Sony ICDB-16, ICDB-26 Service manual
ICD-B16/B26
SERVICE MANUAL
Ver 1.0 2004.03
Photo: ICD-B26
SPECIFICATIONS
Recording media Built-in flash memory, Monaural recording
Recording time ICD-B16:
SP: 5 hours
LP: 8 hours 15 minutes
ICD-B26:
SP: 10 hours
LP: 16 hours 25 minutes
Frequency range 160 Hz - 3,300 Hz
Speaker approx. 3.2 cm (1 5/16 in.) dia.
Power output 250 mW
Input/Output • Earphone jack (minijack) for 8 - 300 ohms
ear receiver/headphones
• Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
Power requirements Tw o LR03 (size AAA) alkaline batter ies: 3 V DC
Dimensions (w/h/d) (not incl. projecting parts and controls)
44.5 × 105.3 × 14.0 mm (1 13/16 × 4 1/4 × 9/16 in.)
Mass (incl. batteries) 69 g (2.5 oz)
Supplied accessories LR03 (size AAA) alkaline batteries (2) (For the
US only)
US Model
ICD-B26
AEP Model
Tourist Model
ICD-B16/B26
9-877-648-01
2004C04-1
© 2004.03
Design and specifications are subject to change without notice.
IC RECORDER
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
1
ICD-B16/B26
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
UNLEADED SOLDER
•
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TABLE OF CONTENTS
1. SERVICE NOTE ................................................................3
2. GENERAL
Index to Parts and Controls ..................................................... 4
3. DISASSEMBLY
3-1. Case (Upper) Assy .............................................................. 5
3-2. F-SW Board, P-SW Board .................................................. 6
3-3. Main Board ......................................................................... 6
4. DIAGRAMS
4-1. IC Pin Description............................................................... 7
4-2. Block Diagram .................................................................... 9
4-3. Printed Wiring Board – Main Section – ............................ 11
4-4. Printed Wiring Board – F-SW Section – ........................... 12
4-5. Printed Wiring Board – P-SW Section – ........................... 13
4-6. Schematic Diagram – Main Section –............................... 14
4-7. IC Block Diagrams............................................................ 15
5. EXPLODED VIEWS
5-1. Case Section ...................................................................... 16
5-2. Main Board Section .......................................................... 17
6. ELECTRICAL PARTS LIST ........................................ 18
2
SECTION 1
C
SERVICE NOTE
1-1. CAUTIONS OF FLASH MEMORY (IC701)
EXCHANGE
[Precaution when the flash memory (IC701) is replaced]
When the flash memory (IC701) is replaced, be sure to perform the
BAD BLOCK check* and writing of the model code. If they are not
completed, the unit will not operate normally.
* BAD BLOCK check is to check the flash ROM memory
area (the BAD BLOCK area) where data cannot be
guaranteed. The resultant information of this check is stored
in the TOC-AREA so that the BAD BLOCK area should
not be used.
[BAD BLOCK Check Procedure]
1. When the power is turned on after the flash memory (IC701) is
replaced, the BAD BLOCK check starts automatically and the
OPR (D701) lights in orange.
2. In about 30 seconds after start of the check, the OPR (D701)
changes the color to green indicating that the check is
completed.
ICD-B16/B26
J101
MIC
(PLUG IN POWER)
J102
EAR
MAIN BOARD (SIDE A)
TP101
FB101
FB102
TP106
D701
OPR
RED(REC)
GRN
(PLAY)
Q701
CCB
FB104
—2
R727
E
—1
B
FB103
R726
R102
TP110
TP102
R103
TP708
R135
R104
TP702
C103
C101
TP107
C106
C105
TP701
TP501
C129
C104
C128
C120
X101
30
31
50
51
3
ICD-B16/B26
Index to Parts and Controls
Main unit
(built-in microphone)
MIC
SECTION 2
GENERAL
MIC jack
(PLUG IN POWER)
EAR (earphone) jack
OPR (operation) indicator
This section is extracted
from instruction manual.
Rear
Display window
FOLDER
DIVIDE
DISPLAY
MIC SENS
(microphone sensitivity)
MENU
ERASE
Speaker
STOP
Battery
compartment
Hook for handstrap
(not supplied)
Display window
Remaining memory indicator
Folder indication
Alarm indicator
Microphone sensitivity
indication
Counter /Remaining time indication /Recording date
indication /Current time indication (15:30, etc.) /Menu
indication (ALARM, BEEP, etc.) /Messages (ERASE, HOLD,
etc.)
zREC (record) /STOP
X PAUSE
– .REVIEW/
>+CUE
NxPLAY/STOP•
EXECUTE
HOLD
VOL (volume)
Remaining battery
indicator
Repeat play indicator
Recording mode
indication
REC (recording)
indicator
Selected message
number/Mode
indication of the
menu (ON, OFF, etc.)
4
SECTION 3
y
DISASSEMBLY
Note : This set can be disassemble according to the following sequence.
SET
3-1. CASE (UPPER) ASSY
(Page 5)
3-2. F-SW BOARD,
P-SW BOARD
(Page 6)
3-3. MAIN BOARD
(Page 6)
Note : Follow the disassembly procedure in the numerical order given.
ICD-B16/B26
3-1. CASE (UPPER) ASSY
9
speaker (SP101)
8
two
(1.7
2
(B 1.7x7)
screws
x
2.5)
screw
3
two claws
6
claw
4
two claws
7
0
case (upper) ass
5
three claws
case block assy
1
screw
(B 1.7x10)
5
ICD-B16/B26
3-2. F-SW BOARD, P-SW BOARD
6
F-SW board
5
P-SW board
3-3. MAIN BOARD
speaker (SP101)
2
3
2
CN701
4
Removal the five solders.
1
Removal the solder.
case block assy
3
(1.7x4)
screw
1
Removal the two solders.
7
MAIN board
4
claw
5
6
case (lower) assy
claw
6
ICD-B16/B26
SECTION 4
DIAGRAMS
4-1. IC PIN DESCRIPTION
• IC703 µPD780308GC-A71-8EU (MEMORY CONTROL, SYSTEM CONTROL)
Pin No. Pin Name I/O Pin Description
1 – 3 KEY0 – KEY2 I Key signal input
4 XHOLD I Hold switch signal input
5 AMPPOW O Power down control signal output to the power amplifier IC (IC103)
6AVREFON I A/D reference voltage input
7 XFMCE O Chip enable signal output to the flash memory IC (IC701)
8 VDD0 — Power supply pin (+3.3 V)
9AVREF — A/D reference voltage
10 XFMWE O Write enable signal output to the flash memory IC (IC701)
11 XFMALE O ALE signal output to the flash memory IC (IC701)
12 VSS1 — Ground pin
13 XFMR/B I Ready/Busy signal input from the flash memory IC (IC701)
14 XFMCLE O CLE signal output to the flash memory IC (IC701)
15, 16 NC O Not used. (Open)
17 XFMRE O Read enable signal output to the flash memory IC (IC701)
18 XFMSE O SE signal output to the flash memory IC (IC701)
19 XFMWP O WP signal output to the flash memory IC (IC701)
20 CLKOUT O Not used in this set. (Open)
21 BEEP O Beep signal output (2.4 kHz)
22 LIGHT O LCD back light control output Not used in this set. (Open)
23 to 26 COM0 to COM3 O LCD common signal output
27 BIAS O Connect to VDD. (LCD bias)
28 to 30 VLC0 to VLC2 — LCD drive power supply pin
31 VSS0 — Ground pin
32 to 61 S0 to S29 O LCD segment signal output
62 NC I Not used. (Open)
63 NC O Not used. (Open)
64 XTEST I Test pin
65 DSPPOW O Digital signal processor registor control I/F enable signal output
66 LEDREC O OPR (REC) LED (D701: red) ON/OFF signal output
67 LEDPB O OPR (PLAY) LED (D701: green) ON/OFF signal output
68 RTCCE O Real time clock chip enable signal output
69 XDSPIFRQ O I/F request signal output to the DSP IC (IC101)
70 DSPIFRW O I/F data read/write signal output to the DSP IC (IC101)
71 XDSPRST O Reset signal output to the A/D, D/A converter, DSP IC (IC101)
72 SI0 I I/F data signal input to the DSP IC (IC101)
73 SO0 O I/F data signal output to the DSP IC (IC101)
74 SCK0 O I/F signal clock output to the DSP IC (IC101)
75 RTCDI I Real time clock data signal input
76 RTCDO O Real time clock data and digital signal processor registor control data output
77 RTCCLK O Real time clock I/F data and digital signal processor registor control clock output
78 IC — Connect to ground.
79 X2 O System clock output (5 MHz)
80 X1 I System clock input (5 MHz)
81 VDD1 — Power supply pin
82 XT1 — Sub clock input (32.768 kHz)
83 XT2 — Not used in this set. (Open)
84 XRESET I Reset signal input
85 NC — Not used. (Open)
7
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