Design and specifications are subject to change without notice.
IC RECORDER
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
1
Page 2
ICD-B16/B26
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
UNLEADED SOLDER
•
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TABLE OF CONTENTS
1. SERVICE NOTE ................................................................3
2. GENERAL
Index to Parts and Controls ..................................................... 4
3. DISASSEMBLY
3-1. Case (Upper) Assy .............................................................. 5
4-6. Schematic Diagram – Main Section –............................... 14
4-7. IC Block Diagrams............................................................ 15
5. EXPLODED VIEWS
5-1. Case Section ...................................................................... 16
5-2. Main Board Section .......................................................... 17
6. ELECTRICAL PARTS LIST ........................................ 18
2
Page 3
SECTION 1
C
SERVICE NOTE
1-1. CAUTIONS OF FLASH MEMORY (IC701)
EXCHANGE
[Precaution when the flash memory (IC701) is replaced]
When the flash memory (IC701) is replaced, be sure to perform the
BAD BLOCK check* and writing of the model code. If they are not
completed, the unit will not operate normally.
* BAD BLOCK check is to check the flash ROM memory
area (the BAD BLOCK area) where data cannot be
guaranteed. The resultant information of this check is stored
in the TOC-AREA so that the BAD BLOCK area should
not be used.
[BAD BLOCK Check Procedure]
1. When the power is turned on after the flash memory (IC701) is
replaced, the BAD BLOCK check starts automatically and the
OPR (D701) lights in orange.
2. In about 30 seconds after start of the check, the OPR (D701)
changes the color to green indicating that the check is
completed.
ICD-B16/B26
J101
MIC
(PLUG IN POWER)
J102
EAR
MAIN BOARD (SIDE A)
TP101
FB101
FB102
TP106
D701
OPR
RED(REC)
GRN
(PLAY)
Q701
CCB
FB104
—2
R727
E
—1
B
FB103
R726
R102
TP110
TP102
R103
TP708
R135
R104
TP702
C103
C101
TP107
C106
C105
TP701
TP501
C129
C104
C128
C120
X101
30
31
50
51
3
Page 4
ICD-B16/B26
Index to Parts and Controls
Main unit
(built-in microphone)
MIC
SECTION 2
GENERAL
MIC jack
(PLUG IN POWER)
EAR (earphone) jack
OPR (operation) indicator
This section is extracted
from instruction manual.
Rear
Display window
FOLDER
DIVIDE
DISPLAY
MIC SENS
(microphone sensitivity)
MENU
ERASE
Speaker
STOP
Battery
compartment
Hook for handstrap
(not supplied)
Display window
Remaining memory indicator
Folder indication
Alarm indicator
Microphone sensitivity
indication
Counter /Remaining time indication /Recording date
indication /Current time indication (15:30, etc.) /Menu
indication (ALARM, BEEP, etc.) /Messages (ERASE, HOLD,
etc.)
zREC (record) /STOP
X PAUSE
– .REVIEW/
>+CUE
NxPLAY/STOP•
EXECUTE
HOLD
VOL (volume)
Remaining battery
indicator
Repeat play indicator
Recording mode
indication
REC (recording)
indicator
Selected message
number/Mode
indication of the
menu (ON, OFF, etc.)
4
Page 5
SECTION 3
y
DISASSEMBLY
Note : This set can be disassemble according to the following sequence.
SET
3-1.CASE (UPPER) ASSY
(Page 5)
3-2.F-SW BOARD,
P-SW BOARD
(Page 6)
3-3.MAIN BOARD
(Page 6)
Note : Follow the disassembly procedure in the numerical order given.
ICD-B16/B26
3-1. CASE (UPPER) ASSY
9
speaker (SP101)
8
two
(1.7
2
(B 1.7x7)
screws
x
2.5)
screw
3
two claws
6
claw
4
two claws
7
0
case (upper) ass
5
three claws
case block assy
1
screw
(B 1.7x10)
5
Page 6
ICD-B16/B26
3-2. F-SW BOARD, P-SW BOARD
6
F-SW board
5
P-SW board
3-3. MAIN BOARD
speaker (SP101)
2
3
2
CN701
4
Removal the five solders.
1
Removal the solder.
case block assy
3
(1.7x4)
screw
1
Removal the two solders.
7
MAIN board
4
claw
5
6
case (lower) assy
claw
6
Page 7
ICD-B16/B26
SECTION 4
DIAGRAMS
4-1. IC PIN DESCRIPTION
• IC703 µPD780308GC-A71-8EU (MEMORY CONTROL, SYSTEM CONTROL)
Pin No.Pin NameI/OPin Description
1 – 3KEY0 – KEY2IKey signal input
4XHOLDIHold switch signal input
5AMPPOWOPower down control signal output to the power amplifier IC (IC103)
6AVREFONIA/D reference voltage input
7XFMCEOChip enable signal output to the flash memory IC (IC701)
8VDD0—Power supply pin (+3.3 V)
9AVREF—A/D reference voltage
10XFMWEOWrite enable signal output to the flash memory IC (IC701)
11XFMALEOALE signal output to the flash memory IC (IC701)
12VSS1—Ground pin
13XFMR/BIReady/Busy signal input from the flash memory IC (IC701)
14XFMCLEOCLE signal output to the flash memory IC (IC701)
15, 16NCONot used. (Open)
17XFMREORead enable signal output to the flash memory IC (IC701)
18XFMSEOSE signal output to the flash memory IC (IC701)
19XFMWPOWP signal output to the flash memory IC (IC701)
20CLKOUTONot used in this set. (Open)
21BEEPOBeep signal output (2.4 kHz)
22LIGHTOLCD back light control output Not used in this set. (Open)
23 to 26COM0 to COM3OLCD common signal output
27BIASOConnect to VDD. (LCD bias)
28 to 30VLC0 to VLC2—LCD drive power supply pin
31VSS0—Ground pin
32 to 61S0 to S29OLCD segment signal output
62NCINot used. (Open)
63NCONot used. (Open)
64XTESTITest pin
65DSPPOWODigital signal processor registor control I/F enable signal output
66LEDRECOOPR (REC) LED (D701: red) ON/OFF signal output
67LEDPBOOPR (PLAY) LED (D701: green) ON/OFF signal output
68RTCCEOReal time clock chip enable signal output
69XDSPIFRQOI/F request signal output to the DSP IC (IC101)
70DSPIFRWOI/F data read/write signal output to the DSP IC (IC101)
71XDSPRSTOReset signal output to the A/D, D/A converter, DSP IC (IC101)
72SI0II/F data signal input to the DSP IC (IC101)
73SO0OI/F data signal output to the DSP IC (IC101)
74SCK0OI/F signal clock output to the DSP IC (IC101)
75RTCDIIReal time clock data signal input
76RTCDOOReal time clock data and digital signal processor registor control data output
77RTCCLKOReal time clock I/F data and digital signal processor registor control clock output
78IC—Connect to ground.
79X2OSystem clock output (5 MHz)
80X1ISystem clock input (5 MHz)
81VDD1—Power supply pin
82XT1—Sub clock input (32.768 kHz)
83XT2—Not used in this set. (Open)
84XRESETIReset signal input
85NC—Not used. (Open)
7
Page 8
ICD-B16/B26
Pin No.Pin NameI/OPin Description
86WAKEUPIWAKE UP signal input
87RTCINTIReal time clock (2 Hz) signal input
88FLMPOWOFlash memory power ON/OFF signal output
89DSPIFACKII/F acknowledge signal input to the DSP IC (IC101)
90LMUTEOLine mute ON/OFF signal output
91 to 98FMI01 to FMI07I/OData bus signal input/output
99AVSS—Ground pin
100BATTIPower supply voltage detection signal input
8
Page 9
4-2. BLOCK DIAGRAM
A/D,D/A CONVERTER
DSP IC101
ICD-B16/B26
MIC101
MIC
J101
MIC
(PLUG IN POWER)
KEY MATRIX
S706-708,713
S710-712,714
S704,705,709,715
Signal path
: PB
: REC
+3.3V
(VCCB)
VCC
29
I
32
•
41
I
44
IC701
FLASH MEMORY
I/O1
I
I/O8
KEY-IN
DETECT
Q703-705
R/B
CLE
ALE
WE
WP
IC103
POWER AMP
LOUT0
XOUT
X101
3.98MHz
VDD
52
X701
5MHz
XIN
34
4
3
2
7
6
1
SI
SO
SCLK
CE
INTB
32KOUT
VCCA+3.3V
(VCC A)
VCC
+3.3V
(VCC B)
I/O
LCD701
LIQUID
CRYSTAL
DISPLAY
PANEL
LED
DRIVER
Q701
REAL TIME CLOCK
TIMER
COUNTER
CONTROL
INTERRUPT
CONTROL
IC704
IC702
1
RESET
+3.3V
(VCC C)
OSCIN
OSC
OSCOUT
D701
OPR
(GRN)(PLAY)
(RED)(REC)
32.768kHz
9
8
VDD
RV101
VOL
X702
+3.3V
(VCC C)
Q101
MUTE
+3.3V
(VCC A)
+3.3V
(VCC B)
+3.3V
(VCC C)
-IN
4
+IN
3
2
BYPASS
SHUTDOWN
IC502
+3.3V REG
52
VOUT VIN
SHUTDOWN
3
IC503
+3.3V REG
52
VOUT VIN
CE
3
IC504
+3.3V REG
52
VOUT VIN
CE
3
BUFFER
Q502
1
VDD
6
IC505,Q501
DC-DC
CONVERTER
(3.7V)
IC506
VOLTAGE
DETECTOR
VO2
VO1
8
5
MIP
47
MIN
46
EGPI011
EGPI014
EGPI013
EGPI015
BGPI02
EGPI014
69
70
DSPIFACK
XDSPIFRQ
RSTN
71
DSPIFRW
XDSPRST
AMPPOW
LMUTE
BEEP
RTCDO
RTCDI
RTCCLK
RTCCE
RTCINT
XT1
DSPPOW
FLMPOW
XRESET
COM0
I
COM3
S0
I
S29
LEDPB
LEDREC
90
21
5
76
75
77
68
87
82
65
88
84
X1
80
79
X2
23
I
26
32
I
61
67
66
23
2651
25 27 58 24 54
72
73
74
89
SI0
SD0
SCK0
FMI00
91
I
I
98
FMI07
7
RE
8
9
CE
16
17
18
19
SL701
(TEST)
Q702
S703
HOLD
OFF ON
13
17
7
14
11
10
19
64
86
63
62
1
2
3
4
XFMR/B
XFMRE
XFMCE
XFMCLE
XFMALE
XFMWE
XFMWP
XTEST
WAKEUP
MGHIGH
MGTEST
KEY0
KEY1
KEY2
XHOLD
MEMORY
CONTROL,
SYSTEM
CONTROL
IC703
SP101
SPEAKER
J102
EAR
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION LR03)
2PCS,3V
99
Page 10
ICD-B16/B26
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Common Note on Schematic Diagrams:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
f
•
• C : panel designation.
• A : B+ Line.
•Power voltage is dc 3V and fed with regulated dc power
•Voltage and waveforms are dc with respect to ground
•Voltages are taken with a VOM (Input impedance 10 MΩ).
•Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
: internal component.
supply from battery terminal.
under no-signal (detuned) conditions.
no mark : PB
(): REC
Voltage variations may be noted due to normal production tolerances.
Voltage variations may be noted due to normal production tolerances.
E: PB
a : REC
4
W or less unless otherwise
• Waveforms
0.5V/div 0.1µsec/div
1
3.98MHz
IC101 ta (XOUT)
1.0V/div 10µsec/div
2
32.768kHz
IC704 1 (32KOUT)
0.5V/div 10µsec/div
3
32.768kHz
IC704 8 (OSCOUT)
1.0V/div 0.2µsec/div
4
5MHz
IC703 ul (X2)
1.0Vp-p
2.2Vp-p
1.2Vp-p
3.2Vp-p
Common Note on Printed Wiring Boards:
• X : par ts extracted from the component side.
• Y : par ts extracted from the conductor side.
f
•
•
•: Pattern from the side which enables seeing.
Caution:
Pattern face side:Parts on the pattern face side seen from
(SIDE B)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(SIDE A)the parts face are indicated.
• Lead Layouts
Lead layout of conventional IC
: internal component.
z
: Through hole.
1010
Page 11
ICD-B16/B26
4-3. PRINTED WIRING BOARD — MAIN SECTION — • Refer to page 10 for Common Note on Printed Wiring Boards.
IC1016-704-144-01 IC D36521A11AQC
IC1036-705-850-01 IC MM3111XWLE
IC5028-759-657-74 IC XC62HR3302MR
IC5038-759-657-74 IC XC62HR3302MR
IC5048-759-657-74 IC XC62HR3302MR
IC5058-759-825-96 IC XC6368A371MR
IC5068-759-694-89 IC XC61CN1002MR
IC7016-705-077-01 IC K9F5608U0C-PCB0T00 (B26)
IC7016-705-336-01 IC K9F2808U0C-PCB0T (B16)
IC7028-759-333-42 IC XC61AN3002MR
IC7036-804-049-01 IC uPD780308GC-A71-8EU
IC7048-759-560-17 IC RS5C348A-E2-FB
< JACK >
J1011-784-848-41 JACK (MIC (PLUG IN POWER))
J2011-784-848-41 JACK (EAR)
R7131-218-981-11 RES-CHIP220K5%1/16W
R7141-218-990-11 SHORT CHIP0
R7151-218-990-11 SHORT CHIP0
R7191-218-990-11 SHORT CHIP0
R7231-218-953-11 RES-CHIP1K5%1/16W
Clicking the version allows you to jump to the revised page.
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Ver.DateDescription of Revision
1.02004.03New
22
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