Sony ICD-55 Service Manual
ICD-55
SERVICE MANUAL
Ver 1.1 1999. 01
SPECIFICATIONS
US Model
Canadian Model
AEP Model
E Model
Tourist Model
MICROFILM
IC RECORDER
SECTION 1
SERVICING NOTES
TABLE OF CONTENTS
1. SERVICING NOTES............................................... 2
2. GENERAL ................................................................... 3
3. DISASSEMBLY ......................................................... 4
4. DIAGRAMS
4-1. Block Diagram ................................................................ 7
4-2. Printed Wiring Board ...................................................... 9
4-3. Schematic Diagram ......................................................... 11
4-4. IC Pin Function Description ........................................... 17
5. EXPLODED VIEW................................................... 19
6. ELECTRICAL PARTS LIST ............................... 20
CAUTION ON REPLACING FLASH MEMORY
The BAD-BLOCK check* must be executed, when the flash
memory in this set was replaced.
The set will not operation normally, unless this check is finished.
* The BAD-BLOCK check detects an area (bad-block) in the flash
memory where data validity cannot be guaranteed, and saves this
information in the TOC-AREA so that a bad-block is not used.
BAD-BLOCK check Procedure:
1. Apply 1.5V from re gulated po wer supply to the battery terminals.
2. Once the po wer is supplied, the check starts and then proceeds
for approx. 20 seconds. (Be sure to keep applying the power
during the check)
3. When the check completes, the result is shown as bellows.
OK:Only the LCD back light LED (D503) turns on.
NG:Red LED blinks or turns on or green LED turns on in the
OPR LED (D504).
4. In case of OK, press the
Note:
• In case of NG, check system control IC (IC701), flash memory IC and
the peripheral circuit. (Particularly , check carefully the soldering of the
flash memory)
• After finishing the BAD-BLOCK check, assemble the set, load the dry
battery, and confirm if the set operates normally.
[STOP] button.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board. (within 3 times)
• Be careful not to apply force on the conductor when soldering
or unsoldering.
– 2 –
SECTION 2
GENERAL
This section is extracted from
instruction manual.
– 3 –
SECTION 3
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
LID, BATTERY CASE
3
lid, battery case
2
boss
1
2
boss
CASE (FRONT)/(REAR) SECTION
2
claw
3
Remove the two solders
speaker lead (SP101).
1
screw (1.7 × 4.5)
5
case (rear) section
2
three claws
2
three claws
4
case (front) section
– 4 –
MAIN BOARD
r
3
Remove the MAIN board to
direction of the arrow.
2
bracket
(jack)
1
two screws
(M1.7
×
4)
INSTALLATION “MAIN BOARD”, “MICROPHONE, ELECTRIC CONDENSER” (MIC101)
On installation MAIN board adjust the S711, S712
and knob (HOLD, MODE).
S712
S711
knob (HOLD)
knob (MODE)
microphone, electric condenser
(MIC101)
two leads
Install two leads the electric condenser microphone
(MIC101) in the figure.
microphone,
electric condense
(MIC101)
– 5 –
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