Sony ICDB-5 Service manual
ICD-B5
SERVICE MANUAL
Ver 1.0 2002. 04
SPECIFICATIONS
Recording media Built-in flash memory, Monaural recording
Recording time 150 minutes
Frequency response 150 Hz - 3,500 Hz
Speaker approx. 3.2 cm (1 5/16 in.) dia.
Power output 150 mW
Input/Output • Earphone jack (minijack) for 8 - 300 ohms
earphone/headphones
• Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
Power requirements Tw o LR03 (size AAA) alkaline batteries: 3 V DC
Dimensions (w/h/d) (not incl. projecting parts and controls)
44.5 × 105.3 × 14.0 mm (1 13/16 × 4 1/4 × 9/16 in.)
Mass (incl. batteries) 68 g (2.4 oz)
US Model
Canadian Model
AEP Model
UK Model
E Model
Tourist Model
9-874-006-01
2002D0400-1
© 2002. 04
Design and specifications are subject to change without notice.
IC RECORDER
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
1
ICD-B5
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
UNLEADED SOLDER
•
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TABLE OF CONTENTS
1. GENERAL
Index to Parts and Controls ..................................................... 3
2. DISASSEMBLY
2-1. Upper Lid Assy ................................................................... 4
2-2. F-SW Board, P-SW Board .................................................. 5
2-3. Main Board ......................................................................... 5
3. DIAGRAMS
3-1. IC Pin Description...............................................................6
3-2. Block Diagram .................................................................... 9
3-3. Schematic Diagram – Main Section –............................... 10
3-4. Printed Wiring Board – Main Section – ............................ 11
3-5. Printed Wiring Board – F-SW Section – ........................... 12
3-6. Printed Wiring Board – P-SW Section – ........................... 13
3-7. IC Block Diagrams............................................................ 14
4. EXPLODED VIEWS
4-1. Case Section ...................................................................... 15
4-2. Main Board Section .......................................................... 16
5. ELECTRICAL PARTS LIST......................................... 17
2
SECTION 1
GENERAL
Index to Parts and Controls
Main unit
MIC jack
(PLUG IN POWER)
(built-in microphone)
MIC
EAR (earphone) jack
OPR (operation) indicator
ICD-B5
This section is extracted
from instruction manual.
Rear
Display window
FOLDER
INDEX
DISPLAY
MIC SENSE
(microphone sensitivity)
MENU
ERASE
Speaker
STOP
Battery
compartment
Hook for handstrap
(not supplied)
Display window
Folder indication
Alarm indicator
Repeat play indicator
Microphone sensitivity
indication
REC DATE (recorded date)
indication
REMAIN indicator
Counter /Remaining time indication /Recording date
indication /Current time indication (15:30, etc.) /Menu
indication (ALARM, BEEP, etc.) /Messages (ERASE, HOLD,
etc.)
zREC (record) /STOP
X PAUSE
— .REVIEW/
>+CUE
NxPLAY/STOP•
EXECUTE
HOLD
VOL (volume)
Selected message
number/Mode
indication of the
menu (ON, OFF, etc.)
REC (recording)
indicator
Remaining battery
indicator
Remaining memory
indicator
3
ICD-B5
y
SECTION 2
DISASSEMBLY
Note : This set can be disassemble according to the following sequence.
SET
2-1. UPPER LID ASSY
(Page 4)
2-2. F-SW BOARD,
P-SW BOARD
(Page 5)
2-3. MAIN BOARD
(Page 5)
Note : Follow the disassembly procedure in the numerical order given.
2-1. UPPER LID ASSY
8
speaker (SP101)
7
screws 1.7x2.5
3
claws
claw
6
9
upper lid assy
5
case ass
claws
1
2
B 1.7x7
4
claw
B 1.7x10
4
2-2. F-SW BOARD, P-SW BOARD
d
w
4
F-SW board
5
P-SW boar
ICD-B5
2-3. MAIN BOARD
2
speaker (SP101)
2
1
CN701
3
Removal the five solders.
case assy
3
scre
1
Removal the two solders.
6
MAIN board
4
claw
case assy
5
claw
5
ICD-B5
SECTION 3
DIAGRAMS
3-1. IC PIN DESCRIPTION
• IC703 µPD780308GC-A57-8EU (SYSTEM CONTROL)
Pin No. Pin Name I/O Pin Description
1 to 3 KEY1 to 3 I Key input
4 XHOLD I Hold switch input
5 AMPPOW O Power down control output for power amplifier IC (IC103).
6AVREFON O A/D reference voltage input
7 XFMCE O Chip enable output for flash memory IC (IC701).
8 VDD0 — Power supply pin
9AVREF — A/D reference voltage
10 XFMWE O Write enable signal output for flash memory IC (IC701).
11 XFMALE O ALE signal output
12 VSS1 — Ground
13 XFMR/B I Ready/Busy signal input from flash memory IC (IC701).
14 XFMCLE O CLE signal output for flash memory IC (IC701).
15, 16 NC O Not used. (Open)
17 XFMRE O Read enable signal output for flash memory IC (IC701).
18 XFMSE O SE signal output for flash memory IC (IC701).
19 XFMWP O WP signal output for flash memory IC (IC701).
20 CLKOUT O Not used. (Open)
21 BEEP O Beep signal output (2.4 kHz)
22 LIGHT O LCD back light control output
23 to 26 COM0 to 3 O LCD common signal output
27 BIAS O Connect to VDD. (LCD bias)
28 to 30 VLC0 to 2 — LCD drive power supply pin
31 VSS0 — Ground
32 to 61 S0 to 29 O LCD segment signal output
62 MGHIGH I Mic gain mode input (High: high mode)
63 MGTEST O Mic gain mode test output
64 XTEST I Test pin
65 DSPPOW O Digital signal processor registor control I/F enable signal output
66 LEDREC O OPR (REC) LED (D701: red) ON/OFF output
67 LEDPB O OPR (PLAY) LED (D701: green) ON/OFF output
68 RTCCE O Real time clock chip enable signal output
69 XDSPIFRQ O I/F request signal output for DSP IC (IC101).
70 DSPIFRW O I/F data read/write signal output for DSP IC (IC101).
71 XDSPRST O Reset signal output for A/D, D/A converter, DSP IC (IC101).
72 SI0 I I/F data signal input for DSP IC (IC101).
73 SO0 O I/F data signal output for DSP IC (IC101).
74 SCK0 O I/F signal clock output for DSP IC (IC101).
75 RTCDI I Real time clock data input
76 RTCDO O Real time clock data and digital signal processor registor control data output
77 RTCCLK O Real time clock I/F data and digital signal processor registor control clock output
78 IC — Ground
79 X2 O System clock output (5 MHz)
80 X1 — System clock input (5 MHz)
81 VDD1 — Power supply pin
82 XT1 — Sub clock input (32.768 kHz)
83 XT2 — Not used. (Open)
84 XRESET I Reset signal input
85 NC — Not used. (Open)
6
Loading...