POGφ – VL
RG – GND
Vφ1, CGG1, CGG2, Hφ1, Hφ2, HHGφ1, HHGφ2, VOGφ, VHOLDφ – VL
Storage temperature
Operating temperature

– 4 –

ICX074AL

∗1

Indications of substrate voltage (VSUB) setting value
The setting value of the substrate voltage is indicated on the back of image sensor by a special code.
Adjust the substrate voltage (VSUB) to the indicated voltage.

VSUB code — two characters indication

↑ ↑

Integer portion Decimal portion

The integer portion of the code and the actual value correspond to each other as follows.

Item

VDD
VSUB

VL

14.55

9.0

Indicated

voltage –0.1

15.45

18.5

Indicated

voltage +0.1

15.0

Indicated

voltage

∗2

V
V

V

∗1

Symbol Min. Typ. Max. Unit Remarks

Bias Conditions

DC Characteristics

Value

9 10 11 12 13 14 15 16 17

18

9 A C d E f G h

J

K

<Example> "A5" → VSUB = 10.5V.

∗2

VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL
power supply for the V driver should be used.

∗3

(1)Current to each pin when 18V is applied to VDD, VOUT1, VOUT2, HIS, RG, CGG1, CGG2, GND and SUB

pins, while pins that are not tested are grounded.

(2)Current to each pin when 20V is applied sequentially to Vφ1, Vφ2 and Vφ3 pins, while pins that are not

tested are grounded. However, 20V is applied to SUB pin.

(3)Current to each pin when 15V is applied sequentially to RG, Hφ1 and Hφ2 pins, while pins that are not

tested are grounded. However, 15V is applied to SUB pin.

(4)Current to VL pin when 25V is applied to Vφ2, Vφ3, POGφ, HIGφ1, HIG2, VDD, VOUT1 and VOUT2 pins or

when, 15V is applied to Vφ1, VHOLDφ, VOGφ, CGG1, CGG2, Hφ1, Hφ2, HHGφ1 and HHGφ2 pins, while VL
pin is grounded. However, GND and SUB pins are left open.

(5)Current to GND pin when 20V is applied to the RG pin and the GND pin is grounded.

∗4

Current to SUB pin when 55V is applied to SUB pin, while all pins that are not tested are grounded.

Supply voltage
Substrate voltage

adjustment range
Substrate voltage

adjustment precision
Protective transistor bias

Item
Supply current
Input current
Input current

IDD
IIN1
IIN2

10

1

10

mA

µA
µA

∗3
∗4

Symbol Min. Typ. Max. Unit Remarks

Integer portion of code

– 5 –

ICX074AL

Item

VVT
VVH02
VVH1, VVH2, VVH3
VVL1, VVL2, VVL3
VφV
I VVL1– VVL3 I
VVHH
VVHL
VVLH
VVLL
VφH
VHL

VφRG
V

RGLH –

V

RGLL

VRGH
VφSUB

VVHOLDH, VVOGH
VVHOLDL, VVOGL
VHHG1H, VHHG2H
VHHG1L, VHHG2L
VHHG1M, VHHG2M

14.55
–0.05

–0.2
–8.0

6.8

4.75

–0.05

4.5

VDD

+0.4

21.5

–0.05

–8.0

4.75
–8.0

–0.05

15.0
0
0

–7.5

7.5

5.0
0

5.0

VDD

+0.6

22.5
0

–7.5

5.0

–7.5

0

15.45

0.05

0.05
–7.0

8.05

0.1

0.5

0.5

0.5

0.5

5.75

0.05

5.5

0.8

VDD

+0.8

23.5

0.05
–7.0

5.25
–7.0

0.05

V
V
V
V
V
V
V
V
V
V
V
V

V
V
V
V

V
V
V
V
V

1
2
2
2
2
2
2
2
2
2
3
3

4
4
4
5

6
6
7
7
7

VVH = VVH02

VVL = (VVL01 + VVL03)/2
VφV = VVHn – VVLn (n = 1 to 3)

High-level coupling
High-level coupling
Low-level coupling
Low-level coupling

Input through 0.01µF
capacitance

Low-level coupling

Readout clock voltage

Vertical transfer clock
voltage

Horizontal transfer
clock voltage

Reset gate clock
voltage

Substrate clock voltage
Vertical final stage

accumulation clock voltage
transfer clock voltage

Inter-horizontal register
transfer clock voltage

Symbol Min. Typ. Max. Unit

Waveform

diagram

Remarks

Clock Voltage Conditions

– 6 –

ICX074AL

Clock Equivalent Circuit Constant

Item

CφV1
CφV2
CφV3
CφV12
CφV23
CφV31

CφVHOLD

CφVOG
CφHHG1

CφHHG2
CφH1
CφH2

CφHH

CφRG

CφSUB
R1, R2, R3

RGND
RφH1
RφH2

3300
4700
4700
1000

22

100

19

12
23

19
60
69

40

9

400

10
15
24
30

pF
pF
pF
pF
pF
pF

pF

pF
pF

pF
pF
pF

pF

pF

pF

Ω
Ω
Ω
Ω

Capacitance between vertical transfer
clock and GND

Capacitance between vertical transfer
clocks

Capacitance between vertical final stage
accumulation clock and GND

Capacitance between vertical final stage
transfer clock and GND

Capacitance between inter-horizontal
register transfer clock and GND

Capacitance between horizontal transfer
clock and GND

Capacitance between horizontal transfer
clocks

Capacitance between reset gate clock and
GND

Capacitance between substrate clock and
GND

Vertical transfer clock series resistor
Vertical transfer clock ground resistor

Horizontal transfer clock series resistor

Symbol Min. Typ. Max. Unit

Remarks

RφH1

RφH2

Hφ2

CφH1 CφH2

CφHH

Vertical transfer clock equivalent circuit

Horizontal transfer clock equivalent circuit

Hφ1

Vφ1

CφV12

Vφ2

Vφ3

CφV2

RGND

R3

R1

R2

CφV1

Cφv31

Cφv23

CφV3

– 7 –

ICX074AL

Drive Clock Waveform Conditions

(1) Readout clock waveform

(2) Vertical transfer clock waveform

II II

100%

90%

10%

0%

VVT

tr twh tf

φM

0V

φM

2

Vφ1

VVH1

VVH1

VVHH VVHH VVH

VVHL VVHL

VVLH

VVLH

VVL1

VVL1

VVL01

VVL

VVLL VVLL

Vφ3

VVH3 VVH3

VVHH VVHH VVH

VVHL VVHL

VVLH

VVLH

VVL3

VVL03

VVL

VVLLVVLL

VφV1 = VVH1 – VVL01
VφV2 = VVH02 – VVL2
VφV3 = VVH3 – VVL03

VVH = VVH02
VVL = (VVL01 + VVL03) /2

Vφ2

VVLH

VVL2

VVLL

VVLH

VVL2

VVL

VVLL

VVH

VVHH

VVH02

VVHH

VVH2

VVHL

VVH2

VVHL