LP: 300 Hz - 3,500 Hz
Speakerapprox. 3.2 cm (1 5/16 in.) dia.
Power output300 mW
Input/Output• Earphone jack (minijack) for 16 - 300 ohms
earphone/headphones
• Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
Playback speed control FAST +30%, SLOW –15%
Power requirementsTw o LR03 (size AAA) alkaline batteries: 3 V DC
Dimensions (w/h/d) (not incl. projecting parts and controls)
44.5 × 105.3 × 14.0 mm (1 13/16× 4 1/4×9/16 in.)
Mass (incl. batteries)68 g (2.4 oz)
Optional accessoriesElectret Condenser Microphone ECM-Z60,
Your dealer may not handle some of the above listed optional accessories.
Please ask the dealer for detailed information.
Design and specifications are subject to change without notice.
IC RECORDER
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
1
Page 2
ICD-B25
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
UNLEADED SOLDER
•
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TABLE OF CONTENTS
1. GENERAL
Index to Parts and Controls ..................................................... 3
2. DISASSEMBL Y
2-1. Upper Lid Sub Block Assy.................................................. 4
4-1. Case Section ...................................................................... 21
4-2. Main Board Section .......................................................... 22
5. ELECTRICAL PARTS LIST ........................................ 23
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY P ARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE P AR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS P AR SONY.
À LA SÉCURITÉ!!
2
Page 3
SECTION 1
GENERAL
ICD-B25
This section is extracted
from instruction manual.
3
Page 4
ICD-B25
y
SECTION 2
DISASSEMBLY
Note : This set can be disassemble according to the following sequence.
SetUpper Lid Sub Block AssyF-SW BoardMain Board
Note : Follow the disassembly procedure in the numerical order given.
2-1. UPPER LID SUB BLOCK ASSY
3
claws
8
speaker
5
6
upper lid sub block ass
7
screws (B1.7x2.5)
2-2. F-SW BOARD
screw (B1.7x7)
2
3
F-SW board
4
claw
case assy
1
screw (B1.7x10)
2
case assy
1
CN703
4
Page 5
2-3. MAIN BOARD
y
2
speaker
1
Removal the solders.
6
MAIN board
4
3
screw (B1.7x10)
claw
ICD-B25
5
case ass
claw
5
Page 6
ICD-B25
SECTION 3
DIAGRAMS
3-1. IC PIN DESCRIPTION
• IC712 MB90523APFF-G-122-BND (SYSTEM CONTROL)
Pin No.Pin NameI/OPin Description
1RTCCEOReal-time clock chip enable signal output
2BEEPOBeep signal output
3XFLMREOFlash memory read enable signal output
4XFLMWEOFlash memory write enable signal output
5FLMRBIFlash memory R/B signal input
6DSPPWRODSP power supply signal output
7ADASYSCKOADA codec system clock signal output
8VCC—Power supply pin
9DSPSYSCKODSP system clock signal output
10XZRSTOZephy reset signal output (Not used in this set.)
11DSPACKODSP I/F acknowledge signal output
12XDIFENODSP I/F enable signal output
13DCOMDTODSP I/F command/data signal output
14SIN1IDSP I/F serial data signal input
15SOT1ODSP I/F serial data signal output
16SCK1ODSP I/F serial clock signal output
17 to 32SEG00 to 15OLCD segment signal output
33VSS—Ground pin
34C—C (Connect to power supply pin.)
35SIN2IZephyr/RTC I/F serial data signal input
36SOT2OZephyr/RTC I/F serial data signal output
37SCK2OZephyr/RTC I/F serial clock signal output
38DVCC—Digital power supply pin
39DVSS—Digital ground pin
40ZIFACKOZephyr I/F acknowledge signal output (Not used in this set.)
41SIPCSOSerial parallel converter IC I/F chip enable signal output
42AVCC—Analog power supply pin
43AVRH—A/D reference voltage H (Connect to VCC.)
44AVRL—A/D reference voltage L (Connect to ground.)
45AVSS—Analog ground pin
46BATTIBattery level detection A/D signal input
47KEYIN0IKey A/D signal input 0
48KEYIN1IKey A/D signal input 1
49SPEEDISpeed switch A/D signal input
50XVORSWIVOR switch signal input (Low: VOR switch ON)
51HPJACKIHeadphone jack ON/OFF signal input (Fixed at “L” in this set.)
52FLMSELIFlash memory select A/D signal input
53KEYPUPOKey pull-up signal output
54VCC—Power supply pin
55FLMALEOFlash memory address latch enable signal output (AND: OE)
56FLMCLEOFlash memory command enable signal output (AND: CDE)
57XVORINIVOR signal input
58XDSPRSTODSP reset signal output
59 to 62COM0 to 3OLCD common signal output
63VSS—Ground pin
64 to 72SEG16 to 24OLCD segment signal output
73SUBXTALOSub clock oscillation pin (Not used in this set.)
74SUBCLKISub clock oscillation signal input (32.768 kHz)
6
Page 7
Pin No.Pin NameI/OPin Description
75 to 81SEG25 to 31OLCD segment signal output
82 to 85V0 to 3—LCD driver reference power supply pin
86XHSTBYIHardware standby signal input
87MD2IOperation mode signal input 2
88MD1IOperation mode signal input 1 (Connect to VCC.)
89MD0IOperation mode signal input 0
90XRESETIReset signal input
91VSS—Ground pin
92XTALINIMain oscillation signal input (4.096 MHz)
93XTALOMain oscillation signal output (4.096 MHz)
94VCC—Power supply pin
95WAKEUPIWake up signal input
96DSPIFREQIDSP voice I/F request signal input
97ZIFREQIUSB microcomputer (zephyr) I/F request signal input
98RTCINTRIReal-time clock interruption request signal input
99VBUSOFFIUSB Vbus ON/OFF detection signal input (H=OFF)
100HOLDSWIHold switch signal input (High: HOLD)
101XFLMCEOOFlash memory chip enable 0 signal output
102XFLMRST/CE1OFlash memory reset signal/chip enable 1 signal output (Not used in this set.)
103 to 110FLMIO00 to 07I/OFlash memory data bus
111 to 118FLMIO08 to 15I/OFlash memory data bus (Not used in this set.)
119VSS—Ground pin
120XFLMWPOFlash memory write protect signal output
ICD-B25
77
Page 8
ICD-B25
3-2. BLOCK DIAGRAM
J101
MIC
MIC101
MIC
MAIN BOARD
Q101
MIC
SENS
IC101
MIC AMP
3
VIN+
VIN-
4
135
VOUT
IC102
ALC AMP
INOUT
IC103
VOR CONTROL
1
INPUT
OUT1
IC107
A/D, D/A CONVERTER
VINVOUT
4
6
IC106
29
SCK1
27
SI1
31
SO1
28
SIEN1
33
SOEN1
42
P3
43
P2
PDWN
IC109
DSP
XTI
BCK
DIN
DOUT
FS
SIEN2
SOEN2
CLKIN
/RESET
22
20
17
8
9
10
11
SI2
SO2
SCK2
Q106
LPF
SW
38
35
37
34
IC105
36
59
72
IC112
AMP
VIN- VOUT
41
SI/PO DRIVER
MICSENSE
13
SOT2
DATA
2
3
CLOCK
XFLMPWR
15
Q107, 108
LPF
SW
IC715
XSPPWR
XHPPWR
HPMUTE
XREDLED
XGRNLED
APOWER
ADAPWR
XLIGHT
XBATTEN
LMUTE
Q105
Q103
SW
AVCC
15
RF
11
8
SP101
SPEAKER
J102
EAR
IC110
POWER AMP
RV101
VOL
Q102
MUTE
7
11
D703
12
10
14
OPR
8
5
6
9
4
RED (REC)
GRN (PB)
17
IN1
13
6
IN2
INV
OUT
+
-
BUFFER
STNBY
31
• Signal Path
: PB
: REC
F-SW BOARD (2/2)
S701 - 705
S706, 707
ZVCC
P-SW BOARD
S722
S721, 723 - 725
Q702
+B
SW
FLASH MEMORY
29
ı
IO1
32
ı
•
41
IO8
ı
44
12
•
VCC
37
Q705, 706
WAKE-UP
SW
S726
IC706
7
R/B
8
RE
9
CE
16
CLE
17
ALE
18
WE
19
WP
S702
PLAY SPEED
SLOW NORMAL FAST
SYSTEM CONTROL
DSPIFREQ
96
13
DCOMDT
12
XDIFEN
14
SIN1
15
SOT1
16
SCK1
57
XVORIN
FLMIO00
103
ı
FLMIO07
110
FLMRB
5
XFLMRE
3
XFLMCE0
101
FLMCLE
56
FLMALE
55
4
XFLMWE
120
XFLMWP
52
FLMSEL
49
SPEED
95
WAKEUP
KEYPUP
53
KEYIN0
47
KEYIN1
48
HOLDSW
100
ı
IC712
DSPSYSCK
ADASYSCK
IC104, 108
CLOCK GEN
CLKIN
96
DSPPWR
6
76
58
XDSPRST
11
DSPACK
364
SOT2
35
SIN2
37
SCK2
41
SIPCS
1
RTCCE
98
RTCINTR
74
SUBCLK
46
BATT
2
BEEP
HPJACK
51
XHSTBY
86
901
XRESET
92
XTALIN
XTAL
93
COM0
59
ı
ı
COM3
62
17
ı
32
•
SEG00
64
ı
ı
72
SEG31
•
75
ı
81
1
1
CE
CE
CLKIN
Q0
Q0
X701
4.096MHz
3
3
Q707
SW
LCD101
LIQUID
CRYSTAL
DISPLAY
PANEL
Q710
AVCC
REAL-TIME CLOCK
3
2
7
6
1
SW
IC716
SI
SO
SCLK
OSCIN
OSCOUT
CE
INTR
32KOUT
IC710
RESET
X702
32.768kHz
9
8
3.1V
2.3V
2.9V
2.9V
F-SW BOARD (1/2)
3V
AVCC
DSPVCC
MICVCC
ADAVCC
ZVCC
SVCC
(BACK LIGHT)
CONVERTER
+2.9V REG
5
VOUT
+2.9V REG
5
VOUT
+3.1V REG
52
VOUT
D701, 702
IC504
DC-DC
IC505
CE
3
IC506
CE
3
IC502
CE
3
VIN
VIN
VIN
DECODER
2
2
Q504
IC508, Q503
DC-DC
CONVERTER
(3.2V)
IC507
VOLTAGE
DETECTOR
DRY BATTERY
SIZE"AAA"
(IEC DESIGNATION LR03)
2PCS,3V
88
Page 9
ICD-B25
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Common Note on Schematic Diagrams:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
f
•
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 3V and fed with regulated dc power
•Voltages are taken with a VOM (Input impedance 10 MΩ).
•Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
• The voltages and Waveform of CSP (chip size package)
: internal component.
supply from battery terminal.
Voltage variations may be noted due to normal produc-
tion tolerances.
Voltage variations may be noted due to normal production tolerances.
E: PB
a : REC
IC109 on main board are not replaceable.
*
cannot be measured, because its lead layout is different
from that of conventional IC.
4
W or less unless otherwise
• Waveforms
0.5V/div 50nsec/div
1
4.096MHz
IC712 od (XTAL)
0.2V/div 10µsec/div
2
32.768kHz
IC716 8 (OSCOUT)
1.3Vp-p
0.8Vp-p
Common Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
f
•
•: Pattern from the side which enables seeing.
Caution:
Pattern face side:Parts on the pattern face side seen from
(SIDE B)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(SIDE A)the parts face are indicated.
• Lead Layouts
Lead layout of conventional IC CSP (chip size package)
When indicating parts by reference
number, please include the board.
•Abbreviation
CND : Canadian model
JE: Tourist model
< CONNECTOR >
* CN5011-815-199-21 CONNECTOR, BOARD TO BOARD 30P
< DIODE >
D5028-719-066-16 DIODE RB491D-T146
D7018-719-070-68 LED CL-220YG-C-TS (BACK LIGHT)
D7028-719-070-68 LED CL-220YG-C-TS (BACK LIGHT)
< IC >
IC5028-759-661-66 IC XC62HR3102MR
IC5046-700-122-01 IC XC62HR2302MR
IC5058-759-825-95 IC XC62HR2902MR
IC5068-759-825-95 IC XC62HR2902MR
IC5078-759-694-89 IC XC61CN1002MR
IC1018-759-677-71 IC LMV751M5X
IC1028-759-586-57 IC AN6123MS-TXL
IC1038-759-701-51 IC NJM2072M
IC1048-759-833-82 IC XC25BS5006MR
IC1058-759-058-58 IC TC7S04FU(TE85R)
IC1068-759-058-58 IC TC7S04FU(TE85R)
IC1078-759-825-99 IC PCM3500E-2K
IC1088-759-827-31 IC XC25BS5005MR
@ IC1096-800-204-01 IC uPD77113AF1-013-CN1
IC1106-700-841-01 IC BA6640BF-E2
IC1128-759-677-71 IC LMV751M5X
IC7066-702-289-01 IC K9F2808U0B-YCB0T
IC7108-759-590-37 IC XC61FC2712MR
IC7126-700-766-01 IC MB90523APFF-G-122-BND
IC7158-759-670-89 IC BU2090FS-E2
IC7168-759-560-17 IC RS5C348A-E2
@Replacement of µPD77113AF1-013-CN1 (IC109)
used in this set requires a special tool.
Therefore, it cannot be replaced.
J1011-784-848-31 JACK (MIC)
J2011-784-848-31 JACK (EAR)
< LIQUID CRYSTAL DISPLAY >
LCD101 1-804-254-12 DISPLAY PANEL, LIQUID CRYSTAL
< TRANSISTOR >
Q1018-729-048-04 FET 3LN01S-TL
Q1028-729-048-04 FET 3LN01S-TL
Q1038-729-037-58 TRANSISTOR UN9110J-(TX).SO
Q1058-729-904-86 TRANSISTOR 2SB1197K-Q
Q1068-729-048-04 FET 3LN01S-TL
Q1078-729-048-04 FET 3LN01S-TL
Q1088-729-048-04 FET 3LN01S-TL
Q7028-729-041-23 FET NDS356AP
Q7058-729-420-24 TRANSISTOR 2SB1218A-QRS
Q7068-729-420-24 TRANSISTOR 2SB1218A-QRS
Q7078-729-051-53 FET 3LP01S-TL
Q7108-729-051-53 FET 3LP01S-TL
Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised
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Ver.DateDescription of Revision
1.02002. 03New
28
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