4-1. Upper Lid Assy Section ················································ 23
4-2. Main Board Section ······················································24
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
* Replacement of IC109 used in this set requires a special tool.
• The voltage and waveform of CSP (chip size package) cannot be
measured, because its lead layout is different from that of conventional IC.
• Lead layouts
surface
Lead layout of
conventional IC
CSP (chip size package)
5. ELECTRICAL PARTS LIST ·································· 25
Unleaded solder
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
2
SECTION 1
GENERAL
ICD-BP220
This section is extracted from
instruction manual.
qk HOLD switch (38)
ql VOL (volume) control (17)
w; USB connector for
connecting to a computer
(48)
Rear
wa
ws
wd
wa PLAY SPEED selector (18)
ws MIC SENS (microphone
sensitivity) selector (14)
wd VOR selector (15)
wf Clip*
wg Battery compartment (8)
wh Hook for handstrap (not
supplied)
wf
wg
wh
3
ICD-BP220
y
d
Note : Disassemble the unit in the order as shown below.
SECTION 2
DISASSEMBLY
Set
Sub block assy,upper lidF-SW boardPC boardMAIN board, P-SW board
Note : Follow the disassembly procedure in the numerical order given.
2-1.SUB BLOCK ASSY, UPPER LID
4
3
Remove two solderings
Sub block assy, upper li
5
Case assy
2-2.F-SW BOARD
F-SW board
3
2
Screw (B1.7 × 7)
2
1
Screw (B1.7 × 10)
Case ass
1
Connector (CN703)
4
2-3.MAIN BOARD, P-SW BOARD
s
4
MAIN board
2
Connector
(CN802)
1
Screw (1.7
ICD-BP220
×
4)
5
Remove seven soldering
6
P-SW board
3
2-4.PC BOARD
Claw
Screw (1.7 × 4)
1
Claw
2
Case assy
3
PC board
Case assy
5
ICD-BP220
SECTION 3
DIAGRAMS
Note on Schematic Diagrams:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
f
•
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 3V and fed with regulated dc power
• Voltages and waveforms are dc with respect to ground
• Voltages are taken with a VOM (Input impedance 10 MΩ).
• Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
* Replacement of IC109 used in this set requires a special
• The voltage and waveform of CSP (chip size package)
: internal component.
supply from battery terminal.
under no-signal (detuned) conditions.
no mark : REC
() : PB
Voltage variations may be noted due to normal production tolerances.
Voltage variations may be noted due to normal production tolerances.
E: PB
a : REC
tool.
cannot be measured, because its lead layout is different
from that of conventional IC.
4
W or less unless otherwise
• WAVEFORMS
1
IC712 od XTAL
4.096 MHz
VOLT/DIV : 0.5 V AC
TIME/DIV : 50 nsec
2
IC716 8 oscout
32.768 kHz
VOLT/DIV : 0.2 V AC
TIME/DIV : 10 µsec
3
IC508 5 EXT
3.3 µs
VOLT/DIV : 1.0 V DC
TIME/DIV : 2 µsec
1.3 Vp-p
0.8 Vp-p
3.2 Vp-p
Note on Printed Wiring Boards:
• Y : parts extracted from the conductor side.
• b : Pattern from the side which enables seeing.
Caution:
Pattern face side: Parts on the pattern face side seen from
(SIDE B)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(SIDE A)the parts face are indicated.
* Replacement of IC109 used in this set requires a special